CN107900029B - Surface treatment mechanism of automatic chip mounter - Google Patents
Surface treatment mechanism of automatic chip mounter Download PDFInfo
- Publication number
- CN107900029B CN107900029B CN201711204349.7A CN201711204349A CN107900029B CN 107900029 B CN107900029 B CN 107900029B CN 201711204349 A CN201711204349 A CN 201711204349A CN 107900029 B CN107900029 B CN 107900029B
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- CN
- China
- Prior art keywords
- air
- air supply
- functional part
- channel
- connecting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004381 surface treatment Methods 0.000 title claims abstract description 18
- 238000006073 displacement reaction Methods 0.000 claims abstract description 20
- 238000005192 partition Methods 0.000 claims description 6
- 230000000087 stabilizing effect Effects 0.000 claims description 5
- 239000012535 impurity Substances 0.000 abstract description 8
- 239000002245 particle Substances 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004140 cleaning Methods 0.000 abstract description 4
- 239000000428 dust Substances 0.000 description 6
- 239000008187 granular material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
Abstract
The invention discloses a surface treatment mechanism of an automatic chip mounter, which comprises a displacement mechanism arranged above a chip mounting platform, wherein a scraper component is arranged between the displacement mechanism and the chip mounting platform, the scraper component comprises a connecting part and a functional part, a gap is reserved between the lower end of the functional part and the chip mounting platform, a main channel is arranged in the functional part, an exhaust channel is arranged in the connecting part, the lower part of the main channel is communicated with the environment outside the functional part, a plurality of air nozzles are uniformly distributed on the inner side wall of the main channel, a first air supply pipe is arranged in the functional part, an air supply channel communicated with the first air supply pipe is arranged on the connecting part, and an air supply joint is arranged on the outer side wall of the connecting part. The invention provides a surface treatment mechanism of an automatic chip mounter, which has a good cleaning effect on a chip mounting platform and can not cause impurity particles on the chip mounting platform to pollute a working space on the chip mounting platform.
Description
Technical Field
The invention relates to the technical field of automatic chip mounters, in particular to a surface treatment mechanism of an automatic chip mounter.
Background
The automatic chip mounter can be widely used in the processing of the liquid crystal screen, and the automatic chip mounter needs to automatically clean a chip mounting platform after each chip mounting in the process of automatically mounting the chip, so that the cleanliness of the next batch of liquid crystal screen chip mounting process is guaranteed. The automatic cleaning equipment used on the full-automatic chip mounter in the prior art is mainly used for removing the adhesion particles on the chip mounting platform in a gas blowing mode by using a gas nozzle. But the too little pressure on this prior art air cock then can't effectually get rid of the attached particle that will adsorb on the paster platform, and air cock pressure is too big then can lead to light impurity particle to raise and suspend in whole equipment space, not only causes the damage to precision equipment, and the impurity particle that raises is on the contrary easy absorption on the LCD screen, leads to the surface purity disqualification of product.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the surface treatment mechanism of the automatic chip mounter is good in cleaning effect on a chip mounting platform, and cannot cause impurity particles on the chip mounting platform to pollute a working space on the chip mounting platform.
The technical scheme adopted by the invention is as follows: the utility model provides an automatic surface treatment mechanism of chip mounter, it is including locating the displacement mechanism of paster platform top, displacement mechanism and paster platform between be equipped with the scraper subassembly, the scraper subassembly hang in displacement mechanism's below, displacement mechanism drives the scraper subassembly and removes its characterized in that along the horizontal direction: the scraper component comprises a connecting part and a functional part, wherein the upper end of the connecting part is arranged on the displacement mechanism, the lower end of the connecting part is fixed with the upper end of the functional part, a gap is reserved between the lower end of the functional part and the patch platform, a main channel is arranged in the functional part, an exhaust channel communicated with the upper end of the main channel is arranged in the connecting part, the lower part of the main channel is communicated with the environment outside the functional part through the gap between the lower end of the functional part and the patch platform, a plurality of air nozzles are uniformly distributed on the inner side wall of the main channel, all the air nozzles incline towards the position of the connecting part along the horizontal direction, a first air supply pipe for supplying air nozzles to jet air flow in the main channel is arranged in the functional part, an air supply channel communicated with the first air supply pipe is arranged in the connecting part, and air supply connectors communicated with the two ends of the air supply channel are respectively arranged on the outer side wall of the connecting part along the corresponding two ends of the length direction of the connecting part and are used for communicating with an external air source. Through the adsorption effect of main passageway, can adsorb the impurity granule on the paster platform, consequently dust removal effect is good, and can not cause the raise dust. In addition, through the air feed connector that two symmetries set up, can make in the air feed channel along self length direction's atmospheric pressure homogeneity good.
The utility model discloses a main passageway, functional part, a plurality of arc recesses are located respectively to both sides that lie in the main passageway on the lower terminal surface of functional part, and each arc recess sets up along the length direction interval of connecting portion, is equipped with the second air supply pipe that is used for supplying with each arc recess high pressure air on the functional part, and the second air supply pipe communicates with the air feed passageway in the connecting portion. The arc-shaped grooves can form an air wall between the patch platforms, and a certain gap can be kept between the lower end face of the functional part and the patch platforms all the time through the air wall, so that hard contact between the functional part and the patch platforms is avoided. Therefore, hard scratches of the functional part to the surface mount platform are avoided.
The clearance M between the lower end face of the position of the arc-shaped groove of the functional part and the patch platform is smaller than the clearance N between the lower end face of the position of the arc-shaped groove of the functional part, which is far away from the arc-shaped groove, and the patch platform. Through the clearance that reduces arc recess place, can guarantee from this that the clearance that arc recess corresponds is the minimum of whole functional portion terminal surface, consequently can make each position of functional portion can not produce the rigid contact with the paster platform.
The dust-raising air tap is arranged below all air taps on the inner side wall of the main channel, the dust-raising air tap points to the position, corresponding to the position, of the patch platform below the main channel, and the dust-raising air tap is communicated with the air supply channel. The dust-raising air tap can enable impurity particles adsorbed on the patch platform to be stirred well when being located below the main channel, and negative pressure generated by upward inclined air blowing of the air tap is matched, so that a good cleaning effect on the patch platform is finally achieved.
The dust air tap is communicated with the first air supply pipe through a branch pipe, and a pressure stabilizing valve is arranged in the branch pipe, so that the air pressure value of one side of the branch pipe, which is close to the first air supply pipe, is larger than that of one side of the branch pipe, which is close to the dust air tap. The pressure value in the first air supply pipe can be kept through the pressure stabilizing valve, so that the air flow blown out by the air nozzle is stable.
A filter screen is arranged between the main channel and the exhaust channel.
The air supply channel in be equipped with a baffle, the baffle separates into first chamber and second chamber with the air supply channel, first air supply pipe and first chamber intercommunication, second air supply pipe and second chamber intercommunication, the air feed joint communicates with the both ends in first chamber respectively.
The partition board is provided with a pressure reducing valve, and the pressure reducing valve enables the pressure value in the second cavity to be smaller than the pressure value in the first cavity.
After adopting above structure, the surface treatment mechanism of the automatic chip mounter has the following advantages compared with the prior art: firstly, the negative pressure that produces through the air cock in the main passageway can make the main passageway can be fine absorb the impurity granule on paster platform surface and make impurity granule along with the air current motion to exhaust passage in, can accomplish the clean of realization paster platform on the basis of the working space of pollution-free paster platform top from this, secondly, can not produce hard contact between functional part and the paster platform through the arc recess, consequently the paster platform can not receive the fish tail problem that cleans the in-process and bring, finally, can make the air pressure difference along length direction in the air feed passageway little through setting up two air feed connectors, the homogeneity is good.
Drawings
Fig. 1 is a schematic structural view of a surface treatment mechanism of an automatic chip mounter according to the present invention.
Fig. 2 is a schematic side view of the surface treatment mechanism of the automatic chip mounter of the present invention.
Fig. 3 is an enlarged partial schematic view of the area "a" in fig. 1.
Wherein, 1, a patch platform, 2, a displacement mechanism, 3, a connecting part, 4, a functional part, 5, a main channel, 6, an exhaust channel, 7, an air tap, 8, a first air supply pipe, 9, an air supply channel, 9.1 and a first cavity, 9.2, a second cavity, 10, an air supply joint, 11, an arc groove, 12, a second air supply pipe, 13, a dust-raising air tap, 14, a branch pipe, 15, a pressure stabilizing valve, 16, a filter screen, 17, a partition board, 18 and a pressure reducing valve;
m is the gap between the lower end surface of the functional part at the position of the arc-shaped groove and the patch platform;
n is the clearance between the lower terminal surface and the paster platform that the functional portion kept away from arc recess place.
Detailed Description
The invention is further described below with reference to the drawings and the detailed description.
The invention provides a surface treatment mechanism of an automatic chip mounter, which comprises a displacement mechanism 2 arranged above a chip mounting platform 1, wherein a scraper component is arranged between the displacement mechanism 2 and the chip mounting platform 1, the scraper component is suspended below the displacement mechanism 2, and the displacement mechanism 2 drives the scraper component to move along the horizontal direction, and is characterized in that: the scraper component comprises a connecting part 3 and a functional part 4, wherein the upper end of the connecting part 3 is arranged on the displacement mechanism 2, the lower end of the connecting part 3 is fixed with the upper end of the functional part 4, a gap is reserved between the lower end of the functional part 4 and the patch platform 1, a main channel 5 is arranged in the functional part 4, an exhaust channel 6 communicated with the upper end of the main channel 5 is arranged in the connecting part 3, the lower part of the main channel 5 is communicated with the environment outside the functional part 4 through the gap between the lower end of the functional part 4 and the patch platform 1, a plurality of air nozzles 7 are uniformly distributed on the inner side wall of the main channel 5, all the air nozzles 7 incline towards the position of the connecting part 3 along the horizontal direction, a first air supply pipe 8 for supplying the air nozzles 7 to jet air flow in the main channel 5 is arranged in the functional part 4, an air supply channel 9 communicated with the first air supply pipe 8 is arranged in the connecting part 3, and air supply connectors 10 communicated with the two ends of the air supply channel 9 are respectively arranged on the outer side wall of the connecting part 3 along the length direction of the connecting part.
The displacement mechanism is a mechanical arm which is in sliding fit with the guide rail and is driven by the driver to move along the horizontal direction.
The lower end face of the functional part 4 is provided with a plurality of arc grooves 11 respectively arranged on two sides of the main channel 5, the arc grooves 11 are arranged at intervals along the length direction of the connecting part 3, the functional part 4 is provided with a second air supply pipe 12 for supplying high-pressure air to the arc grooves 11, and the second air supply pipe 12 is communicated with the air supply channel 9 in the connecting part 3.
The clearance M between the lower end face of the functional part 4 at the position of the arc-shaped groove 11 and the patch platform 1 is smaller than the clearance N between the lower end face of the functional part 4 at the position far away from the arc-shaped groove 11 and the patch platform 1.
The dust-raising air nozzle 13 is arranged below all the air nozzles 7 on the inner side wall of the main channel 5, the dust-raising air nozzle 13 points to the position, corresponding to the position, of the patch platform 1 below the main channel 5, of the dust-raising air nozzle 13, and the air supply channel 9 are communicated.
The dust air tap 13 is communicated with the first air supply pipe 8 through a branch pipe 14, and a pressure stabilizing valve 15 is arranged in the branch pipe 14, so that the air pressure value of one side of the branch pipe 14 close to the first air supply pipe 8 is larger than the air pressure value of one side of the branch pipe 14 close to the dust air tap 13.
A filter screen 16 is arranged between the main channel 5 and the exhaust channel 6.
The air supply channel 9 is internally provided with a partition plate 17, the partition plate 17 divides the air supply channel 9 into a first cavity 9.1 and a second cavity 9.2, the first air supply pipe 8 is communicated with the first cavity 9.1, the second air supply pipe 12 is communicated with the second cavity 9.2, and the air supply joints 10 are respectively communicated with two ends of the first cavity 9.1.
The partition 17 is provided with a pressure reducing valve 18, and the pressure reducing valve 18 enables the air pressure value in the second cavity 9.2 to be smaller than the air pressure value in the first cavity 9.1 constantly.
The foregoing description of the preferred embodiments of the present invention is provided for illustration and is not to be construed as limiting the claims. The present invention is not limited to the above embodiments, and the specific structure thereof is allowed to be changed, and all changes made within the scope of the invention as independently claimed are within the scope of the invention.
Claims (7)
1. The utility model provides an automatic surface treatment mechanism of chip mounter, it is including locating displacement mechanism (2) of paster platform (1) top, displacement mechanism (2) and paster platform (1) between be equipped with scraper assembly, scraper assembly hang in the below of displacement mechanism (2), displacement mechanism (2) drive scraper assembly and remove its characterized in that along the horizontal direction: the scraper component comprises a connecting part (3) and a functional part (4), wherein the upper end of the connecting part (3) is arranged on a displacement mechanism (2), the lower end of the connecting part (3) is fixed with the upper end of the functional part (4), a gap is reserved between the lower end of the functional part (4) and a patch platform (1), a main channel (5) is arranged in the functional part (4), an exhaust channel (6) communicated with the upper end of the main channel (5) is arranged in the connecting part (3), the lower part of the main channel (5) is communicated with the environment outside the functional part (4) through the gap between the lower end of the functional part (4) and the patch platform (1), a plurality of air nozzles (7) are uniformly distributed on the inner side wall of the main channel (5), all the air nozzles (7) incline towards the position where the connecting part (3) is located along the horizontal direction, a first air supply pipe (8) for supplying the air nozzles (7) to jet air flow towards the main channel (5) is arranged in the functional part (4), the connecting part (3) is provided with an air supply channel (9) communicated with the two ends of the air supply channel (3) along the corresponding to the connecting part (9) and the two ends of the air supply channel (3) are communicated with the air supply channel (9);
a plurality of arc grooves (11) are respectively arranged on two sides of the main channel (5) on the lower end surface of the functional part (4), the arc grooves (11) are arranged at intervals along the length direction of the connecting part (3), a second air supply pipe (12) for supplying high-pressure air to the arc grooves (11) is arranged on the functional part (4), and the second air supply pipe (12) is communicated with the air supply channel (9) in the connecting part (3); the displacement mechanism is a mechanical arm which is in sliding fit on the guide rail.
2. The surface treatment mechanism of an automatic chip mounter according to claim 1, wherein: the clearance M between the lower end face of the position of the arc-shaped groove (11) of the functional part (4) and the patch platform (1) is smaller than the clearance N between the lower end face of the position of the arc-shaped groove (11) of the functional part (4) away from the patch platform (1).
3. The surface treatment mechanism of an automatic chip mounter according to claim 2, wherein: the dust-raising air tap (13) is arranged below all air taps (7) on the inner side wall of the main channel (5), the dust-raising air tap (13) points to the position corresponding to the position of the patch platform (1) below the main channel (5), and the dust-raising air tap (13) is communicated with the air supply channel (9).
4. A surface treatment mechanism of an automatic chip mounter according to claim 3, wherein: the dust-raising air tap (13) is communicated with the first air supply pipe (8) through a branch pipe (14), and a pressure stabilizing valve (15) is arranged in the branch pipe (14), so that the air pressure value of one side of the branch pipe (14) close to the first air supply pipe (8) is larger than the air pressure value of one side of the branch pipe (14) close to the dust-raising air tap (13).
5. The surface treatment mechanism of an automatic chip mounter according to claim 4, wherein: a filter screen (16) is arranged between the main channel (5) and the exhaust channel (6).
6. The surface treatment mechanism of an automatic chip mounter according to claim 4, wherein: the air supply channel (9) in be equipped with a baffle (17), baffle (17) are separated into first chamber (9.1) and second chamber (9.2) with air supply channel (9), first air supply pipe (8) and first chamber (9.1) intercommunication, second air supply pipe (12) and second chamber (9.2) intercommunication, air feed joint (10) respectively with the both ends intercommunication of first chamber (9.1).
7. The surface treatment mechanism of an automatic chip mounter according to claim 6, wherein: the partition plate (17) is provided with a pressure reducing valve (18), and the pressure reducing valve (18) enables the air pressure value in the second cavity (9.2) to be smaller than the air pressure value in the first cavity (9.1) constantly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711204349.7A CN107900029B (en) | 2017-11-27 | 2017-11-27 | Surface treatment mechanism of automatic chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711204349.7A CN107900029B (en) | 2017-11-27 | 2017-11-27 | Surface treatment mechanism of automatic chip mounter |
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| Publication Number | Publication Date |
|---|---|
| CN107900029A CN107900029A (en) | 2018-04-13 |
| CN107900029B true CN107900029B (en) | 2024-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711204349.7A Active CN107900029B (en) | 2017-11-27 | 2017-11-27 | Surface treatment mechanism of automatic chip mounter |
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| Country | Link |
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| CN (1) | CN107900029B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112599445B (en) * | 2020-12-13 | 2022-05-20 | 无锡英诺赛思科技有限公司 | Reverse fool-proof device for wafer of semiconductor chip mounter |
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| CN203508518U (en) * | 2013-10-21 | 2014-04-02 | 山东沃丰格瑞管业有限公司 | Molding powder removing device |
| CN106423691A (en) * | 2016-10-27 | 2017-02-22 | 长园高能电气股份有限公司 | Spray head and coating machine provided with spray head |
| CN207547176U (en) * | 2017-11-27 | 2018-06-29 | 江西合力泰科技有限公司 | The surface disposal facility of automatic placement machine |
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2017
- 2017-11-27 CN CN201711204349.7A patent/CN107900029B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10156302A (en) * | 1996-11-28 | 1998-06-16 | Towa Sangyo Kk | Dust removing device for conveyed articles |
| JPH11216507A (en) * | 1998-01-27 | 1999-08-10 | Nisshin Steel Co Ltd | Equipment and method of removing foreign matter on roll surface during operation |
| CN101455127A (en) * | 2006-05-30 | 2009-06-10 | 松下电器产业株式会社 | Atmospheric pressure plasma generating method, plasma processing method and component mounting method using same, and device using these methods |
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| CN102946970A (en) * | 2010-06-18 | 2013-02-27 | 株式会社爱瑞思 | Isolator device |
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| CN107900029A (en) | 2018-04-13 |
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