CN107895701B - Power supply device for electrostatic chuck board - Google Patents

Abstract

Provided is a power supply device for an electrostatic chuck plate, wherein a power supply unit can be more easily and appropriately connected to an electrode terminal unit formed on the side surface of the electrostatic chuck plate, and power supply or power removal for the electrostatic chuck plate can be more appropriately performed. The power supply device (100) comprises: a base portion (110); a power supply unit (120) having a pair of conductive pins (121, 122) and a pin support unit (123 (124)) that houses the base end of the pins and a spring (151 (152)) therein and supports the pins while biasing the pins by the spring, wherein the power supply unit protrudes substantially parallel to the mounting surface (110 a) by the tips of the pins contacting the electrode terminal portions (6) of the electrostatic chuck plate (1); a power supply unit that controls a voltage applied to the power supply unit; and a positioning unit (140) for positioning the electrostatic chuck plate supported by the base portion at a position corresponding to the power supply portion.

Description

Power supply device for electrostatic chuck board

technical field

The invention relates to a power supply device for an electrostatic chuck plate.

Background technique

Conventionally, there is known a technique of attaching a protective member to a workpiece when processing a workpiece such as a semiconductor wafer using various processing devices such as a CVD device, a grinding device, a laser processing device, and a tool cutting device. On the other hand, it protects the installation surface of the protection part of the workpiece or prevents the damage of the workpiece. Usually, as a protective member, adhesive tapes, such as a back grinding tape and a dicing tape, or hard substrates, such as glass or ceramics, etc. which are bonded with wax etc. are used, for example. In this way, when the protective member is attached to the workpiece with an adhesive, it takes time and effort in the process of attaching and peeling the protective member to the workpiece. In addition, a part of the protective member may be used up and thrown away.

As a protective member that does not use an adhesive, there are an electrostatic chuck plate and a vacuum chuck plate. For example, Patent Document 1 discloses an electrostatic support plate having a plate main body having a flat electrical insulating layer embedded with an electrode portion on the front surface. In this electrostatic support plate, the workpiece (wafer) is placed on the electrical insulating layer, and the first charge is supplied to the workpiece from the connection portion of the base material exposed on the upper surface of the electrical insulating layer, and to the wafer exposed on the main body of the plate. The connecting portion of the electrode portion on the lower surface supplies the second charge. Thus, an electrostatic force is generated between the workpiece and the electrical insulating layer, and the workpiece is attracted to the electrostatic support plate.

Patent Document 1: Japanese Patent Laid-Open No. 2016-051836

In the electrostatic support plate described in Patent Document 1, electrode terminals are formed on the upper surface of the plate (that is, the holding surface for holding a workpiece) or the lower surface of the plate, and a voltage is applied to the electrode terminal portions from a power supply device. However, in order to use the holding surface as wide as possible and to increase the flatness of the holding surface, it is sometimes desirable to form the electrode terminal portion on the side surface of the electrostatic chuck plate. However, since the electrostatic chuck plate is a thin plate-shaped member with a thickness of, for example, about several hundreds of μm, the electrode terminal portion formed on the side is also relatively small, and there is a problem that it is difficult to connect the power supply device and the electrode terminal portion.

Contents of the invention

The present invention has been made in view of the above circumstances, and its object is to provide a power supply device for an electrostatic chuck plate, which can make the power supply part more easily and appropriately connect to the electrode terminal part formed on the side surface of the electrostatic chuck plate, and can be more suitable. ground for power supply or static removal of the electrostatic chuck board.

In order to solve the above-mentioned problems and achieve the object, the present invention is a power supply device for an electrostatic chuck plate that applies a voltage to a bipolar electrostatic chuck plate that has a pair of electrodes formed on the side of the holding surface. The pair of electrode terminal parts connected and exposed on the side surface is characterized in that the power supply device of the electrostatic chuck plate has: a base part having a mounting surface on which the electrostatic chuck plate is placed; a power supply part, It has a pair of conductive needles and a needle supporting part. The needle supporting part accommodates the base of the needle and the spring inside, and supports the needle while using the spring to urge the needle. The power supply part utilizes the A needle is in contact with the electrode terminal portion of the electrostatic chuck plate placed on the base portion, and the tip of the needle protrudes substantially parallel to the mounting surface; a power supply portion controls the voltage applied to the power supply portion. a control; and a positioning unit, which positions the electrostatic chuck plate supported by the base part at a position corresponding to the power supply part, and the power supply part supplies voltage to the pair of needles according to a combination of positive and negative.

In addition, it is preferable that the positioning unit pushes the electrostatic chuck plate toward the needle with a force such that the spring of the power supply part is contracted but not completely compressed.

The power supply device for the electrostatic chuck plate of the present invention has the following effects: the power supply unit can be more easily and appropriately connected to the electrode terminal portion formed on the side surface of the electrostatic chuck plate, and the power supply of the electrostatic chuck plate can be more appropriately performed. Or in addition to electricity.

Description of drawings

FIG. 1 is a perspective view showing an electrostatic chuck plate according to an embodiment.

FIG. 2 is a plan view showing the electrostatic chuck plate of FIG. 1 .

Fig. 3 is a cross-sectional view along line II-II in Fig. 2 .

FIG. 4 is a perspective view showing a wafer W as a workpiece held by the electrostatic chuck plate 1 shown in FIGS. 1 to 3 .

Fig. 5 is a perspective view showing the power supply device according to the embodiment.

6 is a partial cross-sectional view showing a state where the electrostatic chuck plate is placed on the power supply device.

7 is a partial cross-sectional view showing a state where the electrostatic chuck plate is connected to a power supply unit of a power supply device.

Fig. 8 is a partially enlarged cross-sectional view showing a power supply unit.

9 is a schematic diagram schematically showing the configuration of a power supply unit and a power supply unit of the power supply device.

Label description

1: electrostatic chuck plate; 2: substrate; 2a: main surface; 2b: back; 2c: side; 2d, 2e: outer edge; 3: comb electrode; 31: positive electrode; 311, 321: branch; 311a , 321a: wide area; 311b, 321b: narrow area; 312, 322: trunk; 32: negative electrode; 4: metal layer; 5: insulating layer; 5a: inner insulating layer; 5b: outer insulating layer; 5c : holding surface; 6: electrode terminal portion; 6a: positive electrode terminal portion; 6b: negative electrode terminal portion; 100: power supply unit; 110: base portion; 110a: mounting surface; 120: power supply portion; Needle; 121a, 122a: front end; 121b, 122b: base end; 123, 124: needle supporting part; 123a, 124a: storage part; 125: fixing part; 130: power supply part; 131: first power supply part; 2 power supply part; 133: capacitance measurement circuit; 134: power supply indicator switch; 135: static elimination indicator switch; 136: control part; 140: positioning unit; 141: pushing part; 141a: pushing surface; 142: supporting part; 151, 152: springs.

Detailed ways

Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the structural elements described below include those that are easily conceived by those skilled in the art and that are actually the same. In addition, the structures described below can be appropriately combined. In addition, various omissions, substitutions, or changes in the structure can be made without departing from the spirit of the present invention.

A power supply device for an electrostatic chuck plate according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1 shows a perspective view of an electrostatic chuck plate 1 to which a voltage is applied by a power supply device of an embodiment, Fig. 2 is a top view showing the electrostatic chuck plate 1 of Fig. 1 , and Fig. 3 is along the line II-II in Fig. 2 cutaway view. FIG. 4 is a perspective view showing a wafer W as a workpiece held by the electrostatic chuck plate 1 shown in FIGS. 1 to 3 . FIG. 5 is a perspective view showing the power supply device 100 according to the embodiment.

The electrostatic chuck plate 1 is a bipolar electrode that holds a wafer W (object to be processed) shown in FIG. Type electrostatic chuck plate. In this embodiment, the wafer W is a disk-shaped semiconductor wafer or optical device wafer made of silicon, sapphire, gallium, or the like. As shown in FIG. 4 , in the wafer W, devices D are formed in each region demarcated by a plurality of intersecting dividing lines S on the front surface WS. As the device D, IC (Integrated Circuit: Integrated Circuit), LSI (Large Scale Integration: Large Scale Integration), MEMS (Micro Electro Mechanical Systems: Micro Electro Mechanical System), etc. are formed in each region. The electrostatic chuck plate 1 according to the present embodiment is used as a supporting member for supporting the wafer W in each process when performing a dicing process of dividing the wafer W into a plurality of device chips along the plurality of planned dividing lines S.

As shown in FIGS. 1 and 2 , the electrostatic chuck plate 1 according to the embodiment is formed in a disc shape. The electrostatic chuck plate 1 may also be formed in a quadrangular shape. As shown in FIG. 3, the electrostatic chuck plate 1 has: the above-mentioned substrate 2; The rear surface 2 b side opposite to the main surface 2 a ; the insulating layer 5 includes an inner insulating layer 5 a coated on the front surface (main surface 2 a, rear surface 2 b ) of the substrate 2 and an outer coating coated on the metal layer 4 an insulating layer (holding surface insulating layer) 5 b ; and an electrode terminal portion 6 connected to a pair of comb-shaped electrodes 3 . In addition, in FIG. 2 , description of the outer insulating layer 5 a is omitted for simplification of description.

The substrate 2 is a relatively hard plate-shaped substrate made of silicon, glass, quartz, or ceramics. In this embodiment, the substrate 2 is formed in a disc shape. In addition, the substrate 2 may also be formed on a flat plate. The diameter of the substrate 2 is, for example, about 300 mm, and the thickness of the substrate 2 is, for example, about 100 μm to 800 μm.

The metal layer 4 is a coating layer made of a metal material that is coated on the inner insulating layer 5 a. In the present embodiment, the metal layer 4 is formed using a polyimide film to which a metal foil is applied (for example, a copper foil polyimide film manufactured by Ube Aikeximo Co., Ltd.). As a result, metal layer 4 is formed flat along the front surface (main surface 2 a, rear surface 2 b ) of substrate 2 . For example, the metal layer 4 on the main surface 2 a side of the substrate 2 is patterned by laser ablation to form a pair of comb-shaped electrodes 3 . Furthermore, as shown in FIG. 3 , the metal layer 4 is also coated on a part of the side surface 2 c of the substrate 2 , and the metal layer 4 coated on the side surface 2 c forms the electrode terminal portion 6 . In addition, if the metal layer 4 is a coating film made of a metal material, it is not limited to a polyimide film to which a metal foil is applied. The metal layer 4 can also be coated by sputtering, for example. In addition, the metal layer 4 on the rear surface 2a side of the substrate 2 and the main surface 2a of the substrate 2 may be formed by coating the inner insulating layer 5 with a solder material made of a metal material or the like by screen printing or inkjet printing. A pair of comb-shaped electrodes 3 and an electrode terminal portion 6 on the side. In addition, a pair of comb-shaped electrodes 3 may be formed by performing photolithography on the metal layer 4 .

The pair of comb-shaped electrodes 3 has a positive electrode 31 and a negative electrode 32 . As shown in FIG. 2 , the positive electrode 31 has a plurality of branch portions 311 extending straight in one direction along the main surface 2 a of the substrate 2 , and a trunk portion 312 extending along the outer edge portion of the substrate 2 . The plurality of branch portions 311 are arranged side by side with a gap therebetween from the side of the outer edge portion 2d where the electrode terminal portion 6 is formed on the substrate 2 toward the side of the outer edge portion 2e facing each other. Each branch portion 311 is connected to the trunk portion 312 at one end. As shown in FIG. 2 , each branch portion 311 is formed in a comb-tooth shape. Wide regions 311 a and narrow regions 311 b having different electrode widths are alternately formed at a constant interval in the extending direction. In the present embodiment, the wide region 311a is formed in a circular shape protruding from the narrow region 311b.

As shown in FIG. 2 , the negative electrode 32 has a plurality of branch portions 321 extending straight in one direction along the main surface 2 a of the substrate 2 , and a trunk portion 322 extending along the outer edge of the substrate 2 . The plurality of branch portions 321 are arranged side by side with a gap therebetween from the outer edge portion 2d side of the substrate 2 toward the outer edge portion 2e side. Each branch portion 321 is connected to the trunk portion 322 at one end portion (the end portion on the side opposite to the trunk portion 312 of the positive electrode 31 ). As shown in FIG. 2 , each branch portion 321 is formed in a comb shape, and wide regions 321 a and narrow regions 321 b having different electrode widths are alternately formed at regular intervals in the extending direction. In the present embodiment, the wide region 311a is formed in a circular shape protruding from the narrow region 311b.

As shown in FIG. 2 , the positive electrode 31 and the negative electrode 32 are set so that branch portions 311 and 321 are shifted from each other and are set at intervals. That is, with respect to the positive electrode 31 and the negative electrode 32, the branch portion 311 of the positive electrode 31 and the branch portion 321 of the negative electrode 32 are directed from the side of the outer edge portion 2d on which the electrode terminal portion 6 of the substrate 2 is formed toward the outer edge portion 2d and through the substrate. The outer edge portion 2e sides facing the axial centers of 2 are arranged side by side at intervals from each other in order.

Furthermore, as shown in FIG. 2 , the narrow regions 311 b and 321 b of the other comb-shaped electrode 3 are disposed on adjacent sides of the wide-width regions 311 a and 321 a of one comb-shaped electrode 3 . That is, the wide region 321 a of the branch 321 of the negative electrode 32 is disposed between the narrow regions 311 b of the two adjacent branch portions 311 of the positive electrode 31 . Further, the wide region 311 a of the branch 311 of the positive electrode 31 is arranged between the narrow regions 321 b of the two adjacent branch portions 321 of the negative electrode 32 . Accordingly, it is possible to further fill the gap between the branch portion 311 of the positive electrode 31 and the branch portion 321 of the negative electrode 32 .

The insulating layer 5 is an insulating film covering the metal layer 4 (the pair of comb-shaped electrodes 3 ) around the substrate 2 . The insulating layer 5 is formed of, for example, polyimide resin. As shown in FIG. 3 , the insulating layer 5 has: an inner insulating layer 5a, which is coated on a part of the main surface 2a, the back surface 2b, and the side surface 2c of the substrate 2; and an outer insulating layer (holding surface insulating layer) 5b, which is coated The film is on the metal layer 4 (a pair of comb-teeth electrodes 3 ) except for the electrode terminal portion 6 . The outer insulating layer 5b forms a holding surface 5c for holding the wafer W. As shown in FIG. In the present embodiment, the inner insulating layer 5 a and the outer insulating layer 5 b are formed flat along the front surface (main surface 2 a or rear surface 2 b ) of the substrate 2 .

As shown in FIGS. 1 and 3 , the electrode terminal portion 6 is formed on the side surface 2 c of the substrate 2 . The electrode terminal portion 6 has a positive electrode terminal portion 6 a and a negative electrode terminal portion 6 b. The positive electrode terminal portion 6 a and the negative electrode terminal portion 6 b are disposed on the side surface 2 c of the substrate 2 so as to be close to each other. As shown in FIG. 2 , the positive electrode terminal portion 6 a is connected to the trunk portion 312 of the positive electrode 31 , and the negative electrode terminal portion 6 b is connected to the trunk portion 322 of the negative electrode 32 .

When holding the wafer W by the electrostatic chuck plate 1, first, the wafer W is placed on the holding surface 5c of the outer insulating layer 5b. Then, when a positive voltage is applied from the power supply device 100 to the positive electrode 31 via the positive electrode terminal portion 6a and a negative voltage is applied to the negative electrode 32 via the negative electrode terminal portion 6b, positive and negative charges are pulled to the wafer W and the positive electrode. 31 and the negative electrode 32 to generate an electrostatic force (gradient force). The wafer W is attracted to the electrostatic chuck plate 1 by this electrostatic force. In addition, in the embodiment, the voltage applied from the power supply device 100 to the pair of comb-shaped electrodes 3 via the electrode terminal portion 6 is preferably 1000V or more and 2000V or less.

Regarding the electrostatic chuck plate 1, the branch portion 311 of the positive electrode 31 constituting the pair of comb-shaped electrodes 3 has a wide region 311a and a narrow region 311b, and the branch portion 321 of the negative electrode 32 constituting the pair of comb-shaped electrodes 3 has a wide region. 321a and narrow region 321b. As a result, electric charge is intensively accumulated in the region where each branch portion 311 , 321 changes from a wide width to a narrow width. As a result, strong electrostatic force (gradient force) is generated in the region where each branch portion 311, 321 changes from wide to narrow, and the suction force for attracting wafer W can be further increased. Furthermore, even if the power supply to the pair of comb-shaped electrodes 3 is stopped, the temporarily generated charge can be maintained for a longer period of time, and the attractive force generated by the electrostatic chuck plate 1 can be maintained after the power supply is stopped. In addition, the narrow regions 311b and 321b of the other comb-shaped electrode 3 are disposed on adjacent sides of the wide-width regions 311a and 321a of one comb-shaped electrode 3 . Thus, since the space between the branch portion 311 of the positive electrode 31 and the branch portion 321 of the negative electrode 32 can be further filled and arranged, the suction force of the electrostatic chuck plate 1 can be further improved.

Next, the power supply device 100 according to the embodiment will be described with reference to the drawings. 6 is a partial sectional view showing a state where the electrostatic chuck plate 1 is placed on the power supply device 100 , and FIG. 7 is a partial sectional view showing a state where the electrostatic chuck plate 1 is connected to the power supply unit 120 of the power supply device 100 . FIG. 8 is a partially enlarged cross-sectional view showing the power supply unit 120 . FIG. 9 is a schematic diagram schematically showing the structures of the power supply unit 120 and the power supply unit 130 of the power supply device 100 .

The power supply device 100 is a power supply device that is connected to a pair of comb-toothed electrodes 3 formed on the side of the holding surface 5c and applies a voltage to the above-mentioned bipolar electrostatic chuck plate 1 having a A pair of electrode terminal portions 6 exposed to the outside. As shown in FIG. 5 , the power supply device 100 has a base unit 110 , a power supply unit 120 , a power supply unit 130 (see FIG. 9 ), and a positioning unit 140 .

As shown in FIG. 5 , in the present embodiment, the base unit 110 is formed as a quadrangular housing. The base portion 110 may also be formed as a circular housing. The base portion 110 has a mounting surface 110 a on which the electrostatic chuck plate 1 is mounted. Furthermore, the base unit 110 accommodates the power supply unit 130 therein.

The power supply part 120 is connected to the positive electrode terminal part 6a and the negative electrode terminal part 6b of the electrostatic chuck plate 1 placed on the mounting surface 110a of the base part 110, and the power supply part 120 applies the voltage from the power supply part 130 to the Electrostatic chuck plate 1. As shown in FIG. 5 , the power supply unit 120 is arranged near one outer edge of the base unit 110 . The power supply part 120 has: a pair of conductive needles 121, 122; a pair of conductive needle support parts 123, 124, which support the pair of needles 121, 122; and a fixing part 125, which supplies the needle support part 123, 124 fixed.

The pair of needles 121 and 122 are contact terminals of a contact detection type, and they are formed of metal. In the present embodiment, the pair of needles 121 and 122 are formed of a nickel alloy whose surface is gold-plated. The diameter of the pair of needles 121 and 122 is about 0.9 mm to 1.5 mm, and the positive electrode terminal portion 6 a and the negative electrode terminal portion 6 b can be brought into good contact. As shown in FIG. 9 , in this embodiment, the needle 121 is connected to the positive electrode terminal 6 a of the electrostatic chuck plate 1 , and the needle 122 is connected to the negative electrode terminal 6 b.

As shown in FIGS. 6 and 7 , the pair of needles 121 , 122 extend from the fixing portion 125 side toward the center side of the base portion 110 substantially parallel to the mounting surface 110 a of the base portion 110 . That is, the front ends (contact ends) 121 a and 122 a of the needles 121 and 122 protrude substantially parallel to the mounting surface 110 a of the base part 110 from the fixing part 125 side. As shown in FIG. 8 , the front end 121 a of the needle 121 is recessed in an inverted conical shape toward the base end 121 b side. Furthermore, as shown in FIG. 8 , the tip 122a of the needle 122 is recessed in an inverted conical shape toward the base end 122b side. However, the shape of the tip 121a, 122a of the needle 121, 122 may be any shape such as a triangular pyramid, a cone, a crown shape, or the like.

The pair of needle support parts 123 and 124 are socket-type cylindrical support members formed of metal. In the present embodiment, the pair of needle supports 123 and 124 are formed of a nickel alloy whose surface is gold-plated. As shown in FIG. 8 , one end sides of the pair of needle supporting parts 123 and 124 are fixed to the fixing part 125 . The pair of needle support portions 123 and 124 are arranged at substantially the same interval as the interval between the positive electrode terminal portion 6 a and the negative electrode terminal portion 6 b of the electrostatic chuck plate 1 . In this embodiment, as shown in FIG. 9 , a pair of needle supports 123 and 124 can be connected to a power supply unit 130 , and a DC voltage from the power supply unit 130 is applied to the pair of needle supports 123 and 124 .

As shown in FIG. 8 , the needle support portion 123 has an accommodating portion 123 a that is opened at the other end on the opposite side to the fixing portion 125 and extends inside in the axial direction. The needle 121 is fitted into the accommodating portion 123a so as to be freely movable in the axial direction from the base end (root portion) 121b side thereof. Furthermore, a spring (coil spring) 151 for urging the needle 121 toward the side opposite to the fixing portion 125 is housed in the housing portion 123 a of the needle supporting portion 123 . As a result, the needle 121 is supported by the needle supporting portion 123 so as to be freely movable in the axial direction while being biased toward the side opposite to the fixing portion 125 by the spring 151 . In addition, in the example shown in FIG. 8, the spring 151 is disposed between the base end 121b of the needle 121 and the bottom of the housing portion 123a of the needle supporting portion 123, but the spring 151 only needs to face the needle 121 to the side opposite to the fixing portion 125. If it is biased sideways, it may be arranged at any position in the storage portion 123a.

As shown in FIG. 8 , the needle support portion 124 has an accommodating portion 124 a that is opened at the other end on the opposite side to the fixing portion 125 and extends inside in the axial direction. The needle 122 is fitted into the accommodating portion 124a so as to be freely movable in the axial direction from the base end (root portion) 122b side thereof. In addition, a spring (coil spring) 152 for urging the needle 122 toward the side opposite to the fixing portion 125 is accommodated in the housing portion 124 a of the needle supporting portion 124 . Thus, the needle 122 is supported by the needle support portion 124 so as to be freely movable in the axial direction while being biased by the spring 152 toward the side opposite to the fixed portion 125 . In addition, in the example shown in FIG. 8 , the spring 152 is disposed between the base end 122 b of the needle 122 and the bottom of the housing portion 124 a of the needle supporting portion 124 , but the spring 152 only needs to face the needle 122 opposite to the fixed portion 125 . If it is biased sideways, it may be arranged at any position in the storage portion 124a. In addition, the springs 151 and 152 are not limited to coil springs, and may be leaf springs or Belleville springs.

The power supply unit 130 is a power supply source that applies a positive DC voltage V(+) or a negative DC voltage V(−) to the pair of needles 121 and 122 via the needle support units 123 and 124 of the power supply unit 120 . The power supply unit 130 controls the DC voltage applied to the power supply unit 120 . That is, the power supply unit 130 can supply (apply) voltage to the pair of needles 121 , 122 via the needle support portions 123 , 124 in combination of positive and negative. The power supply unit 130 is accommodated inside the base unit 110 .

As shown in Figure 9, the power supply unit 130 has: a first power supply unit 131 and a second power supply unit 132; a switching element SW1 connected to the first power supply unit 131; a switching element SW2 connected to the second power supply unit 132; a capacitor Measuring circuit 133, which is arranged between the first power supply unit 131 and the second power supply unit 132; power supply indicating switch 134 and static elimination indicating switch 135 (refer to FIG. and the control unit 136 controls the overall operation of the power supply unit 130 .

The first power supply unit 131 and the second power supply unit 132 are DC power supply devices capable of changing an output voltage from a positive DC voltage V(+) to a negative DC voltage V(−). In this embodiment, the negative electrode of the first power supply unit 131 is connected to the reference potential source, and the positive electrode of the second power supply unit 132 is connected to the reference potential source.

The switch element SW1 is an on-off switch capable of connecting and disconnecting the positive electrode side of the first power supply unit 131 and the needle support unit 123 . The switch element SW2 is an on-off switch capable of connecting and disconnecting the negative electrode side of the second power supply unit 132 and the needle support unit 124 . The switching elements SW1 and SW2 are controlled to be turned on and off by the control unit 136 .

Capacitance measurement circuit 133 is a circuit that measures the value of charge accumulated in a capacitor (not shown) arranged at an arbitrary position between first power supply unit 131 and second power supply unit 132 . The control unit 136 determines whether the pair of needles 121 and 122 of the power supply unit 120 are in contact with the electrode terminal portion 6 of the electrostatic chuck plate 1 based on the measurement result of the capacitance measurement circuit 133 (that is, the value of the charge accumulated in the capacitor not shown). determination. In addition, the capacitance measurement circuit 133 may be omitted from the power supply unit 130 .

As shown in FIG. 5 , the power supply instruction switch 134 and the static elimination instruction switch 135 are push-type switches provided on the mounting surface 110 a of the base unit 110 . The power supply instruction switch 134 and the static elimination instruction switch 135 are connected to the control unit 136 . When the operator turns on the power supply instruction switch 134 , a power supply instruction signal for supplying power to the electrostatic chuck plate 1 is output to the control unit 136 . When the operator turns on the charge removal instruction switch 135 , a charge removal instruction signal for carrying out charge removal from the electrostatic chuck plate 1 is output to the control unit 136 .

The control unit 136 controls the output voltages of the first power supply unit 131 and the second power supply unit 132 according to the power supply instruction signal from the power supply instruction switch 134, the static elimination instruction signal from the static elimination instruction switch 135, and the measurement result of the capacitance measurement circuit 133. Control and perform on-off control of the switching elements SW1 and SW2. The control of the first power supply unit 131 , the second power supply unit 132 , and the switching elements SW1 and SW2 by the control unit 136 will be described in detail later.

The positioning unit 140 positions the electrostatic chuck plate 1 supported by the base part 110 at a position corresponding to the power supply part 120 . As shown in FIG. 5 , the positioning unit 140 is provided in the vicinity of one outer edge portion of the base portion 110 to face the power supply portion 120 . The positioning unit 140 has: a pressing part 141 that pushes the electrostatic chuck plate 1 placed on the mounting surface 110 a of the base part 110 toward the power supply part 120 side; and a support part 142 that pushes the pressing part 141 The support is free sliding.

In the present embodiment, as shown in FIG. 5 , the pressing portion 141 has a pressing surface 141a curved along the side surface (the side surface 2c of the substrate 2 ) of the disc-shaped electrostatic chuck plate 1 . Accordingly, the electrostatic chuck plate 1 can be stably pressed toward the power supply unit 120 side by the pressing unit 141 . In addition, when the electrostatic chuck plate 1 is formed in a flat plate shape, the pressing surface 141 a may be formed as a vertical surface along the side surface of the electrostatic chuck plate 1 . The pressing part 141 is supported by the supporting part 142 so as to be movable toward the power feeding part 120 side by a predetermined distance.

Next, the procedure when the electrostatic chuck plate 1 is powered by the power supply device 100 configured as described above and the operation of the power supply device 100 will be described. When power is supplied to the electrostatic chuck plate 1 from the power supply device 100 , first, the surface of the electrostatic chuck plate 1 on the back side 2 b side is placed on the mounting surface 110 a of the base unit 110 manually by an operator. At this time, as shown in FIGS. 5 and 6 , the side surface 2 c of the electrostatic chuck plate 1 is brought into contact with the pressing surface 141 a of the pressing portion 141 of the positioning unit 140 . Furthermore, the rotation angle of the electrostatic chuck plate 1 is positioned so that the positive power supply terminal 6 a and the negative power supply terminal 6 b of the electrostatic chuck plate 1 face the needles 121 and 122 of the power supply unit 120 directly.

Various methods are considered regarding the positioning of the rotation angle of the electrostatic chuck plate 1 . For example, marks may be provided on the placement surface 110 a corresponding to positions where the positive power supply terminal 6 a and the negative power supply terminal 6 b face the needles 121 and 122 of the power supply unit 120 directly to the ground. In addition, a rotary table may be provided on the mounting surface 110a of the base portion 110 in advance, the electrostatic chuck plate 1 may be placed on the rotary table, and the rotary table may be rotated to feed power to the positive power supply terminal 6a and the negative electrode. The terminal 6b is in a position facing the needles 121, 122 directly to the ground. In addition, the electrostatic chuck plate 1 may be placed in a predetermined orientation (orientation in which the positive power supply terminal 6a, the negative power supply terminal 6b and the needles 121, 122 face each other) by automatic control using a robot arm or the like. on the mounting surface 110 a of the base unit 110 .

Then, the pressing part 141 of the positioning unit 140 is automatically moved toward the power supply part 120 side (in the direction of the solid arrow shown in FIGS. 5 and 6 ) by manual operation by an operator or by using a robot arm or the like. As a result, as shown in FIG. 7, the electrostatic chuck plate 1 is pushed toward the power supply unit 120 side by the pressing portion 141 of the positioning unit 140, the positive electrode terminal portion 6a comes into contact with the needle 121 of the power supply unit 120, and the negative electrode terminal The portion 6 b is in contact with the needle 122 of the power supply portion 120 .

As described above, the spring 151 is disposed between the needle 121 and the needle support portion 123 , and the spring 152 is disposed between the needle 122 and the needle support portion 124 . As a result, the springs 151 and 152 can relieve the impact when the electrostatic chuck plate 1 comes into contact with the needles 121 and 122 . Therefore, the needles 121, 122 can be better protected. Furthermore, in the present embodiment, the pressing portion 141 presses the electrostatic chuck plate 1 toward the needles 121 , 122 with a force such that the springs 151 , 152 are contracted but not completely compressed. That is, after the positive electrode terminal 6 a contacts the needle 121 and the negative electrode terminal 6 b contacts the needle 122 , the maximum moving distance of the pressing part 141 toward the power supply part 120 is smaller than the maximum contraction of the springs 151 , 152 . Thereby, the needles 121 and 122 can be protected more reliably.

Next, as shown in FIG. 7 , the wafer W is placed on the holding surface 5 c of the electrostatic chuck plate 1 . In addition, before placing the electrostatic chuck plate 1 on the base portion 110 of the power supply device 100 , the wafer W may be placed on the holding surface 5 c of the electrostatic chuck plate 1 in advance. Then, the power supply instructing switch 134 is turned on by an operator's manual operation. Accordingly, a power supply instruction signal is output from the power supply instruction switch 134 to the control unit 136 of the power supply unit 130 . When a power supply instruction signal is input from the power supply instruction switch 134 , the control unit 136 starts power supply to the electrostatic chuck plate 1 from the power supply unit 130 . First, the control unit 136 turns on the switching elements SW1 and SW2 to check whether the positive electrode terminal 6 a is in contact with the needle 121 and the negative electrode terminal 6 b is in contact with the needle 122 based on the measurement result of the capacitance measurement circuit 133 .

When the control part 136 confirms that the positive electrode terminal part 6a is in contact with the needle 121 and the negative electrode terminal part 6b is in contact with the needle 122, the first power supply part 131 is controlled so as to output a positive DC voltage V (+), and the second power supply The unit 132 is controlled so as to output a negative DC voltage V(−). Thus, the positive DC voltage V(+) from the first power supply unit 131 is applied to the positive electrode terminal portion 6a of the electrostatic chuck plate 1 via the needle supporting portion 123 and the needle 121 of the power supply unit 120 , and The needle supporting portion 124 and the needle 122 apply a negative DC voltage V(−) from the second power supply portion 132 to the negative electrode terminal portion 6 b of the electrostatic chuck plate 1 . As a result, positive and negative charges are pulled between the wafer W and the positive electrode 31 and the negative electrode 32 to generate an electrostatic force (gradient force), and the wafer W is attracted by the electrostatic chuck plate 1 . The control unit 136 supplies power from the power supply unit 130 to the electrostatic chuck plate 1 at a predetermined time.

When the power supply from the power supply unit 130 to the electrostatic chuck plate 1 is supplied for a predetermined time and sufficient positive and negative charges are accumulated between the wafer W and the positive electrode 31 and the negative electrode 32, the control unit 136 stops the power supply from the power supply unit 130. power supply. The control unit 136 stops the voltage application by the first power supply unit 131 and the second power supply unit 132 , and turns off the switching elements SW1 and SW2 . In addition, it is also possible to stop the power supply to the electrostatic chuck plate 1 through the operator's manual operation, for example, stop the power supply when the power supply indicating switch 134 is pressed again.

Thereafter, the pressing part 141 is moved to the side opposite to the power feeding part 120 (support part 142 side) by manual operation by an operator or using a robot arm or the like. Thus, the pressing of the electrostatic chuck plate 1 toward the power supply unit 120 by the pressing unit 141 is released, and the electrostatic chuck plate 1 and wafer W can be automatically transferred from the base unit 110 by manual operation or a robot arm.

Next, the procedure when the electrostatic chuck plate 1 is neutralized by the power supply device 100 and the operation of the power supply device 100 will be described. When the electrostatic chuck plate 1 is neutralized by the power supply device 100 , the electrostatic chuck plate 1 holding the wafer W by suction on the holding surface 5 c is placed on the mounting surface 110 a of the base unit 110 . Then, the pressing part 141 of the positioning unit 140 is moved toward the power supply part 120, as shown in FIG. 6b is in contact with the needle 122 of the power supply unit 120 .

Next, the charge removal instruction switch 135 is turned on. Accordingly, a static elimination instruction signal is output from the static elimination instruction switch 135 to the control unit 136 . When a static elimination instruction signal is input from the static elimination instruction switch 135 , the control unit 136 starts the static elimination of the electrostatic chuck plate 1 . First, the control unit 136 turns on the switching elements SW1 and SW2 to check whether the positive electrode terminal 6 a is in contact with the needle 121 and the negative electrode terminal 6 b is in contact with the needle 122 based on the measurement result of the capacitance measurement circuit 133 .

When the control part 136 confirms that the positive electrode terminal part 6a is in contact with the needle 121 and the negative electrode terminal part 6b is in contact with the needle 122, the first power supply part 131 is controlled so as to output a negative DC voltage V(-), and the second power supply The unit 132 is controlled so as to output a positive DC voltage V(+). Thus, the negative direct current voltage V(−) from the first power supply unit 131 is applied to the positive electrode terminal portion 6a of the electrostatic chuck plate 1 via the needle supporting portion 123 and the needle 121 of the power supply unit 120 , and The needle supporting portion 124 and the needle 122 apply the positive DC voltage V(+) from the second power supply portion 132 to the negative electrode terminal portion 6 b of the electrostatic chuck plate 1 . As a result, the charges accumulated between the wafer W and the positive electrode 31 and the negative electrode 32 are removed, and the suction of the wafer W by the electrostatic chuck plate 1 is released.

As described above, the power supply device 100 of the embodiment is a power supply device 100 for an electrostatic chuck plate that applies voltage to a bipolar electrostatic chuck plate 1, and the electrostatic chuck plate has a side formed on the side of the holding surface 5c. The pair of electrode terminal portions 6 connected to the comb-toothed electrodes 3 and exposed on the side surface 2c side, the power supply device 100 has: a base portion 110 having a mounting surface 110a on which the electrostatic chuck plate 1 is mounted; a power supply portion 120, which has a pair of conductive needles 121, 122 and a needle support portion 123 (124), the front end 121a (122a) of the needle 121 (122) protrudes substantially parallel to the mounting surface 110a, and the needle support portion 123 ( 124) Store the base end (root) 121b (122b) of the needle 121 (122) and the spring 151 (152) inside, and press the needle 121 (122) while using the spring 151 (152) to force the needle 121 (122). For supporting, the power supply unit 120 is in contact with the electrode terminal part 6 of the electrostatic chuck plate 1 placed on the base part 110 by using the needle 121 (122); control; and a positioning unit 140, which positions the electrostatic chuck plate 1 supported by the base part 110 at a position corresponding to the power supply part 120, and the power supply part 130 supplies voltage to the pair of needles 121, 122 according to the combination of positive and negative.

Accordingly, the electrostatic chuck plate 1 can be moved to a position corresponding to the power supply unit 120 (that is, a position where the electrode terminal unit 6 is in contact with the needles 121 and 122 ) by the positioning unit 140 . As a result, the positive electrode terminal portion 6 a and the needle 121 and the negative electrode terminal portion 6 b and the needle 122 can be easily brought into contact. Furthermore, since the tips 121a, 122a of the needles 121, 122 protrude approximately parallel to the mounting surface 110a, the electrode terminal portion 6 formed on the side surface 2c of the electrostatic chuck plate 1 can be brought into more stable contact with the needles 121, 122. Furthermore, a spring 151 is disposed between the needle 121 and the needle support portion 123 , and a spring 152 is disposed between the needle 122 and the needle support portion 124 . As a result, the springs 151 and 152 can relieve the impact when the electrostatic chuck plate 1 comes into contact with the needles 121 and 122 . As a result, the needles 121, 122 can be better protected. And, the power supply unit 130 supplies voltages to the pair of needles 121, 122 according to the combination of positive and negative (a positive DC voltage V(+) is applied to one of the needles 121, 122, and a negative DC voltage V(-) is applied to the other. ). Thereby, the positive and negative voltages applied to the positive electrode terminal portion 6 a and the negative electrode terminal portion 6 b of the electrostatic chuck plate 1 via the needles 121 and 122 can be switched, and the electrostatic chuck plate 1 can be powered or neutralized. Therefore, according to the power supply device 100 of the electrostatic chuck plate 1 of the embodiment, the power supply unit 120 can be more easily and appropriately connected to the electrode terminal portion 6 formed on the side surface 2c of the electrostatic chuck plate 1, and electrostatic discharge can be performed more appropriately. Power supply or static elimination of chuck board 1.

Then, the positioning unit 140 presses the electrostatic chuck plate 1 against the needles 121 and 122 with a force to the extent that the springs 151 and 152 of the power supply unit 120 are contracted but not completely compressed. Accordingly, the springs 151 and 152 can reliably absorb the impact when the electrostatic chuck plate 1 comes into contact with the needles 121 and 122 . Therefore, the needles 121, 122 can be protected more reliably.

As described above, the electrostatic chuck plate 1 can maintain the attractive force for attracting the wafer W well even after the power supply is stopped. That is, it is not necessary to provide a power supply device in each of the devices used for dicing the wafer W and forming a modified layer inside it with laser beams, and it is not necessary to supply power when the wafer W is transported. In various processes such as laser processing of laser processing, grinding and thinning of the front surface. In this way, the power supply device 100 of this embodiment is preferable for power supply and static elimination of the electrostatic chuck plate 1 that can maintain the suction force for attracting the wafer W well even after the power supply is stopped. However, as long as the electrostatic chuck plate as the object of power supply (static elimination) of the power supply device 100 has a positive electrode terminal portion and a negative electrode terminal portion formed close to each other on the side surface, it is not limited to the electrostatic chuck plate shown in FIGS. 1 to 3 . Chuck plate 1.

Furthermore, in this embodiment, the pressing part 141 of the positioning unit 140 is automatically moved by manual operation by an operator or using a robot arm, but the structure and operation of the positioning unit 140 are not limited thereto. For example, the positioning unit 140 may also be a unit that is driven and controlled by the control unit 136 of the power supply unit 130 including a driving unit, wherein the driving unit has a driving source such as a motor and transmits force from the driving source to the pressing unit. 141 transfer agencies. In this case, for example, when the operator turns on the power supply instructing switch 134 or the static elimination instructing switch 135 , the control unit 136 may drive and control the driving unit to move the pressing unit 141 to the power supply unit 120 side. In addition, the control unit 136 may drive and control the drive unit to move the pressing unit 141 to the side opposite to the power supply unit 120 according to the timing when the electrostatic chuck plate 1 is supplied with electricity or neutralized.

Furthermore, the power supply device 100 may include a separation pressing unit (not shown) capable of pressing the electrostatic chuck plate 1 toward the positioning unit 140 side (that is, the side separated from the power supply unit 120 ). The separation pressing units can be provided, for example, on both sides of the power supply unit 120 . The separation pressing unit may have, for example, a pressing portion freely movable toward the positioning unit 140 , and the pressing portion has a pressing surface that is reversely curved with respect to the side surface 2 c of the substrate 2 of the electrostatic chuck plate 1 . Thus, the electrostatic chuck plate 1 can be moved to the positioning unit 140 side by pushing the electrostatic chuck plate 1 released from the pressing of the positioning unit 140 on the power supply unit 120 side by the pressing portion of the separating pressing unit. The electrostatic chuck plate 1 is separated from the pair of needles 121 , 122 . Compared with the case where the electrostatic chuck plate 1 is separated from the pair of needles 121 , 122 by manual operation, the pair of needles 121 , 122 can be better protected. In addition, the pressing part of the separation pressing unit may be moved manually by an operator, or may be moved automatically using a robot arm or the like. In addition, a driving mechanism for moving the pressing portion may be provided on the separation pressing unit itself, and the driving mechanism may be controlled by the control unit 136 .

Claims (2)

1. A power supply device for an electrostatic chuck plate, which applies a voltage to a bipolar electrostatic chuck plate having a pair of electrodes connected to a pair of electrodes formed on a holding surface side and exposed on a side surface terminal section, characterized in that, The power supply device of the electrostatic chuck board has: a base portion having a mounting surface on which the electrostatic chuck plate is mounted; The power supply part has a pair of conductive needles and a needle support part. The needle support part accommodates the base of the needle and the spring inside, and supports the needle while using the spring to urge the needle. contacting the electrode terminal portion of the electrostatic chuck plate placed on the base portion with the needle, the tip of the needle protruding substantially parallel to the mounting surface; a power supply section that controls the voltage applied to the power supply section; and a positioning unit, which positions the electrostatic chuck plate supported by the base portion at a position corresponding to the power supply portion, The power supply unit supplies voltage to the pair of needles according to the combination of positive and negative, The power supply unit is disposed near an outer edge of the base portion on the mounting surface of the base portion, The positioning unit is provided in the vicinity of an outer edge of the base portion to face the power supply portion on the mounting surface of the base portion. 2. The power supply device of the electrostatic chuck plate according to claim 1, characterized in that, The positioning unit pushes the electrostatic chuck plate toward the needle with a force to the extent that the spring of the power supply part is contracted but not fully compressed.

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