CN107895701B - Power supply device of electrostatic chuck plate - Google Patents
Power supply device of electrostatic chuck plate Download PDFInfo
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- CN107895701B CN107895701B CN201710896577.9A CN201710896577A CN107895701B CN 107895701 B CN107895701 B CN 107895701B CN 201710896577 A CN201710896577 A CN 201710896577A CN 107895701 B CN107895701 B CN 107895701B
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- electrostatic chuck
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Abstract
Provided is a power supply device for an electrostatic chuck plate, wherein a power supply unit can be more easily and appropriately connected to an electrode terminal unit formed on the side surface of the electrostatic chuck plate, and power supply or power removal for the electrostatic chuck plate can be more appropriately performed. The power supply device (100) comprises: a base portion (110); a power supply unit (120) having a pair of conductive pins (121, 122) and a pin support unit (123 (124)) that houses the base end of the pins and a spring (151 (152)) therein and supports the pins while biasing the pins by the spring, wherein the power supply unit protrudes substantially parallel to the mounting surface (110 a) by the tips of the pins contacting the electrode terminal portions (6) of the electrostatic chuck plate (1); a power supply unit that controls a voltage applied to the power supply unit; and a positioning unit (140) for positioning the electrostatic chuck plate supported by the base portion at a position corresponding to the power supply portion.
Description
Technical Field
The present invention relates to a power supply device for an electrostatic chuck plate.
Background
Conventionally, the following techniques have been known: when a workpiece such as a semiconductor wafer is processed by using a CVD apparatus, a grinding apparatus, a laser processing apparatus, a tool cutting apparatus, or other processing apparatuses, a protective member is attached to the workpiece to protect a mounting surface of the protective member of the workpiece or prevent breakage of the workpiece. In general, for example, a bonding tape such as a back grinding tape or a dicing tape, a hard substrate such as glass or ceramic bonded with wax, or the like is used as the protective member. In this way, when the protective member is attached to the workpiece by the adhesive, it takes time and effort to attach and detach the protective member to and from the workpiece. Further, a part of the protective member may be used up and discarded.
As a protective member that does not use an adhesive, there are an electrostatic chuck plate and a vacuum chuck plate. For example, patent document 1 discloses an electrostatic support plate having a plate body with a flat electrically insulating layer in which an electrode portion is buried on the front surface. The electrostatic support plate is configured such that a workpiece (wafer) is placed on an electrically insulating layer, and a 1 st charge is supplied to the workpiece from a connection portion of a base material exposed on an upper surface of the electrically insulating layer, and a 2 nd charge is supplied to a connection portion of an electrode portion exposed on a lower surface of a plate main body. Thereby, an electrostatic force is generated between the workpiece and the electrically insulating layer, and the workpiece is attracted to the electrostatic support plate.
Patent document 1: japanese patent laid-open publication 2016-051836
The electrostatic support plate described in patent document 1 has an electrode terminal portion formed on an upper surface of a plate (i.e., a holding surface for holding a workpiece) or a lower surface of the plate, and a voltage is applied to the electrode terminal portion from a power supply device. However, in order to use the holding surface as widely as possible and to improve the flatness of the holding surface, it is sometimes desirable to form the electrode terminal portion on the side surface of the electrostatic chuck plate. However, since the electrostatic chuck plate is a thin plate-like member having a thickness of, for example, about several hundreds of μm, the electrode terminal portions formed on the side surfaces are also relatively small, and there is a problem in that the power supply device and the electrode terminal portions are not easily connected.
Disclosure of Invention
The present invention has been made in view of the above-described circumstances, and an object thereof is to provide a power supply device for an electrostatic chuck plate, which can make it easier and appropriate to connect a power supply portion to an electrode terminal portion formed on a side surface of the electrostatic chuck plate, and which can perform power supply and power removal for the electrostatic chuck plate more appropriately.
In order to solve the above-described problems and achieve the object, the present invention provides a power supply device for an electrostatic chuck plate, which applies a voltage to a bipolar electrostatic chuck plate having a pair of electrode terminal portions connected to a pair of electrodes formed on a holding surface side and exposed on a side surface side, the power supply device comprising: a base portion having a mounting surface for mounting the electrostatic chuck plate; a power supply unit having a pair of conductive pins and a pin support unit that houses a root portion of the pin and a spring therein and supports the pin while biasing the pin by the spring, the power supply unit being configured to contact the electrode terminal portion of the electrostatic chuck plate mounted on the base unit with the pin, and a tip end of the pin protruding substantially parallel to the mounting surface; a power supply unit that controls a voltage applied to the power supply unit; and a positioning unit that positions the electrostatic chuck plate supported by the base portion at a position corresponding to the power supply portion, the power supply portion supplying a voltage to the pair of pins in a positive-negative combination.
Further, the positioning means preferably presses the electrostatic chuck plate against the needle with a force of such a degree that the spring of the power supply portion is contracted but not fully compressed.
The power supply device of the electrostatic chuck plate has the following effects: the power supply portion can be more easily and appropriately connected to the electrode terminal portion formed on the side surface of the electrostatic chuck plate, and the power supply and the power removal of the electrostatic chuck plate can be more appropriately performed.
Drawings
Fig. 1 is a perspective view illustrating an electrostatic chuck plate of an embodiment.
Fig. 2 is a top view illustrating the electrostatic chuck plate of fig. 1.
Fig. 3 is a sectional view taken along line II-II in fig. 2.
Fig. 4 is a perspective view showing a wafer W as a workpiece held by the electrostatic chuck plate 1 shown in fig. 1 to 3.
Fig. 5 is a perspective view showing the power supply device of the embodiment.
Fig. 6 is a partial cross-sectional view showing a state in which an electrostatic chuck plate is mounted on a power supply device.
Fig. 7 is a partial cross-sectional view showing a state after the electrostatic chuck plate is connected to the power supply portion of the power supply device.
Fig. 8 is an enlarged partial cross-sectional view showing the power supply portion.
Fig. 9 is a schematic diagram schematically showing the structures of a power supply section and a power supply section of the power supply device.
Description of the reference numerals
1: an electrostatic chuck plate; 2: a substrate; 2a: a main surface; 2b: a back surface; 2c: a side surface; 2d, 2e: an outer edge portion; 3: comb electrodes; 31: a positive electrode; 311. 321: a support; 311a, 321a: a wide area; 311b, 321b: a narrow area; 312. 322: a main body; 32: a negative electrode; 4: a metal layer; 5: an insulating layer; 5a: an inner insulating layer; 5b: an outer insulating layer; 5c: a holding surface; 6: an electrode terminal part; 6a: a positive electrode terminal portion; 6b: a negative electrode terminal portion; 100: a power supply device; 110: a base portion; 110a: a mounting surface; 120: a power supply unit; 121. 122: a needle; 121a, 122a: a front end; 121b, 122b: a base end; 123. 124: a needle support; 123a, 124a: a storage section; 125: a fixing part; 130: a power supply section; 131: a 1 st power supply unit; 132: a 2 nd power supply unit; 133: a capacitance measurement circuit; 134: a power supply indication switch; 135: a power-off indication switch; 136: a control unit; 140: a positioning unit; 141: a pressing part; 141a: a pressing surface; 142: a support section; 151. 152: and (3) a spring.
Detailed Description
The mode (embodiment) for carrying out the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the following embodiments. The following components include substantially the same structures as those easily understood by those skilled in the art. The following structures may be appropriately combined. Various omissions, substitutions and changes in the structure may be made without departing from the spirit of the invention.
A power supply device for an electrostatic chuck plate according to an embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view showing an electrostatic chuck plate 1 to which a voltage is applied by a power supply device of an embodiment, fig. 2 is a plan view showing the electrostatic chuck plate 1 of fig. 1, and fig. 3 is a sectional view taken along line II-II in fig. 2. Fig. 4 is a perspective view showing a wafer W as a workpiece held by the electrostatic chuck plate 1 shown in fig. 1 to 3. Fig. 5 is a perspective view showing the power supply device 100 according to the embodiment.
The electrostatic chuck plate 1 is a bipolar electrostatic chuck plate for holding a wafer W (workpiece) shown in fig. 4 by a pair of comb-teeth electrodes 3 provided on the main surface 2a (see fig. 3) side of a plate-like substrate 2. In the present embodiment, the wafer W is a disk-shaped semiconductor wafer or an optical device wafer using silicon, sapphire, gallium, or the like as a raw material. As shown in fig. 4, the wafer W has devices D formed in regions of the front surface WS, which are divided by a plurality of intersecting lines S. As the device D, an IC (Integrated Circuit: integrated circuit), an LSI (Large Scale Integration: large scale integrated circuit), a MEMS (Micro Electro Mechanical Systems: microelectromechanical system), and the like are formed in each region. When a dicing process of dividing the wafer W into a plurality of device chips along a plurality of lines S is performed, the electrostatic chuck plate 1 of the present embodiment is used as a support member for supporting the wafer W in each process.
As shown in fig. 1 and 2, the electrostatic chuck plate 1 of the embodiment is formed in a disk shape. The electrostatic chuck plate 1 may be formed in a quadrangular shape. As shown in fig. 3, the electrostatic chuck plate 1 has: the substrate 2; a metal layer 4 including the pair of comb-teeth electrodes (electrode circuits) 3, the metal layer 4 being coated on the main surface 2a side of the substrate 2 and the back surface 2b side opposite to the main surface 2 a; an insulating layer 5 including an inner insulating layer 5a coated on the front surface (main surface 2a, back surface 2 b) of the substrate 2 and an outer insulating layer (holding surface insulating layer) 5b coated on the metal layer 4; and an electrode terminal portion 6 connected to the pair of comb-teeth electrodes 3. In fig. 2, the outer insulating layer 5a is omitted for simplicity of description.
The substrate 2 is a relatively hard plate-like substrate made of silicon, glass, quartz, or ceramic. In the present embodiment, the substrate 2 is formed in a disk shape. The substrate 2 may be formed on a flat plate. The diameter of the substrate 2 is, for example, about 300mm, and the thickness of the substrate 2 is, for example, about 100 μm to 800 μm.
The metal layer 4 is a film layer made of a metal material and formed on the inner insulating layer 5 a. In this embodiment, the metal layer 4 is formed using a polyimide film (for example, a copper foil polyimide film manufactured by the company algomo corporation, department of astro) to which a metal foil is applied. Thus, the metal layer 4 is formed flat along the front surface (the main surface 2a, the rear surface 2 b) of the substrate 2. The metal layer 4 on the main surface 2a side of the substrate 2 is patterned by, for example, laser ablation to form a pair of comb-teeth electrodes 3. As shown in fig. 3, the metal layer 4 is also coated on a part of the side surface 2c of the substrate 2, and the electrode terminal portion 6 is formed by coating the metal layer 4 on the side surface 2c. In addition, if the metal layer 4 is a film made of a metal material, it is not limited to a polyimide film to which a metal foil is applied. The metal layer 4 may be coated by sputtering, for example. Further, a metal layer 4 on the back surface 2a side of the substrate 2, a pair of comb-teeth electrodes 3 on the main surface 2a side of the substrate 2, and an electrode terminal portion 6 may be formed by coating a solder material made of a metal material or the like on the inner insulating layer 5 by screen printing or ink-jet printing. Further, the pair of comb-teeth electrodes 3 may be formed by performing photolithography on the metal layer 4.
The pair of comb-teeth electrodes 3 has a positive electrode 31 and a negative electrode 32. As shown in fig. 2, the positive electrode 31 includes: a plurality of branch portions 311 extending straight in one direction along the main surface 2a of the substrate 2; and a trunk portion 312 extending along an outer edge portion of the substrate 2. The plurality of branch portions 311 are arranged side by side with a gap from the outer edge portion 2d side of the substrate 2 where the electrode terminal portion 6 is formed toward the opposite outer edge portion 2e side. Each leg 311 is connected to the trunk 312 at one end. As shown in fig. 2, each of the branch portions 311 is formed in a comb-tooth shape. The wide area 311a and the narrow area 311b having different widths of the electrodes are alternately formed at a constant interval in the extending direction. In the present embodiment, the wide area 311a is formed in a shape that bulges out from the narrow area 311b into a circular shape.
As shown in fig. 2, the negative electrode 32 has: a plurality of branch portions 321 extending straight in one direction along the main surface 2a of the substrate 2; and a trunk portion 322 extending along an outer edge portion of the substrate 2. The plurality of branch portions 321 are arranged side by side with a gap therebetween from the outer edge portion 2d side toward the outer edge portion 2e side of the substrate 2. Each leg 321 is connected to the stem 322 at one end (the end opposite to the stem 312 of the positive electrode 31). As shown in fig. 2, each of the branch portions 321 is formed in a comb-tooth shape, and wide areas 321a and narrow areas 321b having different widths of electrodes are alternately formed at regular intervals in the extending direction. In the present embodiment, the wide area 311a is formed in a shape that bulges out from the narrow area 311b into a circular shape.
As shown in fig. 2, the positive electrode 31 and the negative electrode 32 are arranged with the branch portions 311 and 321 being offset from each other and spaced apart from each other. That is, with respect to the positive electrode 31 and the negative electrode 32, the leg 311 of the positive electrode 31 and the leg 321 of the negative electrode 32 are arranged in this order at intervals from the outer edge 2d side of the substrate 2 where the electrode terminal portion 6 is formed toward the outer edge 2d and the outer edge 2e side facing each other with the axial center of the substrate 2 interposed therebetween.
As shown in fig. 2, the narrow regions 311b and 321b of the other comb electrode 3 are disposed on the adjacent sides of the wide regions 311a and 321a of the one comb electrode 3. That is, the wide region 321a of the leg 321 of the negative electrode 32 is disposed between the narrow regions 311b of the two adjacent legs 311 of the positive electrode 31. The wide region 311a of the branch portion 311 of the positive electrode 31 is arranged between the narrow regions 321b of the two adjacent branch portions 321 of the negative electrode 32. This allows the gap between the branch portion 311 of the positive electrode 31 and the branch portion 321 of the negative electrode 32 to be further filled.
The insulating layer 5 is an insulating film that covers the metal layer 4 (the pair of comb-teeth electrodes 3) around the substrate 2. The insulating layer 5 is formed of, for example, polyimide resin. As shown in fig. 3, the insulating layer 5 has: an inner insulating layer 5a which covers a part of the main surface 2a, the back surface 2b, and the side surface 2c of the substrate 2; and an outer insulating layer (holding surface insulating layer) 5b that is coated on the metal layer 4 (the pair of comb-teeth electrodes 3) except the electrode terminal portion 6. The outer insulating layer 5b forms a holding surface 5c for holding the wafer W. In the present embodiment, the inner insulating layer 5a and the outer insulating layer 5b are formed flat along the front surface (the main surface 2a or the rear surface 2 b) of the substrate 2.
As shown in fig. 1 and 3, the electrode terminal portion 6 is formed on the side surface 2c of the substrate 2. The electrode terminal portion 6 has a positive electrode terminal portion 6a and a negative electrode terminal portion 6b. The positive electrode terminal portion 6a and the negative electrode terminal portion 6b are disposed close to each other on the side surface 2c of the substrate 2. As shown in fig. 2, the positive electrode terminal portion 6a is connected to the trunk portion 312 of the positive electrode 31, and the negative electrode terminal portion 6b is connected to the trunk portion 322 of the negative electrode 32.
When the wafer W is held by the electrostatic chuck plate 1, the wafer W is first placed on the holding surface 5c of the outer insulating layer 5 b. Then, when a positive voltage is applied from the power supply device 100 to the positive electrode 31 via the positive electrode terminal portion 6a and a negative voltage is applied to the negative electrode 32 via the negative electrode terminal portion 6b, positive and negative charges are pulled between the wafer W and the positive electrode 31 and the negative electrode 32, generating an electrostatic force (gradient force). The wafer W is attracted to the electrostatic chuck plate 1 by the electrostatic force. In the embodiment, the voltage applied from the power supply device 100 to the pair of comb-teeth electrodes 3 via the electrode terminal portion 6 is preferably 1000V or more and 2000V or less.
In the electrostatic chuck plate 1, the leg 311 of the positive electrode 31 constituting the pair of comb-teeth electrodes 3 has a wide area 311a and a narrow area 311b, and the leg 321 of the negative electrode 32 constituting the pair of comb-teeth electrodes 3 has a wide area 321a and a narrow area 321b. As a result, electric charges are accumulated in the regions where the respective branch portions 311, 321 change from wide to narrow. As a result, a strong electrostatic force (gradient force) is generated in the region where the respective branch portions 311, 321 change from wide to narrow, and the suction force for sucking the wafer W can be further improved. Further, even when the power supply to the pair of comb-teeth electrodes 3 is stopped, the temporarily generated electric charge can be maintained for a longer period of time, and the attractive force generated by the electrostatic chuck plate 1 can be maintained after the power supply is stopped. Further, the narrow areas 311b and 321b of the other comb-teeth electrode 3 are disposed on the adjacent sides of the wide areas 311a and 321a of the one comb-teeth electrode 3. In this way, the gap between the leg 311 of the positive electrode 31 and the leg 321 of the negative electrode 32 can be further filled, and thus the attraction force of the electrostatic chuck plate 1 can be further improved.
Next, a power supply device 100 according to an embodiment will be described with reference to the drawings. Fig. 6 is a partial cross-sectional view showing a state in which the electrostatic chuck plate 1 is mounted on the power feeding device 100, and fig. 7 is a partial cross-sectional view showing a state in which the electrostatic chuck plate 1 is connected to the power feeding portion 120 of the power feeding device 100. Fig. 8 is a partially enlarged cross-sectional view showing the power supply portion 120. Fig. 9 is a schematic diagram schematically showing the structures of the power supply section 120 and the power supply section 130 of the power supply device 100.
The power supply device 100 is a power supply device that is connected to a pair of comb-teeth electrodes 3 formed on the holding surface 5c side and applies a voltage to the bipolar electrostatic chuck plate 1, wherein the electrostatic chuck plate 1 has a pair of electrode terminal portions 6 exposed to the outside on the side surface 2c side. As shown in fig. 5, the power supply device 100 includes a base portion 110, a power supply portion 120, a power supply portion 130 (see fig. 9), and a positioning unit 140.
As shown in fig. 5, in the present embodiment, the base portion 110 is formed as a quadrangular housing. The base portion 110 may be formed as a circular housing. The base portion 110 has a mounting surface 110a on which the electrostatic chuck plate 1 is mounted. The base portion 110 accommodates therein a power supply portion 130.
The power supply unit 120 is connected to the positive electrode terminal portion 6a and the negative electrode terminal portion 6b of the electrostatic chuck plate 1 mounted on the mounting surface 110a of the base unit 110, and the power supply unit 120 applies a voltage from the power supply unit 130 to the electrostatic chuck plate 1. As shown in fig. 5, the power supply portion 120 is disposed near one outer edge portion of the base portion 110. The power supply unit 120 includes: a pair of conductive pins 121, 122; a pair of conductive needle supporting portions 123, 124 for supporting the pair of needles 121, 122; and a fixing portion 125 to which the needle supporting portions 123 and 124 are fixed.
The pair of pins 121, 122 are contact terminals of contact detection type, and they are formed of metal. In the present embodiment, the pair of pins 121 and 122 are formed of a nickel alloy whose surface is plated with gold. The pair of pins 121 and 122 have diameters of about 0.9mm to 1.5mm, and can make good contact between the positive electrode terminal portion 6a and the negative electrode terminal portion 6b. As shown in fig. 9, in the present embodiment, the pin 121 is connected to the positive electrode terminal 6a of the electrostatic chuck plate 1, and the pin 122 is connected to the negative electrode terminal 6b.
As shown in fig. 6 and 7, the pair of pins 121 and 122 extend from the fixed portion 125 side toward the center side of the base portion 110 substantially parallel to the mounting surface 110a of the base portion 110. That is, the tips (contact ends) 121a, 122a of the pins 121, 122 protrude from the fixing portion 125 side substantially parallel to the mounting surface 110a of the base portion 110. As shown in fig. 8, the tip 121a of the needle 121 is recessed toward the base 121b side in a rounded cone shape. As shown in fig. 8, the tip 122a of the needle 122 is recessed toward the base 122b side so as to be rounded. However, the distal ends 121a, 122a of the needles 121, 122 may have any shape such as a triangular pyramid, a cone, or a crown.
The pair of needle supporting portions 123 and 124 are cylindrical supporting members of socket type, and are formed of metal. In the present embodiment, the pair of needle supporting portions 123 and 124 are formed of a nickel alloy whose surface is plated with gold. As shown in fig. 8, one end side of the pair of needle supporting portions 123 and 124 is fixed to the fixing portion 125. The pair of needle supporting portions 123 and 124 are arranged at substantially the same interval as the interval between the positive electrode terminal portion 6a and the negative electrode terminal portion 6b of the electrostatic chuck plate 1. In the present embodiment, as shown in fig. 9, the pair of needle supporting portions 123 and 124 can be connected to the power supply portion 130, and a dc voltage from the power supply portion 130 is applied to the pair of needle supporting portions 123 and 124.
As shown in fig. 8, the needle supporting portion 123 has a receiving portion 123a, and the receiving portion 123a is opened at the other end on the opposite side to the fixing portion 125 and extends the inside in the axial direction. The needle 121 is fitted into the housing 123a from the proximal end (root) 121b side thereof so as to be movable in the axial direction. A spring (coil spring) 151 is housed in the housing portion 123a of the needle support portion 123, and the spring 151 biases the needle 121 toward the opposite side of the fixing portion 125. Thus, the needle 121 is supported by the needle support 123 so as to be movable in the axial direction while being biased by the spring 151 to the opposite side of the fixing portion 125. In the example shown in fig. 8, the spring 151 is disposed between the base end 121b of the needle 121 and the bottom of the housing 123a of the needle support 123, but the spring 151 may be disposed at any position in the housing 123a as long as the spring urges the needle 121 toward the opposite side from the fixing portion 125.
As shown in fig. 8, the needle supporting portion 124 has a receiving portion 124a, and the receiving portion 124a is opened at the other end on the opposite side to the fixing portion 125 and extends the inside in the axial direction. The needle 122 is fitted into the housing 124a from the proximal end (root) 122b side thereof so as to be movable in the axial direction. A spring (coil spring) 152 is housed in the housing portion 124a of the needle support portion 124, and the spring 152 biases the needle 122 toward the opposite side of the fixing portion 125. Thus, the needle 122 is supported by the needle support 124 so as to be movable in the axial direction while being biased by the spring 152 toward the opposite side of the fixed portion 125. In the example shown in fig. 8, the spring 152 is disposed between the base end 122b of the needle 122 and the bottom of the housing portion 124a of the needle support portion 124, but the spring 152 may be disposed at any position in the housing portion 124a as long as the spring urges the needle 122 toward the opposite side from the fixing portion 125. The springs 151 and 152 are not limited to coil springs, and may be plate springs or belleville springs.
The power supply unit 130 is a power supply source for applying a positive dc voltage V (+) or a negative dc voltage V (-V) to the pair of pins 121, 122 via the pin support units 123, 124 of the power supply unit 120. The power supply unit 130 controls the dc voltage applied to the power supply unit 120. That is, the power supply unit 130 can supply (apply) a voltage to the pair of pins 121 and 122 in a positive-negative combination via the pin supporting units 123 and 124. The power supply unit 130 is housed inside the base unit 110.
As shown in fig. 9, the power supply unit 130 includes: a 1 st power supply portion 131 and a 2 nd power supply portion 132; a switching element SW1 connected to the 1 st power supply portion 131; a switching element SW2 connected to the 2 nd power supply section 132; a capacitance measurement circuit 133 disposed between the 1 st power supply portion 131 and the 2 nd power supply portion 132; a power supply instruction switch 134 and a power removal instruction switch 135 (see fig. 5) that can instruct switching between positive and negative of a voltage applied to the power supply unit 120; and a control unit 136 that controls the operation of the entire power supply unit 130.
The 1 st power supply unit 131 and the 2 nd power supply unit 132 are dc power supply devices capable of changing the output voltage from a positive dc voltage V (+) to a negative dc voltage V ((-)). In the present embodiment, the negative electrode of the 1 st power supply unit 131 is connected to a reference potential source, and the positive electrode of the 2 nd power supply unit 132 is connected to the reference potential source.
The switching element SW1 is an on/off switching switch capable of performing connection and disconnection between the positive electrode side of the 1 st power supply portion 131 and the needle supporting portion 123. The switching element SW2 is an on/off switching switch capable of performing connection and disconnection between the negative electrode side of the 2 nd power supply unit 132 and the needle support unit 124. The switching elements SW1 and SW2 are turned on/off by the control unit 136.
The capacitance measurement circuit 133 is a circuit that measures the value of the charge stored in a capacitor, not shown, disposed at any position between the 1 st power supply unit 131 and the 2 nd power supply unit 132. The control unit 136 determines whether or not the pair of pins 121 and 122 of the power supply unit 120 are in contact with the electrode terminal portion 6 of the electrostatic chuck plate 1, based on the measurement result of the capacitance measurement circuit 133 (i.e., the value of the charge accumulated in the capacitor, not shown). The capacitance measuring circuit 133 may be omitted from the power supply unit 130.
As shown in fig. 5, the power supply instruction switch 134 and the power removal instruction switch 135 are push-type switches provided on the mounting surface 110a of the base portion 110. The power supply instruction switch 134 and the power removal instruction switch 135 are connected to the control unit 136. When the operator turns on the power supply instruction switch 134, a power supply instruction signal for supplying power to the electrostatic chuck plate 1 is output to the control unit 136. When the operator turns on the power-off instruction switch 135, a power-off instruction signal for power-off from the electrostatic chuck plate 1 is output to the control unit 136.
The control unit 136 controls the output voltages of the 1 st power supply unit 131 and the 2 nd power supply unit 132 and controls the switching elements SW1 and SW2 to be turned on and off based on the power supply instruction signal from the power supply instruction switch 134, the power removal instruction signal from the power removal instruction switch 135, and the measurement result of the capacitance measurement circuit 133. The control unit 136 controls the 1 st power supply unit 131, the 2 nd power supply unit 132, and the switching elements SW1 and SW2, which will be described later.
The positioning unit 140 positions the electrostatic chuck plate 1 supported by the base portion 110 at a position corresponding to the power supply portion 120. As shown in fig. 5, the positioning unit 140 is provided in the vicinity of one outer edge portion of the base portion 110 so as to face the power supply portion 120. The positioning unit 140 has: a pressing portion 141 for pressing the electrostatic chuck plate 1 placed on the placement surface 110a of the base portion 110 toward the power supply portion 120; and a support portion 142 that supports the pressing portion 141 so as to be slidable.
In the present embodiment, as shown in fig. 5, the pressing portion 141 has a pressing surface 141a curved along a side surface (side surface 2c of the substrate 2) of the electrostatic chuck plate 1 formed in a disk shape. Thus, the electrostatic chuck plate 1 can be stably pressed toward the power supply portion 120 by the pressing portion 141. In addition, when the electrostatic chuck plate 1 is formed in a flat plate shape, the pressing surface 141a may be formed as a surface perpendicular to the side surface of the electrostatic chuck plate 1. The pressing portion 141 is supported by the support portion 142 so as to be movable toward the power feeding portion 120 by a predetermined distance.
Next, a process when the electrostatic chuck plate 1 is supplied with power by the power supply device 100 configured as described above and an operation of the power supply device 100 will be described. When power is supplied from the power supply device 100 to the electrostatic chuck plate 1, first, a surface on the back surface 2b side of the electrostatic chuck plate 1 is placed on the placement surface 110a of the base portion 110 by a manual operation of an operator. At this time, as shown in fig. 5 and 6, the side surface 2c of the electrostatic chuck plate 1 is brought into contact with the pressing surface 141a of the pressing portion 141 of the positioning unit 140. The rotation angle of the electrostatic chuck plate 1 is positioned such that the positive electrode power supply terminal 6a and the negative electrode power supply terminal 6b of the electrostatic chuck plate 1 face the pins 121 and 122 of the power supply unit 120.
Various methods are considered with respect to positioning the rotation angle of the electrostatic chuck plate 1. For example, marks may be provided on the mounting surface 110a at positions where the positive power supply terminal 6a and the negative power supply terminal 6b face the pins 121 and 122 of the power supply unit 120 in a facing manner. A rotary table may be provided on the mounting surface 110a of the base 110, and the electrostatic chuck plate 1 may be mounted on the rotary table, and the rotary table may be rotated so that the positive electrode power supply terminal 6a and the negative electrode power supply terminal 6b are positioned to face the pins 121 and 122. The electrostatic chuck plate 1 may be placed on the placement surface 110a of the base 110 in a predetermined direction (direction in which the positive electrode power supply terminal 6a and the negative electrode power supply terminal 6b face the pins 121 and 122) by automatic control using a robot arm or the like.
Next, the pressing portion 141 of the positioning unit 140 is automatically moved to the power feeding portion 120 side (the solid arrow direction shown in fig. 5 and 6) by a manual operation of an operator or by using a robot arm or the like. As a result, as shown in fig. 7, the electrostatic chuck plate 1 is pressed toward the power feeding portion 120 by the pressing portion 141 of the positioning unit 140, the positive electrode terminal portion 6a is in contact with the needle 121 of the power feeding portion 120, and the negative electrode terminal portion 6b is in contact with the needle 122 of the power feeding portion 120.
As described above, the spring 151 is disposed between the needle 121 and the needle support 123, and the spring 152 is disposed between the needle 122 and the needle support 124. In this way, the springs 151 and 152 can alleviate the impact when the electrostatic chuck plate 1 contacts the pins 121 and 122. Thus, the needles 121, 122 can be better protected. In the present embodiment, the pressing portion 141 presses the electrostatic chuck plate 1 toward the pins 121 and 122 with a force sufficient to contract the springs 151 and 152 but not to fully compress them. That is, after the positive electrode terminal portion 6a is in contact with the pin 121 and the negative electrode terminal portion 6b is in contact with the pin 122, the maximum movement distance of the pressing portion 141 toward the power feeding portion 120 side is smaller than the maximum contraction amount of the springs 151, 152. This can protect the needles 121 and 122 more reliably.
Next, as shown in fig. 7, the wafer W is placed on the holding surface 5c of the electrostatic chuck plate 1. The wafer W may be placed on the holding surface 5c of the electrostatic chuck plate 1 in advance before the electrostatic chuck plate 1 is placed on the base portion 110 of the power supply device 100. Then, the power supply indication switch 134 is turned on by a manual operation of the operator. Thereby, the power supply instruction signal is output from the power supply instruction switch 134 to the control unit 136 of the power supply unit 130. When the power supply instruction signal is input from the power supply instruction switch 134, the control section 136 starts power supply from the power supply section 130 to the electrostatic chuck plate 1. First, the control unit 136 turns on the switching elements SW1 and SW2, and confirms whether the positive electrode terminal portion 6a is in contact with the needle 121 and the negative electrode terminal portion 6b is in contact with the needle 122 based on the measurement result of the capacitance measurement circuit 133.
When the control unit 136 confirms that the positive electrode terminal portion 6a is in contact with the pin 121 and the negative electrode terminal portion 6b is in contact with the pin 122, the 1 st power supply unit 131 is controlled so as to output a positive dc voltage V (+) and the 2 nd power supply unit 132 is controlled so as to output a negative dc voltage V (-). Accordingly, the positive dc voltage V (+) from the 1 st power supply portion 131 is applied to the positive electrode terminal portion 6a of the electrostatic chuck plate 1 via the needle support portion 123 and the needle 121 of the power supply portion 120, and the negative dc voltage V (-V) from the 2 nd power supply portion 132 is applied to the negative electrode terminal portion 6b of the electrostatic chuck plate 1 via the needle support portion 124 and the needle 122 of the power supply portion 120. As a result, positive and negative charges are pulled between the wafer W and the positive electrode 31 and the negative electrode 32, and an electrostatic force (gradient force) is generated, and the wafer W is attracted to the electrostatic chuck plate 1. The control unit 136 supplies power from the power supply unit 130 to the electrostatic chuck plate 1 for a predetermined time.
When the power supply from the power supply unit 130 to the electrostatic chuck plate 1 is performed for a predetermined period of time and sufficient positive and negative charges are accumulated between the wafer W and the positive electrode 31 and the negative electrode 32, the control unit 136 stops the power supply from the power supply unit 130. The control unit 136 stops the voltage application by the 1 st power supply unit 131 and the 2 nd power supply unit 132, and turns off the switching elements SW1 and SW 2. Further, the power supply to the electrostatic chuck plate 1 may be stopped by a manual operation of an operator, for example, when the power supply instruction switch 134 is pressed again, the power supply may be stopped.
Thereafter, the pressing portion 141 is moved to the opposite side (support portion 142 side) from the power supply portion 120 by a manual operation by an operator or by using a robot arm or the like. Accordingly, the pressing portion 141 is released from pressing the electrostatic chuck plate 1 against the power supply portion 120, and the electrostatic chuck plate 1 and the wafer W can be automatically conveyed from the base portion 110 by a manual operation, a robot arm, or the like.
Next, a process when the power supply device 100 removes the electric power from the electrostatic chuck plate 1 and an operation of the power supply device 100 will be described. When the power supply device 100 removes the electric power from the electrostatic chuck plate 1, the electrostatic chuck plate 1 that attracts and holds the wafer W on the holding surface 5c is placed on the placement surface 110a of the base portion 110. Then, the pressing portion 141 of the positioning unit 140 is moved toward the power feeding portion 120, as shown in fig. 7, the positive electrode terminal portion 6a of the electrostatic chuck plate 1 is brought into contact with the needle 121 of the power feeding portion 120, and the negative electrode terminal portion 6b is brought into contact with the needle 122 of the power feeding portion 120.
Then, the power-off instruction switch 135 is turned on. Thus, the charge removal instruction signal is output from the charge removal instruction switch 135 to the control unit 136. When a power-off instruction signal is input from the power-off instruction switch 135, the control section 136 starts power-off of the electrostatic chuck plate 1. First, the control unit 136 turns on the switching elements SW1 and SW2, and confirms whether the positive electrode terminal portion 6a is in contact with the needle 121 and the negative electrode terminal portion 6b is in contact with the needle 122 based on the measurement result of the capacitance measurement circuit 133.
When the control unit 136 confirms that the positive electrode terminal portion 6a is in contact with the pin 121 and the negative electrode terminal portion 6b is in contact with the pin 122, the 1 st power supply unit 131 is controlled so as to output the negative dc voltage V ((-)), and the 2 nd power supply unit 132 is controlled so as to output the positive dc voltage V (+). Accordingly, the negative dc voltage V (-V) from the 1 st power supply portion 131 is applied to the positive electrode terminal portion 6a of the electrostatic chuck plate 1 via the needle support portion 123 and the needle 121 of the power supply portion 120, and the positive dc voltage V (+) from the 2 nd power supply portion 132 is applied to the negative electrode terminal portion 6b of the electrostatic chuck plate 1 via the needle support portion 124 and the needle 122 of the power supply portion 120. As a result, the electric charges accumulated between the wafer W and the positive electrode 31 and the negative electrode 32 are removed, and the attraction of the electrostatic chuck plate 1 to the wafer W is released.
As described above, the power feeding device 100 according to the embodiment is a power feeding device 100 for an electrostatic chuck plate that applies a voltage to a bipolar electrostatic chuck plate 1, the electrostatic chuck plate having a pair of electrode terminal portions 6 that are connected to a pair of comb-teeth electrodes 3 formed on the holding surface 5c side and are exposed on the side surface 2c side, the power feeding device 100 including: a base portion 110 having a mounting surface 110a on which the electrostatic chuck plate 1 is mounted; a power supply unit 120 having a pair of conductive pins 121 and 122 and a pin support unit 123 (124), wherein a tip 121a (122 a) of the pin 121 (122) protrudes substantially parallel to the mounting surface 110a, the pin support unit 123 (124) accommodates a base end (root) 121b (122 b) of the pin 121 (122) and a spring 151 (152) therein, and supports the pin 121 (122) while biasing the pin 121 (122) by the spring 151 (152), and the power supply unit 120 is in contact with the electrode terminal unit 6 of the electrostatic chuck plate 1 mounted on the base unit 110 by the pin 121 (122); a power supply unit 130 that controls a voltage applied to the power supply unit 120; and a positioning unit 140 for positioning the electrostatic chuck plate 1 supported by the base portion 110 at a position corresponding to the power supply portion 120, wherein the power supply portion 130 supplies a voltage to the pair of pins 121 and 122 in a positive-negative combination.
Thereby, the electrostatic chuck plate 1 can be moved to a position corresponding to the power supply portion 120 (i.e., a position where the electrode terminal portion 6 contacts the pins 121 and 122) by the positioning unit 140. As a result, the positive electrode terminal portion 6a and the needle 121 and the negative electrode terminal portion 6b and the needle 122 can be easily brought into contact. Further, since the tips 121a and 122a of the pins 121 and 122 protrude substantially parallel to the mounting surface 110a, the electrode terminal portions 6 formed on the side surface 2c of the electrostatic chuck plate 1 can be brought into contact with the pins 121 and 122 more stably. A spring 151 is disposed between the needle 121 and the needle support 123, and a spring 152 is disposed between the needle 122 and the needle support 124. In this way, the springs 151 and 152 can alleviate the impact when the electrostatic chuck plate 1 contacts the pins 121 and 122. As a result, the needles 121 and 122 can be protected more effectively. The power supply unit 130 supplies a voltage to the pair of pins 121 and 122 in a positive-negative combination (a positive dc voltage V (+) is applied to one of the pins 121 and 122, and a negative dc voltage V (-V)) is applied to the other pin. This allows switching between positive and negative voltages applied to the positive electrode terminal portion 6a and the negative electrode terminal portion 6b of the electrostatic chuck plate 1 via the pins 121 and 122, and allows supplying or removing electric power to the electrostatic chuck plate 1. Therefore, according to the power supply device 100 of the electrostatic chuck plate 1 of the embodiment, the power supply portion 120 can be more easily and appropriately connected to the electrode terminal portion 6 formed on the side surface 2c of the electrostatic chuck plate 1, and power supply or power removal of the electrostatic chuck plate 1 can be more appropriately performed.
The positioning unit 140 presses the electrostatic chuck plate 1 against the pins 121 and 122 with a force to such an extent that the springs 151 and 152 of the power supply unit 120 contract but do not fully compress. Thus, the springs 151 and 152 can reliably alleviate the impact when the electrostatic chuck plate 1 contacts the pins 121 and 122. Therefore, the needles 121 and 122 can be more reliably protected.
As described above, the electrostatic chuck plate 1 can satisfactorily maintain the suction force for sucking the wafer W even after the power supply is stopped. That is, it is not necessary to provide a power feeding device for each device used in each process such as a dicing process for cutting the wafer W, a laser process for forming a modified layer in the wafer W by a laser beam, and a grinding process for grinding and thinning the front surface, and it is also not necessary to feed power during the conveyance of the wafer W. In this way, the power supply device 100 of the present embodiment is preferable in the power supply and the power removal of the electrostatic chuck plate 1, which can satisfactorily maintain the suction force for sucking the wafer W even after the power supply is stopped. However, the electrostatic chuck plate to be supplied (discharged) by the power supply device 100 is not limited to the electrostatic chuck plate 1 shown in fig. 1 to 3, as long as the positive electrode terminal portion and the negative electrode terminal portion are formed on the side surfaces so as to be close to each other.
In the present embodiment, the pressing portion 141 of the positioning unit 140 is automatically moved by a manual operation of an operator or by using a robot arm or the like, but the structure and operation of the positioning unit 140 are not limited thereto. For example, the positioning unit 140 may be a unit that includes a driving unit having a driving source such as a motor and a transmission mechanism that transmits a force from the driving source to the pressing unit 141, and performs driving control by the control unit 136 of the power supply unit 130. In this case, for example, when the operator turns on the power supply instruction switch 134 or the power removal instruction switch 135, the control unit 136 may drive-control the driving unit so that the pressing unit 141 moves toward the power supply unit 120. The control unit 136 may drive-control the driving unit so that the pressing unit 141 moves to the opposite side of the power feeding unit 120 at the timing when the power feeding or the power removal of the electrostatic chuck plate 1 is completed.
The power supply device 100 may also include a separation pressing means (not shown) capable of pressing the electrostatic chuck plate 1 toward the positioning means 140 (i.e., a side separated from the power supply unit 120). The separation pressing units can be provided on both sides of the power supply unit 120, for example. The separation pressing means may have, for example, a pressing portion that is movable toward the positioning means 140 side, and that has a pressing surface that is curved reversely with respect to the side surface 2c of the substrate 2 of the electrostatic chuck plate 1. Thus, the electrostatic chuck plate 1, which is released from the pressing of the positioning unit 140 to the power supply unit 120, is pressed by the pressing unit of the separation pressing unit, and the electrostatic chuck plate 1 is moved to the positioning unit 140, whereby the electrostatic chuck plate 1 can be separated from the pair of pins 121 and 122. The pair of pins 121, 122 can be better protected than in the case where the electrostatic chuck plate 1 is separated from the pair of pins 121, 122 by manual operation. The pressing portion of the separation pressing unit may be moved by a manual operation of an operator, or may be automatically moved using a robot arm or the like. Further, a driving mechanism for moving the pressing portion may be provided in the separation pressing unit itself, and the driving mechanism may be controlled by the control portion 136.
Claims (2)
1. A power supply device for an electrostatic chuck plate, which applies a voltage to a bipolar electrostatic chuck plate having a pair of electrode terminal portions connected to a pair of electrodes formed on a holding surface side and exposed on a side surface side, characterized in that,
the power supply device of the electrostatic chuck plate comprises:
a base portion having a mounting surface for mounting the electrostatic chuck plate;
a power supply unit having a pair of conductive pins and a pin support unit that houses a root portion of the pin and a spring therein and supports the pin while biasing the pin by the spring, the power supply unit being configured to contact the electrode terminal portion of the electrostatic chuck plate mounted on the base unit with the pin, and a tip end of the pin protruding substantially parallel to the mounting surface;
a power supply unit that controls a voltage applied to the power supply unit; and
a positioning unit for positioning the electrostatic chuck plate supported by the base portion at a position corresponding to the power supply portion,
the power supply unit supplies a voltage to the pair of pins in accordance with a combination of positive and negative,
the power supply part is arranged near one outer edge part of the base part on the carrying surface of the base part,
the positioning unit is provided in the vicinity of one outer edge portion of the base portion so as to face the power supply portion on the mounting surface of the base portion.
2. The apparatus for supplying power to an electrostatic chuck plate according to claim 1, wherein,
the positioning unit presses the electrostatic chuck plate against the needle with a force of such an extent that the spring of the power supply portion is contracted but not fully compressed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-196605 | 2016-10-04 | ||
| JP2016196605A JP6742214B2 (en) | 2016-10-04 | 2016-10-04 | Power supply device for electrostatic chuck plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107895701A CN107895701A (en) | 2018-04-10 |
| CN107895701B true CN107895701B (en) | 2023-06-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710896577.9A Active CN107895701B (en) | 2016-10-04 | 2017-09-28 | Power supply device of electrostatic chuck plate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6742214B2 (en) |
| KR (1) | KR102257254B1 (en) |
| CN (1) | CN107895701B (en) |
| TW (1) | TW201814824A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6493372B2 (en) | 2016-12-07 | 2019-04-03 | トヨタ自動車株式会社 | Semiconductor device |
| JP7556320B2 (en) | 2021-04-15 | 2024-09-26 | 新光電気工業株式会社 | Board removal device |
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| JPH0877989A (en) * | 1994-09-05 | 1996-03-22 | Canon Inc | Battery chamber |
| JPH0883832A (en) * | 1994-07-13 | 1996-03-26 | Shinko Electric Co Ltd | Power supply equipment |
| JP2001085506A (en) * | 1999-07-09 | 2001-03-30 | Toto Ltd | Electrostatic chuck and unit |
| JP2007073363A (en) * | 2005-09-07 | 2007-03-22 | Tomoegawa Paper Co Ltd | Power supply connector, and electrostatic chuck device provided with power supply connector |
| CN102089875A (en) * | 2008-07-08 | 2011-06-08 | 创意科技股份有限公司 | Bipolar electrostatic chuck |
| JP2015226010A (en) * | 2014-05-29 | 2015-12-14 | 東京エレクトロン株式会社 | Electrostatic attraction device, electrostatic chuck, and cooling processing unit |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH05315429A (en) * | 1992-05-07 | 1993-11-26 | Hitachi Ltd | Conveying equipment of semiconductor device manufacturing equipment |
| JP3076727B2 (en) * | 1994-10-19 | 2000-08-14 | 東芝機械株式会社 | Sample holder fixing device |
| JP2002124229A (en) * | 2000-10-13 | 2002-04-26 | Tookado:Kk | Switch of battery |
| JP5112808B2 (en) * | 2007-10-15 | 2013-01-09 | 筑波精工株式会社 | Electrostatic reinforcement device |
| JP2010061949A (en) * | 2008-09-03 | 2010-03-18 | Canon Inc | Electronic equipment |
| JP6433204B2 (en) | 2014-09-01 | 2018-12-05 | 株式会社ディスコ | Electrostatic support plate and method for manufacturing electrostatic support plate |
-
2016
- 2016-10-04 JP JP2016196605A patent/JP6742214B2/en active Active
-
2017
- 2017-09-05 TW TW106130306A patent/TW201814824A/en unknown
- 2017-09-28 CN CN201710896577.9A patent/CN107895701B/en active Active
- 2017-09-28 KR KR1020170125896A patent/KR102257254B1/en active IP Right Grant
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0883832A (en) * | 1994-07-13 | 1996-03-26 | Shinko Electric Co Ltd | Power supply equipment |
| JPH0877989A (en) * | 1994-09-05 | 1996-03-22 | Canon Inc | Battery chamber |
| JP2001085506A (en) * | 1999-07-09 | 2001-03-30 | Toto Ltd | Electrostatic chuck and unit |
| JP2007073363A (en) * | 2005-09-07 | 2007-03-22 | Tomoegawa Paper Co Ltd | Power supply connector, and electrostatic chuck device provided with power supply connector |
| CN102089875A (en) * | 2008-07-08 | 2011-06-08 | 创意科技股份有限公司 | Bipolar electrostatic chuck |
| JP2015226010A (en) * | 2014-05-29 | 2015-12-14 | 東京エレクトロン株式会社 | Electrostatic attraction device, electrostatic chuck, and cooling processing unit |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180037589A (en) | 2018-04-12 |
| KR102257254B1 (en) | 2021-05-26 |
| JP6742214B2 (en) | 2020-08-19 |
| JP2018060894A (en) | 2018-04-12 |
| CN107895701A (en) | 2018-04-10 |
| TW201814824A (en) | 2018-04-16 |
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