CN107895649A - It is a kind of to mount solid tantalum capacitor without leadframe surfaces - Google Patents
It is a kind of to mount solid tantalum capacitor without leadframe surfaces Download PDFInfo
- Publication number
- CN107895649A CN107895649A CN201711354695.3A CN201711354695A CN107895649A CN 107895649 A CN107895649 A CN 107895649A CN 201711354695 A CN201711354695 A CN 201711354695A CN 107895649 A CN107895649 A CN 107895649A
- Authority
- CN
- China
- Prior art keywords
- capacitor
- tantalum
- wire
- leadframe surfaces
- positive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 67
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 229910052715 tantalum Inorganic materials 0.000 title claims abstract description 36
- 239000007787 solid Substances 0.000 title claims abstract description 16
- 239000004593 Epoxy Substances 0.000 claims abstract description 4
- 238000000605 extraction Methods 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 7
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G2009/05—Electrodes or formation of dielectric layers thereon characterised by their structure consisting of tantalum, niobium, or sintered material; Combinations of such electrodes with solid semiconductive electrolytes, e.g. manganese dioxide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses one kind solid tantalum capacitor is mounted without leadframe surfaces, including capacitor body, tantalum core, positive wire and negative wire are provided with capacitor body, the tantalum core is drawn from the bottom of capacitor body respectively outside capacitor by epoxy encapsulation, the positive wire and negative wire.Present invention employs the form without lead frame, the positive and negative lead of tantalum capacitor is encapsulated down, reduces horizontal volume, and required printed circuit board space is smaller, beneficial to the development of the terminal device of miniaturization.
Description
Technical field
It is more particularly to a kind of to mount solid tantalum capacitor without leadframe surfaces the present invention relates to a kind of capacitor.
Background technology
Solid tantalum capacitor is a kind of using the solid capacitor that electrolyte is free of made of metal tantalum, because it uses metal
Tantalum is medium, it is thus possible to adapts to high-temperature work environment, and tantalum capacitor is in the course of the work, has auto-mending or isolation
The performance where fault in oxide-film, oxide film dielectric is set to be reinforced and recovered its due insulating capacity at any time, without
Cause to destroy by continuous cumulative bad, this unique self-healing performance, ensure that the advantage of its long-life and reliability, tantalum capacitor
With very high working field strength, and there is the characteristics of excellent performance, compact, therefore, tantalum capacitor obtains
Rapidly development.Expand day by day with the application of tantalum capacitor, be not only applied in fields such as military communication, space flight,
And the application of tantalum electric capacity also largely uses into fields such as Industry Control, video equipment, communication instrument.
The structure of traditional solid tantalum capacitor is as shown in figure 1, from figure 1 it appears that traditional tantalum capacitor includes
Rectangle or square traditional capacitor body 1, traditional capacitor body 1 is interior to be provided with traditional tantalum core 11, the side of capacitor body
Face is respectively equipped with positive wire frame 12 and negative wire frame 13, it can be seen that existing mount capacitors are because using side lead frame
Form, volume is slightly larger, and space-consuming is more, it is difficult to accomplish to minimize, and more and more integrated equipment, the emptying of its device cloth
Between it is further limited, therefore how to reduce the volume of tantalum capacitor, it is that those skilled in the art are urgently to be resolved hurrily to reduce its space-consuming
The problem of.
The content of the invention
The technical problem to be solved in the present invention is overcome the deficiencies in the prior art, there is provided a kind of solid without leadframe surfaces attachment
Body tantalum capacitor, it employs the form of no lead frame, the positive and negative lead of tantalum capacitor is encapsulated down, reduces weft element
Product, required printed circuit board space is smaller, beneficial to the development of the terminal device of miniaturization.
In order to solve the above technical problems, technical scheme proposed by the present invention is：It is a kind of to mount solid tantalum without leadframe surfaces
Capacitor, including capacitor body, tantalum core, positive wire and negative wire are provided with capacitor body, the tantalum core is in electric capacity
Drawn respectively from the bottom of capacitor body by epoxy encapsulation, the positive wire and negative wire outside device.
Further technical scheme is the present invention：The capacitor body is the square or rectangle structure of inner hollow,
It has the appearance profile consistent with existing traditional tantalum capacitor, is easy to be improved existing traditional tantalum capacitor, and
And it is not necessary to provide the Preparation equipment and production process of tantalum capacitor while improvement in addition；It can be seen that of the invention changes
Enter that cost is relatively low, larger excellent effect is obtained with small cost, there are higher economic benefit and more universal popularization and application
Meaning.
Further, the arrangement of the positive wire and negative wire is placed in horizontal matrix, and both open
Mouth is opposite, has both been easy to the encapsulation in later stage, and the length that and can is beneficial to shorten positive and negative polar curve in the case where assurance function is constant makes
With, it is cost-effective beneficial to economizing on resources, and the extraction of positive and negative electrode line is also convenient for, it is simple to operate, make integral layout more compact.
Further, lead frame is not contained on the capacitor body, can both be beneficial to the space-consuming for reducing device, be easy to
The volume of whole tantalum capacitor is reduced, is developed beneficial to tantalum capacitor to the direction of small size, and can reduces the use of material, can be big
It is big to save production cost, beneficial to increasing economic efficiency and economize on resources.
Further, the positive wire and negative wire are close to capacitor body bottom after the extraction of corresponding pole plate
Encapsulate down, ensure that overall compactness is preferable, save the space shared by positive and negative polar curve.
Compared with prior art, the advantage of the invention is that：
1st, tantalum capacitor of the invention employs the form of no lead frame, and positive and negative polar curve is drawn from the lower end of capacitor, makes
When its surface patch is welded, the space-consuming of whole capacitor arrangement can be reduced, makes integral layout closer, is advantageous to minimize
Terminal device development, be more conducive to widen the application of tantalum capacitor.
2nd, positive and negative electrode lead of the present invention is arranged on the bottom of capacitor body, can avoid similar capacitor body because viscous
Even there is phenomena such as short-circuit.
Brief description of the drawings
Fig. 1 is the structural representation of traditional tantalum capacitor；
Fig. 2 is the structural representation in the present invention.
Marginal data：
1st, traditional capacitor body；11st, traditional tantalum core；12nd, positive wire frame；13rd, negative wire frame；2nd, capacitor body；21、
Tantalum core；22nd, positive wire；23rd, negative wire.
Embodiment
For the ease of understanding the present invention, the present invention is made below in conjunction with Figure of description and preferred embodiment more complete
Face, meticulously describe, but protection scope of the present invention is not limited to embodiment in detail below.
As shown in Fig. 2 the present embodiment mounts solid tantalum capacitor without leadframe surfaces, no leadframe surfaces mount solid
Tantalum capacitor, including capacitor body 2, tantalum core 21, positive wire 22 and negative wire 23 are provided with capacitor body 2, it is described
Tantalum core 21 is by epoxy encapsulation outside capacitor, and the positive wire 22 and negative wire 23 are respectively from capacitor body 2
Bottom draw.
In the present embodiment, capacitor body 2 is square or rectangle structure.
In the present embodiment, the arrangement of positive wire 22 and negative wire 23 is placed in horizontal matrix, and both
Opening is opposite.
In the present embodiment, lead frame is not contained on capacitor body 2.
In the present embodiment, positive wire 22 and negative wire 23 are close to capacitor body 2 after the extraction of corresponding pole plate
Encapsulate down bottom.
Claims (5)
1. a kind of mount solid tantalum capacitor, including capacitor body without leadframe surfaces（2）, capacitor body（2）In be provided with
Tantalum core（21）, positive wire（22）And negative wire（23）, it is characterised in that：The tantalum core（21）By epoxy outside capacitor
Resin-encapsulated, the positive wire（22）And negative wire（23）Respectively from capacitor body（2）Bottom draw.
2. no leadframe surfaces attachment solid tantalum capacitor according to claim 1, it is characterised in that：The capacitor sheet
Body（2）For the interior square or rectangle structure for having tantalum core.
3. no leadframe surfaces attachment solid tantalum capacitor according to claim 1, it is characterised in that：The positive wire
（22）And negative wire（23）Arrangement placed in horizontal matrix, and both openings are opposite.
4. no leadframe surfaces attachment solid tantalum capacitor according to claim 1, it is characterised in that：The capacitor sheet
Body（2）On do not contain lead frame.
5. mount solid tantalum capacitor without leadframe surfaces according to any one of claim 1-4, it is characterised in that：Institute
State positive wire（22）And negative wire（23）It is close to capacitor body after the extraction of corresponding pole plate（2）Wrap down bottom
Envelope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711354695.3A CN107895649A (en) | 2017-12-15 | 2017-12-15 | It is a kind of to mount solid tantalum capacitor without leadframe surfaces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711354695.3A CN107895649A (en) | 2017-12-15 | 2017-12-15 | It is a kind of to mount solid tantalum capacitor without leadframe surfaces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107895649A true CN107895649A (en) | 2018-04-10 |
Family
ID=61807994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711354695.3A Pending CN107895649A (en) | 2017-12-15 | 2017-12-15 | It is a kind of to mount solid tantalum capacitor without leadframe surfaces |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107895649A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1479329A (en) * | 2002-07-22 | 2004-03-03 | Nec������ʽ���� | Solid-state electrolytic capacity |
| CN101154506A (en) * | 2006-09-28 | 2008-04-02 | 三星电机株式会社 | Tantalum capacitor |
| CN201084556Y (en) * | 2007-07-12 | 2008-07-09 | 四川东盛电子科技有限公司 | A solid tantalum electro-analysis capacitor |
| CN101322204A (en) * | 2006-10-04 | 2008-12-10 | 三洋电机株式会社 | Solid electrolytic capacitor and its manufacturing method |
| CN101465211A (en) * | 2007-12-17 | 2009-06-24 | 三洋电机株式会社 | Lead frame and electronic component with the same and manufacturing method thereof |
| CN103137336A (en) * | 2011-11-25 | 2013-06-05 | 三洋电机株式会社 | Solid electrolytic capacitor and method of manufacturing the same |
| CN204516585U (en) * | 2015-03-04 | 2015-07-29 | 厦门法拉电子股份有限公司 | A kind of film capacitor surface-mounted electrode deriving structure |
| CN205723165U (en) * | 2016-03-31 | 2016-11-23 | 上海永铭电子有限公司 | A kind of SMD alminium electrolytic condenser |
-
2017
- 2017-12-15 CN CN201711354695.3A patent/CN107895649A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1479329A (en) * | 2002-07-22 | 2004-03-03 | Nec������ʽ���� | Solid-state electrolytic capacity |
| CN101154506A (en) * | 2006-09-28 | 2008-04-02 | 三星电机株式会社 | Tantalum capacitor |
| CN101322204A (en) * | 2006-10-04 | 2008-12-10 | 三洋电机株式会社 | Solid electrolytic capacitor and its manufacturing method |
| CN201084556Y (en) * | 2007-07-12 | 2008-07-09 | 四川东盛电子科技有限公司 | A solid tantalum electro-analysis capacitor |
| CN101465211A (en) * | 2007-12-17 | 2009-06-24 | 三洋电机株式会社 | Lead frame and electronic component with the same and manufacturing method thereof |
| CN103137336A (en) * | 2011-11-25 | 2013-06-05 | 三洋电机株式会社 | Solid electrolytic capacitor and method of manufacturing the same |
| CN204516585U (en) * | 2015-03-04 | 2015-07-29 | 厦门法拉电子股份有限公司 | A kind of film capacitor surface-mounted electrode deriving structure |
| CN205723165U (en) * | 2016-03-31 | 2016-11-23 | 上海永铭电子有限公司 | A kind of SMD alminium electrolytic condenser |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180410 |
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| RJ01 | Rejection of invention patent application after publication |