CN107891555B - Automatic feeding device for semiconductor plastic packaging material and working method of automatic feeding device - Google Patents
Automatic feeding device for semiconductor plastic packaging material and working method of automatic feeding device Download PDFInfo
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- CN107891555B CN107891555B CN201711301628.5A CN201711301628A CN107891555B CN 107891555 B CN107891555 B CN 107891555B CN 201711301628 A CN201711301628 A CN 201711301628A CN 107891555 B CN107891555 B CN 107891555B
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000005022 packaging material Substances 0.000 title claims abstract description 15
- 239000004065 semiconductor Substances 0.000 title claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 96
- 230000010355 oscillation Effects 0.000 claims abstract description 22
- 239000011148 porous material Substances 0.000 claims abstract description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 8
- 238000000465 moulding Methods 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 6
- 230000009471 action Effects 0.000 claims description 2
- 230000005484 gravity Effects 0.000 claims description 2
- 238000007599 discharging Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/02—Dispensing from vessels, e.g. hoppers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
An automatic feeding device for semiconductor plastic packaging materials and a working method thereof. The automatic feeding device for the semiconductor plastic packaging material and the working method thereof are high in working efficiency and capable of reducing labor cost. The device comprises an oscillation feeding mechanism and a feeding die, wherein the oscillation feeding mechanism sequentially comprises an oscillation sieve, a funnel-shaped oscillation hole and a feeding pipe from top to bottom, a plurality of horizontal baffle switches are arranged in the feeding pipe, the pore diameter of a sieve pore of the oscillation sieve is larger than the diameter of a plastic package material, the upper pore diameter of the funnel-shaped oscillation hole is larger than the pore diameter of the sieve pore, and the lower pore diameter is larger than the diameter of one plastic package material and smaller than the diameters of two plastic package materials; the upper surface of the feeding die is provided with a plurality of grooves corresponding to the bottom of the feeding pipe. The invention has simple structure, and people only need to pour the material on the vibrating screen, thereby greatly reducing the labor intensity and the labor cost, realizing automatic feeding and improving the working efficiency.
Description
Technical Field
The invention relates to the field of semiconductor device processing, in particular to an automatic feeding device for a semiconductor plastic package material and a working method thereof.
Background
In the electronic component manufacturing industry, the subsequent packaging of products is generally performed by injection molding with a plastic packaging mold, and in this process, the general steps are as follows: firstly, placing a lead frame on a die; putting the plastic package material; and then closing the die to perform injection molding.
At present, most of plastic packaging material placing processes are manual feeding, namely, cylindrical plastic packaging materials are placed into a plastic packaging mold one by hand and then are singly packaged by a molding press, so that the working efficiency of the molding press is low.
In order to solve the problems, the tin-free red light microelectronic limited company discloses a plastic package material feeding frame of a QFN packaging process, patent number 201210094642.3, when the QFN packaging process is used, eight cylindrical plastic package materials are respectively and sequentially placed into eight feeding through holes, because the centers of the feeding through holes and the discharging through holes which are in one-to-one correspondence have fixed axial intervals, the eight plastic package materials are placed into the upper panel, after a plastic package mold is opened, the eight plastic package materials are directly placed into the plastic package mold at the same time, at the moment, only an operating handle is pushed to compress a spring, so that the centers of the feeding through holes and the discharging through holes which are in one-to-one correspondence are overlapped, at the moment, the eight plastic package materials can fall into the plastic package mold from the corresponding discharging through holes, the working time is saved, and the time of the working process of a molding press is utilized, and at the same time, the eight plastic package materials are manually placed into the feeding frame, so that the working efficiency of a molding press is high. However, before the feeding frame is used, plastic package materials are needed to be placed into the feeding frame one by hand, the improvement of the working efficiency is not obvious, and the labor cost is not reduced.
Disclosure of Invention
Aiming at the problems, the invention provides the automatic feeding device for the semiconductor plastic packaging material and the working method thereof, which have high working efficiency and reduce the labor cost.
The technical scheme of the invention is as follows:
an automatic feeding device for semiconductor plastic packaging materials comprises an oscillation feeding mechanism and a feeding die, wherein the oscillation feeding mechanism sequentially comprises an oscillation screen, a funnel-shaped oscillation hole and a feeding pipe from top to bottom, a plurality of horizontal baffle switches are arranged in the feeding pipe,
the pore diameter of the sieve pore of the oscillating sieve is larger than the diameter of the plastic package materials, the upper pore diameter of the funnel-shaped oscillating hole is larger than the pore diameter of the sieve pore, and the lower pore diameter is larger than the diameter of one plastic package material and smaller than the diameters of two plastic package materials;
the upper surface of the feeding die is provided with a plurality of grooves corresponding to the bottom of the feeding pipe.
The feeding pipe further comprises a first inductor, wherein the first inductor is arranged on the pipe wall of the feeding pipe, and the first inductor is positioned above the lowest horizontal baffle switch.
The feeding pipe further comprises a second inductor, wherein the second inductor is arranged on the pipe wall of the feeding pipe, and the second inductor is positioned below the lowest horizontal baffle switch.
The device also comprises a laser sensor and a plastic package material average dispersing device which are arranged in the funnel-shaped oscillating hole.
The plastic package material average dispersing device comprises a dispersing plate and two air cylinders vertically arranged below the dispersing plate, wherein the dispersing plate is arranged between two adjacent funnel-shaped oscillating holes, and the width of the dispersing plate is larger than or equal to the distance between the two adjacent funnel-shaped oscillating holes;
two cylinders are aligned with two adjacent funnel-shaped oscillations Kong Bingpai.
The plastic package material average dispersing device comprises a first channel and a second channel which are communicated with two adjacent feeding pipes, and vertical baffle switches are arranged on the pipe walls of the feeding pipes and at the end heads of the first channel and the second channel;
and the first channel and the second channel incline to two different feeding pipes respectively.
The device also comprises a controller and counters which are respectively communicated with the laser sensors, wherein the horizontal baffle switch, the first sensor, the second sensor, the air cylinder, the vertical baffle switch and the counters are respectively connected with the controller.
A working method of an automatic feeding device for semiconductor plastic packaging materials comprises the following steps:
1) Starting the oscillating screen, and pouring the plastic package material on the oscillating screen;
2) The plastic package material falls into the funnel-shaped oscillating holes from the sieve holes of the oscillating screen, continues to oscillate to enable the plastic package material to vertically fall into the feeding pipes, sequentially starts the horizontal baffle switches except the lowest horizontal baffle switch, immediately closes each switch after opening, and stops oscillating when the inductor senses that the plastic package material falls into each feeding pipe;
3) And opening the lowest horizontal baffle switch and immediately closing until the second sensor senses that the plastic package material in each feeding pipe falls into the groove of the feeding mold.
The beneficial effects of the invention are as follows: dispersing plastic package materials through an oscillating screen above to ensure that each groove in the feeding mould is filled with the materials; the plastic package material passing through the sieve holes of the vibrating sieve enters the hopper-shaped oscillating holes and then enters the feeding pipe, and the pipe diameter of the feeding pipe is slightly larger than the diameter of the plastic package material, so that the plastic package material vertically falls down to ensure that the plastic package material smoothly falls into the feeding mold; a plurality of switches are arranged in the feeding pipe to control that only one material is finally discharged into the groove of the corresponding feeding die; the plastic package material average dispersing device is additionally arranged to balance the number of plastic package materials in two adjacent discharging pipes so as to further ensure that each groove on the feeding die is provided with materials. The invention has simple structure, and people only need to pour the material on the vibrating screen, thereby greatly reducing the labor intensity and the labor cost, realizing automatic feeding and improving the working efficiency.
Drawings
Figure 1 is a schematic view of the structure of a first embodiment of the invention,
figure 2 is a top view of figure 1,
figure 3 is a schematic view of the structure of a second embodiment of the invention,
FIG. 4 is a schematic view of a third embodiment of the present invention;
in the figure, 1 is a feeding die, 11 is a groove, 2 is an oscillating screen, 3 is a funnel-shaped oscillating hole, 4 is a feeding pipe, 41 is a horizontal baffle switch, 5 is an inductor I, 6 is an inductor II, 7 is a dispersing plate, 8 is a cylinder, 9 is a channel I, and 10 is a channel II.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings.
Fig. 1-2 show a first embodiment of the present invention, including an oscillating feeding mechanism and a feeding mold 1, where the oscillating feeding mechanism includes an oscillating screen 2, a funnel-shaped oscillating hole 3 and a feeding pipe 4 sequentially from top to bottom (the oscillating screen 2, the funnel-shaped oscillating hole 3 and the feeding pipe 4 are sequentially connected and share a vibration source), a plurality of horizontal baffle switches 41 are disposed in the feeding pipe 4,
the aperture of the sieve aperture of the oscillating screen 2 is larger than the diameter of the plastic package materials, the upper aperture of the funnel-shaped oscillating hole 3 is larger than the aperture of the sieve aperture, the lower aperture is larger than the diameter of one plastic package material and smaller than the diameters of two plastic package materials, the lower aperture is preferably 1.1-1.5 times of the plastic package materials, only one plastic package material can pass through the lower aperture at a time while blocking is prevented, so that the plastic package materials are guaranteed to fall down in sequence and are matched with a plurality of horizontal baffle switches 41, and finally, only one plastic package material falls down from a feeding pipe to a feeding die at a time;
the upper surface of the feeding die 1 is provided with a plurality of grooves 11 corresponding to the bottom of the feeding pipe 4, the shape of each groove 11 is matched with that of the plastic packaging material, and the depth is smaller than the height of the plastic packaging material.
The invention further comprises a first inductor 5, wherein the first inductor 5 is arranged on the pipe wall of the feeding pipe 4, and the first inductor 5 is positioned above the lowest horizontal baffle switch 41, so as to monitor whether plastic packaging materials exist above the horizontal baffle switches 41, and when the plastic packaging materials exist on the horizontal baffle switches 41 in each feeding pipe 4, the oscillator stops oscillating.
The feeding device further comprises a second inductor 6, the second inductor 6 is arranged on the pipe wall of the feeding pipe, the second inductor 6 is located below a lowest horizontal baffle switch 41, and the purpose is to monitor whether plastic package materials fall into a feeding mold in the feeding pipe 4 or not, and the feeding process is finished after the materials fall into each feeding pipe. In order to save time and facilitate management, a reminding device can be additionally arranged, when materials fall down in each feeding pipe, a worker is reminded to take the feeding die through sound or light, and then another empty feeding die is put to continue feeding.
The first sensor and the second sensor are preferably laser sensors.
The working method of the scheme comprises the following steps:
1) Starting the oscillating screen, and pouring the plastic package material on the oscillating screen;
2) The plastic package material falls into the funnel-shaped oscillating holes from the sieve holes of the oscillating screen, continues to oscillate to enable the plastic package material to fall into the feeding pipe vertically (namely, a vertical cylinder), and sequentially starts the horizontal baffle switches except the lowest horizontal baffle switch, and immediately closes each switch after each switch is opened until the inductor senses that the plastic package material falls into each feeding pipe, and stops oscillating;
3) And opening the lowest horizontal baffle switch and immediately closing the switch until the second sensor senses that plastic package materials in each feeding pipe fall into the groove of the feeding mold, taking the full mold to enter the next process, and then replacing the upper feeding mold for continuous feeding.
Fig. 3 is a second embodiment of the present invention, and further includes a laser sensor (a laser generating part of the laser sensor is located on the same horizontal plane of a wall of the funnel-shaped oscillation hole, at least full of semicircle, so that the molding compound can be sensed wherever the molding compound falls down) and an average dispersing device of the molding compound, which are provided in the funnel-shaped oscillation hole, in addition to the first embodiment. The plastic package material average dispersing device comprises a dispersing plate 7 and two air cylinders 8 vertically arranged below the dispersing plate, wherein the dispersing plate 7 is arranged between two adjacent funnel-shaped oscillating holes 3, and the width of the dispersing plate 7 is larger than or equal to the distance between the two adjacent funnel-shaped oscillating holes; the top of the air cylinder 8 is hinged to the bottom surface of the diffusion plate 7.
The two cylinders 8 are aligned with two adjacent funnel-shaped oscillations Kong Bingpai so that the spreader plate 7 can be tilted into any one of the funnel-shaped oscillation holes.
The device also comprises a controller and counters which are respectively communicated with the laser sensors, and the horizontal baffle switch, the first sensor, the second sensor, the air cylinder and the counters are respectively connected with the controller.
The working method of the embodiment is as follows:
1) Starting the oscillating screen, and pouring the plastic package material on the oscillating screen;
2) The plastic package material falls into a funnel-shaped oscillating hole from the sieve holes of the oscillating sieve, and after the laser sensor in the funnel-shaped oscillating hole senses that the plastic package material falls, a signal is transmitted to the counter;
3) Comparing the count sizes of the counters corresponding to the laser sensors in the two adjacent funnel-shaped oscillating holes, when the sizes are inconsistent, starting to adjust the air cylinders (the air cylinders close to the funnel-shaped oscillating holes with large counts ascend, lifting one side of the uniform scattering plate) by the controller to enable the uniform scattering plate to incline into the funnel-shaped oscillating holes with small counts, so that plastic package materials falling on the uniform scattering plate fall into the funnel-shaped oscillating holes with small counts, and the numbers of plastic package materials in the two adjacent funnel-shaped oscillating holes are consistent (even if the numbers cannot be completely consistent, the gap is greatly reduced, and when the numbers are not inconsistent, the number of the air cylinders are retracted to be within 3, and the uniform scattering plate is released);
4) The plastic package material falls into the funnel-shaped oscillating holes from the sieve holes of the oscillating screen, continues to oscillate to enable the plastic package material to vertically fall into the feeding pipes, sequentially starts the horizontal baffle switches except the lowest horizontal baffle switch, immediately closes each switch after opening, and stops oscillating when the inductor senses that the plastic package material falls into each feeding pipe;
5) And opening the lowest horizontal baffle switch and immediately closing until the second sensor senses that the plastic package material in each feeding pipe falls into the groove of the feeding mold.
Fig. 4 is a third embodiment of the present invention, and further includes a laser sensor (a laser generating part of the laser sensor is located on the same horizontal plane of a wall of the funnel-shaped oscillation hole, at least full of semicircle, so that the molding compound can be sensed wherever it falls down) and an average dispersing device of the molding compound, which are provided in the funnel-shaped oscillation hole, in addition to the first embodiment. The plastic package material average dispersing device comprises a first channel 9 and a second channel 10 which are communicated with two adjacent feeding pipes, and vertical baffle switches are arranged on the pipe walls of the feeding pipes and at the end heads of the first channel 9 and the second channel 10;
the first channel and the second channel are inclined towards two different feeding pipes respectively, so that materials in the feeding pipes can slide into the adjacent feeding pipes.
In this embodiment, as in the second embodiment, a controller is required to facilitate control of each link, and a counter is respectively connected to each laser sensor, and the horizontal barrier switch, the first sensor, the second sensor, the vertical barrier switch, and the counter are respectively connected to the controller.
The working method of the embodiment is as follows:
1) Starting the oscillating screen, and pouring the plastic package material on the oscillating screen;
2) The plastic package material falls into a funnel-shaped oscillating hole from the sieve holes of the oscillating sieve, and after the laser sensor in the funnel-shaped oscillating hole senses that the plastic package material falls, a signal is transmitted to the counter;
3) Comparing the count sizes of the counters corresponding to the laser sensors in the two adjacent funnel-shaped oscillating holes, when the sizes are inconsistent, opening a channel inclined to a feeding pipe below the funnel-shaped oscillating hole with small count (namely opening a vertical baffle switch at two ends of the channel), so that plastic package materials enter the feeding pipe with small quantity from the feeding pipe with large quantity under the action of gravity to balance the quantity of the plastic package materials in the two adjacent feeding pipes (the opening time of the vertical baffle switch can be set according to the difference of the counts, and is generally smaller than 10 seconds each time);
4) Sequentially starting the horizontal baffle switches except the lowest horizontal baffle switch, immediately closing each switch after opening until the inductor senses that plastic package materials in each feeding pipe fall down, and stopping oscillating;
5) And opening the lowest horizontal baffle switch and immediately closing until the second sensor senses that the plastic package material in each feeding pipe falls into the groove of the feeding mold.
According to the invention, the plastic package material is dispersed through the vibrating screen above, so that each groove in the feeding die is ensured to be filled with the material; the plastic package material passing through the sieve holes of the vibrating sieve enters the hopper-shaped oscillating holes and then enters the feeding pipe, and the pipe diameter of the feeding pipe is slightly larger than the diameter of the plastic package material, so that the plastic package material vertically falls down to ensure that the plastic package material smoothly falls into the feeding mold; a plurality of switches are arranged in the feeding pipe to control that only one material is finally discharged into the groove of the corresponding feeding die; the plastic package material average dispersing device is additionally arranged to balance the number of plastic package materials in two adjacent discharging pipes so as to further ensure that each groove on the feeding die is provided with materials. The invention has simple structure, and people only need to pour the material on the vibrating screen, thereby greatly reducing the labor intensity and the labor cost, realizing automatic feeding and improving the working efficiency.
Claims (3)
1. The automatic feeding device for the semiconductor plastic packaging material is characterized by comprising an oscillation feeding mechanism and a feeding die, wherein the oscillation feeding mechanism sequentially comprises an oscillation sieve, a funnel-shaped oscillation hole and a feeding pipe from top to bottom, a plurality of horizontal baffle switches are arranged in the feeding pipe,
the pore diameter of the sieve pore of the oscillating screen is larger than the diameter of the plastic package material, and the upper pore diameter of the funnel-shaped oscillating hole is larger than the pore diameter of the sieve pore;
the lower aperture is 1.1-1.5 times of the diameter of the plastic package material, so that the plastic package material can only pass through the lower hole each time while the material is prevented from being blocked, the plastic package material is ensured to fall down in sequence and is matched with a plurality of horizontal baffle switches, and only one plastic package material falls down from the feeding pipe to the feeding mold each time;
the upper surface of the feeding die is provided with a plurality of grooves corresponding to the bottom of the feeding pipe;
the feeding pipe further comprises a first inductor, wherein the first inductor is arranged on the pipe wall of the feeding pipe and is positioned above the lowest horizontal baffle switch;
the feeding pipe further comprises a second inductor which is arranged on the pipe wall of the feeding pipe and is positioned below the lowest horizontal baffle switch;
the device also comprises a laser sensor and a plastic package material average dispersing device which are arranged in the funnel-shaped oscillating hole;
the plastic package material average dispersing device comprises a dispersing plate and two air cylinders vertically arranged below the dispersing plate, wherein the dispersing plate is arranged between two adjacent funnel-shaped oscillating holes, and the width of the dispersing plate is larger than or equal to the distance between the two adjacent funnel-shaped oscillating holes;
two cylinders are arranged with two adjacent funnel-shaped oscillations Kong Bingpai;
the plastic package material average dispersing device comprises a first channel and a second channel which are communicated with two adjacent feeding pipes, and vertical baffle switches are arranged on the pipe walls of the feeding pipes and at the end heads of the first channel and the second channel;
and the first channel and the second channel incline to two different feeding pipes respectively.
2. The automatic feeding device for semiconductor plastic packaging materials according to claim 1, further comprising a controller and counters which are respectively communicated with the laser sensors, wherein the horizontal baffle switch, the first inductor, the second inductor, the air cylinder, the vertical baffle switch and the counters are respectively connected with the controller.
3. A method of operating an automatic semiconductor molding compound loading device according to claim 1, comprising the steps of:
1) Starting the oscillating screen, and pouring the plastic package material on the oscillating screen;
2) The plastic package material falls into a funnel-shaped oscillating hole from the sieve holes of the oscillating sieve, and after the laser sensor in the funnel-shaped oscillating hole senses that the plastic package material falls, a signal is transmitted to the counter;
3) Comparing the count sizes of the counters corresponding to the laser sensors in the two adjacent funnel-shaped oscillating holes, and when the sizes are inconsistent, opening a channel inclined to a feeding pipe below the funnel-shaped oscillating hole with small count by the controller, namely opening vertical baffle switches at two ends of the channel, so that plastic package materials enter the feeding pipe with small quantity from the feeding pipe with large quantity under the action of gravity, and balancing the quantity of the plastic package materials in the two adjacent feeding pipes;
4) Sequentially starting the horizontal baffle switches except the lowest horizontal baffle switch, immediately closing each switch after opening until the inductor senses that plastic package materials in each feeding pipe fall down, and stopping oscillating;
5) And opening the lowest horizontal baffle switch and immediately closing until the second sensor senses that the plastic package material in each feeding pipe falls into the groove of the feeding mold.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711301628.5A CN107891555B (en) | 2017-12-10 | 2017-12-10 | Automatic feeding device for semiconductor plastic packaging material and working method of automatic feeding device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711301628.5A CN107891555B (en) | 2017-12-10 | 2017-12-10 | Automatic feeding device for semiconductor plastic packaging material and working method of automatic feeding device |
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| CN107891555A CN107891555A (en) | 2018-04-10 |
| CN107891555B true CN107891555B (en) | 2023-10-24 |
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| CN201711301628.5A Active CN107891555B (en) | 2017-12-10 | 2017-12-10 | Automatic feeding device for semiconductor plastic packaging material and working method of automatic feeding device |
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| CN110587893A (en) * | 2019-09-11 | 2019-12-20 | 四川洪芯微科技有限公司 | Semiconductor plastic package material feeding device and working method thereof |
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| CN107891555A (en) | 2018-04-10 |
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