CN107891555A - A kind of semiconductor plastic package material automatic charging device and its method of work - Google Patents
A kind of semiconductor plastic package material automatic charging device and its method of work Download PDFInfo
- Publication number
- CN107891555A CN107891555A CN201711301628.5A CN201711301628A CN107891555A CN 107891555 A CN107891555 A CN 107891555A CN 201711301628 A CN201711301628 A CN 201711301628A CN 107891555 A CN107891555 A CN 107891555A
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- Prior art keywords
- plastic packaging
- packaging material
- inductor
- feeding tube
- aperture
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- 239000000463 material Substances 0.000 title claims abstract description 38
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000005022 packaging material Substances 0.000 claims abstract description 81
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 230000010355 oscillation Effects 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 claims description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims 2
- 229910002092 carbon dioxide Inorganic materials 0.000 claims 1
- 239000001569 carbon dioxide Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000010276 construction Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/02—Dispensing from vessels, e.g. hoppers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
A kind of semiconductor plastic package material automatic charging device and its method of work.It is high to provide a kind of operating efficiency, and reduces the semiconductor plastic package material automatic charging device and its method of work of human cost.Including vibration feed mechanism and charging die, the vibration feed mechanism includes shaking screen, funnel type vibration hole and feeding tube successively from top to bottom, some horizontal baffles are provided with the feeding tube to switch, the aperture of the sieve aperture of the shaking screen is more than the diameter of plastic packaging material, the upper aperture in the funnel type vibration hole is more than the aperture of sieve aperture, and lower aperture is more than the diameter of a plastic packaging material and less than the diameter of two plastic packaging materials；The charging die upper surface is provided with some grooves corresponding with feeding bottom of the tube.The present invention is simple in construction, and people will need to only expect on the vibrating, to greatly reduce labor intensity and human cost, realize automatic charging, improve operating efficiency.
Description
Technical field
The present invention relates to semiconductor device fabrication field, and in particular to a kind of semiconductor plastic package material automatic charging device and its
Method of work.
Background technology
In electronic component manufacturing industry, the rear road encapsulation of product typically uses plastic packaging molds injection-compression molding, herein
During, general step is：Lead frame is first put on mould；Place into plastic packaging material；Then matched moulds is molded.
To put plastic packaging material technique be mostly manual feeding at present, will cylindrical plastic packaging material be put into plastic sealed mould one by one with hand
In tool, then single by molding press plastic packaging again, it make it that the operating efficiency of molding press is low.
In order to solve problem above, Wuxi Red Microelectronics Co., Ltd. discloses a kind of " plastic packaging of QFN packaging technologies
Expect stock shelf ", the patent No. " 201210094642.3 ", in use, eight cylindrical plastic packaging materials are put into eight successively respectively
In upper material through hole, because the center of the one-to-one upper material through hole, lower material through hole has fixed axial spacing, therefore eight are moulded
Envelope material is placed in the top panel, is directly put into eight plastic packaging materials in plastic package die simultaneously after plastic package die die sinking, this
When, only it need to promote operation handle so that spring-compressed, so that in the one-to-one upper material through hole, lower material through hole
The heart is overlapped, and now eight plastic packaging materials can be fallen into plastic package die from corresponding lower material through hole, are which saved the working time, are utilized mould
The time of compressor operation process, while eight plastic packaging materials are put into the stock shelf manually, it causes the operating efficiency of molding press
It is high.But the stock shelf using preceding still needs that plastic packaging material is put into the stock shelf one by one with hand, the raising of operating efficiency
Not significantly, and human cost does not also reduce.
The content of the invention
The present invention is directed to problem above, there is provided a kind of operating efficiency is high, and reduces the semiconductor plastic package material of human cost
Automatic charging device and its method of work.
The technical scheme is that：
A kind of semiconductor plastic package material automatic charging device, including vibration feed mechanism and charging die, the vibration feed mechanism
Include shaking screen, funnel type vibration hole and feeding tube successively from top to bottom, opened in the feeding tube provided with some horizontal baffles
Close,
The aperture of the sieve aperture of the shaking screen is more than the diameter of plastic packaging material, and the upper aperture in the funnel type vibration hole is more than sieve aperture
Aperture, lower aperture are more than the diameter of a plastic packaging material and less than the diameters of two plastic packaging materials；
The charging die upper surface is provided with some grooves corresponding with feeding bottom of the tube.
Also include inductor one, the inductor one is located on the tube wall of the feeding tube, and the inductor one is positioned at most
The top of following horizontal baffle switch.
Also include inductor two, the inductor two is located on the tube wall of the feeding tube, and the inductor two is positioned at most
The lower section of following horizontal baffle switch.
Also include the laser sensor and the average dispersal device of plastic packaging material being located in funnel type vibration hole.
The average dispersal device of the plastic packaging material includes falling apart and two vertical cylinders being located under falling apart, described to dissipate
Plate is located between adjacent two funnel types vibration hole, and the width to fall apart shakes more than or equal to two adjacent funnel types
Swing the distance between hole；
Two cylinders are arranged side by side with adjacent two funnel types vibration hole.
The average dispersal device of the plastic packaging material includes the passage one and passage two for connecting two neighboring feeding tube, feeding tube
On tube wall, the end of passage one and passage two switchs provided with vertical baffle；
The passage one and passage two tilt to two different feeding tubes respectively.
Also include controller, and the counter connected respectively with each laser sensor, the horizontal baffle switch, sensing
Device one, inductor two, cylinder, vertical baffle switch, counter are connected with controller respectively.
A kind of method of work of semiconductor plastic package material automatic charging device, comprises the following steps：
1）, start shaking screen, plastic packaging material is poured on shaking screen；
2）, plastic packaging material dropped down onto from the sieve aperture of shaking screen funnel type vibration hole in, continuing vibration makes plastic packaging material vertically fall into feeding
Guan Zhong, the horizontal baffle switch in addition to nethermost horizontal baffle switchs is opened successively, each switch is shut immediately after opening,
Sense in each feeding tube there is plastic packaging material to fall to inductor one, stop oscillation；
3）, open nethermost horizontal baffle and switch and shut immediately, sense in each feeding tube there is plastic packaging to inductor two
Material is fallen into the groove of charging die.
The beneficial effects of the invention are as follows：Plastic packaging material is disperseed by the shaking screen of top, it is every in charging die to ensure
Individual groove part has material；Enter feeding tube, the pipe of feeding tube after the plastic packaging material of vibratory sieve sieve aperture enters the vibration hole of funnel type
Footpath is slightly larger than the diameter of plastic packaging material, plastic packaging material is fallen vertically to ensure that plastic packaging material is smoothly fallen into charging die；In feeding tube
If some switches, finally only gone out in a groove for expecting corresponding charging die with controlling；Set up the average dispersal device of plastic packaging material
With the plastic packaging material number in balanced two neighboring discharge nozzle, there is material with each groove part further ensured that on charging die.This
Inventive structure is simple, and people will need to only expect on the vibrating, to greatly reduce labor intensity and human cost, realize automatic
Feeding, improve operating efficiency.
Brief description of the drawings
Fig. 1 is the structural representation of the first embodiment of the invention,
Fig. 2 is Fig. 1 top view,
Fig. 3 is the structural representation of second of embodiment of the invention,
Fig. 4 is the structural representation of the third embodiment of the invention；
1 is charging die in figure, and 11 be groove, and 2 be shaking screen, and 3 be funnel type vibration hole, and 4 be feeding tube, and 41 be horizontal baffle
Switch, 5 be inductor one, and 6 be inductor two, and 7 be to fall apart, and 8 be cylinder, and 9 be passage one, and 10 be passage two.
Embodiment
The present invention is illustrated below in conjunction with the accompanying drawings.
Fig. 1-2 is the first embodiment of the present invention, including vibrates feed mechanism and charging die 1, in the vibration
Expect that mechanism includes shaking screen 2, funnel type vibration hole 3 and feeding tube 4 successively from top to bottom（Shaking screen 2, funnel type vibration hole 3
And feeding tube 4 is sequentially connected, a vibration source is shared）, some horizontal baffles switch 41 is provided with the feeding tube 4,
The aperture of the sieve aperture of the shaking screen 2 is more than the diameter of plastic packaging material, and the upper aperture in the funnel type vibration hole 3 is more than sieve aperture
Aperture, lower aperture is more than the diameter of plastic packaging material and less than the diameter of two plastic packaging materials, and it is plastic packaging material preferably descend aperture
1.1 ~ 1.5 times, there can only be a plastic packaging material while preventing from getting stuck every time by lower opening, to ensure that plastic packaging material is fallen successively, with
Some horizontal baffle switches 41 coordinate, and finally, only fall next plastic packaging material from feeding tube every time into charging die；
The upper surface of charging die 1 is provided with some grooves 11 corresponding with the bottom of feeding tube 4, and the shape of groove 11 is fitted with plastic packaging material
Match somebody with somebody, depth is less than the height of plastic packaging material.
Present invention additionally comprises inductor 1, the inductor 1 is located on the tube wall of the feeding tube 4, the inductor
One 5 positioned at the top of nethermost horizontal baffle switch 41, in order to which whether the top of level monitoring barrier switch 41 has
Plastic packaging material, when having plastic packaging material on the horizontal baffle switch 41 in each feeding tube 4, oscillator stops oscillation.
Also include inductor 26, the inductor 26 is located on the tube wall of the feeding tube, and the inductor 26 is located at
The lower section of nethermost horizontal baffle switch 41, in order to which whether monitor in feeding tube 4 has plastic packaging material to drop down onto charging die
In, treat there is material to fall in each feeding tube, upper material process terminates.In order to save time and convenient management, prompting can be set up
Device, when having material to fall in each feeding tube, staff is reminded to take the charging die away by sound or light, then put
Upper another piece empty charging die continues feeding.
Inductor one and inductor two preferably use laser sensor.
The method of work of the program is：
1）, start shaking screen, plastic packaging material is poured on shaking screen；
2）, plastic packaging material dropped down onto from the sieve aperture of shaking screen funnel type vibration hole in, continuing vibration makes plastic packaging material vertical（It is i.e. vertical
Cylinder）Fall into feeding tube, open the horizontal baffle switch in addition to nethermost horizontal baffle switchs successively, each switch is beaten
Shut immediately after opening, sense in each feeding tube there is plastic packaging material to fall to inductor one, stop oscillation；
3）, open nethermost horizontal baffle and switch and shut immediately, sense in each feeding tube there is plastic packaging to inductor two
Material is fallen into the groove of charging die, and the mould for taking full material away enters subsequent processing, is then changed on empty charging die continues
Material.
Fig. 3 is second of embodiment of the present invention, on the basis of the scheme of the first embodiment, in addition to is located at
Laser sensor in funnel type vibration hole（The laser beam-generating section part of laser sensor is located at the same of the hole wall in funnel type vibration hole
On one horizontal plane, at least it is covered with semicircle so that no matter plastic packaging material wherefrom falls, and can be sensed）With plastic packaging material average mark
It is in bulk to put.The average dispersal device of the plastic packaging material includes fall apart 7 and two vertical cylinders 8 being located under falling apart, described equal
Fall apart and 7 be located between adjacent two funnel types vibration hole 3,7 width of falling apart is more than or equal to two adjacent leakages
The distance between bucket type vibration hole；The top of cylinder 8 be hinged on fall apart 7 bottom surface.
Two cylinders 8 are arranged side by side with adjacent two funnel types vibration hole, can thus make to fall apart and 7 appoint thereto
What cut tiltedly in funnel type vibration hole.
Also include controller, and the counter connected respectively with each laser sensor, the horizontal baffle switch, sensing
Device one, inductor two, cylinder, counter are connected with controller respectively.
The method of work of present embodiment is：
1）, start shaking screen, plastic packaging material is poured on shaking screen；
2）, plastic packaging material dropped down onto from the sieve aperture of shaking screen funnel type vibration hole in, funnel type vibration hole in laser sensor sense
It should arrive after plastic packaging material falls, transmit a signal to counter；
3）, counter corresponding to laser sensor in more two neighboring funnel type vibration hole counting size, it is big when occurring
When small inconsistent, controller starts to adjust cylinder（Ramped up close to the cylinder for counting big funnel type vibration hole, lift and fall apart
Side）, make to fall apart tilts into the small funnel type vibration hole of counting, and so falling the plastic packaging material on falling apart will drop into
Count in small funnel type vibration hole, so that being that plastic packaging material number is consistent in two neighboring funnel type vibration hole（Even if
Can not be completely the same, its gap can be also substantially reduced, when quantity is more or less the same within such as 3, the cylinder for rise of retracting, is laid flat
Fall apart）；
4）, plastic packaging material dropped down onto from the sieve aperture of shaking screen funnel type vibration hole in, continuing vibration makes plastic packaging material vertically fall into feeding
Guan Zhong, the horizontal baffle switch in addition to nethermost horizontal baffle switchs is opened successively, each switch is shut immediately after opening,
Sense in each feeding tube there is plastic packaging material to fall to inductor one, stop oscillation；
5）, open nethermost horizontal baffle and switch and shut immediately, sense in each feeding tube there is plastic packaging to inductor two
Material is fallen into the groove of charging die.
Fig. 4 is the third embodiment of the present invention, on the basis of the scheme of the first embodiment, in addition to is located at
Laser sensor in funnel type vibration hole（The laser beam-generating section part of laser sensor is located at the same of the hole wall in funnel type vibration hole
On one horizontal plane, at least it is covered with semicircle so that no matter plastic packaging material wherefrom falls, and can be sensed）With plastic packaging material average mark
It is in bulk to put.The average dispersal device of the plastic packaging material includes the passage 1 and passage 2 10 for connecting two neighboring feeding tube, feeding tube
Tube wall on, the end of passage 1 and passage 2 10 switchs provided with vertical baffle；
The passage one and passage two tilt to two different feeding tubes respectively so that the material in feeding tube can slide into adjacent
Feeding tube in.
Present embodiment as second of embodiment, it is necessary to controller facilitates the control of each link, and respectively
The counter connected with each laser sensor, the horizontal baffle switch, inductor one, inductor two, vertical baffle switch, meter
Number device is connected with controller respectively.
The method of work of present embodiment is：
1）, start shaking screen, plastic packaging material is poured on shaking screen；
2）, plastic packaging material dropped down onto from the sieve aperture of shaking screen funnel type vibration hole in, funnel type vibration hole in laser sensor sense
It should arrive after plastic packaging material falls, transmit a signal to counter；
3）, counter corresponding to laser sensor in more two neighboring funnel type vibration hole counting size, it is big when occurring
When small inconsistent, controller is opened to the inclined passage of feeding tube counted below small funnel type vibration hole（Open its two
The vertical baffle switch at end）, plastic packaging material is entered from the feeding tube more than quantity by Action of Gravity Field in the few feeding tube of quantity, with
The quantity of plastic packaging material in balanced two neighboring feeding tube（It can be switched on according to the size for counting difference to set vertical baffle
The length of time, general each opening time are less than 10 seconds）；
4）, open horizontal baffle switch in addition to nethermost horizontal baffle switchs successively, each switch closes immediately after opening
On, sense in each feeding tube there is plastic packaging material to fall to inductor one, stop oscillation；
5）, open nethermost horizontal baffle and switch and shut immediately, sense in each feeding tube there is plastic packaging to inductor two
Material is fallen into the groove of charging die.
The present invention disperses plastic packaging material by the shaking screen of top, has material with each groove part ensured in charging die；
Enter feeding tube after the plastic packaging material of vibratory sieve sieve aperture enters the vibration hole of funnel type, the caliber of feeding tube is slightly larger than plastic packaging material
Diameter, plastic packaging material is fallen vertically to ensure that plastic packaging material is smoothly fallen into charging die；Some switches are set in feeding tube, with control
System is final only to be gone out in a groove for expecting corresponding charging die；Set up the average dispersal device of plastic packaging material with it is balanced it is two neighboring go out
Plastic packaging material number in expects pipe, there is material with each groove part further ensured that on charging die.The present invention is simple in construction, and people is only
It will need to expect on the vibrating, to greatly reduce labor intensity and human cost, realize automatic charging, improve work effect
Rate.
Claims (8)
1. a kind of semiconductor plastic package material automatic charging device, it is characterised in that described including vibration feed mechanism and charging die
Vibrate feed mechanism includes shaking screen, funnel type vibration hole and feeding tube successively from top to bottom, if being provided with the feeding tube
The flat barrier switch of solid carbon dioxide,
The aperture of the sieve aperture of the shaking screen is more than the diameter of plastic packaging material, and the upper aperture in the funnel type vibration hole is more than sieve aperture
Aperture, lower aperture are more than the diameter of a plastic packaging material and less than the diameters of two plastic packaging materials；
The charging die upper surface is provided with some grooves corresponding with feeding bottom of the tube.
2. a kind of semiconductor plastic package material automatic charging device according to claim 1, it is characterised in that also including inductor
One, the inductor one is located on the tube wall of the feeding tube, and the inductor one is located at nethermost horizontal baffle switch
Top.
3. a kind of semiconductor plastic package material automatic charging device according to claim 1, it is characterised in that also including inductor
Two, the inductor two is located on the tube wall of the feeding tube, and the inductor two is located at nethermost horizontal baffle switch
Lower section.
4. a kind of semiconductor plastic package material automatic charging device according to claim 1, it is characterised in that also include being located at Lou
Laser sensor and the average dispersal device of plastic packaging material in bucket type vibration hole.
5. a kind of semiconductor plastic package material automatic charging device according to claim 4, it is characterised in that the plastic packaging material is put down
Monodispersed device includes falling apart is located at two adjacent funnels with two vertical cylinders being located under falling apart, described fall apart
Between type vibration hole, the width to fall apart is more than or equal to the distance between adjacent two funnel types vibration hole；
Two cylinders are arranged side by side with adjacent two funnel types vibration hole.
6. a kind of semiconductor plastic package material automatic charging device according to claim 4, it is characterised in that the plastic packaging material is put down
Monodispersed device includes the passage one and passage two for connecting two neighboring feeding tube, on the tube wall of feeding tube, passage one and passage
Two end switchs provided with vertical baffle；
The passage one and passage two tilt to two different feeding tubes respectively.
7. a kind of semiconductor plastic package material automatic charging device according to claim 4, it is characterised in that also include control
Device, and the counter connected respectively with each laser sensor, the horizontal baffle switch, inductor one, inductor two, gas
Cylinder, vertical baffle switch, counter are connected with controller respectively.
A kind of a kind of 8. method of work of semiconductor plastic package material automatic charging device described in claim 1, it is characterised in that bag
Include following steps：
1）, start shaking screen, plastic packaging material is poured on shaking screen；
2）, plastic packaging material dropped down onto from the sieve aperture of shaking screen funnel type vibration hole in, continuing vibration makes plastic packaging material vertically fall into feeding
Guan Zhong, the horizontal baffle switch in addition to nethermost horizontal baffle switchs is opened successively, each switch is shut immediately after opening,
Sense in each feeding tube there is plastic packaging material to fall to inductor one, stop oscillation；
3）, open nethermost horizontal baffle and switch and shut immediately, sense in each feeding tube there is plastic packaging to inductor two
Material is fallen into the groove of charging die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711301628.5A CN107891555B (en) | 2017-12-10 | 2017-12-10 | Automatic feeding device for semiconductor plastic packaging material and working method of automatic feeding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711301628.5A CN107891555B (en) | 2017-12-10 | 2017-12-10 | Automatic feeding device for semiconductor plastic packaging material and working method of automatic feeding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107891555A true CN107891555A (en) | 2018-04-10 |
| CN107891555B CN107891555B (en) | 2023-10-24 |
Family
ID=61807734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711301628.5A Active CN107891555B (en) | 2017-12-10 | 2017-12-10 | Automatic feeding device for semiconductor plastic packaging material and working method of automatic feeding device |
Country Status (1)
| Country | Link |
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| CN (1) | CN107891555B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110587893A (en) * | 2019-09-11 | 2019-12-20 | 四川洪芯微科技有限公司 | Semiconductor plastic package material feeding device and working method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107891555B (en) | 2023-10-24 |
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