CN107891231A - Smoke-less formulations of solder flux - Google Patents
Smoke-less formulations of solder flux Download PDFInfo
- Publication number
- CN107891231A CN107891231A CN201711204699.3A CN201711204699A CN107891231A CN 107891231 A CN107891231 A CN 107891231A CN 201711204699 A CN201711204699 A CN 201711204699A CN 107891231 A CN107891231 A CN 107891231A
- Authority
- CN
- China
- Prior art keywords
- parts
- solder flux
- formulations
- acetic acid
- tissuemat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Catalysts (AREA)
- Nonmetallic Welding Materials (AREA)
Abstract
The invention discloses a kind of smoke-less formulations of solder flux, including：Carbon fluorine ion surfactant, butyl acetate, calcium chloride, Tissuemat E, styrax acetic acid, silica and catalyst, described formulations of solder flux include following composition by weight：70 90 parts of 100 200 parts of carbon fluorine ion surfactant, 150 300 parts of butyl acetate, 80 120 parts of calcium chloride, 200 300 parts of Tissuemat E, 320 450 parts of styrax acetic acid, silica and catalyst.This formula will not produce substantial amounts of flue gas in welding process, environment will not be polluted, excitant is small.
Description
Technical field
The present invention relates to chemical material field, more particularly to a kind of smoke-less formulations of solder flux.
Background technology
Scaling powder：It can be helped in welding procedure and promote welding process, while there is protective effect, prevent oxidation reaction
Chemical substance, be currently that the scaling powder of in the market can produce flue gas during welding, cause the pollution of environment.
It is badly in need of a kind of smoke-less formulations of solder flux in the market.
The content of the invention
The present invention solves the technical problem of provide a kind of smoke-less formulations of solder flux.
In order to solve the above technical problems, one aspect of the present invention is：A kind of smoke-less scaling powder is provided to match somebody with somebody
Side, including：Carbon fluorine ion surfactant, butyl acetate, calcium chloride, Tissuemat E, styrax acetic acid, silica and catalysis
Agent,
Described formulations of solder flux includes following composition by weight：Carbon fluorine ion surfactant 100-200 parts, butyl acetate 150-
300 parts, calcium chloride 80-120 parts, Tissuemat E 200-300 parts, styrax acetic acid 320-450 parts, silica and catalyst
70-90 parts.
In a preferred embodiment of the present invention, described formulations of solder flux includes following composition by weight：Carbon fluorine ion table
100 parts of face activating agent, 150 parts of butyl acetate, 80 parts of calcium chloride, 200 parts of Tissuemat E, 320 parts of styrax acetic acid, silica
And 70 parts of catalyst.
In a preferred embodiment of the present invention, described formulations of solder flux includes following composition by weight：Carbon fluorine ion table
200 parts of face activating agent, 300 parts of butyl acetate, 120 parts of calcium chloride, 300 parts of Tissuemat E, 450 parts of styrax acetic acid, titanium dioxide
90 parts of silicon and catalyst
In a preferred embodiment of the present invention, described formulations of solder flux includes following composition by weight：Live on carbon fluorine ion surface
150 parts of agent of property, 180 parts of butyl acetate, 100 parts of calcium chloride, 250 parts of Tissuemat E, 350 parts of styrax acetic acid, silica and
80 parts of catalyst.
In a preferred embodiment of the present invention, described formulations of solder flux includes following composition by weight：Carbon fluorine ion table
180 parts of face activating agent, 250 parts of butyl acetate, 90 parts of calcium chloride, 280 parts of Tissuemat E, 400 parts of styrax acetic acid, silica
And 75 parts of catalyst.
Described formulations of solder flux includes following composition by weight in a preferred embodiment of the present invention：Carbon fluorine ion surface
130 parts of activating agent, 230 parts of butyl acetate, 115 parts of calcium chloride, 230 parts of Tissuemat E, 370 parts of styrax acetic acid, silica
And 85 parts of catalyst.
The beneficial effects of the invention are as follows：Smoke-less formulations of solder flux of the present invention, this formula will not produce in welding process
Substantial amounts of flue gas, environment will not be polluted, excitant is small.
Embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example is only the part of the embodiment of the present invention, rather than whole embodiments.It is common based on the embodiment in the present invention, this area
All other embodiment that technical staff is obtained under the premise of creative work is not made, belong to the model that the present invention protects
Enclose.
A kind of smoke-less formulations of solder flux of the present invention, including：It is carbon fluorine ion surfactant, butyl acetate, calcium chloride, poly-
Ethylene waxes, styrax acetic acid, silica and catalyst,
Described formulations of solder flux includes following composition by weight：Carbon fluorine ion surfactant 100-200 parts, butyl acetate 150-
300 parts, calcium chloride 80-120 parts, Tissuemat E 200-300 parts, styrax acetic acid 320-450 parts, silica and catalyst
70-90 parts.
Preferably, described formulations of solder flux includes following composition by weight：100 parts of carbon fluorine ion surfactant, acetic acid
70 parts of 150 parts of butyl ester, 80 parts of calcium chloride, 200 parts of Tissuemat E, 320 parts of styrax acetic acid, silica and catalyst.
Preferably, described formulations of solder flux includes following composition by weight：200 parts of carbon fluorine ion surfactant, acetic acid
90 parts of 300 parts of butyl ester, 120 parts of calcium chloride, 300 parts of Tissuemat E, 450 parts of styrax acetic acid, silica and catalyst
Preferably, described formulations of solder flux includes following composition by weight：150 parts of carbon fluorine ion surfactant, butyl acetate
80 parts of 180 parts, 100 parts of calcium chloride, 250 parts of Tissuemat E, 350 parts of styrax acetic acid, silica and catalyst.
Preferably, described formulations of solder flux includes following composition by weight：180 parts of carbon fluorine ion surfactant, acetic acid
75 parts of 250 parts of butyl ester, 90 parts of calcium chloride, 280 parts of Tissuemat E, 400 parts of styrax acetic acid, silica and catalyst.
Preferably, described formulations of solder flux includes following composition by weight：130 parts of carbon fluorine ion surfactant, acetic acid
85 parts of 230 parts of butyl ester, 115 parts of calcium chloride, 230 parts of Tissuemat E, 370 parts of styrax acetic acid, silica and catalyst.
Smoke-less formulations of solder flux of the present invention, solves the defects of in technical scheme, and this formula will not in welding process
Substantial amounts of flue gas is produced, environment will not be polluted, excitant is small.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in other related technology necks
Domain, it is included within the scope of the present invention.
Claims (6)
- A kind of 1. smoke-less formulations of solder flux, it is characterised in that including：Carbon fluorine ion surfactant, butyl acetate, chlorination Calcium, Tissuemat E, styrax acetic acid, silica and catalyst,Described formulations of solder flux includes following composition by weight：Carbon fluorine ion surfactant 100-200 parts, butyl acetate 150- 300 parts, calcium chloride 80-120 parts, Tissuemat E 200-300 parts, styrax acetic acid 320-450 parts, silica and catalyst 70-90 parts.
- 2. smoke-less formulations of solder flux according to claim 1, it is characterised in that described formulations of solder flux includes following Composition by weight：100 parts of carbon fluorine ion surfactant, 150 parts of butyl acetate, 80 parts of calcium chloride, 200 parts of Tissuemat E, rest in peace 70 parts of fragrant 320 parts of acetic acid, silica and catalyst.
- 3. smoke-less formulations of solder flux according to claim 1, it is characterised in that described formulations of solder flux includes following Composition by weight：200 parts of carbon fluorine ion surfactant, 300 parts of butyl acetate, 120 parts of calcium chloride, 300 parts of Tissuemat E, rest in peace 90 parts of fragrant 450 parts of acetic acid, silica and catalyst.
- 4. smoke-less formulations of solder flux according to claim 1, it is characterised in that described formulations of solder flux includes following Composition by weight：150 parts of carbon fluorine ion surfactant, 180 parts of butyl acetate, 100 parts of calcium chloride, 250 parts of Tissuemat E, rest in peace 80 parts of fragrant 350 parts of acetic acid, silica and catalyst.
- 5. smoke-less formulations of solder flux according to claim 1, it is characterised in that described formulations of solder flux includes following Composition by weight：180 parts of carbon fluorine ion surfactant, 250 parts of butyl acetate, 90 parts of calcium chloride, 280 parts of Tissuemat E, rest in peace 75 parts of fragrant 400 parts of acetic acid, silica and catalyst.
- 6. smoke-less formulations of solder flux according to claim 1, it is characterised in that described formulations of solder flux includes following Composition by weight：130 parts of carbon fluorine ion surfactant, 230 parts of butyl acetate, 115 parts of calcium chloride, 230 parts of Tissuemat E, rest in peace 85 parts of fragrant 370 parts of acetic acid, silica and catalyst.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711204699.3A CN107891231A (en) | 2017-11-27 | 2017-11-27 | Smoke-less formulations of solder flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711204699.3A CN107891231A (en) | 2017-11-27 | 2017-11-27 | Smoke-less formulations of solder flux |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107891231A true CN107891231A (en) | 2018-04-10 |
Family
ID=61806246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711204699.3A Withdrawn CN107891231A (en) | 2017-11-27 | 2017-11-27 | Smoke-less formulations of solder flux |
Country Status (1)
| Country | Link |
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| CN (1) | CN107891231A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192200A (en) * | 2013-03-24 | 2013-07-10 | 广东普赛特电子科技股份有限公司 | Three-prevention electronic liquid soldering flux and preparation method thereof |
| CN103817460A (en) * | 2014-03-17 | 2014-05-28 | 苏州龙腾万里化工科技有限公司 | Novel photo-curing soldering flux |
| CN104084713A (en) * | 2014-06-20 | 2014-10-08 | 宁国新博能电子有限公司 | No-clean soldering flux for copper wire processing |
| CN104842090A (en) * | 2015-05-17 | 2015-08-19 | 合肥长城制冷科技有限公司 | Copper pipe soldering flux formula |
| CN107199417A (en) * | 2017-06-28 | 2017-09-26 | 常州市瑞泰物资有限公司 | A kind of scaling powder |
-
2017
- 2017-11-27 CN CN201711204699.3A patent/CN107891231A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192200A (en) * | 2013-03-24 | 2013-07-10 | 广东普赛特电子科技股份有限公司 | Three-prevention electronic liquid soldering flux and preparation method thereof |
| CN103817460A (en) * | 2014-03-17 | 2014-05-28 | 苏州龙腾万里化工科技有限公司 | Novel photo-curing soldering flux |
| CN104084713A (en) * | 2014-06-20 | 2014-10-08 | 宁国新博能电子有限公司 | No-clean soldering flux for copper wire processing |
| CN104842090A (en) * | 2015-05-17 | 2015-08-19 | 合肥长城制冷科技有限公司 | Copper pipe soldering flux formula |
| CN107199417A (en) * | 2017-06-28 | 2017-09-26 | 常州市瑞泰物资有限公司 | A kind of scaling powder |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180410 |