CN107891146A - A kind of selective laser melting forming metal component supporting mechanism - Google Patents
A kind of selective laser melting forming metal component supporting mechanism Download PDFInfo
- Publication number
- CN107891146A CN107891146A CN201711209241.7A CN201711209241A CN107891146A CN 107891146 A CN107891146 A CN 107891146A CN 201711209241 A CN201711209241 A CN 201711209241A CN 107891146 A CN107891146 A CN 107891146A
- Authority
- CN
- China
- Prior art keywords
- support member
- substrate
- selective laser
- hardware
- supporting substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/40—Structures for supporting workpieces or articles during manufacture and removed afterwards
- B22F10/47—Structures for supporting workpieces or articles during manufacture and removed afterwards characterised by structural features
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
The invention discloses a kind of selective laser melting forming metal component supporting mechanism,It is related to 3D printing field,Including metal substrate and the hardware for melting shaping using selective laser being placed on metal substrate,Also include supporting substrate,The supporting substrate upper surface is movably equipped with several support members,The top of the support member is set to cusp-shaped,The bottom array distribution of support member,The top of each support member together constitutes a unique plane,The front and rear sides wall of supporting substrate is provided with elastic bumps,The metal substrate is provided with two slide rails,Through hole is offered on the slide rail,Supporting substrate is slidably connected with slide rail,And the elastic bumps match with the through hole,It is detachably connected between elastic bumps and through hole,Technical ability of the present invention realizes the firm support to hardware,And can easily removes hardware in the case where ensureing hardware complete appearance.
Description
Technical field
The present invention relates to 3D printing field, and in particular to a kind of selective laser melting forming metal component support machine
Structure.
Background technology
In recent years, 3D printing was quickly grown, and was more and more paid attention to the continuous expansion of application field by each side.With
The appearance of national every policy favourable, increasing material manufacturing also receive the favor of capital, in a foreseeable future in, increasing material manufacturing neck
Domain certainly will welcome the growth of explosion type.Increasing material manufacturing belongs to advanced Digitized Manufacturing Technology, and it can quickly make according to CAD model
Produce the part with complex geometric shapes.Increases material manufacturing technology collection cad technique, Numeric Control Technology, laser technology and material technology
It is the developing direction of following advanced manufacturing technology Deng modern scientific and technical result in one.
Increases material manufacturing technology species is various, in terms of metal increases material manufacturing technology, selective laser melting technology (SLM:
SelectedLaserMelting) be great development prospect metal parts increases material manufacturing technology, in print procedure, laser beam
With rapid melting metal dust and continuously molten road can be obtained, can directly obtain almost arbitrary shape, there is complete metallurgical junction
Close, high-precision intimate densified metal component.Other metal increasing material manufacturing methods that compare such as LENS, SLS, DLF, EBM etc.,
SLM has the advantages that forming efficiency is high, precision is high, good mechanical performance.Selective laser melting technology is using laser as thermal source pair
Dusty material carries out selective laser melting, is a kind of moulding process for being piled into 3D solid from level to level by discrete point.Selection
Property laser melting process, before processing is started, first by operating room's heating filled with inert atmosphere (argon gas or nitrogen), and keep
Below the fusing point of powder.During shaping, feed cylinder rises, powdering roller movement, first in one layer of workbench upper berth fixed thickness
Dusty material, then laser beam under the control of the computer according to cross section profile to where solid section powder carry out laser add
Work, dissolve powder and then reach metallurgical binding one layer of solid contour of formation.After the completion of first layer sintering, workbench, which declines, to be set
Fixation thickness height, repave last layer powder, carry out next layer of sintering, can be again sharp after the powder not utilized is recovered
With, it is such to circulate, form the prototype parts of three-dimensional.
Selective laser melting technology compares classical production process, and the manufacturing cycle of product shortens 1/3rd, material
Utilization rate is expected up to 100%, and the part relative density obtained by selective laser melting technology is up to 100%, mechanical property
Can be suitable with forging better than casting.Selective laser melting technology is especially suitable for the shaping of labyrinth, molding part and matrix point
Only make simple sandblasting from after or rubbing down processing can be used.
Selective laser melting technology has its many excellent as a kind of advanced manufacture compared with conventionally manufactured mode
Point.But a kind of emerging technology is used as, also run into bottleneck unavoidably during development.Due to must on metallic substrates into
Type, the problem of being separated with substrate is just faced with after part forming.Traditional way is that surplus is left at the beginning of design, is made after shaping
It is cut from substrate with wire cutting.This way adds the workload of part manufacture, and essence is carried out to part after separation
Processing, the metal substrate after separation rubbing down will can just be reused after processing.
The content of the invention
It is existing to solve it is an object of the invention to provide a kind of selective laser melting forming metal component supporting mechanism
There is caused above-mentioned multinomial defect in technology.
A kind of selective laser melting forming metal component supporting mechanism, including metal substrate and be placed on metal substrate
The hardware for melting shaping using selective laser, in addition to supporting substrate, the supporting substrate upper surface be movably equipped with
Several support members, the top of the support member are set to cusp-shaped, the bottom array distribution of support member, the top of each support member
A unique plane is together constituted, the front and rear sides wall of supporting substrate is provided with elastic bumps, and the metal substrate is provided with
Two slide rails, offer through hole on the slide rail, supporting substrate is slidably connected with slide rail, and the elastic bumps with it is described logical
Hole matches, and is detachably connected between elastic bumps and through hole.
Preferably, the height of each support member is equal to each other.
Preferably, each support member is the mutually the same cone of size.
Preferably, the supporting substrate is the substrate of engraved structure.
The advantage of the invention is that：The present invention utilizes a kind of brand-new structure design, both can complete to that will be molded
The supporting role of hardware, additionally it is possible to realize the separation between hardware and metal substrate, be easy to hardware from gold
Taken off on category substrate, substantially increase the operating efficiency of selective laser melting forming metal component extraction；
Supporting substrate is designed using engraved structure, can be effectively cost-effective, at the same supporting substrate and metal substrate it
Between using removably being slidably connected, convenient installation and dismounting supporting substrate；
The top of support member is set to cusp-shaped, and the bottom array distribution of support member, the height of each support member is each other
Equal, each support member is the mutually the same cone of size by reducing the contact area of support member and hardware,
It is convenient subsequently to remove hardware, and the integrality of hardware outward appearance is maintained, by increasing support member and supporting substrate
Contact area, realize the supporting substrate support more firm to hardware.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention.
Fig. 2 is the schematic diagram that the present invention applies.
Wherein, 1- supporting substrates, 2- elastic bumps, 3- support members, 4- metal substrates, 5- slide rails, 6- hardwares.
Embodiment
To be easy to understand the technical means, the inventive features, the objects and the advantages of the present invention, with reference to
Embodiment, the present invention is expanded on further.
As shown in Figure 1 to Figure 2, a kind of selective laser melting forming metal component supporting mechanism, including metal substrate 4
With the hardware 6 for melting shaping using selective laser being placed on metal substrate 4, in addition to supporting substrate 1, the support
The upper surface of substrate 1 is movably equipped with several support members 3, and the top of the support member 3 is set to cusp-shaped, the bottom battle array of support member 3
Column distribution, the top of each support member 3 together constitute a unique plane, and the front and rear sides wall of supporting substrate 1 is provided with bullet
Property projection 2, the metal substrate 1 is provided with two slide rails 5, and through hole, supporting substrate 1 and slide rail 5 are offered on the slide rail 5
It is slidably connected, and the elastic bumps 2 match with the through hole, are detachably connected between elastic bumps 2 and through hole.
In the present embodiment, the height of each support member 3 is equal to each other.
In the present embodiment, each support member 3 is the mutually the same cone of size.
In the present embodiment, the supporting substrate 1 is the substrate of engraved structure.
In the present invention, plane of the unique plane that each support member is formed where with supporting substrate 1 and metal substrate 4
It is parallel to each other, using the supporting mechanism of the present invention, using a kind of brand-new structure design, can have both completed to that will be molded
Hardware 6 supporting role, additionally it is possible to realize the separation between hardware 6 and metal substrate 4, be easy to hardware
2 take off from metal substrate 6, substantially increase the operating efficiency of the acquisition of selective laser melting forming metal component 6.
Each support member 3 is all the upper surface for being actively installed on supporting substrate 1, according to reality hardware 6 size and
The factors such as weight, have the quantity of selection support member 5 and the installation site on supporting substrate 1 by oneself, regulation support member 3 is in branch support group
Density Distribution on plate 1, realize the use that support member 3 is reduced while stable support.
When specifically used, first according to the size and weight of hardware 6, the support of the upper surface of supporting substrate 1 is adjusted
The position of part 3, its Density Distribution on supporting substrate 3 is adjusted, then, supporting substrate 1 will be inserted on slide rail 5, and lead to
The cooperation for crossing through hole and elastic bumps 2 is fixed, then hardware 6 is placed on into unique plane that each support member 3 forms
Top, and each support member 3 cusp-shaped top insertion hardware 2 lower surface, and cusp-shaped top insertion metal structure
The depth of the lower surface of part 6 is 0.1mm -0.2mm, works as hardware, after 6 shapings terminate, using nipper plier by each support member 3
The contact position of cusp-shaped top and the lower surface of hardware 6 cut, you can hardware 6 is taken off, and maintained
The integrality of the outward appearance of hardware 6.
Based on above-mentioned, the present invention utilizes a kind of brand-new structure design, can both complete the hardware 6 to that will be molded
Supporting role, additionally it is possible to realize the separation between hardware 6 and metal substrate 4, be easy to hardware 2 from metal substrate
Taken off on 6, substantially increase the operating efficiency of the acquisition of selective laser melting forming metal component 6；
Supporting substrate 4 is designed using engraved structure, can be effectively cost-effective, while supporting substrate 4 and metal substrate 4
Between using removably being slidably connected, convenient installation and dismounting supporting substrate 4；
The top of support member 3 is set to cusp-shaped, the bottom array distribution of support member 3, the height of each support member 3 that
This is equal, and each support member 3 is the mutually the same cone of size by reducing contact of the support member 3 with hardware 6
Area, it is convenient subsequently to remove hardware 6, and maintain the integrality of the outward appearance of hardware 6, by increase support member 3 with
The contact area of supporting substrate 1, realize the support more firm to hardware 6 of supporting substrate 1.
As known by the technical knowledge, the present invention can pass through the embodiment party of other essence without departing from its spirit or essential feature
Case is realized.Therefore, embodiment disclosed above, for each side, all it is merely illustrative, is not only.Institute
Have within the scope of the present invention or be included in the invention in the change being equal in the scope of the present invention.
Claims (4)
1. a kind of selective laser melting forming metal component supporting mechanism, including metal substrate (4) and it is placed in metal substrate
(4) hardware (6) for melting shaping using selective laser on, it is characterised in that described also including supporting substrate (1)
Supporting substrate (1) upper surface is movably equipped with several support members (3), and the top of the support member (3) is set to cusp-shaped, support member
(3) bottom array distribution, the top of each support member (3) together constitute a unique plane, supporting substrate (1) it is front and rear
Two side is provided with elastic bumps (2), and the metal substrate (1) is provided with two slide rails (5), opened up on the slide rail (5)
There is through hole, supporting substrate (1) is slidably connected with slide rail (5), and the elastic bumps (2) match with the through hole, and elasticity is convex
(2) are played to be detachably connected between through hole.
A kind of 2. selective laser melting forming metal component supporting mechanism according to claim 1, it is characterised in that：
The height of each support member (3) is equal to each other.
A kind of 3. selective laser melting forming metal component supporting mechanism according to claim 2, it is characterised in that：
Each support member (3) is the mutually the same cone of size.
A kind of 4. selective laser melting forming metal component supporting mechanism according to claim 1, it is characterised in that：
The supporting substrate (1) is the substrate of engraved structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711209241.7A CN107891146A (en) | 2017-11-27 | 2017-11-27 | A kind of selective laser melting forming metal component supporting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711209241.7A CN107891146A (en) | 2017-11-27 | 2017-11-27 | A kind of selective laser melting forming metal component supporting mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107891146A true CN107891146A (en) | 2018-04-10 |
Family
ID=61806840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711209241.7A Pending CN107891146A (en) | 2017-11-27 | 2017-11-27 | A kind of selective laser melting forming metal component supporting mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107891146A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109202083A (en) * | 2018-10-15 | 2019-01-15 | 深圳技师学院（深圳高级技工学校） | A kind of 3D printing method |
| CN110466217A (en) * | 2019-08-27 | 2019-11-19 | 大连理工大学 | A kind of tencel metal laminate and preparation method thereof |
| CN111421138A (en) * | 2019-10-14 | 2020-07-17 | 江苏科技大学 | Movable combined type selective laser melting metal additive manufacturing movable substrate |
| CN112935278A (en) * | 2021-04-12 | 2021-06-11 | 李�浩 | 3D prints injection mold convenient to dismantle |
| WO2021232298A1 (en) * | 2020-05-20 | 2021-11-25 | 西门子股份公司 | Additive manufacturing method |
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| CN105127423A (en) * | 2015-09-07 | 2015-12-09 | 苏州西帝摩三维打印科技有限公司 | Selective laser melting three-dimensional printing device |
| CN204977468U (en) * | 2015-08-25 | 2016-01-20 | 宁波乔克兄弟三维科技有限公司 | 3d printer |
| CN205684719U (en) * | 2016-06-15 | 2016-11-16 | 北京隆源自动成型系统有限公司 | A kind of support means for selective laser melting form metal component |
| CN106141184A (en) * | 2016-08-13 | 2016-11-23 | 中北大学 | Multi-functional selective laser melting shapes SLM substrate levelling device |
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2017
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130004607A1 (en) * | 2009-12-02 | 2013-01-03 | Prometal Rct Gmbh | Construction box for a rapid prototyping system |
| CN204977468U (en) * | 2015-08-25 | 2016-01-20 | 宁波乔克兄弟三维科技有限公司 | 3d printer |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109202083A (en) * | 2018-10-15 | 2019-01-15 | 深圳技师学院（深圳高级技工学校） | A kind of 3D printing method |
| CN110466217A (en) * | 2019-08-27 | 2019-11-19 | 大连理工大学 | A kind of tencel metal laminate and preparation method thereof |
| CN110466217B (en) * | 2019-08-27 | 2022-01-04 | 大连理工大学 | Fiber metal laminated plate and preparation method thereof |
| CN111421138A (en) * | 2019-10-14 | 2020-07-17 | 江苏科技大学 | Movable combined type selective laser melting metal additive manufacturing movable substrate |
| CN111421138B (en) * | 2019-10-14 | 2022-02-25 | 江苏科技大学 | Movable combined type selective laser melting metal additive manufacturing movable substrate |
| WO2021232298A1 (en) * | 2020-05-20 | 2021-11-25 | 西门子股份公司 | Additive manufacturing method |
| CN112935278A (en) * | 2021-04-12 | 2021-06-11 | 李�浩 | 3D prints injection mold convenient to dismantle |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180410 |