CN107888849B - Method for realizing area array imaging mode of linear TDI (time delay integration) type infrared detector - Google Patents
Method for realizing area array imaging mode of linear TDI (time delay integration) type infrared detector Download PDFInfo
- Publication number
- CN107888849B CN107888849B CN201711021452.8A CN201711021452A CN107888849B CN 107888849 B CN107888849 B CN 107888849B CN 201711021452 A CN201711021452 A CN 201711021452A CN 107888849 B CN107888849 B CN 107888849B
- Authority
- CN
- China
- Prior art keywords
- detector
- data
- tdi
- infrared detector
- type infrared
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/701—Line sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/711—Time delay and integration [TDI] registers; TDI shift registers
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Radiation Pyrometers (AREA)
- Image Processing (AREA)
Abstract
The invention discloses a system for realizing a linear TDI infrared detector area array imaging mode, which realizes the output of the area array imaging mode through a Bypass test mode and comprises: the system comprises an upper computer, a preprocessing device and a linear TDI infrared detector, wherein the upper computer sends an area array working command to the preprocessing device, the preprocessing device starts to set a linear TDI infrared detector control register after receiving the upper computer command, the content of relevant bits of a Bypass test mode is continuously switched to enable the detector to output a determined pixel array imaging signal, the preprocessing device receives an analog imaging signal output by a conversion detector and finally sends arranged digital imaging data to the upper computer, and the upper computer completes image display and storage. The method is simple and easy to implement, has intuitive result and short development period, improves the integration level of the pretreatment device, and provides technical support for the practicability of the linear TDI type infrared detector.
Description
Technical Field
The invention belongs to the technical field of infrared imaging, and relates to a method for realizing an area array imaging mode of a linear TDI (time delay integration) type infrared detector.
Background
The linear TDI infrared detector is an important photoelectric load in the field of remote sensing mapping, the collection of large-width imaging data can be realized by a working mode of TDI linear push-broom, and a multispectral imaging system is often integrated with a plurality of linear TDI infrared detectors to realize multispectral imaging data collection and provide a foundation for later-stage spectral band fusion. In a multi-spectral-band linear TDI infrared detector integrated system, in order to ensure the geometric precision of imaging data, the scanning direction must be strictly vertical to the arrangement direction of pixel lines of a detector; in order to ensure that the spectrum data can be fused, the consistency of the linear arrays must be ensured among the linear array TDI type infrared detectors. In the installation and debugging of the area array type detector, a word target is generally adopted to search the position relationship between a target and pixels so as to determine the orientation of a linear array, but the conventional working mode of a linear array TDI device is TDI integration, the obtained imaging data is the result of the combined action of a plurality of pixels, the relationship between pixel arrangement and the imaging data cannot be effectively established, the difficulty is increased for the system integration and debugging, and in the process of the multispectral linear array TDI type infrared detector system integration static installation and debugging, if the imaging data can correspond to the pixel position arrangement, the integration and debugging efficiency is greatly improved. Therefore, the method can realize the area array imaging mode of the linear TDI infrared detector, output all pixel information, establish the relation between imaging data and pixel position arrangement, and has important significance for the integration and debugging of the multispectral linear TDI infrared detector system.
Disclosure of Invention
Objects of the invention
The purpose of the invention is: the method for realizing the area array imaging mode of the linear TDI infrared detector enables the linear TDI infrared detector to work in the area array imaging mode in a static state, outputs imaging data of all pixels, establishes a relation between the imaging data and pixel position arrangement, expands the working mode of the linear TDI infrared detector, and provides technical support for debugging and other applications of the linear TDI infrared detector.
(II) technical scheme
In order to solve the technical problem, the invention provides a system for realizing an area array imaging mode of a linear TDI (time delay and integration) type infrared detector, which is characterized in that the output of the area array imaging mode is realized by utilizing a Bypass test mode of the linear TDI type infrared detector, an upper computer sends an area array working command to a preprocessing device, the preprocessing device starts to set a linear TDI type infrared detector control register after receiving the command of the upper computer, the content of relevant bits of the Bypass test mode is continuously switched to enable the detector to output a determined pixel array imaging signal, the preprocessing device receives an analog imaging signal output by a conversion detector, and finally, arranged digital imaging data are sent to the upper computer, and the upper computer completes image display and storage.
The line-array TDI type infrared detector normally works in a TDI integration mode, for example, a 512 × 6-element line-array TDI type infrared detector is used, in the TDI integration mode, the output result of the detector is an accumulated value of 6 pixels, if a system images a target in a static state, the imaging effect of the 6 pixels is combined, the specific imaging information of each pixel cannot be distinguished, and the specific position of the target imaging cannot be determined, a Bypass test mode is a test interface reserved by a manufacturer of the line-array TDI type infrared detector for testing the performance of the detector, the TDI process can be bypassed in the Bypass test mode, single-row addressing of the detector pixels can be achieved, namely the detector outputs 512 pixel data of a certain line in the 6 lines after setting is successful, the Bypass test mode is achieved by setting DIR, BYPPAS 2 and BYPAS1 bits of a control register of the line-array TDI type infrared detector, and the control register of the line-array TDI type infrared detector is normally set only once in a starting-up integration mode.
The pretreatment device comprises: the device comprises a communication module, a detector control module, an analog-to-digital conversion module, a data preprocessing module and a data output module; the communication module is used for communicating with the upper computer and analyzing the control command of the upper computer; the detector control module is used for generating signals of a detector working clock MC, an integration time INT and a serial interface SERDAT to control the working state of the detector, and accessing the control register of the linear TDI type infrared detector through the signals of the serial interface SERDAT; the analog-to-digital conversion module is used for digitizing the analog signal output by the detector; the data preprocessing module is used for packaging the digitized imaging data according to an image acquisition format; and the data output module is used for sending the packed imaging data to the upper computer.
The upper computer is used for sending commands to control the working state of the preprocessing device and receiving the image data sent by the preprocessing device.
Further, the method for realizing the area array imaging mode of the linear TDI infrared detector is realized by the following steps:
step S1: and starting up and sending an area array working command. The linear TDI type infrared detector is normally started to work, is in a TDI integral working mode by default, and the upper computer sends an area array working command to the preprocessing device;
step S2: and receiving a command and setting a detector control register. The preprocessing device receives an area array working command, changes the working mode of the detector control module, the detector control module increases the access frequency of a control register of the linear TDI type infrared detector, the modification setting of the detector control module on the linear TDI type infrared detector control register is increased from the start-up setting once during the TDI integration working mode to the setting once per line period every time the detector outputs complete 512 data to calculate a line period, the detector control module opens a register modification window at the moment of an idle period t1, three-bit data of DIR, BYPAD 2 and BYPAD 1 are modified, after the idle period is over, the register modification window is closed, the content of the linear TDI type infrared detector control register is written into the linear TDI type infrared detector in a serial mode, and the detector works according to the register content set at the moment of t1 in the next line period, the detector data corresponding to the setting of the time t1 can be really output in the next period, so that two line period delays exist between the setting time of the control register of the linear TDI infrared detector and the detector data corresponding to the setting time; the detector control module modifies DIR, BYPAS2 and BYPAS1 three-column data into determined content according to each row of the detector specification, and the detector can sequentially output single-column imaging data from a 1 st column to a 6 th column;
step S3: and converting the data preprocessing mode. The analog-to-digital conversion module receives single-row imaging data output by the linear TDI type infrared detector, digitizes the single-row imaging data and inputs the digitized single-row imaging data into the data preprocessing module, the data preprocessing module also changes the working mode after the preprocessing device receives an area array working command, changes the parity data delay synthesis mode during TDI integration working into a direct odd coupling mode during area array working, namely, buffering of a plurality of lines of imaging data is not performed any more, the imaging data of a odd area and an even area are data generated at the same exposure time, but in order to increase the compatibility of the preprocessing device and reduce the system complexity, the output image frame and the image output time of the preprocessing device are not changed under the area array working mode, the detector control module is required to circularly modify three-bit data of DIR, BYPAD 2 and BYPAD 1 in the linear TDI type infrared detector control register, enabling the detector to work in a single-column image output mode from the 1 st column to the 6 th column in a circulating mode;
step S4: and (6) aligning data. Before the data are transmitted to the data output module, the 1 st row of the packed data must be determined as the 1 st row of the pixel of the linear TDI type infrared detector, so as to ensure that the 1 st line acquired and displayed by the upper computer is the 1 st line of the pixel of the linear TDI infrared detector, as already explained in step S2, there is a delay of two line periods between the setting time of the control register of the line-array TDI type infrared detector and the corresponding detector data, and it is pointed out in step S3 that the image output time when the TDI integration operation mode is adopted in the area array operation mode, in addition to the two line period delay described in step S2, the area array operation mode should also take into account the line period delay caused by the parity delay image output timing in the TDI integration operation mode, therefore, only by setting a proper output delay parameter, the 1 st row acquired and displayed by the upper computer can be ensured to be the 1 st row of the pixels of the linear TDI type infrared detector;
step S5: and (5) outputting, collecting and displaying data. The data preprocessing module sends the aligned imaging data to the data output module, the data output module sends the data to the upper computer through an interface chip, the upper computer acquires an area array image with the same image amplitude as that in a TDI integration working mode, and in step S3, the detector control module enables the line-array TDI type infrared detector to circularly work in a single-column image output mode from the 1 st column to the 6 th column, and in step S4, proper output delay parameters are set to ensure that the 1 st row acquired and displayed by the upper computer is the 1 st column of pixels of the line-array TDI type infrared detector, so that the upper computer acquires images which are circularly performed in 6 lines, and only the front 6 rows of data can be displayed in a cutting mode and respectively correspond to the 1 st column to the 6 th column of pixel data of the line-array TDI type infrared detector.
(III) advantageous effects
The method for realizing the area array imaging mode of the linear TDI infrared detector expands the imaging mode of the linear TDI infrared detector and enriches the testing means and the debugging method of the linear TDI infrared detector; the method is simple and easy to implement, the result is visual, and the relation between pixels and images of the linear TDI type device is established; the development period is short, the integration level of the pretreatment device is improved based on the developed TDI integration working mode resource optimization design, and technical support is provided for the practicability of the linear TDI type infrared detector.
Drawings
FIG. 1 is a schematic diagram of arrangement of pixels of a linear TDI infrared detector and a schematic diagram of the problem of consistency of linear arrays.
Fig. 2 is a schematic diagram of the image acquisition system of the linear TDI type infrared detector.
Fig. 3 shows the definition of the control bit of the Bypass test mode of the control register of the linewise TDI type infrared detector adopted by the present invention.
Fig. 4 is a schematic diagram of a detector control mode in the area array operating mode of the linear TDI type infrared detector.
Fig. 5 is a schematic diagram of an image output mode of a linear TDI infrared detector area array imaging mode.
Fig. 6 is a diagram of the correspondence between imaging data and target imaging positions in the area array imaging mode of the linear TDI infrared detector.
Detailed Description
In order to make the objects, contents, and advantages of the present invention clearer, the following detailed description of the embodiments of the present invention will be made in conjunction with the accompanying drawings and examples.
The multispectral imaging system requires that the line arrays of all spectral line array TDI type infrared detectors are strictly consistent in the integrated assembly and debugging process, the imaging direction is strictly parallel to the scanning direction of a platform, the pixel arrangement of the line array TDI type infrared detectors is shown in figure 1, the figure takes a 512 × 6-element line array TDI type infrared detector as an example, each 6 pixels form an imaging channel, in the TDI integration working mode, imaging is completed in the TDI mode along the X direction, the output result of the detector is the accumulated value of the imaging results of the 6 pixels, the Y direction is the line array direction of the detector, if the line array TDI type infrared detectors work in the TDI integration working mode, whether a word target is parallel to the line array direction or not, the imaging results are possibly the same, the direct relation between the target and the line array direction cannot be found from the output result of the detector, difficulty is increased for assembly and debugging, the problem existing technology is solved, the invention provides a method for realizing the line array imaging mode of the TDI type infrared detectors, realizes the plane array output testing mode by using the Bypass testing mode of the line array infrared detectors, controls the plane array output testing mode, and provides a device for realizing the plane imaging data transmission of the imaging system, and the invention, and realizes the plane imaging system, and the invention, and provides the invention for realizing the plane imaging system for realizing the method for realizing the target data transmission of the invention, and the.
The Bypass test mode is a test interface reserved for detector performance test by the manufacturer of the linear TDI infrared detector, can Bypass the TDI process, can realize single-row addressing of detector pixels, namely, after each successful setting, the detector outputs 512 pixel data (including odd region pixels and even region pixels) of one line in the 6 lines, the test mode is realized by setting the contents of DIR, BYPAD 1 and BYPAD 2 bits in the control register of the linear TDI type infrared detector, the control register of the linear TDI type infrared detector has 30 bits, the detector is used for realizing functions of detector gain control, integral direction control, blind pixel substitution and the like, DIR, BYPAD 2 and BYPAD 1 bits are respectively positioned at three bits of bit4, bit5 and bit6 of the control register of the line TDI infrared detector, and 8 combinations of three data bits are formed, as shown in figure 3, 8 detector pixel output modes can be realized.
The pretreatment device comprises: the device comprises a communication module, a detector control module, an analog-to-digital conversion module, a data preprocessing module and a data output module; the communication module is used for communicating with the upper computer and analyzing the control command of the upper computer; the detector control module is used for generating signals of a detector working clock MC, an integration time INT and a serial interface SERDAT to control the working state of the detector, and accessing the control register of the linear TDI type infrared detector through the signals of the serial interface SERDAT; the analog-to-digital conversion module is used for digitizing the analog signal output by the detector; the data preprocessing module is used for packaging the digitized imaging data according to an image acquisition format; and the data output module is used for sending the packed imaging data to the upper computer.
The upper computer is used for sending commands to control the working state of the preprocessing device and receiving the image data sent by the preprocessing device.
The invention utilizes the upper computer to send an area array imaging mode command, the preprocessing device receives the command and controls the state of a control register of the linear TDI type infrared detector, three-bit contents of DIR, BYPAD 2 and BYPAD 1 are circularly set, the linear TDI type infrared detector circularly and sequentially outputs the 1 st row to the 6 th row of the linear array to realize the output of a 512 × 6-element area array image, and finally the upper computer finishes image acquisition, in particular to a method for realizing the area array imaging mode of the linear TDI type infrared detector, which comprises the following steps:
step S1: and starting up and sending an area array working command. The linear TDI type infrared detector is normally started to work, is in a TDI integral working mode by default, and the upper computer sends an area array working command to the preprocessing device;
step S2: and receiving a command and setting a detector control register. The preprocessing device receives an area array working command and changes the working mode of the detector control module, specifically, the preprocessing device controls the working state and data output of the line array TDI-type infrared detector through a time sequence shown in FIG. 4, when the line array TDI-type infrared detector is in a TDI integration working mode, the line array TDI-type infrared detector is only started up and set once, a register modification window is closed at the rest time, the change of the working state of the detector is forbidden, in order to realize the output of the area array imaging mode, after the preprocessing device receives the area array working command sent by the upper computer, the control mode of the detector control module to the line array TDI-type infrared detector is changed, the register modification window is opened in a data idle period after 512 data outputs are completed in each row, and the three-bit data contents of DIR, BYPAS2 and PAS BYP 1 are modified, before the idle period is finished, a register modification window is closed, the content of a control register is written into the linear TDI infrared detector in a serial mode, as shown in FIG. 4, t1 completes the modification of the content of the register, the detector works according to the content of the register set at the time of t1 in the next line period, and the detector data corresponding to the setting of the time of t1 can be really output in the next line period, so that the delay of two line periods exists between the setting time of the control register of the linear TDI infrared detector and the detector data corresponding to the setting time of the control register;
step S3: and converting the data preprocessing mode. In the TDI integral operation mode, pixels of the linear TDI infrared detector are arranged in odd and even regions, so that data in an imaging region of the preprocessing device are cached first and synthesized with a subsequent imaging region after n line periods, and then the data are output in the area array operation mode, the data in the odd and even regions are output simultaneously without delay synthesis, but in order to improve the integration degree of the preprocessing device, reduce the system complexity and simplify the operation process, the area array imaging mode follows the image output mode of the TDI integral operation mode, as shown in fig. 5, in the TDI integral operation mode, effective data are output backwards only after n lines are continuously and effectively output by the detector, n is a delay odd and even line number and is arranged in the preprocessing device, on the basis, after the area array imaging mode is started, a detector control module of the preprocessing device advances two line period cycles of the original 1 st effective output line period of the linear TDI infrared detector Setting relevant bits of a Bypass test mode in the control register of the linear TDI type infrared detector as DIR 0, BYPAS2 0 and BYPAS1 1, enabling an original 1 st effective output line to output 1 st column of pixel data periodically, setting DIR 0, BYPAS2 1 and BYPAS1 0 in a line period before the 1 st effective output line period of the original detector, enabling an original 2 nd effective output line to output 2 nd column of pixel data periodically, and repeating in sequence to output pixel data of 1 st to 6 th columns;
step S4: and (6) aligning data. Before data is transmitted to the data output module, it is necessary to determine the 1 st row of packed data as the 1 st column of the pixel of the TDI type infrared detector, so as to ensure that the 1 st row collected and displayed by the upper computer is the 1 st column of the pixel of the TDI type infrared detector, as already stated in step S2, there is a delay of two line periods between the setting time of the control register of the TDI type infrared detector and the corresponding detector data, it is pointed out in step S3 that the image output time when the TDI integration operation mode is adopted in the area array operation mode, so in addition to the delay of two line periods stated in step S2, the area array imaging mode should also consider the line period delay caused by the delay of the odd and even image output time in the TDI integration operation mode, and it is also pointed out in step S3 that the detector control module makes the TDI type infrared detector circularly operate in the single-column image output mode of the 1 st to the 6 th columns, therefore, as long as a proper output delay parameter n is set, the 1 st row acquired and displayed by the upper computer can be ensured to be the 1 st row of the pixels of the linear TDI type infrared detector; according to the previous analysis, in the setting state, the 1 st effective output row periodically outputs the 1 st column of pixel data, the 2 nd effective output row periodically outputs the 2 nd column of pixel data, and the like, when the 6 th effective output row outputs the 6 th column, the 1 st column of pixel data is output again on the 7 th effective output row, and according to the rule, n is a multiple of 6, so that the data of the 1 st column of pixel arrangement of the 1 st column of output data can be ensured;
and S5, outputting data and acquiring and displaying, wherein the data preprocessing module sends the aligned imaging data to the data output module, the data output module sends the data to the upper computer through an interface chip, the upper computer acquires an area array image with the same image frame as that in the TDI integration working mode, only displays the image data of the first 6 lines by utilizing a cutting mode, respectively corresponds to the pixel data of the 1 st to the 6 th lines of the linear TDI type infrared detector (6 k +1 to 6k +6 lines of data can also be cut, wherein k is an integer, the minimum value is 0, the maximum value is required to ensure that 6k +6 is not more than the total number of lines output in the TDI integration working mode), the effective image frame in the area imaging mode is 512 × 6, 0 is taken as an initial pixel point, each line of the even coordinate position point is pixel data of an odd area of the detector, the odd coordinate position point is pixel data of an even area of the detector, the corresponding relation is shown in FIG. 6, the upper pixel can independently view the data of the odd and even coordinate position points or even and odd and even coordinate position points of the image data of the odd and even coordinate positions of the line array image data and the odd and even coordinate point and the odd coordinate point can be.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (4)
1. A method for realizing a linear TDI type infrared detector area array imaging mode is realized by a system for realizing the linear TDI type infrared detector area array imaging mode, the system for realizing the area array imaging mode output is realized by a Bypass test mode, and the method comprises the following steps: the system comprises an upper computer, a preprocessing device and a linear TDI (time delay and integration) infrared detector, wherein the upper computer sends an area array working command to the preprocessing device, the preprocessing device starts to set a linear TDI infrared detector control register after receiving the upper computer command, the content of relevant bits of a Bypass test mode is continuously switched to enable the detector to output a determined pixel array imaging signal, the preprocessing device receives an analog imaging signal output by a conversion detector and finally sends arranged digital imaging data to the upper computer, and the upper computer completes image display and storage; the linear TDI type infrared detector works in a TDI integration mode, and the implementation of the Bypass test mode is realized by setting DIR, BYPAS2 and BYPAS1 bits of a control register of the linear TDI type infrared detector; the pretreatment device comprises: the device comprises a communication module, a detector control module, an analog-to-digital conversion module, a data preprocessing module and a data output module; the communication module is used for communicating with the upper computer and analyzing the control command of the upper computer; the detector control module is used for generating a detector working clock, integration time and serial interface signals to control the working state of the detector, and accessing the linear TDI infrared detector control register through the serial interface signals; the analog-to-digital conversion module is used for digitizing the analog signal output by the detector; the data preprocessing module is used for packaging the digitized imaging data according to an image acquisition format; the data output module is used for sending the packed imaging data to the upper computer, and is characterized by comprising the following steps:
step S1: starting a linear TDI (time delay and integration) type infrared detector and sending an area array working command;
step S2: the preprocessing device receives a command and sets a detector control register;
step S3: the preprocessing device converts a data preprocessing mode;
step S4: data alignment, namely setting output delay parameters before the data are transmitted to the data output module, and realizing that the 1 st row acquired and displayed by the upper computer is the 1 st row of pixels of the linear TDI type infrared detector;
step S5: data output, acquisition and display;
in the step S1, the line-array TDI type infrared detector is normally turned on and in the TDI integral operation mode, and the upper computer sends an area array operation command to the preprocessing device;
in step S2, the preprocessing apparatus receives an area array operation command, changes the operation mode of the detector control module, and the detector control module increases the access frequency to the control register of the line TDI type infrared detector;
in step S2, the line-column TDI type infrared detector is a 512 × -element line-column TDI type infrared detector, when the detector outputs 512 complete data to calculate a line period, the modification setting of the line-column TDI type infrared detector control register by the detector control module is increased from the start-up setting in the TDI integration operation mode to the setting of each line period once, the detector control module opens a register modification window at the time of an idle period t1, modifies DIR, by 2, and BYPAS1 three-bit data, after the idle period is finished, the register modification window is closed, the contents of the line-column TDI type infrared detector control register are written into the line-column TDI type infrared detector in a serial manner, the detector operates the register contents set at the time of t1 in the next line period, and can really output detector data corresponding to the time of t1 in the next period, so that the contents of the line-column TDI type infrared detector control register set at the time and the detector data corresponding to the detector have a delay of two line periods, the contents of the detector control module modifies the detector and the detector in turn to output data of a single-column TDI, and the by 8678, and the detector control module sequentially determines the contents of the line-column TDI type infrared detector as imaging data.
2. The method according to claim 1, wherein in step S3, the analog-to-digital conversion module receives single-row imaging data outputted by the TDI infrared detector, digitizes the single-row imaging data, and inputs the digitized single-row imaging data into the data preprocessing module, and the data preprocessing module changes the operation mode after the preprocessing device receives the area array operation command, so as to change the delayed synthesis mode of parity data during TDI integration operation into the direct parity synthesis mode during area array operation, i.e. buffering of several lines of imaging data is not performed, and the imaging data in the odd area and the even area are both data generated at the same exposure time; and the detector control module circularly modifies the DIR, BYPAS2 and BYPAS1 three-bit data in the control register of the linear TDI type infrared detector, so that the detector circularly works in a single-column image output mode from the 1 st column to the 6 th column.
3. The method for implementing the area array imaging mode of the line-array TDI type infrared detector as set forth in claim 2, wherein in the step S4, when the output delay parameter is set, there is a delay of two line periods between the setting time of the control register of the line-array TDI type infrared detector and the corresponding detector data in the step S2; the image output timing in the TDI integration operation mode in the area array operation mode in step S3 includes a line period delay due to the odd-even delay image output timing in the TDI integration operation mode, in addition to the delay of two line periods in step S2.
4. The method according to claim 3, wherein in step S5, the data preprocessing module sends the aligned imaging data to the data output module, the data output module sends the data to the upper computer through an interface chip, and the upper computer acquires an area array image with the same image size as that in the TDI integration mode; based on the step S3, the detector control module makes the linear TDI type infrared detector circularly work in a single-column image output mode from the 1 st column to the 6 th column; based on the step S4, it is ensured that the 1 st line collected and displayed by the upper computer is the 1 st line of the pixels of the linear TDI type infrared detector by setting a suitable output delay parameter, the upper computer collects images circulating in 6 lines periodically, only the first 6 lines of data are displayed by using a cutting mode, and the data correspond to the 1 st line to the 6 th line of pixel data of the linear TDI type infrared detector respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711021452.8A CN107888849B (en) | 2017-10-27 | 2017-10-27 | Method for realizing area array imaging mode of linear TDI (time delay integration) type infrared detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711021452.8A CN107888849B (en) | 2017-10-27 | 2017-10-27 | Method for realizing area array imaging mode of linear TDI (time delay integration) type infrared detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107888849A CN107888849A (en) | 2018-04-06 |
| CN107888849B true CN107888849B (en) | 2020-07-28 |
Family
ID=61782659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711021452.8A Active CN107888849B (en) | 2017-10-27 | 2017-10-27 | Method for realizing area array imaging mode of linear TDI (time delay integration) type infrared detector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107888849B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102158651A (en) * | 2011-03-23 | 2011-08-17 | 中国科学院上海技术物理研究所 | TDI-CCD (time-delayed-integration charge coupled device) camera real-time image motion digital compensation system and compensation method |
| CN102466521A (en) * | 2010-11-12 | 2012-05-23 | 南京理工大学 | TDI (Time Delay Integration) scan imaging method for Snapshot type area array infrared detector |
| CN103024299A (en) * | 2012-11-30 | 2013-04-03 | 中国科学院上海技术物理研究所 | Gazing type digital trandport driver interface (TDI) short wave infrared glimmering imager and imaging method |
| CN106404179A (en) * | 2016-08-31 | 2017-02-15 | 天津津航技术物理研究所 | Infrared TDI detector bidirectional scanning characteristic-based real-time calibration method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8463078B2 (en) * | 2007-08-23 | 2013-06-11 | Lockheed Martin Corporation | Multi-bank TDI approach for high-sensitivity scanners |
-
2017
- 2017-10-27 CN CN201711021452.8A patent/CN107888849B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102466521A (en) * | 2010-11-12 | 2012-05-23 | 南京理工大学 | TDI (Time Delay Integration) scan imaging method for Snapshot type area array infrared detector |
| CN102158651A (en) * | 2011-03-23 | 2011-08-17 | 中国科学院上海技术物理研究所 | TDI-CCD (time-delayed-integration charge coupled device) camera real-time image motion digital compensation system and compensation method |
| CN103024299A (en) * | 2012-11-30 | 2013-04-03 | 中国科学院上海技术物理研究所 | Gazing type digital trandport driver interface (TDI) short wave infrared glimmering imager and imaging method |
| CN106404179A (en) * | 2016-08-31 | 2017-02-15 | 天津津航技术物理研究所 | Infrared TDI detector bidirectional scanning characteristic-based real-time calibration method |
Non-Patent Citations (1)
| Title |
|---|
| 线列TDI 型红外探测器组件坏元替代方法;郭亮等;《激光与红外》;20150731;第45卷(第7期);809-813 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107888849A (en) | 2018-04-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9124829B2 (en) | Optical black pixel readout for image sensor data correction | |
| CN101888491B (en) | Solid-state imaging apparatus | |
| CN103986869A (en) | Image collecting and displaying device of high-speed TDICCD remote sensing camera | |
| CN102638661A (en) | Data processing and transmitting system of high-speed multichannel CCD (charge-coupled device) | |
| US20170332022A1 (en) | Imaging method, imaging device, and electronic device | |
| CN111669517B (en) | Video overlapping method | |
| CN101916428A (en) | Image processing device for image data | |
| CN110225316B (en) | Software and hardware cooperative multi-channel video processing device and system | |
| CN102835948B (en) | A kind of swept light source OCT Real-time image display method and system thereof | |
| CN111669648A (en) | Video frequency doubling method | |
| CN107888849B (en) | Method for realizing area array imaging mode of linear TDI (time delay integration) type infrared detector | |
| JP4584391B2 (en) | Device for panning and scaling the screen with an image sensor | |
| CN102868865B (en) | The circuit that a kind of image picture elements merges and method | |
| CN103813144A (en) | Information processing device, imaging device, and information processing method | |
| CN109068023B (en) | Synchronous control system and control method for reading circuit of super-large area array image sensor | |
| CN116539160A (en) | Uncooled infrared detector imaging and thermal time constant testing system and method | |
| CN101436168B (en) | Image acquiring method and apparatus based on USB | |
| CN104156954A (en) | Registration pre-processing system suitable for multispectral image compression | |
| CN100481913C (en) | Device of asynchronous acquisition for image in real time | |
| RU85781U1 (en) | DEVICE FOR ELECTRONIC PROCESSING OF SIGNALS OF MATRIX PHOTO RECEPTION DEVICES | |
| CN215871605U (en) | Multi-view imaging circuit with self-adaptive cache | |
| CN110285886A (en) | A kind of data transmission method and device of infrared machine core | |
| US9049422B2 (en) | Data throttling to facilitate full frame readout of an optical sensor for wafer testing | |
| TWI500313B (en) | Image scanning system and method of controlling the same | |
| CN100555404C (en) | Image is adjusted circuit and interpolating circuit and interpolating method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |