CN107887292A - Silicon chip chemical reduction equipment - Google Patents
Silicon chip chemical reduction equipment Download PDFInfo
- Publication number
- CN107887292A CN107887292A CN201610867231.1A CN201610867231A CN107887292A CN 107887292 A CN107887292 A CN 107887292A CN 201610867231 A CN201610867231 A CN 201610867231A CN 107887292 A CN107887292 A CN 107887292A
- Authority
- CN
- China
- Prior art keywords
- hand basket
- silicon chip
- supporting plate
- horizontal supporting
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The present invention relates to a kind of silicon chip chemical reduction equipment, including contain the casing of nitration mixture liquid, it is characterised in that：Tank floor is fixed with horizontal supporting plate using column, the rectangular bubble through hole for offering on gas sparging box and horizontal supporting plate and being communicated with gas sparging box is fixed with below horizontal supporting plate, the rotation hand basket being supported by support and the support for clamping silicon chip is provided with above horizontal supporting plate, hand basket is rotated by two circular fixed plates, four piece hand basket bars composition of the lateral arrangement between two circular fixed plates, four hand basket bars are uniformly distributed using the center line of circular fixed plate as symmetrical centre, hand basket bar is uniformly provided with multiple radial ringed grooves along its length, the radial ringed groove location of four hand basket bars is mutually corresponding and forms the silicon chip clamping groove of multiple vertical direction.Its is reasonable in design, simple to operate, realizes silicon chip one side chemical reduction, not only produces of large quantities, and improves yield rate, saves resource, reduces production cost.
Description
Technical field
The present invention relates to silicon chip thinning single surface technology, particularly a kind of production process suitable for power semiconductor
Silicon chip chemical reduction equipment.
Background technology
Silicon chip thinning single surface technology is mainly used in the controllable silicon, commutation diode, the pole of high density two of 6500V high pressures series
The production technology of pipe, the effect of thinning single surface is to improve the surface millivolt number of silicon chip one side, in order to next step phosphorus diffusion process
Smoothly complete.At present, other domestic enterprises all use conventional reduction process, i.e., are thinned with grinding machine, there are the following problems for it：Subtract
Thin lack of homogeneity, the thickness subtracted are difficult to accurately control, easy fragment, and are ground by diamond dust, introduce impurity again, make
It is difficult to control into silicon chip surface state.
The content of the invention
The invention aims to provide a kind of silicon chip reasonable in design, simple to operate to solve the above problems
Stripping apparatus is learned, realizes silicon chip one side chemical reduction, not only produces of large quantities, and yield rate is improved, saves resource, reduce
Production cost.
The technical scheme is that：
A kind of silicon chip chemical reduction equipment, including contain the casing of nitration mixture liquid, it is characterised in that：The tank floor profit
Horizontal supporting plate is fixed with column, is fixed with gas sparging box and horizontal supporting plate and offers below the horizontal supporting plate
The rectangular bubble through hole communicated with gas sparging box, the horizontal supporting plate top, which is provided with support and the support, to be supported by
For the rotation hand basket of clamping silicon chip, the rotation hand basket is by two circular fixed plates, lateral arrangement in two circular fixed plates
Between four hand basket bars composition, four hand basket bars are uniformly distributed using the center line of circular fixed plate as symmetrical centre, described to carry
Basket bar is uniformly provided with multiple radial ringed grooves along its length, and the radial ringed groove location of four hand basket bars mutually corresponds to and shape
Into the silicon chip clamping groove of multiple vertical direction, the concentric rotating shafts being supported on support are provided with the outside of the circular fixed plate, it is described
Concentric rotating shafts are connected using transmission mechanism with the motor on the outside of casing, heating are additionally provided with the casing, cooling is used
Corrosion-resistant circulating water pipe.
Above-mentioned wafer thinning drift piece machine, three hand basket bar positions that the circular fixed plate is corresponded in four hand basket bars are set
There is circular mounting hole, corresponding remaining hand basket bar position is provided with U-shaped installation neck, in order to pick and place silicon chip.
Above-mentioned wafer thinning drift piece machine, the support are provided with the U-lag of corresponding concentric rotating shafts, the concentric rotating shafts branch
The bottom land in U-lag is supportted, while convenient place rotates hand basket.
Above-mentioned wafer thinning drift piece machine, the transmission mechanism by the driven angular wheel on concentric rotating shafts, with from
The active taper gear train of dynamic angular wheel engagement is into the active angular wheel utilizes shaft coupling and the output shaft of motor
End connects, and the motor is inverted in casing top.
Above-mentioned wafer thinning drift piece machine, the corrosion-resistant circulating water pipe is along the snakelike arrangement of cabinet wall.
The beneficial effects of the invention are as follows：
1st, by rotating hand basket, to drive silicon chip to be realized while the casing internal rotation equipped with acid solution, rotation thinned, for
Original silicon chip is effectively controlled monolithic uniformity, repeatability and stability, improves final finished rate.
2nd, by the corrosion-resistant circulating water pipe of the heating in casing, cooling, sour temperature measurement, sour temperature control system are realized,
Avoid sour temperature it is too high caused by floating glue phenomenon, the too low silicon slice corrosion speed of acid temperature is slow, drift piece is uneven, ensure that corrosion reaction
Meet design and calculate desired corrosion efficiency and uniformity.
3rd, because hand basket bar is uniformly provided with multiple radial ringed grooves along its length, then while a large amount of silicon chips can be achieved
Clamping, realize the batch production of wafer thinning.
4th, the rectangular bubble through hole that nitrogen is passed on horizontal supporting plate is filled with into gas sparging box to produce uniformly
Intensive bubble, acid solution flowing is driven acid solution is effectively occurred with silicon chip uniformly through silicon chip, when bubble passes through between piece
Corrosion reaction, and silicon chip and hand basket bar have certain gap radial and axial, do not have dead angle when ensure that spin etching,
Silicon chip rotates under hand basket drive, so makes the corrosion reaction of silicon chip quick, uniform, improves operating efficiency and product quality.
To sum up, lifting of the chemical reduction mode of the application for dynamic parameters such as finished chip pressure drops is played extremely important
Effect, and effectively reduce phosphorus and expand the time, reach the purpose of energy-conservation.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the structural representation of the rotation hand basket of the present invention；
Fig. 3 be in Fig. 2 A-A to profile；
Fig. 4 is the structural representation of the horizontal supporting plate of the present invention.
In figure：1. casing, 2. circulating water pipes, 3. supports, 4. circular fixed plates, 5. hand basket bars, 6. silicon chips, 7. driving electricity
Machine, 8. shaft couplings, 9. driven angular wheels, 10. active tapers, 11. concentric rotating shafts, 12. columns, 13. gas sparging boxes, 14.
Horizontal supporting plate, 15 radial ringed grooves, 16
Embodiment
As illustrated, the wafer thinning floats piece machine, including the casing 1 of nitration mixture liquid is contained, the bottom surface of casing 1 utilizes vertical
Post 12 is fixed with horizontal supporting plate 14, and the lower section of horizontal supporting plate 14 is fixed with gas sparging box 13 and horizontal supporting plate 14
Offer the rectangular bubble through hole communicated with gas sparging box 13, the top of horizontal supporting plate 14 is provided with support 3 and described
The rotation hand basket for clamping silicon chip 6 is supported by support 3.It is described rotation hand basket by two circular fixed plates 4, lateral arrangement in
Four hand basket bars 5 between two circular fixed plates 4 form, four hand basket bars 5 using the center line of circular fixed plate 4 to be symmetrical in
The heart is uniformly distributed, and the hand basket bar 5 is uniformly provided with multiple radial ringed grooves 15, the radial direction of four hand basket bars 5 along its length
The position of annular groove 15 is mutually corresponding and forms the silicon chip clamping groove of multiple vertical direction, and the width of the radial ringed groove 15 is silicon
3~5 times of the thickness of piece 6.For ease of picking and placeing silicon chip 6, the circular fixed plate 4 corresponds to three hand basket bars 5 in four hand basket bars 5
Position is provided with circular mounting hole, and a corresponding remaining hand basket bar 5 position is provided with U-shaped installation neck 16.The circular fixed plate 4
Outside is provided with the concentric rotating shafts 11 being supported on support 3, and the support 3 is provided with the U-lag of corresponding concentric rotating shafts 11, described same
Heart rotating shaft 11 is supported in the bottom land of U-lag.The concentric rotating shafts 11 utilize transmission mechanism and the motor located at the outside of casing 1
7 are connected, and the transmission mechanism is by the driven angular wheel 9 on concentric rotating shafts 11, the active engaged with driven angular wheel 9
Angular wheel 10 is formed, and the active angular wheel 10 is connected using shaft coupling 8 with the output shaft end of motor 7, described
Motor 7 is inverted in the top of casing 1.The corrosion-resistant circulating water pipe 2 of heating, cooling is additionally provided with the casing 1, it is described resistance to
Corrosive cycle water pipe 2 is along the snakelike arrangement of the inwall of casing 1.
The course of work：Appropriate nitration mixture liquid is first added in casing 1, while opens circulation (circulation
Temperature is automatically adjusted according to sour temperature), supply suitable recirculated water into corrosion-resistant circulating water pipe 2；Silicon chip clamping is carried in rotation
In basket, then rotation hand basket is placed on support 3, stirring active angular wheel 10 makes it be engaged with the driven phase of angular wheel 9, opens
Dynamic motor 7 drives rotation hand basket to start to rotate, while is filled with nitrogen into gas sparging box 13 and produces bubble；Utilize timing
Device starts timing, and time is up, and timer sends sound prompting.
In the present embodiment, casing 1 is welded using PP plastic plates, rotation hand basket made using acidproof PVC plastic and
Into corrosion-resistant circulating water pipe 2 uses polyfluortetraethylene pipe, rotates hand basket 25 silicon chips 6 of clamped one time.
Claims (5)
1. a kind of silicon chip chemical reduction equipment, including contain the casing of nitration mixture liquid, it is characterised in that：The tank floor utilizes
Column is fixed with horizontal supporting plate, be fixed with below the horizontal supporting plate on gas sparging box and horizontal supporting plate offer with
The rectangular bubble through hole that gas sparging box communicates, the horizontal supporting plate top, which is provided with support and the support, is supported by use
In the rotation hand basket of clamping silicon chip, the rotation hand basket by two circular fixed plates, lateral arrangement in two circular fixed plates it
Between four hand basket bars composition, four hand basket bars are uniformly distributed using the center line of circular fixed plate as symmetrical centre, the hand basket
Bar is uniformly provided with multiple radial ringed grooves along its length, and the radial ringed groove location of four hand basket bars is mutually corresponding and is formed
The silicon chip clamping groove of multiple vertical direction, the circular fixed plate outside is provided with the concentric rotating shafts being supported on support, described same
Heart rotating shaft is connected using transmission mechanism with the motor being located on the outside of casing, and heating, cooling are additionally provided with the casing
Corrosion-resistant circulating water pipe.
2. wafer thinning according to claim 1 floats piece machine, it is characterised in that：Corresponding four hand baskets of circular fixed plate
Three hand basket bar positions in bar are provided with circular mounting hole, and corresponding remaining hand basket bar position is provided with U-shaped installation neck.
3. wafer thinning according to claim 1 floats piece machine, it is characterised in that：The support is provided with corresponding concentric rotating shafts
U-lag, the concentric rotating shafts are supported in the bottom land of U-lag.
4. wafer thinning according to claim 1 floats piece machine, it is characterised in that：The transmission mechanism is by located at concentric rotating shafts
On driven angular wheel, the active taper gear train that is engaged with driven angular wheel is into the active angular wheel utilizes connection
The output shaft end of axle device and motor connects, and the motor is inverted in casing top.
5. wafer thinning according to claim 1 floats piece machine, it is characterised in that：The corrosion-resistant circulating water pipe is along casing
The snakelike arrangement of wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610867231.1A CN107887292A (en) | 2016-09-30 | 2016-09-30 | Silicon chip chemical reduction equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610867231.1A CN107887292A (en) | 2016-09-30 | 2016-09-30 | Silicon chip chemical reduction equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107887292A true CN107887292A (en) | 2018-04-06 |
Family
ID=61769396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610867231.1A Withdrawn CN107887292A (en) | 2016-09-30 | 2016-09-30 | Silicon chip chemical reduction equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107887292A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137306A (en) * | 2019-05-08 | 2019-08-16 | 苏州联诺太阳能科技有限公司 | A kind of chemical etching method of the battery with transparent conductive oxide film |
| CN110931401A (en) * | 2020-01-02 | 2020-03-27 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer box rotating device and wafer box rotating and lifting equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101275287A (en) * | 2008-01-02 | 2008-10-01 | 株洲南车时代电气股份有限公司 | Whirl etching system and method for large area silicon chips |
| CN101728240A (en) * | 2009-09-30 | 2010-06-09 | 耿彪 | Multifunctional throw rotating mechanism |
| CN202390538U (en) * | 2011-12-21 | 2012-08-22 | 常州星海电子有限公司 | Low-temperature acid etching tank |
| CN205028888U (en) * | 2015-10-19 | 2016-02-10 | 锦州阳光能源有限公司 | Silicon chip pickling hand -basket for attenuate |
| CN105374663A (en) * | 2015-10-19 | 2016-03-02 | 锦州阳光能源有限公司 | Silicon chip pickling thinning machine |
| CN105551952A (en) * | 2015-12-21 | 2016-05-04 | 上海提牛机电设备有限公司 | Chip deep groove corrosion device |
-
2016
- 2016-09-30 CN CN201610867231.1A patent/CN107887292A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101275287A (en) * | 2008-01-02 | 2008-10-01 | 株洲南车时代电气股份有限公司 | Whirl etching system and method for large area silicon chips |
| CN101728240A (en) * | 2009-09-30 | 2010-06-09 | 耿彪 | Multifunctional throw rotating mechanism |
| CN202390538U (en) * | 2011-12-21 | 2012-08-22 | 常州星海电子有限公司 | Low-temperature acid etching tank |
| CN205028888U (en) * | 2015-10-19 | 2016-02-10 | 锦州阳光能源有限公司 | Silicon chip pickling hand -basket for attenuate |
| CN105374663A (en) * | 2015-10-19 | 2016-03-02 | 锦州阳光能源有限公司 | Silicon chip pickling thinning machine |
| CN105551952A (en) * | 2015-12-21 | 2016-05-04 | 上海提牛机电设备有限公司 | Chip deep groove corrosion device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137306A (en) * | 2019-05-08 | 2019-08-16 | 苏州联诺太阳能科技有限公司 | A kind of chemical etching method of the battery with transparent conductive oxide film |
| CN110931401A (en) * | 2020-01-02 | 2020-03-27 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer box rotating device and wafer box rotating and lifting equipment |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180406 |
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| WW01 | Invention patent application withdrawn after publication |