The application is divided into cases with application date of '2016, 08 and 16 th month, application number of' 201610677965.3 ', application name of' fingerprint module and mobile terminal with the same
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, the invention provides a fingerprint module which has the advantage of static electricity prevention.
The invention further provides a mobile terminal which comprises the fingerprint module.
According to the fingerprint module of the embodiment of the invention, include: a fingerprint identification component; the front side of the decoration is provided with an embedded groove, and the fingerprint identification assembly is embedded in the embedded groove; one end of the circuit board assembly extends into the embedded groove, the end part of the circuit board assembly is attached to the rear end face of the fingerprint identification assembly, and the circuit board assembly is provided with a grounding terminal; and the conductive piece is clamped between the end part of the circuit board assembly and the inner bottom wall of the embedded groove so that the decoration piece is electrically connected with the grounding terminal through the circuit board assembly.
According to the fingerprint module, one end of the circuit board assembly extends into the embedded groove, the grounding terminal is arranged on the circuit board assembly, and the conductive piece is arranged between the end part of the circuit board assembly and the inner bottom wall of the embedded groove so that the decorating part is electrically connected with the grounding terminal through the circuit board assembly, the purpose of grounding the decorating part can be achieved, the phenomenon of static electricity of the decorating part can be avoided, the bad influence on the fingerprint module can be avoided, and the working reliability of the fingerprint module can be further guaranteed.
According to some embodiments of the present invention, a mounting groove is provided on an inner bottom wall of the insertion groove, and the conductive member is inserted into the mounting groove.
According to some embodiments of the invention, the conductive member is conductive foam.
According to some embodiments of the invention, the circuit board assembly comprises: one end of the flexible circuit board extends into the embedded groove, the end part of the flexible circuit board is attached to the rear end face of the fingerprint identification assembly, and the grounding terminal is arranged on the flexible circuit board; and the reinforcing plate is attached to the flexible circuit board and electrically connected with the flexible circuit board, the reinforcing plate is located on the flexible circuit board and far away from one side of the fingerprint identification assembly, and the conductive piece is electrically connected with the reinforcing plate.
According to some embodiments of the invention, the decorative element has a peripheral wall with a sealing member.
In some embodiments of the present invention, the outer peripheral wall of the decoration has a sealing groove, and the sealing member is embedded in the sealing groove.
In some embodiments of the invention, further comprising: the cover plate is embedded in the embedding groove and located on the front side of the fingerprint identification assembly.
In some embodiments of the invention, the cover plate is a glass cover plate or a ceramic cover plate.
The mobile terminal comprises the fingerprint module.
According to the mobile terminal provided by the embodiment of the invention, one end of the circuit board assembly extends into the embedded groove, the grounding terminal is arranged on the circuit board assembly, and the conductive piece is arranged between the end part of the circuit board assembly and the inner bottom wall of the embedded groove so that the decorating part is electrically connected with the grounding terminal through the circuit board assembly, so that the aim of grounding the decorating part can be fulfilled, the phenomenon of static electricity of the decorating part can be avoided, the bad influence on the fingerprint module can be avoided, and the working reliability of the fingerprint module can be further ensured.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "central," "lateral," "thickness," "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The fingerprint module 100 according to an embodiment of the present invention is described below with reference to fig. 1-4.
As shown in fig. 1 to 4, a fingerprint module 100 according to an embodiment of the present invention includes: fingerprint identification subassembly, decoration 2, circuit board component 3 and electrically conductive 4.
Specifically, the front side of the decoration 2 is provided with an embedded groove 21, and the fingerprint identification component is embedded in the embedded groove 21, so that the appearance of the fingerprint identification component can be more exquisite. One end of the circuit board assembly 3 extends into the embedded groove 21, the end part of the circuit board assembly 3 is attached to the rear end face of the fingerprint identification assembly to ensure the tight connection between the fingerprint identification assembly and the circuit board assembly 3, the circuit board assembly 3 is provided with a grounding terminal, and the conductive piece 4 is clamped between the end part of the circuit board assembly 3 and the inner bottom wall of the embedded groove 21 so that the decoration piece 2 is electrically connected with the grounding terminal through the circuit board assembly 3. After decorating 2 is connected with the ground terminal electricity through circuit board assembly 3, can realize the purpose of the ground connection of decorating 2, can avoid decorating 2 phenomenon that static appears to avoid producing bad influence to fingerprint module 100, guarantee the reliability of fingerprint module 100 work.
According to the fingerprint module 100 of the embodiment of the invention, one end of the circuit board assembly 3 is inserted into the embedded groove 21, the ground terminal is arranged on the circuit board assembly 3, and the conductive piece 4 is arranged between the end part of the circuit board assembly 3 and the inner bottom wall of the embedded groove 21 so that the decoration 2 is electrically connected with the ground terminal through the circuit board assembly 3, so that the purpose of grounding the decoration 2 can be realized, the phenomenon of static electricity generated on the decoration 2 can be avoided to avoid the bad influence on the fingerprint module 100, and the working reliability of the fingerprint module 100 is further ensured.
In some embodiments of the present invention, as shown in fig. 2 and 4, a mounting groove 24 is provided on an inner bottom wall of the insertion groove 21, and the conductive member 4 is inserted into the mounting groove 24. The mounting groove 24 may serve to limit the conductive member 4, and prevent the conductive member 4 from moving on the bottom wall of the insertion groove 21, so that the reliability of connection between the conductive member 4 and the inner bottom wall of the insertion groove 21 and between the conductive member 4 and the circuit board assembly 3 may be ensured.
Specifically, the conductive member 4 is conductive foam. The conductive foam is formed by wrapping conductive cloth on flame-retardant sponge, has good surface conductivity after a series of treatments, and can be easily fixed on a device to be shielded by an adhesive tape. The conductive foam has low cost and simple processing technology, and can ensure the reliability of grounding. After circuit board components 3 and decoration 2 assembled, the cotton certain compression volume that has of electrically conductive bubble that lies in between circuit board components 3 and the decoration 2, can guarantee that the reliability between electrically conductive bubble is cotton and the decoration 2 and between electrically conductive bubble and the circuit board components 3 is connected to guarantee the good ground connection of decoration 2, prevent that decoration 2 static from producing harmful effects to fingerprint module 100.
In some embodiments of the present invention, as shown in fig. 2-4, the circuit board assembly 3 includes a flexible circuit board 31 and a stiffener 32. One end of the flexible circuit board 31 extends into the embedded groove 21, and the end of the flexible circuit board 31 is attached to the rear end face (shown in fig. 4) of the fingerprint identification assembly, so that the tight connection between the fingerprint identification assembly and the flexible circuit board 31 can be ensured, and the reliability of the operation of the fingerprint module 100 can be ensured. The ground terminal is disposed on the flexible circuit board 31, the reinforcing plate 32 is attached to the flexible circuit board 31 and electrically connected to the flexible circuit board 31, the reinforcing plate 32 is located on a side of the flexible circuit board 31 away from the fingerprint identification component, and the conductive member 4 is electrically connected to the reinforcing plate 32 (i.e., the reinforcing plate 32 is a conductive member). Reinforcing plate 32 can strengthen flexible circuit board 31's structural strength, prevent that flexible circuit board 31 from taking place to buckle etc., thereby guarantee the reliability of flexible circuit board 31 work, and simultaneously, reinforcing plate 32 can be connected with flexible circuit board 31 electricity, electrically conductive 4 is connected with reinforcing plate 32 electricity in order to realize decoration 2 and flexible circuit board 31's electricity, thereby can realize decoration 2 and pass through flexible circuit board 31 and ground connection terminal's electricity and be connected, and then can realize the effect of decoration 2 ground connection, in order to avoid the harmful effects of decoration 2 static to fingerprint module 100.
In some embodiments of the invention, as shown in figure 4, the peripheral wall of the decorative element 2 is provided with a sealing element 7. When the fingerprint module 100 is installed on a mobile terminal such as a mobile phone, sweat or other liquid on the hand can be prevented from invading the inside of the mobile terminal to damage parts inside the mobile terminal, so that the working reliability of the mobile terminal is ensured.
Further, as shown in fig. 4, a sealing groove 25 is provided on the outer peripheral wall of the garnish 2, and the sealing member 7 is fitted in the sealing groove 25. It is thereby possible to prevent the seal member 7 from rattling in the axial direction of the garnish 2 (the front-rear direction shown in fig. 4), ensuring the reliability of the sealing.
In some embodiments of the present invention, as shown in fig. 2-4, the fingerprint module 100 further includes a cover plate 5, and the cover plate 5 is disposed in the insertion groove 21 and located at the front side (the front side shown in fig. 4) of the fingerprint identification assembly. On the one hand, the cover plate 5 can further protect the fingerprint identification assembly and the circuit board assembly 3, and on the other hand, the cover plate 5 can also increase the attractiveness of the fingerprint module 100.
Optionally, the cover plate 5 may be a glass cover plate 5 or a ceramic cover plate 5, and the glossiness of the glass cover plate 5 or the ceramic cover plate 5 is high, so that the aesthetic property of the fingerprint module 100 may be improved.
In some embodiments of the present invention, the fingerprint recognition assembly includes a packaging layer 1, a first engagement portion is provided on a rear wall surface (rear side as shown in fig. 4) of the packaging layer 1, a decoration 2 has an insertion groove 21, the packaging layer 1 is inserted into the insertion groove 21, a second engagement portion is provided in the insertion groove 21, and the first engagement portion and the second engagement portion are engaged with each other. From this, when encapsulation layer 1 inlays and establishes in embedded groove 21, and first cooperation portion and second cooperation portion when inlaying each other, can reduce the thickness of encapsulation layer 1 and decoration 2 cooperation back along fore-and-aft direction (the fore-and-aft direction as shown in fig. 4) to can reduce fingerprint module 100's thickness, and then can adapt to the ultra-thin design of mobile terminal complete machine, satisfy user's user demand.
As shown in fig. 2 to 4, the first mating portion is a protruding portion 11 formed on the rear wall surface (rear surface as shown in fig. 4) of the encapsulation layer 1, the second mating portion is a recessed portion 22 formed in the insertion groove 21, and at least a part of the protruding portion 11 is located in the recessed portion 22. From this, when assembling encapsulation layer 1 and decoration 2, with the at least part embedding of bellying 11 to depressed part 22 in, can reduce decoration 2 and encapsulation layer 1 assembly back along the thickness of fore-and-aft direction to can reduce fingerprint module 100's thickness, and then can adapt to the ultra-thin design of mobile terminal complete machine, satisfy user's user demand.
For example, in the example shown in fig. 3 and 4, the rear wall surface of the packaging layer 1 has a first engagement portion formed as a protrusion 11, the garnish 2 has a fitting groove 21, the packaging layer 1 is disposed in the fitting groove 21, the bottom wall of the fitting groove 21 is provided with a second engagement portion formed as a recess 22, the protrusion 11 is located in the recess 22, the side wall surface of the protrusion 11 and the rear wall surface of the packaging layer 1 form a first step surface, the bottom wall of the fitting groove 21 and the side wall of the recess 22 form a second step surface, and the first step surface and the second step surface are engaged with each other, so that displacement of the packaging layer 1 in the backward direction can be limited, thereby ensuring reliability of operation of the fingerprint module 100. And when the thickness of the protruding part 11 in the front-back direction is a, the overall thickness of the fingerprint module 100 can be reduced by a.
Specifically, as shown in fig. 3, the boss 11 is one. Therefore, the structure and the processing technology of the packaging layer 1 can be simplified, the production period is saved, and the production cost is reduced. For example, in the example shown in fig. 3, the rear wall surface of the encapsulation layer 1 is provided with the protruding portion 11, and the protruding portion 11 is one and is located at the central portion of the encapsulation layer 1, when the encapsulation layer 1 is processed, the encapsulation layer 1 with the uniform thickness may be processed first, and then a circle of steps may be processed on the rear wall surface of the encapsulation layer 1 along the circumferential direction thereof.
The following description of the fingerprint module 100 according to one embodiment of the present invention is provided with reference to fig. 1-4, and the following description is only exemplary and is intended to illustrate the present invention, but not to be construed as limiting the present invention.
As shown in fig. 1 to 4, a fingerprint module 100 according to an embodiment of the present invention includes a fingerprint recognition assembly, a decoration 2, a circuit board assembly 3, a conductive member 4, and a cover plate 5.
Specifically, as shown in fig. 3 and 4, the fingerprint identification assembly includes a package layer 1, a first matching portion is provided on a rear wall surface of the package layer 1, the first matching portion is a protruding portion 11 formed on the rear wall surface of the package layer 1, the protruding portion 11 is one and located in a middle portion of the package layer 1, when the protruding portion 11 is processed, a circle of steps can be processed along a circumferential direction of the package layer 1, and the package layer 1 and a side wall surface of the rear wall surface and the protruding portion 11 form a first step surface. As shown in fig. 2 and 4, the decoration 2 has an insertion groove 21, the encapsulation layer 1 is provided in the insertion groove 21, a second engagement portion is provided in the insertion groove 21, the second engagement portion is a recessed portion 22 formed in the insertion groove 21, and the protrusion portion 11 is located in the recessed portion 22. The bottom wall of the fitting groove 21 and the side wall of the recessed portion 22 form a second step surface, and the first step surface and the second step surface are engaged. After the decoration 2 and the packaging layer 1 are assembled, the thickness of the decoration 2 and the packaging layer 1 in the front-back direction can be reduced, so that the thickness of the fingerprint module 100 is reduced, and the requirement of the whole machine ultra-thin of the mobile terminal can be met.
Note that, when the thickness of the boss 11 in the front-rear direction is a, the thickness of the garnish 2 assembled with the potting layer 1 in the front-rear direction can be reduced by a. For example, when the thickness of the boss 11 in the front-rear direction is 0.2mm, the thickness of the garnish 2 after being assembled with the encapsulation layer 1 can be reduced by 0.2mm in the front-rear direction.
As shown in fig. 2 to 4, the circuit board assembly 3 includes a flexible circuit board 31 and a reinforcing plate 32, a through hole 23 is provided on the bottom wall of the recessed portion 22 of the decoration 2, one end of the flexible circuit board 31 passes through the through hole 23 and extends into the recessed portion 22, and the end of the flexible circuit board 31 extending into the recessed portion 22 is attached to the free end surface of the protruding portion 11 (i.e., the rear wall surface of the protruding portion 11). On the one hand, encapsulation layer 1 can play the effect of protection to flexible circuit board 31, can prevent that impurity in the air from causing the electrical performance to descend to the corruption of circuit, and on the other hand can also guarantee the zonulae occludens of fingerprint identification subassembly and flexible circuit board 31 in the encapsulation layer 1, guarantees the reliability of fingerprint module 100 work. The reinforcing plate 32 may be a reinforcing steel plate, and the reinforcing plate 32 is attached to one side of the flexible circuit board 31 away from the encapsulation layer 1 and electrically connected to the flexible circuit board 31, that is, the reinforcing plate 32 is attached to the rear side wall of the flexible circuit board 31. The reinforcing plate 32 can reinforce the structural strength of the flexible circuit board 31 and prevent the flexible circuit board 31 from being bent and damaged.
In addition, as shown in fig. 2-4, the decoration 2 is a conductive metal part, the other end (the end not extending into the recess 22) of the flexible circuit board 31 is provided with a grounding terminal, a conductive member 4 is arranged between the reinforcing plate 32 and the inner bottom wall of the recess 22, and the decoration 2 is electrically connected to the grounding terminal through the conductive member 4, the reinforcing plate 32 and the flexible circuit board 31, so that the purpose of grounding the decoration 2 is achieved, and the bad influence of static electricity of the decoration 2 on the fingerprint module 100 is prevented. Wherein, it is cotton that electrically conductive 4 is electrically conductive bubble, and the shape of the cotton cross section of electrically conductive bubble is the rectangle, is equipped with the cross section on the diapire of depressed part 22 and is rectangular mounting groove 24, and electrically conductive bubble is cotton to be inlayed and to be established in mounting groove 24, from this, can prevent that electrically conductive bubble is cotton to remove to guarantee the reliability of electricity connection between decoration 2 and the flexible circuit board 31.
As shown in fig. 4, the cover plate 5 is a glass cover plate 5, the cover plate 5 is disposed in the embedded groove 21 and located at the front side of the encapsulation layer 1, and the cover plate 5 can close the front side opening of the embedded groove 21. The cover plate 5 not only can further protect the circuit board assembly 3, but also can increase the aesthetic property of the fingerprint module 100.
As shown in fig. 4, the sealing member 7 is sleeved on the outer peripheral wall of the decoration 2, and the sealing member 7 is embedded in the sealing groove 25 on the outer peripheral wall of the decoration 2, so that when the fingerprint module 100 is mounted on a mobile terminal such as a mobile phone, sweat or other liquid on the hand can be prevented from invading the mobile terminal to damage parts inside the mobile terminal, and the working reliability of the mobile terminal is ensured.
As shown in fig. 2-4, the fingerprint module 100 further includes a fingerprint pressing plate 6, and the fingerprint pressing plate 6 is disposed at the rear side of the decoration 2.
In the process of processing the fingerprint module 100, the cover plate 5, the packaging layer 1, the flexible circuit board 31 and the reinforcing plate 32 can be processed together, then the conductive foam is pasted in the mounting groove 24 of the decoration 2, and the processed cover plate 5, the packaging layer 1, the flexible circuit board 31 and the reinforcing plate 32 are assembled together with the processed decoration 2 through peripheral circle of dispensing and pressure maintaining. Meanwhile, through dispensing assembly, the conductive foam between the reinforcing plate 32 and the decorating part 2 passes through a certain compression amount, and after dispensing and pressure maintaining for a certain time, good grounding between the reinforcing plate and the decorating part is ensured after glue is cured.
The mobile terminal according to the embodiment of the present invention includes the fingerprint module 100.
According to the mobile terminal provided by the embodiment of the invention, one end of the circuit board assembly 3 is inserted into the embedded groove 21, the grounding terminal is arranged on the circuit board assembly 3, and the conductive piece 4 is arranged between the end part of the circuit board assembly 3 and the inner bottom wall of the embedded groove 21 so that the decorating part 2 is electrically connected with the grounding terminal through the circuit board assembly 3, so that the aim of grounding the decorating part 2 can be realized, the phenomenon of static electricity of the decorating part 2 can be avoided to avoid generating bad influence on the fingerprint module 100, the working reliability of the fingerprint module 100 is further ensured, and the working reliability of the mobile terminal is ensured.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.