CN107880833A - A kind of UV heat dual curings epoxy adhesive and preparation method thereof - Google Patents
A kind of UV heat dual curings epoxy adhesive and preparation method thereof Download PDFInfo
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- CN107880833A CN107880833A CN201711269895.9A CN201711269895A CN107880833A CN 107880833 A CN107880833 A CN 107880833A CN 201711269895 A CN201711269895 A CN 201711269895A CN 107880833 A CN107880833 A CN 107880833A
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- epoxy adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention relates to a kind of UV heat dual curings epoxy adhesive, described UV heat dual curings epoxy adhesive is with low-viscosity (mobile) liquid epoxy resin, stabilizer, curing agent, curing accelerator, light alkali accelerator, thixotropic agent is raw material, by being added separately in stirring container, stir under vacuum conditions, discharge and produce product, resulting bonded adhesives can realize UV and heat dual curing, pliability is good, bonding force is excellent, storage stability is good, can be widely applied to bonding of the temperature than more sensitive electronic component.
Description
Technical field
The present invention relates to a kind of UV heat dual curings epoxy adhesive and preparation method thereof, belong to electronics adhesive field.
Background technology
With the high performance of electronic component, the development trend of multifunction, the update of consumer electronics product
Speed is accelerated, and yield constantly rises, and higher requirement is proposed to used electronics adhesive.To electronic component bonding and
The production line of protection, automated job degree is higher, and the curing rate of traditional single-component epoxy electronics adhesive is partially slow, sternly
Production efficiency is govern again.
The content of the invention
The present invention in view of the shortcomings of the prior art, by being modified to epoxy resin, there is provided UV heat dual curing epoxy glues
Stick and preparation method thereof, obtained epoxy adhesive in ultraviolet lighting rapid curing, meanwhile, illumination less than place can be with
Realization is heating and curing, suitable for the bonding of consumer electronics automated job and baroque electronic component.
The technical scheme that the present invention solves above-mentioned technical problem is as follows：A kind of UV heat dual curings epoxy adhesive and its preparation
Method, double cured epoxy adhesive are made up of each raw material of following mass parts：Epoxy resin 30-60 parts, stabilizer：0.1-
1 part, curing agent：20-50 parts, curing accelerator：1-10 parts, light alkali accelerator：0.1-3 parts, thixotropic agent：1-10 parts.
The beneficial effects of the invention are as follows：The present invention uses pure epoxy system, by the thermosetting for introducing modified amine, imidazoles
Change accelerator and light alkali accelerator so that obtained double solid epoxy adhesives can both realize that UV solidified and can heat cure, and
Being fully cured for adhesive can be achieved in pure UV and pure heat cure.Suitable for consumer electronics automated job and baroque
The bonding of electronic component.
On the basis of above-mentioned technical proposal, the present invention can also do following improvement.
Further, described epoxy resin is the bisphenol-A epoxy DER331, DER332,828E, LE51 and bis-phenol of low viscosity
One kind or any several mixture in F epoxies 830LVP, 835LV, 4901E.
Beneficial effect using above-mentioned further scheme is that the skeleton structure of bisphenol-A and bisphenol F epoxy resin determines it
Solidfied material has preferable obdurability and heat resistance, and hydroxyl therein, which assigns it, has preferable adhesive property.
Further, described stabilizer be salicylic acid, lactic acid, citric acid, fumaric acid, benzoic acid, phenylacetic acid, barbiturates
One kind or any several mixture.
Beneficial effect using above-mentioned further scheme is to improve the bin stability of one-component epoxy resin adhesive.
Further, the curing agent is four（3- mercaptopropionic acids）Pentaerythritol ester, trimethylolpropane tris（3- mercaptopropionic acids
Ester）, ethylene glycol two（3-thiopropionate）, four（TGA）Pentaerythritol ester, trimethylolpropane tris mercaptoacetate, second
A kind of or arbitrarily several mixture in dimercapto acetate.The curing accelerator is that the curing accelerator is river
MC120D, AJICURE of well PN-23, PN-H, PN31, PN-40, PN50, ADEKA EH3293S, EH5011S,
One kind or any several mixture in EH4360S, Fuijicure FXR-1081, FXR-1020, FXR-1030.
Beneficial effect using above-mentioned further scheme is that selected curing agent is polysulfide alcohol resin, and product can be made low
Warm rapid curing, and imparting glue has preferable pliability, and there is good bonding effect to various base materials；It is selected solid
Change accelerator, it is more preferable by modified or microcapsule coated, its storage stability.
Further, described thixotropic agent is ENVIK R202, R972, R8200, WACKER H15, H17, H20, H2000
A kind of or arbitrarily several mixture in aerosil.
Beneficial effect using above-mentioned further scheme is can to obtain good thixotropy, the glue point energy after dispensing
It is enough to keep its shape very well, the component of other around glue point will not be polluted.
Further, described light alkali accelerator is Japan and WPBG-266, WPBG-140, WPBG-082, WPBG- of light
166th, one kind in WPBG-165 or any several mixture.
Beneficial effect using above-mentioned further scheme is that under ultraviolet light, light alkali accelerator can be with quick release
Go out amine substance, and then trigger the reaction of epoxy and sulfydryl, finally can be achieved to be fully cured.
Another technical scheme that the present invention solves above-mentioned technical problem is as follows：A kind of UV heat dual curings epoxy adhesive and its
Preparation method, described preparation method are：First by the epoxy resin of 30-60 parts, the stabilizer of 0.1-1 parts, 20-50 part curing agent
It is added in double-planet stirred tank, stirs 10-30min under vacuum state and then add the thixotropic agent of 1-10 parts, is well mixed
High-speed stirred 1-3h under vacuum conditions afterwards, then aging 12-16h at room temperature, be eventually adding 1-5 parts curing accelerator and
The light alkali accelerator of 0.1-3 parts stirs, then is discharged after vacuumizing lucifuge stirring 1-3h.
Beneficial effect using above-mentioned further scheme is that preparation process of the invention is carried out in stirred tank, entirely
Whipping process is carried out under vacuum conditions, avoids the influence of external environment, makes the quality of glue more stable, and avoid
Three-roll grinder is crossed, does not have destruction for the curing accelerator with microcapsules, its storage stability is more preferable.
Embodiment
The principles and features of the present invention are described below, and the given examples are served only to explain the present invention, is not intended to limit
Determine the scope of the present invention.
Embodiment 1
Raw material is weighed according to following mass parts
EP-828EL ：30 parts
EP-4901E ：30 parts
Salicylic acid：1 part
Four（3- mercaptopropionic acids）Pentaerythritol ester：50 parts
MC120D:1 part
R202：3 parts
WPBG-266： 0.2
First by EP-828EL, EP-4901E, salicylic acid, four（3- mercaptopropionic acids）Pentaerythritol ester is added to double-planet stirred tank
In, 10min is stirred under vacuum state and then adds R202, silicon powder and talcum powder, it is high under vacuum conditions after being well mixed
Speed stirring 3h, then aging 12h at room temperature, is eventually adding MC120D and WPBG-266 lucifuges and stirs, then vacuumize and stir
Discharged after mixing 2h.
Embodiment 2
Raw material is weighed according to following mass parts
DER331：30 parts
830LVP:15 parts
Benzoic acid：0.5 part
Trimethylolpropane tris（3-thiopropionate）：40 parts
PN-23:10 parts
R 972：1 part
WPBG-140：3 parts
First by DER331,830LVP, benzoic acid, trimethylolpropane tris（3-thiopropionate）It is added to double-planet stirred tank
In, 20min is stirred under vacuum state and then adds R 972, silicon powder, high-speed stirred under vacuum conditions after being well mixed
2h, then aging 14h at room temperature, finally sequentially adds PN-23 and WPBG-140 lucifuges and stirs, then vacuumize low speed and stir
Discharged after mixing 3h.
Embodiment 3
Raw material is weighed according to following mass parts
E51 ：30 parts
Lactic acid：0.1 part
Trimethylolpropane tris mercaptoacetate：30 parts
EH5011S:6 parts
H2000：10 parts
WPBG-018：1.5 part
First E51, MX217, lactic acid, ethylene glycol dimercapto acetate are added in double-planet stirred tank, stirred under vacuum state
30min and then R805, calcium carbonate are added, high-speed stirred 3h under vacuum conditions after being well mixed, then aging at room temperature
16h, it is eventually adding PN-40 and WPBG-018 lucifuges and stirs, then vacuumizes discharging after stirring at low speed 1h.
The embodiment 1-3 experimental results of table 1
As it can be seen from table 1 double cured epoxy adhesive of present invention gained have UV and hot rapid curing, and simple heat cure
It can be fully cured with pure UV, there is good bonding again to various base materials, can be widely applied to consumer electronics automation
Operation and the bonding of baroque electronic component.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc., it should be included in the scope of the protection.
Claims (6)
1. a kind of UV heat dual curings epoxy adhesive, it is characterised in that be made up of each raw material of following mass parts：Epoxy resin
30-60 parts, stabilizer 0.1-1 parts, curing agent 20-50 parts, curing accelerator 1-10 parts, light alkali accelerator 0.1-3 parts, thixotropic agent
1-10 parts；
The curing accelerator is MC120D, AJICURE of Chkawai PN-23, PN-H, PN31, PN-40, PN50, ADEKA's
EH3293S, EH5011S, EH4360S, one kind or any in Fuijicure FXR-1081, FXR-1020, FXR-1030
Several mixtures；
The smooth alkali accelerator is Japan and WPBG-266, WPBG-140, WPBG-082, WPBG- 166, the WPBG-165 of light
In one kind or any several mixture.
2. UV heat dual curings epoxy adhesive according to claim 1, it is characterised in that the epoxy resin is low viscosity
Bisphenol-A epoxy DER331, DER332,828E, LE51 and one kind in Bisphenol F epoxy 830LVP, 835LV, 4901E or any
Several mixtures.
3. UV heat dual curings epoxy adhesive according to claim 1, it is characterised in that the stabilizer be salicylic acid,
Lactic acid, citric acid, fumaric acid, benzoic acid, phenylacetic acid, one kind of barbiturates or any several mixture.
4. UV heat dual curings epoxy adhesive according to claim 1, it is characterised in that the curing agent is four（3- mercaptos
Base propionic acid）Pentaerythritol ester, trimethylolpropane tris（3-thiopropionate）, ethylene glycol two（3-thiopropionate）, four（Sulfydryl
Acetic acid）Pentaerythritol ester, trimethylolpropane tris mercaptoacetate, ethylene glycol dimercapto acetate middle a kind of or any several
Mixture.
5. UV heat dual curings epoxy adhesive according to claim 1, it is characterised in that the thixotropic agent is ENVIK's
R202, R972, R8200, one kind or any several mixture in WACKER H15, H17, H20, H2000.
6. UV heat dual curings epoxy adhesive according to claim 1, it is characterised in that preparation method includes：First by 30-
60 parts of epoxy resin, the stabilizer of 0.1-1 parts, 20-50 part curing agent are added in double-planet stirred tank, are stirred under vacuum state
Mix 10-30min and then add the thixotropic agent of 1-10 parts, high-speed stirred 1-3h, Ran Hou under vacuum conditions after being well mixed
Aging 12-16h at room temperature, is eventually adding the curing accelerator of 1-5 parts and the light alkali accelerator of 0.1-3 parts stirs, then takes out
Discharged after vacuum lucifuge stirring 1-3h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711269895.9A CN107880833A (en) | 2017-12-05 | 2017-12-05 | A kind of UV heat dual curings epoxy adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711269895.9A CN107880833A (en) | 2017-12-05 | 2017-12-05 | A kind of UV heat dual curings epoxy adhesive and preparation method thereof |
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| CN107880833A true CN107880833A (en) | 2018-04-06 |
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| CN201711269895.9A Pending CN107880833A (en) | 2017-12-05 | 2017-12-05 | A kind of UV heat dual curings epoxy adhesive and preparation method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109337613A (en) * | 2018-09-07 | 2019-02-15 | 天长市永泰密封材料有限公司 | A kind of high adhesion butyl epoxy sealing glue |
| CN110684493A (en) * | 2019-10-12 | 2020-01-14 | 深圳飞世尔新材料股份有限公司 | Epoxy adhesive for flexible screen packaging |
| CN112500821A (en) * | 2020-12-29 | 2021-03-16 | 烟台信友新材料有限公司 | Ultraviolet-curing single-component epoxy adhesive with variable operation time and preparation method thereof |
| CN112680122A (en) * | 2020-12-22 | 2021-04-20 | 天能电池(芜湖)有限公司 | UV (ultraviolet) light-cured epoxy glue |
| CN112876998A (en) * | 2021-01-22 | 2021-06-01 | 海泰纳鑫科技(成都)有限公司 | Epoxy resin adhesive for optical electronic packaging and preparation method and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101679829A (en) * | 2007-06-14 | 2010-03-24 | 积水化学工业株式会社 | Photocurable pressure-sensitive adhesive composition |
| WO2014129403A1 (en) * | 2013-02-20 | 2014-08-28 | スリーボンドファインケミカル株式会社 | Adhesive composition, curing method, and method for producing adhesive composition |
| CN104592923A (en) * | 2015-01-07 | 2015-05-06 | 烟台信友电子有限公司 | UV-initiated delay-curable one-component epoxy adhesive and preparation method thereof |
-
2017
- 2017-12-05 CN CN201711269895.9A patent/CN107880833A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101679829A (en) * | 2007-06-14 | 2010-03-24 | 积水化学工业株式会社 | Photocurable pressure-sensitive adhesive composition |
| WO2014129403A1 (en) * | 2013-02-20 | 2014-08-28 | スリーボンドファインケミカル株式会社 | Adhesive composition, curing method, and method for producing adhesive composition |
| CN104592923A (en) * | 2015-01-07 | 2015-05-06 | 烟台信友电子有限公司 | UV-initiated delay-curable one-component epoxy adhesive and preparation method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109337613A (en) * | 2018-09-07 | 2019-02-15 | 天长市永泰密封材料有限公司 | A kind of high adhesion butyl epoxy sealing glue |
| CN110684493A (en) * | 2019-10-12 | 2020-01-14 | 深圳飞世尔新材料股份有限公司 | Epoxy adhesive for flexible screen packaging |
| CN112680122A (en) * | 2020-12-22 | 2021-04-20 | 天能电池(芜湖)有限公司 | UV (ultraviolet) light-cured epoxy glue |
| CN112500821A (en) * | 2020-12-29 | 2021-03-16 | 烟台信友新材料有限公司 | Ultraviolet-curing single-component epoxy adhesive with variable operation time and preparation method thereof |
| CN112500821B (en) * | 2020-12-29 | 2022-07-15 | 烟台信友新材料有限公司 | Ultraviolet-curing single-component epoxy adhesive with variable operation time and preparation method thereof |
| CN112876998A (en) * | 2021-01-22 | 2021-06-01 | 海泰纳鑫科技(成都)有限公司 | Epoxy resin adhesive for optical electronic packaging and preparation method and application thereof |
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Application publication date: 20180406 |
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