CN107859882A - Light fixture - Google Patents
Light fixture Download PDFInfo
- Publication number
- CN107859882A CN107859882A CN201610843835.2A CN201610843835A CN107859882A CN 107859882 A CN107859882 A CN 107859882A CN 201610843835 A CN201610843835 A CN 201610843835A CN 107859882 A CN107859882 A CN 107859882A
- Authority
- CN
- China
- Prior art keywords
- coating member
- light fixture
- lens
- luminous assembly
- semiconductor luminous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims abstract description 65
- 238000000576 coating method Methods 0.000 claims abstract description 65
- 239000004065 semiconductor Substances 0.000 claims abstract description 62
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000011324 bead Substances 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- 239000000741 silica gel Substances 0.000 claims description 8
- 229910002027 silica gel Inorganic materials 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000005253 cladding Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 10
- 238000004020 luminiscence type Methods 0.000 abstract description 8
- 238000000605 extraction Methods 0.000 description 18
- 229920000297 Rayon Polymers 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000011469 building brick Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 230000000994 depressogenic effect Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/041—Optical design with conical or pyramidal surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
A kind of light fixture, it includes semiconductor luminous assembly, bearing part and coating member.Bearing part bearing semiconductor luminescence component, coating member coats semiconductor luminous assembly and bearing part, and with one first lens of covering semiconductor luminous assembly, wherein coating member is integrally formed structure, the light that semiconductor luminous assembly is sent passes through the first lens, the present invention forms the structure of coating member cladding semiconductor luminous assembly and bearing part using integrally formed mode, therefore do not have because degumming and caused by component come off the problem of, in addition, the structure of coating member cladding semiconductor luminous assembly and bearing part also can reach fairly good waterproof effect.
Description
Technical field
The present invention relates to a kind of light fixture, more particularly to a kind of light fixture using semiconductor luminous assembly.
Background technology
The main body of existing projection lamp fitting uses glass material more, and is coated with reflective aluminum in the inner face of main body with reflected light
Line, such structure not only not environmentally but also has poor radiating effect, thus have impact on the service life of light fixture.In addition,
Existing projection lamp fitting uses the lens of glass system more, and lens are binded with viscose and main body, when in use can caused by degumming structure
Part comes off and produces problem for security.
The content of the invention
It is an object of the invention to provide a kind of light fixture, its by coating member by integrally formed mode encapsulate light source and with
The related electronic building brick of light source, such structure without using viscose due to engaging, so not having degumming and causing component to come off
The problem of, and the structure integrally encapsulated can play the role of waterproof for light source and electronic building brick, while in coating member
Upper formation lens and heat emission hole, desired light type can be produced and solve the problems, such as radiating, in addition the shape in plastic main body
Into another lens, can improving optical effect again, thus reflective aluminum need not be coated with the inner face of main body, product is more met
The requirement of environmental protection.
One embodiment of light fixture provided by the present invention includes semiconductor luminous assembly, bearing part and coating member.Carrying
Part system bearing semiconductor luminescence component, coating member system cladding semiconductor luminous assembly and bearing part simultaneously have the first lens, its
Middle coating member cladding semiconductor luminous assembly and bearing part, and there are one first lens of covering semiconductor luminous assembly, its
The structure that middle coating member is one of the forming, the present invention form coating member cladding semiconductor luminous assembly using integrally formed mode
And the structure of bearing part, therefore do not have existing light fixture with viscose binds and be possible to because degumming and caused by component come off
Problem, in addition, the structure of coating member cladding semiconductor luminous assembly and bearing part also can reach fairly good waterproof effect, and
The light that semiconductor luminous assembly is sent can whereby produce desired light type by the first lens and light extraction.
In another embodiment, coating member has top, recess is formed at top, the first lens are located in recess, and position
In the top of semiconductor luminous assembly.
In another embodiment, the material of coating member includes silica gel, and silica gel structure can reach the effect of waterproof, in addition,
The thickness of silica gel structure is influential for the colour temperature of light extraction, therefore can form appropriate thickness according to demand and be wished
That hopes goes out light color temperature.
In another embodiment, bearing part includes circuit board, i.e., electronic building brick related to semiconductor luminous assembly can be with
It is encapsulated in together with semiconductor luminous assembly in coating member.
In another embodiment, bearing part includes more several terminals, and the terminal extends to the outer of coating member from circuit board
Portion.
In another embodiment, semiconductor luminous assembly includes an at least light emitting diode.
In another embodiment, coating member has an at least heat emission hole, and heat emission hole is formed at the periphery wall of coating member, and dissipates
The position correspondence of hot hole is in semiconductor luminous assembly, in this way, heat caused by semiconductor luminous assembly can dissipate to via heat emission hole
Outside, reach the effect of radiating.
In another embodiment, coating member has an at least groove, and groove is formed at the periphery wall of coating member and corresponded to
Bearing part.
In another embodiment, light fixture further includes lampshade, and lampshade is incorporated into coating member, the light that semiconductor luminous assembly is sent
Line sequentially exposes to outside by the first lens and lampshade.
In another embodiment, lampshade is sheathed on the periphery wall of coating member.
In another embodiment, coating member further includes bead, and bead is formed at the periphery wall of coating member, when lampshade is sheathed on
During the periphery wall of coating member, the bottom margin of lampshade is connected to bead.
In another embodiment, lampshade includes the second lens and reflecting surface, and the second lens cover the first lens and reflection
Face ring around the second lens and the semiconductor luminous assembly, the light that semiconductor luminous assembly is sent sequentially by the first lens and
Second lens and light extraction, and some light is by light extraction after reflective surface.Lampshade due to that with the second lens, can be lifted again
Optical effect, therefore aluminium film need not be coated with the reflecting surface of lampshade, the standard of environmental protection can be more conformed to.
In another embodiment, reflecting surface is circular conical surface.
In another embodiment, the material of lampshade includes plastics.
The light fixture of the present invention forms coating member cladding semiconductor luminous assembly and bearing part using integrally formed mode,
So do not have in prior art with viscose engages and because component comes off caused by degumming the problem of, in addition, integrally formed cladding
Part coats semiconductor luminous assembly and the structure of bearing part also can reach fairly good waterproof effect, in addition, in an embodiment
In, lampshade, can improving optical effect, therefore need not be coated with aluminium in the reflecting surface of lampshade again due to the second lens
Film, make the light fixture of the present invention more environmentally friendly.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, and in order to allow the above and other objects, features and advantages of the present invention can
Become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, describe in detail as follows.
Brief description of the drawings
Fig. 1 is the three-dimensional exploded view of an embodiment of the light fixture of the present invention.
Fig. 2 is sectional view of the embodiment of Fig. 1 light fixture after combination.
Fig. 3 is the three-dimensional exploded view of another embodiment of the light fixture of the present invention.
Fig. 4 is sectional view of the embodiment of Fig. 3 light fixture after combination.
Embodiment
Fig. 1 and Fig. 2 is referred to, it represents an embodiment of the light fixture of the present invention.The light fixture 100 of the present invention includes semiconductor
Luminescence component 110, bearing part 120 and coating member 130.Bearing part 120 carries semiconductor luminous assembly 110, coating member 130
Coat semiconductor luminous assembly 110 and bearing part 120 and there are the first lens 132 of covering semiconductor luminous assembly 110, its
The structure that middle coating member 130 is one of the forming, the light that semiconductor luminous assembly 110 is sent pass through the first lens 132.In this reality
To apply in example, coating member 130 has top 134, and recess 136 is formed at top 134, and the first lens 132 are located in recess 136, and
Positioned at the top of semiconductor luminous assembly 110.
In the present embodiment, coating member 130 can by way of being embedded to and projecting integrally encapsulating semiconductor luminescence component 110
And bearing part 120, that is, be embedded in again in mould after semiconductor luminous assembly 110 and bearing part 120 are first assembled, and
The both sides of semiconductor luminous assembly 110 are fixed using special intermediate plate, make the semiconductor luminous assembly 110 and bearing part of embedment
120 do not have crooked situation during injected plastic occurs, and then injects in mould plastics and cladding is pre-placed
Semiconductor luminous assembly 110 and bearing part 120 in a mold, after plastics cooling forming, that is, it is overall to form coating member 130
Ground coats the structure of semiconductor luminous assembly 110 and bearing part 120.In addition, in this embodiment, the plastics example of coating member 130
Such as it is silica gel, the present embodiment for example forms coating member 130 using the technology of low temperature runner shaping.Due to the thermal coefficient of expansion of silica gel
Height, therefore can expand when heating, and there was only slight shrinkage when cooling down, it is more difficult to product size is precisely controlled to, and utilizes low temperature runner
Forming technique, silica gel can be allowed to be maintained at lower temperature and maintain its mobility, product size is precisely controlled to profit.
In the present embodiment, semiconductor luminous assembly 110 includes at least semiconductor luminescence component, such as light-emitting diodes
Pipe, Organic Light Emitting Diode, laser diode or other semiconductor luminous assemblies.When the quantity of semiconductor luminous assembly is multiple
When, semiconductor luminous assembly array can be arranged in.It will be illustrated below exemplified by using light emitting diode.Bearing part 120 wraps
Include circuit board, circuit board bearing light emitting diode, and light emitting diode and be electrically connected at circuit board, also carried and half on circuit board
The related electronic building brick of conductor luminescence component 110.Other bearing part 120 for example further includes more several terminals 122, these terminals
122 are electrically connected to circuit board and the outside of coating member 130 are extended to from circuit board, and in the present embodiment, bearing part 120 includes
Two terminals 122, the two terminals 122 can make external power source to bearing part 120 and semiconductor light emitting with externally connected power supply
Component 110 is powered.Moreover, it is noted that the material using silica gel as coating member 130 can make the colour temperature of light extraction produce change
Change, referred to herein as " colour temperature drift ", its main cause is because the colour temperature that the thickness of the coating member 130 of silica gel can influence light extraction becomes
Change.To excite yellow fluorescent powder with blue light by taking the light emitting diode for blending together white light as an example, when the thinner thickness of coating member 130,
The colour temperature drift of light extraction can fall in ± 500K, and its reason is blue light emitting after coating member 130 coats semiconductor luminous assembly 110
The position for the blue light total reflection interface that diode chip for backlight unit is sent can change, and make the blue light of light extraction increase, cause the blue light of total reflection
Reducing, thus reduce the generation of gold-tinted, i.e., the blue light of light extraction becomes more and gold-tinted tails off, and then colour temperature is produced change, so
The colour temperature of light extraction can be controlled by the thickness for changing coating member 130.
Coating member 130 has an at least heat emission hole 138, and heat emission hole 138 is formed at the periphery wall 135 of coating member 130, and dissipates
The position correspondence of hot hole 138 is in semiconductor luminous assembly 110, in this way, heat can be via radiating caused by semiconductor luminous assembly 110
Hole 138 dissipates to outside, reaches the effect of radiating.In the present embodiment, two are formed on the periphery wall 135 of coating member 130
Heat emission hole 138 is simultaneously located on the relative position of periphery wall 135, but not limited to this, can also set one or more.
In the present embodiment, coating member 130 has more an at least groove 137, and groove 137 is formed at the outer of coating member 130
Perisporium 135 and correspond to bearing part 120, the effect of this groove 137 mainly makes light fixture 100 be fixed in lamp socket.
In this embodiment, light fixture 100 can also further include lampshade 140, and lampshade 140 is incorporated into coating member 130, semiconductor light emitting
The light that component 110 is sent sequentially exposes to outside by the first lens 132 and lampshade 140.Lampshade 140 is sheathed on cladding
The periphery wall 135 of part 130, and in the present embodiment, coating member 130 further includes bead 139, and bead 139 is also formed in coating
The periphery wall 135 of part 130, when lampshade 110 is sheathed on the periphery wall 135 of coating member 130, the bottom margin 142 of lampshade 140 supports
Bead 139 is connected to, lampshade 140 is positioned at coating member 130 whereby.Lampshade 140 includes the second lens 144 and reflecting surface 146,
Second lens 144 cover the first lens 132 and reflecting surface 146 surround the second lens 144, what semiconductor luminous assembly 110 was sent
Light extraction after light is sequentially reflected by the first lens 132 and the second lens 144 and light extraction, and some light by reflecting surface 146.
In the present embodiment, lampshade 140 is in circular cone shape and can be made up of plastic material, and with the first opening 141 and the second opening
143, the opposite end surface that the first opening 141 is formed at lampshade 140 with the second opening 143, it is open from second at 143 towards lampshade
140 inside extensions form boss 145, and the inside of boss 145 is in hollow form and forms depressed part 147, and depressed part 147 is sheathed on cladding
The periphery wall 135 of part 130, and the wall of depressed part 147 is coated on viscose, and lampshade 140 is fixed on cladding whereby
On the periphery wall 135 of part 130.Second lens 144 are formed on the top of boss 145.Reflecting surface 146 for lampshade 140 inner peripheral surface simultaneously
The first opening 141 is extended to from the bottom margin of boss 145, therefore reflecting surface 146 is circular conical surface, in the present embodiment, anti-
Penetrate the webbed decorative pattern of shape (such as indentation) on face 146, can allow light extraction via reflecting surface 146 reflect after evenly.Semiconductor
The light that luminescence component 110 is sent is via light extraction after the first lens 132 and the second lens 144, and partial light extraction is via reflection
Face 146 is reflected, and overall light is turned into desired light type.
Fig. 3 and Fig. 4 is referred to, it represents another embodiment of the light fixture of the present invention.In the light fixture 100 ' of the present embodiment,
In addition to the first lens 132 ' and the second lens 144 ', remaining structure and component with the embodiment phase shown in Fig. 1 and Fig. 2
Together, therefore identical component gives identical symbol and the description thereof will be omitted.In the present embodiment, the curvature ratio of the first lens 132 '
First lens 132 of embodiment shown in Fig. 1 and Fig. 2 are big, the curvature of the second lens 144 ' also than Fig. 1 and Fig. 2 shown in implementation
First lens 132 of example are big, and the light fixture of such the present embodiment can produce different from the embodiment light fixture shown in Fig. 1 and Fig. 2
Light type, and the thickness of first lens 132 ' of the present embodiment is all than first lens 132 of the embodiment shown in Fig. 1 and Fig. 2
Thickness is big, as it was previously stated, the thickness of silica gel can influence the colour temperature of light extraction, therefore the colour temperature of light extraction would also vary from.
The light fixture of the present invention is by with coating member 130 integratedly encapsulating semiconductor luminescence component 110 and bearing part 120, no
Need as prior art is combined light source with main body using viscose, the problem of degumming can be prevented and cause component to come off, and this
The structure of the integral type encapsulating of invention can also reach waterproof and dampproof effect, more increase the life-span of light fixture, in addition, the present invention
Light fixture can produce secondary optics effect due to forming the second lens 144 in lampshade 140 to light extraction, therefore without reflecting
Aluminium lamination is coated with face 146, therefore the light fixture of the present invention more meets environmental protection standard compared with the light fixture of prior art.
The above described is only a preferred embodiment of the present invention, any formal limitation not is made to the present invention, though
So the present invention is disclosed above with preferred embodiment, but is not limited to the present invention, any to be familiar with this professional technology people
Member, without departing from the scope of the present invention, when method and technology contents using the disclosure above make it is a little more
Equivalent embodiment that is dynamic or being modified to equivalent variations, as long as being the content without departing from technical solution of the present invention, according to the present invention's
Any simple modification, equivalent change and modification that technical spirit is made to above example, still falls within technical solution of the present invention
In the range of.
Claims (14)
- A kind of 1. light fixture, it is characterised in that including：Semiconductor luminous assembly；Bearing part, carry the semiconductor luminous assembly；AndCoating member, the semiconductor luminous assembly and the bearing part are coated, and with the covering semiconductor luminous assembly The first lens, wherein the structure that the coating member is one of the forming.
- 2. light fixture as claimed in claim 1, it is characterised in that the coating member has top, and recess is formed at the top, First lens are located in the recess, and positioned at the top of the semiconductor luminous assembly.
- 3. light fixture as claimed in claim 1, it is characterised in that the material of the coating member includes silica gel.
- 4. light fixture as claimed in claim 1, it is characterised in that the bearing part includes circuit board.
- 5. light fixture as claimed in claim 4, it is characterised in that the bearing part further includes more several terminals, and the terminal is certainly The circuit board extends to the outside of the coating member.
- 6. light fixture as claimed in claim 1, it is characterised in that the semiconductor luminous assembly includes an at least light-emitting diodes Pipe.
- 7. light fixture as claimed in claim 1, it is characterised in that the coating member has an at least heat emission hole, and described at least one Heat emission hole is formed at the periphery wall of the coating member, and the position correspondence of an at least heat emission hole is in the semiconductor light emitting group Part.
- 8. light fixture as claimed in claim 1, it is characterised in that the coating member has an at least groove, and described at least one is recessed Groove is formed at the periphery wall of the coating member and corresponds to the bearing part.
- 9. light fixture as claimed in claim 1, it is characterised in that the light fixture further includes lampshade, is incorporated into the coating member, and Cover first lens of the semiconductor luminous assembly.
- 10. light fixture as claimed in claim 9, it is characterised in that the coating member has top, is formed at the top recessed Portion, first lens are located in the recess, and are sheathed on institute positioned at the top of the semiconductor luminous assembly, the lampshade State the periphery wall at top.
- 11. light fixture as claimed in claim 10, it is characterised in that the coating member further includes bead, and the bead is formed at The periphery wall of the coating member, when the lampshade is sheathed on the periphery wall at the top, the bottom of the lampshade Edge is connected to the bead.
- 12. light fixture as claimed in claim 9, it is characterised in that the lampshade includes the second lens and reflecting surface, and described Two lens cover first lens and the reflecting surface is around second lens and the semiconductor luminous assembly.
- 13. light fixture as claimed in claim 12, it is characterised in that the reflecting surface is circular conical surface.
- 14. light fixture as claimed in claim 9, it is characterised in that the material of the lampshade includes plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610843835.2A CN107859882A (en) | 2016-09-22 | 2016-09-22 | Light fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610843835.2A CN107859882A (en) | 2016-09-22 | 2016-09-22 | Light fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107859882A true CN107859882A (en) | 2018-03-30 |
Family
ID=61698952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610843835.2A Pending CN107859882A (en) | 2016-09-22 | 2016-09-22 | Light fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107859882A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001119067A (en) * | 1999-10-19 | 2001-04-27 | Sanken Electric Co Ltd | Semiconductor light emitting device |
| TW200507293A (en) * | 2003-08-08 | 2005-02-16 | Galaxy Optoelectronics Corp | Lens with multi-curvature and LED package having the same |
| US20080157112A1 (en) * | 2006-10-20 | 2008-07-03 | Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh | Semiconductor lamp |
| CN102734729A (en) * | 2011-04-12 | 2012-10-17 | 株式会社小糸制作所 | Vehicle lamp |
| CN206130561U (en) * | 2016-09-22 | 2017-04-26 | 扬州雷笛克光学有限公司 | Lamp |
-
2016
- 2016-09-22 CN CN201610843835.2A patent/CN107859882A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001119067A (en) * | 1999-10-19 | 2001-04-27 | Sanken Electric Co Ltd | Semiconductor light emitting device |
| TW200507293A (en) * | 2003-08-08 | 2005-02-16 | Galaxy Optoelectronics Corp | Lens with multi-curvature and LED package having the same |
| US20080157112A1 (en) * | 2006-10-20 | 2008-07-03 | Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh | Semiconductor lamp |
| CN102734729A (en) * | 2011-04-12 | 2012-10-17 | 株式会社小糸制作所 | Vehicle lamp |
| CN206130561U (en) * | 2016-09-22 | 2017-04-26 | 扬州雷笛克光学有限公司 | Lamp |
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