CN107841782A - A kind of IC support plates plating mother-son groove - Google Patents
A kind of IC support plates plating mother-son groove Download PDFInfo
- Publication number
- CN107841782A CN107841782A CN201711310917.1A CN201711310917A CN107841782A CN 107841782 A CN107841782 A CN 107841782A CN 201711310917 A CN201711310917 A CN 201711310917A CN 107841782 A CN107841782 A CN 107841782A
- Authority
- CN
- China
- Prior art keywords
- major trough
- trough body
- unit
- support plates
- pilot trench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 238000001816 cooling Methods 0.000 claims abstract description 16
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 239000000498 cooling water Substances 0.000 claims description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 11
- 239000010936 titanium Substances 0.000 claims description 11
- 229910052719 titanium Inorganic materials 0.000 claims description 11
- 239000002826 coolant Substances 0.000 claims description 6
- 210000005056 cell body Anatomy 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 238000009713 electroplating Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 241000208340 Araliaceae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 210000000476 body water Anatomy 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
Abstract
The present invention provides a kind of IC support plates plating mother-son groove, including major trough body；Pilot trench, it is arranged in major trough body；Hanger, it is vertically arranged in pilot trench, it is used to being connected and carrying IC plates to be electroplated with external power source；Electrode unit, it is arranged in pilot trench, for producing copper ion；Heating unit, it is arranged in major trough body, it is used to heat；Cooling unit, it is arranged in major trough body, it is used to cool down；Inflate unit, be arranged in major trough body, it is used to inflate into major trough body.Pilot trench is used to carry electrode unit and carries the hanger, and IC plates to be electroplated are arranged on hanger, and the two sides of IC plates can be electroplated simultaneously；Electroplate liquid is provided with major trough body, unit of inflating is inflated so that the even concentration of the electroplate liquid in major trough body, heating unit heat to the electroplate liquid in major trough body so that electroplate liquid is in the temperature and concentration of setting, and so, the coating of IC plates is uniform, and product quality is higher.
Description
Technical field
The present invention relates to IC support plate production technical fields, more particularly to a kind of IC support plates plating mother-son groove.
Background technology
IC support plates are widely used in electronics production, in process of production, it is necessary to be electroplated to two sides, because its size
It is smaller to be electroplated, it is necessary to be arranged on hanger.In the prior art, the plating of IC-card has the following disadvantages：The plating of IC support plates
Electroplating bath is horizontal, can only one side plating, it is necessary to, it is necessary to electroplated respectively to the two sides of IC plates when electroplating two sides, easily cause
IC support plates two sides is uneven, influences product quality.
The content of the invention
Technical problem solved by the invention is that providing a kind of IC support plates electroplates mother-son groove, including：
Major trough body；
Pilot trench, it is arranged in the major trough body；
Hanger, it is vertically arranged in the pilot trench, it is used to being connected and carrying IC plates to be electroplated with external power source；
Electrode unit, it is arranged in the pilot trench, for producing copper ion；
Heating unit, it is arranged in the major trough body, it is used to heat；
Cooling unit, it is arranged in the major trough body, it is used to cool down；
Inflate unit, be arranged in the major trough body, it is used into the major trough body inflate.
Further, the pilot trench includes main part and two side body portions being connected with the both sides of the main part, institute
State hanger to be located in the main part, the electrode unit is in two side body portions.
Further, the electrode unit includes titanium basket and the anode stub being connected with the titanium basket, and the titanium basket is located at
In the pilot trench.
Further, the heating unit includes two snakelike heating tubes, and two heating tubes are located at institute respectively
State the both sides of pilot trench.
Further, the cooling unit includes cooling water pipe and the Cooling Water system being connected with the cooling water pipe
System, the cooling water pipe are located at the lower section of the pilot trench.
Further, the unit of inflating includes air-inflating tube and the air supply system beaten that is connected with the air-inflating tube.
Further, it is additionally provided with temperature sensor in the major trough body.
Further, be provided with the major trough body water inlet, water return outlet, with the corresponding air inlet of unit of inflating
And coolant intake corresponding with the cooling unit, the mistake being connected with the water return outlet is provided with the outside of the major trough body
Filter, the return pipe being connected with the output end of the filter is additionally provided with the major trough body.
Further, the bottom of the major trough body is provided with leakage fluid dram, and the air inlet is located at the upper of the major trough body
Portion, the water inlet are located at the top of the major trough body, and the water return outlet is located at the bottom of the major trough body.
The IC support plates of present invention plating mother-son groove, the pilot trench are used to carry the electrode unit and carry the extension
Frame, IC plates to be electroplated are arranged on the hanger, and the two sides of IC plates can be electroplated simultaneously；Set in the major trough body
There is electroplate liquid, the unit of inflating is inflated so that the even concentration of the electroplate liquid in the major trough body, the heating unit is to institute
State the electroplate liquid heating in major trough body so that electroplate liquid is in the temperature and concentration of setting, and so, the coating of IC plates is uniform, production
Quality is higher；When temperature of electroplating solution is too high, it can be cooled by the cooling unit, keep the temperature of electroplate liquid to exist
It is easy to adjust in required scope.
Brief description of the drawings
Fig. 1 is that the IC support plates of the present invention electroplate the schematic diagram of mother-son groove；
Fig. 2 is that the IC support plates of the present invention electroplate the exploded view of mother-son groove；
In figure mark for：Major trough body 1, water inlet 11, water return outlet 12, air inlet 13, coolant intake 14, leakage fluid dram 15,
Pilot trench 2, main part 21, side body portion 22, hanger 3, electrode unit 4, titanium basket 41, anode stub 42, heating unit 5, heating tube 51 are cold
But unit 6, inflate unit 7, air-inflating tube 71, temperature sensor 8, return pipe 9.
Embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element is represented to same or similar label eventually or there is the element of same or like function.Below by ginseng
The embodiment for examining accompanying drawing description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
In the following description, will be by many Directional words in order to clearly show that the structure and working method of the present invention
Be described, but should will " on ", " under ", "left", "right", "front", "rear", " interior ", " outer ", " upward ", " downward ", " to
The Word Understanding such as a left side ", " to the right ", " forward ", " backward ", " inside ", " outside " is not construed as limiting for convenience of term
Property word.
As shown in Figures 1 and 2, the present invention provides a kind of IC support plates plating mother-son groove, including：Major trough body 1；Pilot trench 2, if
It is placed in the major trough body 1；Hanger 3, it is vertically arranged in the pilot trench 2, it is used to be connected with external power source and electricity is treated in carrying
The IC plates of plating；Electrode unit 4, it is arranged in the pilot trench 2, for producing copper ion；Heating unit 5, it is arranged at the major trough
In body 1, it is used to heat；Cooling unit 6, it is arranged in the major trough body, it is used to cool down；Inflate unit 7, be arranged at described
In major trough body 1, it is used into the major trough body 1 inflate.The pilot trench 2 is used to carry described in the electrode unit 4 and carrying
Hanger 3, IC plates to be electroplated are arranged on the hanger 3, and the two sides of IC plates can be electroplated simultaneously；The major trough body 1
In be provided with electroplate liquid, the unit 7 of inflating is inflated so that the even concentration of the electroplate liquid in the major trough body 1, the heating
Unit 5 heats to the electroplate liquid in the major trough body 1 so that electroplate liquid is in the temperature and concentration of setting, so, the plating of IC plates
Uniformly, product quality is higher for layer；It when temperature of electroplating solution is too high, can be cooled by the cooling unit 6, keep plating
The temperature of liquid is easy to adjust in required scope.
The pilot trench 2 includes main part 21 and two side body portions 22 being connected with the both sides of the main part 21, the extension
Frame 3 is located in the main part 21, and the electrode unit 4 is in two side body portions 22.The pilot trench 2 facilitates the extension
The setting installation of frame 3 and the electrode unit 4.
The electrode unit 4 includes titanium basket 41 and the anode stub 42 being connected with the titanium basket 41, and the titanium basket 42 is located at institute
State in pilot trench 2.The anode stub 42 is used to be connected with the anode stub 42 and copper ball, so, can produce copper ion.
The heating unit 5 includes two snakelike heating tubes 51, and two heating tubes 51 are located at the pilot trench 2 respectively
Both sides.The snakelike heating tube 51 is used to heat electroplate liquid, and heating is efficient.
The cooling unit 6 includes cooling water pipe 61 and (not schemed with the Cooling Water system that the cooling water pipe 61 is connected
Show), the cooling water pipe 61 is located at the lower section of the pilot trench 2.The Cooling Water system be the cooling of cooling water pipe 61 but
Water, electroplate liquid is cooled, cool convenience and high-efficiency.
The unit 7 of inflating includes air-inflating tube 71 and the air supply system (not shown) beaten that is connected with the air-inflating tube 71.Institute
State air supply system to supply for the air-inflating tube 71, to be stirred electroplate liquid so that bath concentration is uniform.
Temperature sensor 8 is additionally provided with the major trough body 1.The temperature sensor 8 is used for the temperature for detecting electroplate liquid,
When the temperature of electroplate liquid reaches required value, the pause of heating unit 5 heating；When the temperature of electroplate liquid is higher than required
Value when, the cooling unit 6 to coolant cool, keep the temperature of electroplate liquid in the range of setting, it is easy to detect.
Major trough body 1, water inlet 11, water return outlet 12, air inlet 13, coolant intake 14, leakage fluid dram 15, pilot trench 2, main part
21, side body portion 22, hanger 3, electrode unit 4, titanium basket 41, anode stub 42, heating unit 5, heating tube 51, cooling unit 6, inflate
Unit 7, air-inflating tube 71, temperature sensor 8, return pipe 9
Be provided with the major trough body 1 water inlet 11, water return outlet 12, with it is described inflate the corresponding air inlet 13 of unit 7 with
And coolant intake 14 corresponding with the cooling unit 6, the outside of the major trough body 1 is provided with to be connected with the water return outlet 12
Filter, be additionally provided with the return pipe 9 being connected with the output end of the filter in the major trough body 1.So, can be to institute
After stating the electroplate liquid filtering in major trough body 1, then it is transmitted back in the major trough body 1, is recycled, save cost.
The bottom of the major trough body 1 is provided with leakage fluid dram 15, and the air inlet 13 is located at the top of the major trough body 1, institute
The top that water inlet 11 is located at the major trough body 1 is stated, the water return outlet 12 is located at the bottom of the major trough body 1.
The IC support plates of present invention plating mother-son groove, the pilot trench 2 are used to carry the electrode unit 4 and carry the extension
Frame 3, IC plates to be electroplated are arranged on the hanger 3, and the two sides of IC plates can be electroplated simultaneously；In the major trough body 1
Electroplate liquid is provided with, the unit 7 of inflating is inflated so that the even concentration of the electroplate liquid in the major trough body 1, the heating are single
Electroplate liquid heating in first 5 pairs of major trough bodies 1 so that electroplate liquid is in the temperature and concentration of setting, so, the coating of IC plates
Uniformly, product quality is higher；It when temperature of electroplating solution is too high, can be cooled by the cooling unit 6, keep electroplate liquid
Temperature in required scope, it is easy to adjust.
It is described above, only it is highly preferred embodiment of the present invention, any formal limitation not is made to the present invention, appoints
What those skilled in the art, without departing from the scope of the technical proposal of the invention, using in the method for the disclosure above
Appearance makes many possible changes and modifications to technical solution of the present invention, belongs to protective scope of the claims.
Claims (9)
- A kind of 1. IC support plates plating mother-son groove, it is characterised in that including：Major trough body；Pilot trench, it is arranged in the major trough body；Hanger, it is vertically arranged in the pilot trench, it is used to being connected and carrying IC plates to be electroplated with external power source；Electrode unit, it is arranged in the pilot trench, for producing copper ion；Heating unit, it is arranged in the major trough body, it is used to heat；Cooling unit, it is arranged in the major trough body, it is used to cool down；Inflate unit, be arranged in the major trough body, it is used into the major trough body inflate.
- 2. IC support plates as claimed in claim 1 plating mother-son groove, it is characterised in that：The pilot trench include main part and with institute Two connected side body portions of the both sides of main part are stated, the hanger is located in the main part, and the electrode unit is located at two In the side body portion.
- 3. IC support plates as claimed in claim 1 plating mother-son groove, it is characterised in that：The electrode unit include titanium basket and with The connected anode stub of the titanium basket, the titanium basket are located in the pilot trench.
- 4. IC support plates as claimed in claim 1 plating mother-son groove, it is characterised in that：The heating unit is snakelike including two Heating tube, two heating tubes respectively be located at the pilot trench both sides.
- 5. IC support plates as claimed in claim 1 plating mother-son groove, it is characterised in that：The cooling unit includes cooling water pipe The Cooling Water system being connected with the cooling water pipe, the cooling water pipe are located at the lower section of the pilot trench.
- 6. IC support plates as claimed in claim 1 plating mother-son groove, it is characterised in that：It is described inflate unit include air-inflating tube and Be connected the air supply system beaten with the air-inflating tube.
- 7. IC support plates as claimed in claim 1 plating mother-son groove, it is characterised in that：Temperature is additionally provided with the major trough body Sensor.
- 8. IC support plates as claimed in claim 1 plating mother-son groove, it is characterised in that：It is provided with the major trough body into water Mouth, water return outlet, with described inflate the corresponding air inlet of unit and coolant intake corresponding with the cooling unit, the master The filter being connected with the water return outlet is provided with the outside of cell body, is additionally provided with the major trough body defeated with the filter Go out the connected return pipe in end.
- 9. IC support plates as claimed in claim 8 plating mother-son groove, it is characterised in that：The bottom of the major trough body is provided with row Liquid mouth, the air inlet are located at the top of the major trough body, and the water inlet is located at the top of the major trough body, the water return outlet Positioned at the bottom of the major trough body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711310917.1A CN107841782A (en) | 2017-12-11 | 2017-12-11 | A kind of IC support plates plating mother-son groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711310917.1A CN107841782A (en) | 2017-12-11 | 2017-12-11 | A kind of IC support plates plating mother-son groove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107841782A true CN107841782A (en) | 2018-03-27 |
Family
ID=61663639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711310917.1A Pending CN107841782A (en) | 2017-12-11 | 2017-12-11 | A kind of IC support plates plating mother-son groove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107841782A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001181897A (en) * | 1999-12-17 | 2001-07-03 | Chuo Seisakusho Ltd | Plating method and plating apparatus |
| JP3154267U (en) * | 2009-07-09 | 2009-10-15 | 株式会社アイプラント | Plated material holder |
| CN207596985U (en) * | 2017-12-11 | 2018-07-10 | 苏州玄影影像科技有限公司 | A kind of IC support plates plating mother-son groove |
-
2017
- 2017-12-11 CN CN201711310917.1A patent/CN107841782A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001181897A (en) * | 1999-12-17 | 2001-07-03 | Chuo Seisakusho Ltd | Plating method and plating apparatus |
| JP3154267U (en) * | 2009-07-09 | 2009-10-15 | 株式会社アイプラント | Plated material holder |
| CN207596985U (en) * | 2017-12-11 | 2018-07-10 | 苏州玄影影像科技有限公司 | A kind of IC support plates plating mother-son groove |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180327 |
|
| WD01 | Invention patent application deemed withdrawn after publication |