CN207596985U - A kind of IC support plates plating mother-son groove - Google Patents
A kind of IC support plates plating mother-son groove Download PDFInfo
- Publication number
- CN207596985U CN207596985U CN201721718257.6U CN201721718257U CN207596985U CN 207596985 U CN207596985 U CN 207596985U CN 201721718257 U CN201721718257 U CN 201721718257U CN 207596985 U CN207596985 U CN 207596985U
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- China
- Prior art keywords
- major trough
- trough body
- unit
- support plates
- pilot trench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model provides a kind of IC support plates plating mother-son groove, including major trough body；Pilot trench is set in major trough body；Hanger is vertically arranged in pilot trench, is used to being connected and carrying IC plates to be electroplated with external power supply；Electrode unit is set in pilot trench, for generating copper ion；Heating unit is set in major trough body, is used to heat；Cooling unit is set in major trough body, is used to cool down；It inflates unit, is set in major trough body, is used to inflate into major trough body.For carrying electrode unit and carrying the hanger, IC plates to be electroplated are set on hanger pilot trench, and the two sides of IC plates can be electroplated simultaneously；Electroplate liquid being provided in major trough body, unit of inflating is inflated so that the even concentration of the electroplate liquid in major trough body, heating unit heat the electroplate liquid in major trough body so that electroplate liquid is in the temperature and concentration of setting, in this way, the coating of IC plates is uniform, product quality higher.
Description
Technical field
The utility model is related to IC support plates production technical field more particularly to a kind of IC support plates plating mother-son grooves.
Background technology
IC support plates are widely used in electronics production, in process of production, need that two sides is electroplated, because of its size
It is smaller, it needs to be electroplated on hanger.In the prior art, the plating of IC card has the following disadvantages：The plating of IC support plates
Electroplating bath is horizontal, can only single side plating, need be electroplated two sides when, need that the two sides of IC plates is electroplated respectively, easily cause
IC support plates two sides is uneven, influences product quality.
Utility model content
The technical issues of the utility model solves is that providing a kind of IC support plates is electroplated mother-son groove, including：
Major trough body；
Pilot trench is set in the major trough body；
Hanger is vertically arranged in the pilot trench, is used to being connected and carrying IC plates to be electroplated with external power supply；
Electrode unit is set in the pilot trench, for generating copper ion；
Heating unit is set in the major trough body, is used to heat；
Cooling unit is set in the major trough body, is used to cool down；
It inflates unit, is set in the major trough body, is used into the major trough body inflate.
Further, the pilot trench includes main part and two side body portions being connected with the both sides of the main part, institute
It states hanger to be located in the main part, the electrode unit is located in two side body portions.
Further, the electrode unit includes titanium basket and the anode stub being connected with the titanium basket, and the titanium basket is located at
In the pilot trench.
Further, the heating unit includes two snakelike heating tubes, and two heating tubes are located at institute respectively
State the both sides of pilot trench.
Further, the cooling unit includes cooling water pipe and the Cooling Water system being connected with the cooling water pipe
System, the cooling water pipe are located at the lower section of the pilot trench.
Further, the unit of inflating includes air-inflating tube and the air supply system beaten that is connected with the air-inflating tube.
Further, it is additionally provided with temperature sensor in the major trough body.
Further, be provided on the major trough body water inlet, water return outlet, with the corresponding air inlet of unit of inflating
And coolant intake corresponding with the cooling unit, the mistake being connected with the water return outlet is provided on the outside of the major trough body
Filter is additionally provided with the return pipe being connected with the output terminal of the filter in the major trough body.
Further, the bottom of the major trough body is provided with leakage fluid dram, and the air inlet is located at the upper of the major trough body
Portion, the water inlet are located at the top of the major trough body, and the water return outlet is located at the lower part of the major trough body.
The IC support plates of the utility model plating mother-son groove, the pilot trench are used to carry described in the electrode unit and carrying
Hanger, IC plates to be electroplated are set on the hanger, and the two sides of IC plates can be electroplated simultaneously；It is set in the major trough body
Electroplate liquid is equipped with, the unit of inflating is inflated so that the even concentration of the electroplate liquid in the major trough body, the heating unit pair
Electroplate liquid heating in the major trough body so that electroplate liquid is in the temperature and concentration of setting, in this way, the coating of IC plates is uniform,
Product quality higher；When temperature of electroplating solution is excessively high, it can be cooled down by the cooling unit, keep the temperature of electroplate liquid
It is easy to adjust in required range.
Description of the drawings
Fig. 1 is that the schematic diagram of mother-son groove is electroplated in the IC support plates of the utility model；
Fig. 2 is that the exploded view of mother-son groove is electroplated in the IC support plates of the utility model；
In figure label for：Major trough body 1, water inlet 11, water return outlet 12, air inlet 13, coolant intake 14, leakage fluid dram 15,
Pilot trench 2, main part 21, side body portion 22, hanger 3, electrode unit 4, titanium basket 41, anode stub 42, heating unit 5, heating tube 51 are cold
But unit 6, inflate unit 7, air-inflating tube 71, temperature sensor 8, return pipe 9.
Specific embodiment
The embodiment of the utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein
Same or similar label represents same or similar element or the element with same or like function from beginning to end.Lead to below
It crosses the embodiment being described with reference to the drawings to be exemplary, it is intended to for explaining the utility model, and it is not intended that this practicality
Novel limitation.
In the following description, the structure and working method of the utility model in order to clearly demonstrate, will be by all multidirectionals
Word is described, but should will " on ", " under ", "left", "right", "front", "rear", " interior ", " outer ", " upward ", " downward ",
" to the left ", " to the right ", " forward ", " backward ", " inside ", the Word Understandings such as " outside " are not construed as convenience of term
Word of limitation.
As shown in Figures 1 and 2, the utility model provides a kind of IC support plates plating mother-son groove, including：Major trough body 1；Pilot trench
2, it is set in the major trough body 1；Hanger 3 is vertically arranged in the pilot trench 2, is used to external power supply be connected and carry
IC plates to be electroplated；Electrode unit 4 is set in the pilot trench 2, for generating copper ion；Heating unit 5 is set to described
In major trough body 1, it is used to heat；Cooling unit 6 is set in the major trough body, is used to cool down；It inflates unit 7, is set to
In the major trough body 1, it is used into the major trough body 1 inflate.The pilot trench 2 is used to carry the electrode unit 4 and carrying
The hanger 3, IC plates to be electroplated are set on the hanger 3, and the two sides of IC plates can be electroplated simultaneously；The major trough
Electroplate liquid is provided in body 1, the unit 7 of inflating is inflated so that the even concentration of the electroplate liquid in the major trough body 1, it is described
Heating unit 5 heats the electroplate liquid in the major trough body 1 so that electroplate liquid is in the temperature and concentration of setting, in this way, IC plates
Coating it is uniform, product quality higher；It when temperature of electroplating solution is excessively high, can be cooled down by the cooling unit 6, kept
The temperature of electroplate liquid is easy to adjust in required range.
The pilot trench 2 includes main part 21 and two side body portions 22 being connected with the both sides of the main part 21, the extension
Frame 3 is located in the main part 21, and the electrode unit 4 is located in two side body portions 22.The pilot trench 2 facilitates the extension
The setting installation of frame 3 and the electrode unit 4.
The electrode unit 4 includes titanium basket 41 and the anode stub 42 being connected with the titanium basket 41, and the titanium basket 42 is located at institute
It states in pilot trench 2.The anode stub 42 with the anode stub 42 and copper ball for being connected, in this way, copper ion can be generated.
The heating unit 5 includes two snakelike heating tubes 51, and two heating tubes 51 are located at the pilot trench 2 respectively
Both sides.The snakelike heating tube 51 is used to heat electroplate liquid, and heating is efficient.
The Cooling Water system that the cooling unit 6 includes cooling water pipe 61 and is connected with the cooling water pipe 61 (is not schemed
Show), the cooling water pipe 61 is located at the lower section of the pilot trench 2.The Cooling Water system is the cooling water pipe 61 for cooling
Water cools down to electroplate liquid, and cool down convenience and high-efficiency.
The unit 7 of inflating includes air-inflating tube 71 and the air supply system (not shown) beaten that is connected with the air-inflating tube 71.Institute
It states air supply system to supply for the air-inflating tube 71, to be stirred electroplate liquid so that bath concentration is uniform.
Temperature sensor 8 is additionally provided in the major trough body 1.The temperature sensor 8 is used to detect the temperature of electroplate liquid,
When the temperature of electroplate liquid reaches required value, the pause of heating unit 5 heating；When the temperature of electroplate liquid is higher than required
Value when, the cooling unit 6 to coolant cool down, keep the temperature of electroplate liquid in the range of setting, it is easy to detect.
Major trough body 1, water inlet 11, water return outlet 12, air inlet 13, coolant intake 14, leakage fluid dram 15, pilot trench 2, main part
21, side body portion 22, hanger 3, electrode unit 4, titanium basket 41, anode stub 42, heating unit 5, heating tube 51, cooling unit 6 inflates
Unit 7, air-inflating tube 71, temperature sensor 8, return pipe 9
Be provided on the major trough body 1 water inlet 11, water return outlet 12, with it is described inflate 7 corresponding air inlet 13 of unit with
And with the 6 corresponding coolant intake 14 of cooling unit, the outside of the major trough body 1 is provided with to be connected with the water return outlet 12
Filter, be additionally provided with the return pipe 9 being connected with the output terminal of the filter in the major trough body 1.In this way, can to institute
It after stating the electroplate liquid filtering in major trough body 1, then is transmitted back in the major trough body 1, is recycled, save cost.
The bottom of the major trough body 1 is provided with leakage fluid dram 15, and the air inlet 13 is located at the top of the major trough body 1, institute
The top that water inlet 11 is located at the major trough body 1 is stated, the water return outlet 12 is located at the lower part of the major trough body 1.
The IC support plates of the utility model plating mother-son groove, the pilot trench 2 are used to carry the electrode unit 4 and carrying institute
Hanger 3 is stated, IC plates to be electroplated are set on the hanger 3, and the two sides of IC plates can be electroplated simultaneously；The major trough body
Electroplate liquid is provided in 1, the unit 7 of inflating is inflated so that the even concentration of the electroplate liquid in the major trough body 1, it is described to add
Hot cell 5 heats the electroplate liquid in the major trough body 1 so that and electroplate liquid is in the temperature and concentration of setting, in this way, IC plates
Coating is uniform, product quality higher；It when temperature of electroplating solution is excessively high, can be cooled down by the cooling unit 6, keep electricity
The temperature of plating solution is easy to adjust in required range.
The above is only the most preferred embodiment of the utility model, and not the utility model is made in any form
Limitation, any those skilled in the art, in the case where not departing from technical solutions of the utility model ambit, utilization is above-mentioned
The method content of announcement makes technical solutions of the utility model many possible changes and modifications, belongs to claim protection
Range.
Claims (9)
1. a kind of IC support plates plating mother-son groove, which is characterized in that including：
Major trough body；
Pilot trench is set in the major trough body；
Hanger is vertically arranged in the pilot trench, is used to being connected and carrying IC plates to be electroplated with external power supply；
Electrode unit is set in the pilot trench, for generating copper ion；
Heating unit is set in the major trough body, is used to heat；
Cooling unit is set in the major trough body, is used to cool down；
It inflates unit, is set in the major trough body, is used into the major trough body inflate.
2. IC support plates as described in claim 1 plating mother-son groove, it is characterised in that：The pilot trench include main part and with institute
Two side body portions that the both sides of main part are connected are stated, the hanger is located in the main part, and the electrode unit is located at two
In the side body portion.
3. IC support plates as described in claim 1 plating mother-son groove, it is characterised in that：The electrode unit include titanium basket and with
The anode stub that the titanium basket is connected, the titanium basket are located in the pilot trench.
4. IC support plates as described in claim 1 plating mother-son groove, it is characterised in that：The heating unit is snakelike including two
Heating tube, two heating tubes respectively be located at the pilot trench both sides.
5. IC support plates as described in claim 1 plating mother-son groove, it is characterised in that：The cooling unit includes cooling water pipe
The Cooling Water system being connected with the cooling water pipe, the cooling water pipe are located at the lower section of the pilot trench.
6. IC support plates as described in claim 1 plating mother-son groove, it is characterised in that：It is described inflate unit include air-inflating tube and
Be connected the air supply system beaten with the air-inflating tube.
7. IC support plates as described in claim 1 plating mother-son groove, it is characterised in that：Temperature is additionally provided in the major trough body
Sensor.
8. IC support plates as described in claim 1 plating mother-son groove, it is characterised in that：It is provided on the major trough body into water
Mouth, water return outlet inflate the corresponding air inlet of unit and coolant intake corresponding with the cooling unit with described, the master
The filter being connected with the water return outlet is provided on the outside of groove body, is additionally provided in the major trough body defeated with the filter
The return pipe that outlet is connected.
9. IC support plates as claimed in claim 8 plating mother-son groove, it is characterised in that：The bottom of the major trough body is provided with row
Liquid mouth, the air inlet are located at the top of the major trough body, and the water inlet is located at the top of the major trough body, the water return outlet
Positioned at the lower part of the major trough body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721718257.6U CN207596985U (en) | 2017-12-11 | 2017-12-11 | A kind of IC support plates plating mother-son groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721718257.6U CN207596985U (en) | 2017-12-11 | 2017-12-11 | A kind of IC support plates plating mother-son groove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207596985U true CN207596985U (en) | 2018-07-10 |
Family
ID=62764064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721718257.6U Expired - Fee Related CN207596985U (en) | 2017-12-11 | 2017-12-11 | A kind of IC support plates plating mother-son groove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207596985U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107841782A (en) * | 2017-12-11 | 2018-03-27 | 苏州玄影影像科技有限公司 | A kind of IC support plates plating mother-son groove |
-
2017
- 2017-12-11 CN CN201721718257.6U patent/CN207596985U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107841782A (en) * | 2017-12-11 | 2018-03-27 | 苏州玄影影像科技有限公司 | A kind of IC support plates plating mother-son groove |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190830 Address after: Room 1906, No. 1399 Jinqiao Road, Pudong New Area, Shanghai, 200120 Patentee after: CHEN TITANIUM TRADE (SHANGHAI) CO., LTD. Address before: 215000 No. 50 North Guandu Road, Yuexi Street, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: Suzhou Xuan shadow imaging technology Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200818 Address after: No.3 Jingkai Road, Nantong Economic and Technological Development Zone, Nantong City, Jiangsu Province, 226000 Patentee after: Jiangsu Tisheng Technology Co., Ltd Address before: Room 1906, No. 1399 Jinqiao Road, Pudong New Area, Shanghai, 200120 Patentee before: CHEN TITANIUM TRADE (SHANGHAI) Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180710 Termination date: 20201211 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |