CN107835580A - A kind of soft board cover layer applying method - Google Patents
A kind of soft board cover layer applying method Download PDFInfo
- Publication number
- CN107835580A CN107835580A CN201711034366.0A CN201711034366A CN107835580A CN 107835580 A CN107835580 A CN 107835580A CN 201711034366 A CN201711034366 A CN 201711034366A CN 107835580 A CN107835580 A CN 107835580A
- Authority
- CN
- China
- Prior art keywords
- cover layer
- hole
- fpc plates
- applying method
- soft board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
The invention discloses a kind of soft board cover layer applying method, including：Step 1. gets out a false sticker, and following table can heat and temperature controllable on false sticker；Step 2. makes tool with epoxy resin board, carries out the hole that aperture is 2.0mm by pitch-row 5mm multiple on tool；Also pitch-row 5mm multiple, aperture 2.0mm hole are carried out on step 3.FPC plates；With tool hole to good, the PIN for beating 2.0mm is followed closely step 4.FPC plates；Step 5. nails on the borehole jack of 2.0mm on cover layer in PIN；Step 6. starts machine and presses 5 10S, treats that machine deck is upspring automatically, FPC plates are taken out；Step 7. repetitive operation, continuous production.Raising efficiency of the present invention, saves labour turnover, simple to operate, and easily-learned easily mastered, cost is low, is applicable small quantities of template, saves the switching model time, solves the problems such as more and full-automatic cover layer make-up machine of manual assembly demand manpower is expensive.
Description
Technical field
The present invention relates to FPC to produce and process technical field, more particularly to a kind of soft board cover layer applying method.
Background technology
Cover layer fitting is the conventional production methods of FPC, and it is that protection copper face and circuit will not aoxidize that it, which is acted on, at present tradition
Laminating type be manual assembly and full-automatic cover layer make-up machine, it has the following disadvantages：
1. manual assembly efficiency is low, demand manpower is more；
2. Full automatic doubler is expensive, suitable for producing in enormous quantities；
There is presently no a kind of technical scheme that can be solved the above problems very well.
The content of the invention
In view of the drawbacks described above of prior art, the technical problems to be solved by the invention are to provide a kind of soft board cover layer
Applying method, using false sticker, apply mechanically universal fixture, by PIN follow closely contraposition and heat mode is bonded, can save
Manpower.
To achieve the above object, the invention provides a kind of soft board cover layer applying method, comprise the following steps：
Step 1. gets out a false sticker, and following table can heat and temperature controllable on false sticker；
Step 2. makes tool with epoxy resin board, carries out the hole that aperture is 2.0mm by pitch-row 5mm multiple on tool；
Also pitch-row 5mm multiple, aperture 2.0mm hole are carried out on step 3.FPC plates；
With tool hole to good, the PIN for beating 2.0mm is followed closely step 4.FPC plates；
Step 5. nails on the borehole jack of 2.0mm on cover layer in PIN；
Step 6. starts machine pressing 5-10S, treats that machine deck is upspring automatically, FPC plates are taken out；
Step 7. repetitive operation, continuous production.
Further, the epoxy resin board of the step 2 includes lower bolster, middle backing plate, upper padding plate.
Further, the lower bolster matching board table top, is drilled with positioning hole.
Further, the middle backing plate has positioning hole, and plate face has aperture 2.0mm, and pitch-row is used for according to the hole of 5mm multiple
Break PIN nails, fixed FPC plates and tool.
Further, the upper padding plate has positioning hole, and plate face has aperture 2.0mm, and pitch-row is according to the hole of 5mm multiple, side
Just FPC plates are taken.
Further, the plank that the step 6 presses, middle backing plate is jacked up by lift cylinder, FPC plates is departed from PIN
Nail.
The beneficial effects of the invention are as follows：
Raising efficiency of the present invention, saves labour turnover, simple to operate, and easily-learned easily mastered, cost is low, is applicable small lot
Plate, the switching model time is saved, solve the problems such as more and full-automatic cover layer make-up machine of manual assembly demand manpower is expensive.
Design, concrete structure and the caused technique effect of the present invention are described further below with reference to accompanying drawing, with
It is fully understood from the purpose of the present invention, feature and effect.
Brief description of the drawings
Fig. 1 is the fast press table structural representation of the present invention.
Fig. 2 is the tool lower bolster plate structure schematic diagram of the present invention.
Fig. 3 is backing structure schematic diagram in tool of the invention.
Fig. 4 is the tool upper padding plate structural representation of the present invention.
Label declaration：
1st, table top 1；2nd, lift cylinder；3rd, PIN is followed closely；41st, lower bolster；42nd, middle backing plate；
43rd, upper padding plate；5th, positioning hole.
Embodiment
As shown in Figure 1, 2, a kind of soft board cover layer applying method, comprises the following steps：
Step 1. gets out a false sticker, and following table can heat and temperature controllable on false sticker；
Step 2. makes tool with epoxy resin board, carries out the hole that aperture is 2.0mm by pitch-row 5mm multiple on tool；
Also pitch-row 5mm multiple, aperture 2.0mm hole are carried out on step 3.FPC plates；
For step 4.FPC plates with tool hole to good, the PIN for beating 2.0mm follows closely 3；
Step 5. is by the borehole jack of 2.0mm on cover layer on PIN nails 3；
Step 6. starts machine pressing 5-10S, treats that machine deck is upspring automatically, FPC plates are taken out；
Step 7. repetitive operation, continuous production.
In the present embodiment, the epoxy resin board of the step 2 includes lower bolster 41, middle backing plate 42, upper padding plate 43.
As shown in Fig. 2 in the present embodiment, the lower bolster 41 matches board table top 1, is drilled with positioning hole 5.
As shown in figure 3, in the present embodiment, the middle backing plate 42 has positioning hole 5, and plate face has aperture 2.0mm, and pitch-row is according to 5mm
Multiple hole, for breaking PIN nails 3, fixed FPC plates and tool.
As shown in figure 4, in the present embodiment, the upper padding plate 43 has a positioning hole 5, and plate face has an aperture 2.0mm, pitch-row according to
The hole of 5mm multiple, conveniently take FPC plates.
In the present embodiment, middle backing plate 42 is jacked up, takes off FPC plates by plank that the step 6 presses by lift cylinder 2
From PIN nails 3.
Preferred embodiment of the invention described in detail above.It should be appreciated that one of ordinary skill in the art without
Creative work can is needed to make many modifications and variations according to the design of the present invention.Therefore, all technologies in the art
Personnel are available by logical analysis, reasoning, or a limited experiment on the basis of existing technology under this invention's idea
Technical scheme, all should be in the protection domain being defined in the patent claims.
Claims (6)
1. a kind of soft board cover layer applying method, it is characterised in that comprise the following steps：
Step 1. gets out a false sticker, and following table can heat and temperature controllable on false sticker；
Step 2. makes tool with epoxy resin board, carries out the hole that aperture is 2.0mm by pitch-row 5mm multiple on tool；
Also pitch-row 5mm multiple, aperture 2.0mm hole are carried out on step 3.FPC plates；
With tool hole to good, the PIN for beating 2.0mm is followed closely step 4.FPC plates；
Step 5. nails on the borehole jack of 2.0mm on cover layer in PIN；
Step 6. starts machine pressing 5-10S, treats that machine deck is upspring automatically, FPC plates are taken out；
Step 7. repetitive operation, continuous production.
A kind of 2. soft board cover layer applying method as claimed in claim 1, it is characterised in that：The epoxy resin of the step 2
Plate includes lower bolster, middle backing plate, upper padding plate.
A kind of 3. soft board cover layer applying method as claimed in claim 2, it is characterised in that：The lower bolster matches board platform
Face, it is drilled with positioning hole.
A kind of 4. soft board cover layer applying method as claimed in claim 2, it is characterised in that：The middle backing plate has positioning hole,
Plate face has aperture 2.0mm, and pitch-row, for playing PIN nails, fixes FPC plates and tool according to the hole of 5mm multiple.
A kind of 5. soft board cover layer applying method as claimed in claim 2, it is characterised in that：The upper padding plate has positioning hole,
And plate face has aperture 2.0mm, pitch-row conveniently takes FPC plates according to the hole of 5mm multiple.
A kind of 6. soft board cover layer applying method as claimed in claim 1, it is characterised in that：The plank that the step 6 presses,
Middle backing plate is jacked up by lift cylinder, FPC plates is departed from PIN nails.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711034366.0A CN107835580A (en) | 2017-10-30 | 2017-10-30 | A kind of soft board cover layer applying method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711034366.0A CN107835580A (en) | 2017-10-30 | 2017-10-30 | A kind of soft board cover layer applying method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107835580A true CN107835580A (en) | 2018-03-23 |
Family
ID=61651001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711034366.0A Pending CN107835580A (en) | 2017-10-30 | 2017-10-30 | A kind of soft board cover layer applying method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107835580A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105282978A (en) * | 2015-10-20 | 2016-01-27 | 深圳市景旺电子股份有限公司 | Method for increasing lamination frequency of cover film |
| CN205040101U (en) * | 2015-09-30 | 2016-02-17 | 景旺电子科技(龙川)有限公司 | Cover membrane cover laminating device |
| CN205124133U (en) * | 2015-10-20 | 2016-03-30 | 深圳市景旺电子股份有限公司 | Cover tool of membrane laminating |
| CN106535486A (en) * | 2017-01-05 | 2017-03-22 | 景旺电子科技(龙川)有限公司 | Mounting method for electromagnetic film sleeve pin jig |
| CN106793512A (en) * | 2016-12-23 | 2017-05-31 | 东莞康源电子有限公司 | The quick laminating apparatus of flex plate cover layer |
-
2017
- 2017-10-30 CN CN201711034366.0A patent/CN107835580A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205040101U (en) * | 2015-09-30 | 2016-02-17 | 景旺电子科技(龙川)有限公司 | Cover membrane cover laminating device |
| CN105282978A (en) * | 2015-10-20 | 2016-01-27 | 深圳市景旺电子股份有限公司 | Method for increasing lamination frequency of cover film |
| CN205124133U (en) * | 2015-10-20 | 2016-03-30 | 深圳市景旺电子股份有限公司 | Cover tool of membrane laminating |
| CN106793512A (en) * | 2016-12-23 | 2017-05-31 | 东莞康源电子有限公司 | The quick laminating apparatus of flex plate cover layer |
| CN106535486A (en) * | 2017-01-05 | 2017-03-22 | 景旺电子科技(龙川)有限公司 | Mounting method for electromagnetic film sleeve pin jig |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180323 |