CN203435243U - Uncapping tool and uncapping structure for multi-layer circuit board stepped grooves - Google Patents
Uncapping tool and uncapping structure for multi-layer circuit board stepped grooves Download PDFInfo
- Publication number
- CN203435243U CN203435243U CN201320414298.1U CN201320414298U CN203435243U CN 203435243 U CN203435243 U CN 203435243U CN 201320414298 U CN201320414298 U CN 201320414298U CN 203435243 U CN203435243 U CN 203435243U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- uncapping
- multilayer circuit
- step trough
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
The utility model discloses an uncapping tool and uncapping structure for multi-layer circuit board stepped grooves. The uncapping structure for multi-layer circuit board stepped grooves comprises a multi-layer circuit board and the uncapping tool for multi-layer circuit board stepped grooves. The multi-layer circuit board has a first surface and a second surface, the first surface is provided with a plurality of stepped groove uncapping zones, and the second surface is provided with uncapping holes in one-to-one correspondence with the stepped groove uncapping zones. The uncapping tool for multi-layer circuit board stepped grooves comprises a substrate and a plurality of PIN nails, the substrate is provided with a plurality of nail holes in one-to-one correspondence with the uncapping holes, one ends of the PIN nails are embedded in the nail holes, and the other ends of the PIN nails abut in the uncapping holes. The uncapping tool and uncapping structure for multi-layer circuit board stepped grooves disclosed by the utility model is high in efficiency.
Description
Technical field
The utility model relates to process for manufacturing circuit board, particularly relates to a kind of jig for opening cover and cover-opening structure thereof of multilayer circuit board step trough.
Background technology
In the manufacturing process of multilayer circuit board step trough, uncapping is a requisite technique.Traditional process using manual opening cover of uncapping, is mainly first with blade, at the edge of step trough, to lever up a little angle, then takes advantage of a situation whole cover lifting.Significantly, adopt this kind of method, can only go singly to carry out while uncapping, efficiency is very low, and the point of a knife of blade is easy to hurt step trough interior zone, is not suitable for a large amount of production operations.
Utility model content
For solving the problems of the technologies described above, the utility model provides jig for opening cover and the cover-opening structure thereof of the more much higher layer circuit board step trough of a kind of efficiency.
A jig for opening cover for multilayer circuit board step trough, comprises a substrate and a plurality of PIN nail, a plurality of and described multilayer circuit board step trough is set on described substrate and follows closely one to one hole, and described PIN nail one end is embedded in described nail hole.
As the improvement of the jig for opening cover of above-mentioned multilayer circuit board step trough, described substrate is the bakelite plate that size is consistent with described multilayer circuit board.
A cover-opening structure for multilayer circuit board step trough, comprises the jig for opening cover of multilayer circuit board and multilayer circuit board step trough; Described multilayer circuit board comprises first surface and second surface, and described first surface is provided with a plurality of step troughs region of uncapping, and described second surface arranges a plurality of and described step trough hole of uncapping one to one, region of uncapping; The jig for opening cover of described multilayer circuit board step trough comprises a substrate and a plurality of PIN nail, on described substrate, arrange a plurality of with described in the hole of uncapping follow closely one to one hole, described PIN nail one end is embedded in described nail hole, in the hole of uncapping described in the described PIN nail other end withstands on.
As the improvement of the cover-opening structure of above-mentioned multilayer circuit board step trough, described substrate is the bakelite plate that size is consistent with described multilayer circuit board.
As the improvement of the cover-opening structure of above-mentioned multilayer circuit board step trough, described in the hole of uncapping be mechanical blind hole.
As the improvement of the cover-opening structure of above-mentioned multilayer circuit board step trough, described in uncap the degree of depth in hole and with it the uncap degree of depth sum of the step trough that forms after uncapping in region of corresponding described step trough equal the thickness of described multilayer circuit board.
As the improvement of the cover-opening structure of above-mentioned multilayer circuit board step trough, described in the uncap diameter in hole be greater than the diameter of described PIN nail.
As the improvement of the cover-opening structure of above-mentioned multilayer circuit board step trough, the degree of depth in the hole of uncapping described in the length of described PIN nail is greater than.
The beneficial effects of the utility model are: jig for opening cover and the cover-opening structure thereof of the multilayer circuit board step trough that the utility model provides, by designing the hole of uncapping on face corresponding to the region of uncapping at step trough, a plurality of PIN nails are embedded in to the jig for opening cover that forms multilayer circuit board step trough on substrate together simultaneously, the PIN that described multilayer circuit board is enclosed within to the jig for opening cover of described multilayer circuit board step trough by the described hole of uncapping nails on, further exert pressure downwards and reach a plurality of step troughs object that region uncaps simultaneously of uncapping, thereby greatly improve the efficiency of uncapping of circuit board step trough.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, below the accompanying drawing of required use during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also according to these accompanying drawings, obtain other accompanying drawing, wherein:
Fig. 1 is the cutaway view of the jig for opening cover of embodiment mono-multilayer circuit board step trough.
Fig. 2 is the cutaway view of the cover-opening structure of embodiment bis-multilayer circuit board step troughs.
Fig. 3 is the partial sectional view of the cover-opening structure of embodiment bis-multilayer circuit board step troughs.
Embodiment
Below the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only a part of embodiment of the present utility model, rather than whole embodiment.Embodiment based in the utility model, those of ordinary skills are not making all other embodiment that obtain under creative work prerequisite, all belong to the scope of the utility model protection.
Embodiment mono-: the present embodiment discloses a kind of jig for opening cover of multilayer circuit board step trough, refers to Fig. 1, and Fig. 1 is the cutaway view of the jig for opening cover of embodiment mono-multilayer circuit board step trough.
The jig for opening cover 11 of described multilayer circuit board step trough comprises a substrate 111 and a plurality of PIN nail 112, a plurality of and described multilayer circuit board step trough is set on described substrate 111 and follows closely one to one hole (in figure not label), described PIN follows closely 112 one end and is embedded in described nail hole (in figure not label).In the present embodiment, described substrate 111 is the bakelite plate that size is consistent with described multilayer circuit board.
Embodiment bis-: the present embodiment discloses a kind of cover-opening structure of multilayer circuit board step trough, refer to Fig. 2, Fig. 2 is the cutaway view of the cover-opening structure of embodiment bis-multilayer circuit board step troughs, and Fig. 3 is the partial sectional view of the cover-opening structure of embodiment bis-multilayer circuit board step troughs.
The cover-opening structure 100 of described multilayer circuit board step trough comprises the jig for opening cover 11 of multilayer circuit board 12 and multilayer circuit board step trough; Described multilayer circuit board 12 comprises first surface 121 and second surface 122, and described first surface 121 is provided with a plurality of step troughs region 1211 of uncapping, and described second surface 122 arranges a plurality of and described step trough hole 1221 of uncapping one to one, region 1211 of uncapping; The jig for opening cover 11 of described multilayer circuit board step trough comprises a substrate 111 and a plurality of PIN nail 112, on described substrate 111, arrange a plurality of with described in the hole 1221 of uncapping follow closely one to one hole (in figure not label), described PIN follows closely 112 one end and is embedded in described nail hole (in figure not label), and described PIN follows closely 112 other ends and uncaps described in withstanding in hole 1221.
Described multilayer circuit board 12 forms by the following method.First in the process of described multilayer circuit board 12 pressings, between layer to be uncapped and wiring board, be placed with the corrosion resistant PI film of high temperature high voltage resistant, be the thick line part that the step trough shown in Fig. 2 is uncapped under region 1211, doing is like this in order to prevent combination between lid to be backed down (in figure not label) and wiring board.Next is on the first surface 121 of described multilayer circuit board 12, to process a plurality of step troughs region 1211 of uncapping, make described step trough uncap between the edge part in region 1211 and described multilayer circuit board 12 in separable state, so only need uncap to process and just can be formed directly in step trough the described step trough region 1211 of uncapping.The last a plurality of and described step trough hole 1221 of uncapping one to one, region of uncapping of producing on the second surface 122 of described multilayer circuit board 12, making is uncapped before hole 1221, should first choose the position of hole 1221 perforates of uncapping, first this position should be corresponding one by one with the described step trough region 1211 of uncapping, secondly this position should be positioned at spacious district, there is no circuit, the region of Pad etc.Choose behind the position of perforate, just the making in hole 1221 can start to uncap, the described hole 1221 of uncapping can adopt the mode of depthkeeping boring or punching to make, the described hole 1221 of uncapping is for mechanical blind hole, described in uncap the degree of depth in hole 1221 and with it the uncap degree of depth sum of the step trough that forms after uncapping in region 1211 of corresponding step trough equal the thickness of described multilayer circuit board 12.The diameter in the described hole 1221 of uncapping should be greater than the diameter of described PIN nail 112, in the present embodiment, described in uncap the diameter in hole 1221 than the large 0.5mm of diameter of described PIN nail 112.
In addition, the length of described PIN nail 112 degree of depth in hole 1221 of uncapping described in should being greater than.While uncapping, only need exert pressure downwards to the described multilayer circuit board 12 in the cover-opening structure 100 of described multilayer circuit board step trough, just can the uncap lid in region 1211 of described step trough be ejected simultaneously by described PIN nail 112, reach a plurality of described step troughs object that region 1211 uncaps simultaneously of uncapping, thereby greatly improve the efficiency of uncapping of circuit board step trough.In the present embodiment, described substrate 111 is also the bakelite plate that size is consistent with described multilayer circuit board.
Jig for opening cover and the cover-opening structure thereof of the multilayer circuit board step trough that the utility model provides, on face by region 1211 correspondences of uncapping at step trough, design the hole 1221 of uncapping, a plurality of PIN nails 112 are embedded in to the jig for opening cover 11 that forms multilayer circuit board step trough on substrate 111 together simultaneously, the PIN that by the described hole 1221 of uncapping, described multilayer circuit board 12 is enclosed within to the jig for opening cover 11 of described multilayer circuit board step trough follows closely on 112, further exert pressure downwards and reach a plurality of step troughs object that region 1211 uncaps simultaneously of uncapping, thereby greatly improve the efficiency of uncapping of circuit board step trough.
The foregoing is only embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model description to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (8)
1. a jig for opening cover for multilayer circuit board step trough, is characterized in that, comprises a substrate and a plurality of PIN nail, a plurality of and described multilayer circuit board step trough is set on described substrate and follows closely one to one hole, and described PIN nail one end is embedded in described nail hole.
2. the jig for opening cover of multilayer circuit board step trough as claimed in claim 1, is characterized in that, described substrate is the bakelite plate that size is consistent with described multilayer circuit board.
3. a cover-opening structure for multilayer circuit board step trough, is characterized in that, comprises the jig for opening cover of multilayer circuit board and multilayer circuit board step trough; Described multilayer circuit board comprises first surface and second surface, and described first surface is provided with a plurality of step troughs region of uncapping, and described second surface arranges a plurality of and described step trough hole of uncapping one to one, region of uncapping; The jig for opening cover of described multilayer circuit board step trough comprises a substrate and a plurality of PIN nail, on described substrate, arrange a plurality of with described in the hole of uncapping follow closely one to one hole, described PIN nail one end is embedded in described nail hole, in the hole of uncapping described in the described PIN nail other end withstands on.
4. the cover-opening structure of multilayer circuit board step trough as claimed in claim 3, is characterized in that, described substrate is the bakelite plate that size is consistent with described multilayer circuit board.
5. the cover-opening structure of multilayer circuit board step trough as claimed in claim 3, is characterized in that, described in the hole of uncapping be mechanical blind hole.
6. the cover-opening structure of multilayer circuit board step trough as claimed in claim 3, is characterized in that, described in uncap the degree of depth in hole and with it the uncap degree of depth sum of the step trough that forms after uncapping in region of corresponding described step trough equal the thickness of described multilayer circuit board.
7. the cover-opening structure of multilayer circuit board step trough as claimed in claim 3, is characterized in that, described in the uncap diameter in hole be greater than the diameter of described PIN nail.
8. the cover-opening structure of multilayer circuit board step trough as claimed in claim 3, is characterized in that, the degree of depth in the hole of uncapping described in the length of described PIN nail is greater than.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320414298.1U CN203435243U (en) | 2013-07-11 | 2013-07-11 | Uncapping tool and uncapping structure for multi-layer circuit board stepped grooves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320414298.1U CN203435243U (en) | 2013-07-11 | 2013-07-11 | Uncapping tool and uncapping structure for multi-layer circuit board stepped grooves |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203435243U true CN203435243U (en) | 2014-02-12 |
Family
ID=50064252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320414298.1U Expired - Lifetime CN203435243U (en) | 2013-07-11 | 2013-07-11 | Uncapping tool and uncapping structure for multi-layer circuit board stepped grooves |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203435243U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111083882A (en) * | 2018-10-22 | 2020-04-28 | 台湾爱司帝科技股份有限公司 | Partial hardboard removal apparatus, systems and methods |
| CN115209631A (en) * | 2022-08-11 | 2022-10-18 | 高德(江苏)电子科技股份有限公司 | Process for uncovering rigid-flex board by using jig |
-
2013
- 2013-07-11 CN CN201320414298.1U patent/CN203435243U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111083882A (en) * | 2018-10-22 | 2020-04-28 | 台湾爱司帝科技股份有限公司 | Partial hardboard removal apparatus, systems and methods |
| CN115209631A (en) * | 2022-08-11 | 2022-10-18 | 高德(江苏)电子科技股份有限公司 | Process for uncovering rigid-flex board by using jig |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204640358U (en) | Heavy-gauge sheeting perforating device | |
| CN203435243U (en) | Uncapping tool and uncapping structure for multi-layer circuit board stepped grooves | |
| CN106304694A (en) | Rigid-flexible circuit board and preparation method thereof | |
| CN101932198A (en) | Manufacturing method for transplanting printed circuit board and structure thereof | |
| CN203936428U (en) | A kind of chip removal type drill point structure | |
| CN103402333A (en) | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof | |
| CN109548292A (en) | The high multi-layer PCB drilling production technology of overlength size | |
| CN202190454U (en) | Interconnected conducting and heat-conducting structure of double-sided circuit board | |
| CN203983707U (en) | The direct insertion power shell assembling of cavity mould | |
| CN107484340A (en) | A kind of anti-flash pcb board and processing method | |
| CN205742838U (en) | A kind of decoration ceramic tile and special making mould thereof | |
| CN102699601B (en) | Multi-tube-core assembly self-alignment die for diodes and using method for multi-tube-core assembly self-alignment die | |
| CN206272963U (en) | A kind of electronic product pcb board production environmental protection backing plate | |
| CN203044705U (en) | Combination-type punch of numerical control punch press die | |
| CN204148606U (en) | single-edge spiral milling cutter | |
| CN202591681U (en) | Template for drilling surface of lead board | |
| CN203887363U (en) | Welding positioning fixture for straight-inserting LED of display screen module | |
| CN206215817U (en) | Control the instrument of capillary truncation height | |
| CN204546320U (en) | A kind of oilstone manufactures particular manufacturing craft | |
| CN201830554U (en) | Printed circuit board (PCB) transplanting structure | |
| CN203901417U (en) | Solar back film cutting device | |
| CN202963561U (en) | Electric drill with scale | |
| CN204476969U (en) | A kind of hot melt adhesive combination smelting tool | |
| CN202155579U (en) | Combination drill integrating functions of drilling and flash removing | |
| CN203784694U (en) | LED (light-emitting diode) module and luminaire |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140212 |
|
| CX01 | Expiry of patent term |