CN107831169A - A kind of design method of the semiconductor packages defect detecting system based on machine vision - Google Patents
A kind of design method of the semiconductor packages defect detecting system based on machine vision Download PDFInfo
- Publication number
- CN107831169A CN107831169A CN201711016622.3A CN201711016622A CN107831169A CN 107831169 A CN107831169 A CN 107831169A CN 201711016622 A CN201711016622 A CN 201711016622A CN 107831169 A CN107831169 A CN 107831169A
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- China
- Prior art keywords
- semiconductor packages
- machine vision
- defect detecting
- design method
- system based
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/8411—Application to online plant, process monitoring
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- Engineering & Computer Science (AREA)
- Immunology (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Image Processing (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention discloses a kind of design method of the semiconductor packages defect detecting system based on machine vision, belong to semiconductor packages detection field.The semiconductor packages defect detecting system based on machine vision being specifically related to, including industrial camera, light source, sensor, image pick-up card, control system, visual processes software, transmission system, calibrating working platform, warning system.The present invention has the advantages of detection in real time, gathers image clearly, and edge feature is obvious, control section dynamically can be fed back to the real-time monitoring of error, and by the error monitored, timely these errors are eliminated, system also can carry out precise positioning to semiconductor, and speed is fast, stability is high.
Description
Technical field
The invention belongs to semiconductor packages detection field, and in particular to a kind of semiconductor packages defect based on machine vision
The design method of detecting system.
Background technology
Semiconductor packages, which refers to scale off wafer, to be installed on lead frame, and bare chip is connected with wire or salient point
With the circuit on lead frame pin or on pedestal, the plastics or the process of ceramic package then to be insulated in crystal grain outer packing.With
The rapid development of microelectronic industry, electronic product is sent out towards the direction that volume is smaller, quality is lighter, price is less expensive all the time
Exhibition, therefore the packing forms of semiconductor also constantly improve.
Semiconductor packages is a complicated process, and error caused by each procedure all can produce shadow to next process
Ring, and error caused by per procedure is random again, and these errors can not be eliminated by traditional control platform motion.
The content of the invention
The invention aims to solve the shortcomings of the prior art, there is provided a kind of semiconductor based on machine vision
The design method of defect detecting system is encapsulated, the present invention has the advantages of detection in real time to semiconductor packages, gathers image clearly,
Edge feature is obvious, dynamically can feed back to control section to the real-time monitoring of error, and by the error monitored, timely right
These errors are eliminated, and system also can carry out precise positioning to semiconductor, and speed is fast, stability is high.
To achieve the above object, the design of the semiconductor packages defect detecting system proposed by the present invention based on machine vision
The technical scheme of method is as follows：
A kind of design method of the semiconductor packages defect detecting system based on machine vision, industrial camera, light source, sensing
Device, image pick-up card, control system, visual processes software, transmission system, calibrating working platform, warning system.
Further, in order to preferably realize the present invention, the industrial camera selects CCD camera, precision 0.02mm/
pixel。
Further, in order to preferably realize the present invention, the light source is annular LED light source, uniform illumination.
Further, in order to preferably realize the present invention, the control system includes computer, control card, I/O equipment.
Further, in order to preferably realize the present invention, the visual processes choice of software HALCON image processing softwares.
Further, in order to preferably realize the present invention, the transmission system includes servomotor, driving card.
Further, in order to preferably realize the present invention, the calibrating working platform is XY platforms, the long side of platform and short
Side respectively sets an aid mark point.
The present invention compared with prior art, has the following advantages and advantages：
The present invention provides a kind of design method of the semiconductor packages defect detecting system based on machine vision, has real-time
The advantages of detection, image clearly is gathered, edge feature is obvious, can be dynamically to the real-time monitoring of error, and the mistake that will be monitored
Difference feeds back to control section, and timely these errors are eliminated, and system also can carry out precise positioning, speed to semiconductor
It hurry up, stability height.
Embodiment
The invention will be further described in conjunction with the embodiments, it should which explanation, the description below is merely to explain this hair
It is bright, its content is not defined.
A kind of design method of the semiconductor packages defect detecting system based on machine vision, industrial camera, light source, sensing
Device, image pick-up card, control system, visual processes software, transmission system, calibrating working platform, warning system.
Further, in order to preferably realize the present invention, the industrial camera selects CCD camera, precision 0.02mm/
pixel。
Further, in order to preferably realize the present invention, the light source is annular LED light source, uniform illumination.
Further, in order to preferably realize the present invention, the control system includes computer, control card, I/O equipment.
Further, in order to preferably realize the present invention, the visual processes choice of software HALCON image processing softwares.
Further, in order to preferably realize the present invention, the transmission system includes servomotor, driving card.
Further, in order to preferably realize the present invention, the calibrating working platform is XY platforms, the long side of platform and short
Side respectively sets an aid mark point.
Its course of work is：When the semiconductor of encapsulation is transmitted to industrial camera by transmission system, CCD carries out image and adopted
Collection, image to visual processes software, and is carried out image procossing by image pick-up card, by image recognition, by judging semiconductor
The offset distance of one aid mark point is respectively set with the long side and short side of platform, position correction, control are carried out to encapsulation semiconductor
System processed control servomotor carries out deviation compensation, servomotor and then controls calibrating working platform to be encapsulated into row X to semiconductor
The direction adjustment of axle, Y-axis, reaches precise positioning, the image of collection is pre-processed, and match pair with system template image
Than solving the physical location of semiconductor solder joint, the defects of judging semiconductor packages, reaching the effect of detection.
The above embodiment of the present invention is only intended to clearly illustrate example of the present invention, and is not to the present invention
Embodiment restriction.For those of ordinary skill in the field, can also make on the basis of the above description
Other various forms of changes, there is no necessity and possibility to exhaust all the enbodiments.
Claims (7)
1. a kind of design method of the semiconductor packages defect detecting system based on machine vision, including industrial camera, light source, biography
Sensor, image pick-up card, control system, visual processes software, transmission system, calibrating working platform, warning system.
2. a kind of design method of semiconductor packages defect detecting system based on machine vision according to claim 1,
It is characterized in that：The industrial camera selects CCD camera, precision 0.02mm/pixel.
3. a kind of design method of semiconductor packages defect detecting system based on machine vision according to claim 1,
It is characterized in that：The light source is annular LED light source.
4. a kind of design method of semiconductor packages defect detecting system based on machine vision according to claim 1,
It is characterized in that：The control system includes computer, control card, I/O equipment.
5. a kind of design method of semiconductor packages defect detecting system based on machine vision according to claim 1,
It is characterized in that：The visual processes choice of software HALCON image processing softwares.
6. a kind of design method of semiconductor packages defect detecting system based on machine vision according to claim 1,
It is characterized in that：The transmission system includes servomotor, driving card.
7. a kind of design method of semiconductor packages defect detecting system based on machine vision according to claim 1,
It is characterized in that：The calibrating working platform is XY platforms, and the long side and short side of platform respectively set an aid mark point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711016622.3A CN107831169A (en) | 2017-10-26 | 2017-10-26 | A kind of design method of the semiconductor packages defect detecting system based on machine vision |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711016622.3A CN107831169A (en) | 2017-10-26 | 2017-10-26 | A kind of design method of the semiconductor packages defect detecting system based on machine vision |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107831169A true CN107831169A (en) | 2018-03-23 |
Family
ID=61649726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711016622.3A Pending CN107831169A (en) | 2017-10-26 | 2017-10-26 | A kind of design method of the semiconductor packages defect detecting system based on machine vision |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107831169A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112735969A (en) * | 2021-04-02 | 2021-04-30 | 惠州高视科技有限公司 | LED semiconductor packaging glue dispensing defect detection method, electronic equipment and storage medium |
| CN113834825A (en) * | 2021-11-29 | 2021-12-24 | 新恒汇电子股份有限公司 | High-precision UV curing adhesive packaging quality automatic detection equipment and method |
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| CN202649127U (en) * | 2012-06-12 | 2013-01-02 | 深圳市强华科技发展有限公司 | Automatic optical detection system |
| CN103197599A (en) * | 2013-03-25 | 2013-07-10 | 东华大学 | System and method for numerical control (NC) workbench error self correction based on machine vision |
| CN203225236U (en) * | 2012-12-21 | 2013-10-02 | 日月光半导体（昆山）有限公司 | Semiconductor product detection device |
| CN104280406A (en) * | 2014-09-16 | 2015-01-14 | 中国科学院广州能源研究所 | Machine vision system for detecting surface defects of copper part |
| CN105588841A (en) * | 2016-01-28 | 2016-05-18 | 浙江工业大学 | Stitch inclination defect detection device based on machine vision |
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2017
- 2017-10-26 CN CN201711016622.3A patent/CN107831169A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202649127U (en) * | 2012-06-12 | 2013-01-02 | 深圳市强华科技发展有限公司 | Automatic optical detection system |
| CN203225236U (en) * | 2012-12-21 | 2013-10-02 | 日月光半导体（昆山）有限公司 | Semiconductor product detection device |
| CN103197599A (en) * | 2013-03-25 | 2013-07-10 | 东华大学 | System and method for numerical control (NC) workbench error self correction based on machine vision |
| CN104280406A (en) * | 2014-09-16 | 2015-01-14 | 中国科学院广州能源研究所 | Machine vision system for detecting surface defects of copper part |
| CN105588841A (en) * | 2016-01-28 | 2016-05-18 | 浙江工业大学 | Stitch inclination defect detection device based on machine vision |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112735969A (en) * | 2021-04-02 | 2021-04-30 | 惠州高视科技有限公司 | LED semiconductor packaging glue dispensing defect detection method, electronic equipment and storage medium |
| CN112735969B (en) * | 2021-04-02 | 2021-08-06 | 高视科技(苏州)有限公司 | LED semiconductor packaging glue dispensing defect detection method, electronic equipment and storage medium |
| CN113834825A (en) * | 2021-11-29 | 2021-12-24 | 新恒汇电子股份有限公司 | High-precision UV curing adhesive packaging quality automatic detection equipment and method |
| CN113834825B (en) * | 2021-11-29 | 2022-03-01 | 新恒汇电子股份有限公司 | High-precision UV curing adhesive packaging quality automatic detection equipment and method |
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Application publication date: 20180323 |