CN107819177A - Flexible the high frequency flat wire and its device of multilayer co-planar waveguide thin type structure - Google Patents
Flexible the high frequency flat wire and its device of multilayer co-planar waveguide thin type structure Download PDFInfo
- Publication number
- CN107819177A CN107819177A CN201610819390.4A CN201610819390A CN107819177A CN 107819177 A CN107819177 A CN 107819177A CN 201610819390 A CN201610819390 A CN 201610819390A CN 107819177 A CN107819177 A CN 107819177A
- Authority
- CN
- China
- Prior art keywords
- ground connection
- pattern
- signal
- flat wire
- grounding pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/003—Coplanar lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/18—Waveguides; Transmission lines of the waveguide type built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers
Landscapes
- Waveguides (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention provides flexible the high frequency flat wire and its device of multilayer co-planar waveguide thin type structure for being readily able to bend and providing larger impedance adjustable range and being easy to impedance control, and the flexible high frequency flat wire of the multilayer co-planar waveguide thin type structure possesses signal routing pattern, the first grounding pattern arranged with the signal routing pattern with layer and across dielectric layer and at least one layer second grounding pattern opposite with the signal routing pattern or the first grounding pattern；Second grounding pattern is made up of the one group of ground connection segmentation for arranging and intersecting with the signal routing pattern at a predetermined interval, and each ground connection segmentation mutually disconnects and is connected respectively by via with first grounding pattern.The present invention both ensure that impedance control is horizontal and is easy to bending to possess higher service life by distributing rationally for the second ground connection segmentation.
Description
Technical field
The present invention relates to flexible the high frequency flat wire and its device using multilayer coplanar waveguide structure, and more specifically relate to
And a kind of flexible the high frequency flat wire and its device of the co-planar waveguide thin type structure of control impedance matching, it can apply to various micro-
In signal interconnection in ripple, radio frequency, millimetre-wave circuit and device.
Background technology
In recent years, increasing wireless terminal device is designed using shortization, to allow the thickness of terminal more next
More lightening, still, the coaxial transmission linear diameter for being commonly used to connect and transmitting high-frequency signal is smaller, the signal damage of its unit length
Consumption is bigger, and the shortization design of terminal device needs to use diameter coaxial line as small as possible, and this will certainly increase loss of signal,
Therefore, although traditional coaxial transmission line has excellent pliable advantage, in the thin type structure application of shortization requirement
It can be restricted, so, substitute coaxial transmission line to realize that high frequency signal transmission turns into not with flexible PCB (FPC) flat wire
Carry out one of new application trend.
In microwave technology, common transmission line structure is co-planar waveguide (Coplanar waveguide), compared to micro-strip
The other structures such as line, it can effectively realize high characteristic impedance, easily ground connection and relatively low crosstalk, the signal wire S of co-planar waveguide
The same plane of dielectric-slab is in ground plane G, as shown in figure 1, its characteristic impedance is depended between signal wire S and ground plane G
Gap g and signal line width w ratio.In the case where signal line width is certain, by the seam for increasing signal wire and ground plane
Gap g can effectively realize high characteristic impedance, simultaneously because signal wire S and ground plane G is in same plane, without passing through via
(Via) it can be achieved with being grounded, be also readily available relatively low crosstalk, still, it is to be difficult to that co-planar waveguide, which has a notable defect,
Low characteristic impedance, the gap g being primarily due between Low ESR requirement signal wire S and ground plane G is narrow, and width is less than 100um
Gap g be difficult to be realized with traditional PCB technology.Therefore, it is impossible to flexible high frequency is realized using traditional coplanar waveguide structure
The relatively Low ESR (50 ohm) of flat wire requirement.
On the other hand, it is contemplated that bending operation can be often carried out during use, it is necessary to (provided low ensureing that signal wire is sufficiently wide
Loss) on the premise of, make flexible high frequency flat wire that there is the easy bending feature equal with coaxial transmission line, traditional co-planar waveguide
Whole ground level paving copper structure can not also meet bending needs, particularly sandwich construction such case is more difficult to bending.
The content of the invention
Based on the above situation, the present invention for traditional coplanar waveguide structure be applied to low profile flexible flat wire it is a variety of not
Foot carries out innovation transformation, it is proposed that a kind of new co-planar waveguide thin type structure meets this demand, can regard tradition as altogether
A kind of extension of face waveguiding structure.
It is an object of the present invention to can be realized compared with low-resistance using new co-planar waveguide thin type structure to provide one kind
Anti- scope and flexible the high frequency flat wire and its device that impedance matching regulation can be carried out with 50 ohm of communication systems.
It is another object of the present invention to a kind of easily bending and damage are provided using new co-planar waveguide thin type structure
Consume relatively low flexible high frequency flat wire and its device.
A further object of the present invention is to increase signal as much as possible on the basis of impedance matching is controlled as much as possible to walk
The width of line, increase the intensity of signal lead, prevent that signal lead is broken when bending flexible high frequency flat wire.
In order to realize above-mentioned target, according to an aspect of the invention, there is provided a kind of multilayer co-planar waveguide thin type structure
Flexible high frequency flat wire, it possess along a direction extension signal routing pattern, with the signal routing pattern with layer arrangement and
Along the first grounding pattern of equidirectional extension and relative with the signal routing pattern or the first grounding pattern across dielectric layer
The grounding pattern of at least one layer second put, second grounding pattern possess arranged at a predetermined interval along the bearing of trend and with institute
State the intersecting multiple ground connection segmentation of signal routing pattern, the ground connection segmentation mutually disconnects and respectively by via and described the
One grounding pattern is connected.
According to another aspect of the present invention, there is provided a kind of flexible high frequency of multilayer co-planar waveguide thin type structure is flat
Line, it possesses the signal routing pattern along direction extension, arranged with the signal routing pattern with layer and along equidirectional extension
First grounding pattern, across top dielectric layer it is opposite with the signal routing pattern or the first grounding pattern upper strata ground connection
Pattern and across underlying dielectric layers and the lower floor grounding pattern opposite with the signal routing pattern or the first grounding pattern,
Layer and lower floor's grounding pattern where layer where the signal routing pattern and the first grounding pattern is located at the upper strata grounding pattern
Institute between layers, the upper strata grounding pattern and lower floor's grounding pattern possess respectively it is multiple mutually disconnect upper stratas ground connection segmentation and
Respective predetermined space is pressed in multiple lower floor's ground connection segmentations mutually disconnected, the upper strata ground connection segmentation and lower floor's ground connection segmentation respectively
Along the bearing of trend arranged, the upper strata ground connection segmentation is grounded at least one and institute being segmented with the lower floor
Signal routing pattern is stated to intersect and by via with first grounding pattern be connected.
In one of the embodiments, each upper strata ground connection segmentation is grounded segmentation along bearing of trend two with each lower floor
Two are adjacent to and are staggered.
In one of the embodiments, the 3rd ground plane, the 3rd ground plane and the signal routing are at least also included
Pattern and the first grounding pattern configure the electrical characteristic for primarily forming whole circuit together, and the length of described ground connection segmentation does not surpass
Cross a quarter of wavelength corresponding to highest frequency signal and the electrical characteristic for finely tuning whole circuit.
In one of the embodiments, described ground connection segmentation comprises at least connects along the longer length of the bearing of trend length
Ground is segmented and is segmented along the shorter short circuit of the bearing of trend length, and described long ground connection segmentation is used for the inductance for adjusting circuit
Characteristic, described short ground connection segmentation are used for the capacitance characteristic for adjusting circuit.
In one of the embodiments, the upper strata ground connection segmentation (or lower floor's ground connection segmentation) is for adjusting inductance characteristic
The long ground connection segmentation longer along the bearing of trend length, lower floor's ground connection segmentation (or upper strata ground connection segmentation) is for adjusting
It is segmented with saving the short circuit shorter along the bearing of trend length of capacitance characteristic.
In one of the embodiments, described ground connection sectional vertical in signal arrangement line pattern bearing of trend and
The spacing distance for being arranged in parallel ground connection segmentation arrangement in alignment, described corresponds to ripple for its highest frequency signal passed through
Long 1/10th.
In one of the embodiments, the signal routing pattern passes for the single-ended transmission line with preset width or difference
Defeated line, first grounding pattern are that the ground connection that the single-ended transmission line or difference transmission lines both sides are arranged in same intervals is led
Electric paper tinsel.
In one of the embodiments, described ground connection is segmented into the strip conductive foil extended along its length.
In one of the embodiments, described ground connection is segmented into dumb-bell shape conductive foil, the both ends of the dumb-bell shape conductive foil
The width at place is equal to twice of middle width.
In one of the embodiments, at least one of described ground connection segmentation is provided with opening, and the opening is used
To ensure that capacitance characteristic of the flexible high frequency flat wire along the bearing of trend totally keeps constant.
In one of the embodiments, described ground connection segmentation (can be the second grounding pattern ground connection segmentation or
Upper strata ground connection segmentation or lower floor's ground connection segmentation) at least one be network structure.
According to another aspect of the present invention, there is provided a kind of flexible high frequency based on above multilayer co-planar waveguide thin type structure
The device of flat wire, is comprised at least：The flexible high frequency flat wire of multilayer co-planar waveguide thin type structure,
And it is electrically connected to the connector at the flexible high frequency flat wire both ends of the multilayer co-planar waveguide thin type structure；Its
In, the flexible high frequency flat wire of the multilayer co-planar waveguide thin type structure is the strip shape extended along a direction, and it has
It is standby to prolong along the signal routing patterned conductive paper tinsel of direction extension, with the signal routing patterned conductive paper tinsel with layer arrangement and along equidirectional
The first grounding pattern conductive foil for stretching and led across dielectric layer with the signal routing patterned conductive paper tinsel or the first grounding pattern
Opposite at least one layer the second grounding pattern conductive foil of electric paper tinsel, the second grounding pattern conductive foil is by a predetermined interval along described
One group of ground connection segmentation composition that bearing of trend is arranged and intersected with the signal routing patterned conductive paper tinsel, the ground connection segmentation are mutual
Disconnect and be connected respectively by via with the first grounding pattern conductive foil.
In one of the embodiments, the flexible high frequency flat wire of the multilayer co-planar waveguide thin type structure is by multilayer layer
Pressure technique is formed, including at least upper insulating cover, signal transmitting layer, dielectric layer, the second ground plane and lower insulating cover,
Wherein：The signal transmitting layer possesses the signal routing patterned conductive paper tinsel and the first grounding pattern conductive foil, and is located at
The upper surface of the dielectric layer, the signal transmitting layer also include connecting the first map interlinking case conductive foil and by described in from both sides
The ground connection installation portion of signal pattern conductive foil encirclement and the both sides for being connected to the signal routing patterned conductive paper tinsel have width
Wider signal installation portion；
Second ground plane possesses the second grounding pattern conductive foil and its ground connection segmentation, and is located at the dielectric layer
Lower surface, second ground plane also include positioned at the second grounding pattern conductive foil both sides grounding points and by
The grounding points surround and are insulated from the signal connecting element of arrangement；
The two side ends of described upper insulating cover are symmetrically provided with signal opening and ground connection is open；
The signal connecting element of the signal installation portion of the signal transmitting layer and second ground plane passes through the first mistake
Hole is electrically connected, and the signal of the connector connects end and carries out welding company by the signal opening and the signal installation portion
Connect；
The ground connection installation portion of the signal transmitting layer passes through the second mistake with the grounding points of second ground plane
Hole is electrically connected, and the ground connection of the second grounding pattern conductive foil is segmented by symmetrical along the bearing of trend center line
Two ranked third via is electrically connected with first grounding pattern respectively, and the frame ground end of the connector passes through the ground connection
Opening is welded to connect with the ground connection installation portion.
(invention effect)
Flexible the high frequency flat wire and its dress using multilayer co-planar waveguide thin type structure according to the embodiment of the present invention
(hereinafter referred to as flat wire and its device) is put, can not only realize that can to carry out large range of high Low ESR compared with Low ESR big
Minor adjustment matches 50 ohm of communication system impedances, moreover it is possible to caused stress concentration when eliminating bending operation and provide with coaxially passing
The pliable folding endurance that defeated line compares favourably, while ensureing that impedance control possesses good electrical characteristic, under bending repeatedly
It is not easy to that fracture occurs and its impedance can also keeps a constant stationary value, and there is letter according to the embodiment of the present invention
The advantages of single, efficient.
Brief description of the drawings
Fig. 1 is to show traditional coplanar waveguide structure schematic diagram.
Fig. 2 is the typical co-planar waveguide thin type structure schematic diagram for showing the present invention.
Fig. 3 is a kind of figure for the high frequency flat wire for showing first embodiment of the invention.
Fig. 4 is the front view for showing high frequency flat wire shown in Fig. 3.
Fig. 5 is the bottom view for showing high frequency flat wire shown in Fig. 3.
Fig. 6 be show according in Fig. 5 along the cutting of A-A tangent lines and it is positive place after profile.
Fig. 7 is the schematic bottom view for another the high frequency flat wire for showing second embodiment of the invention.
Fig. 8 is the schematic bottom view for another the high frequency flat wire for showing the third embodiment of the present invention.
Fig. 9 is the schematic bottom view for another the high frequency flat wire for showing the fourth embodiment of the present invention.
Figure 10 is the front schematic view for another the high frequency flat wire for showing the fifth embodiment of the present invention.
Figure 11 be show according in Figure 10 along the profile of B-B tangent line cuttings.
Figure 12 is the schematic bottom view for another the high frequency flat wire for showing the sixth embodiment of the present invention.
Figure 13 is that a kind of high frequency flat wire for showing the present invention is applied to the schematic perspective view of the sub-assembly of device.
Figure 14 is the decomposing schematic representation for showing Figure 13.
Figure 15 is the front schematic view for showing the signal graph pattern layer in Figure 14.
Figure 16 is the front schematic view for the second grounding pattern layer for showing Figure 13.
Embodiment
For the target for fully understanding advantages of the present invention and being obtained by embodiments of the present invention, part reality is shown
The structure of example is applied, however, the present invention can be embodied in many different forms, and should not be construed as the implementation herein proposed
The limitation of example.On the contrary, proposing that these embodiments are intended merely to reach abundant and completely separated, and make the technology of the art
Personnel understand the scope of the present invention completely.In these figures, for the sake of clarity, the size and phase in layer and region be may be exaggerated
To size.In addition, length direction referred to herein and bearing of trend are same directions, corresponding to label with the arrow refers to
Dashed region, the preferable implementation content of the present invention is more fully described below with reference to the accompanying drawings.
Such as foregoing teachings, due to traditional coplanar waveguide structure as shown in Figure 1 is attempted for narrow section (slim)
During flat wire, it can not provide with the characteristic impedance in required scope, especially (what such as communication system was conventional is for the impedance of lower value
50 ohm of impedance of system), for example, when the width in the narrow section (slim) of flat wire is below 2mm (value 2mm), media plate thickness
When for 0.05~0.10mm and gap being more than 0.1mm (the smaller gap width less than 0.1mm is difficult to manufacture), by generally soft
Property dielectric-slab PI materials dielectric constant ξ=3.2 calculated, draw characteristic impedance be at least above 90 ohm, in very high
Resistance it is horizontal, it is impossible to 50 ohmages are provided, can not be used.And in the case of sandwich construction configures, due to excessive
It is superimposed with certain thickness copper foil layer so that the hardness of flat wire is larger (although FPC has certain flexibility), can
Bending property is deteriorated.In addition, in order to realize 50 ohm of impedance value in the case of thickness is less, generally have to signal lead
S width is made very small, and this will necessarily be degrading the electrical characteristic of flat wire, causes the increase of insertion loss, while also makes letter
Number cabling S is easily broken off during bending, causes the bad generation of open circuit, therefore, of the invention it is further envisaged that base
In the trace width for how reaching effectively increase signal routing pattern, to reduce the insertion loss of flat wire, control simultaneously
The impedance of flat wire is always consistent, but otherwise can not can not have and coaxial transmission line to sacrifice bending property as cost
Equal bending advantage and replace it.
In consideration of it, referring to Fig. 2, with reference to shown in figure 3, a kind of typical two layers of co-planar waveguide for giving the present invention is slim
Structure, to be in signal lead Sgn applied to narrow section (slim) FPC occasions, co-planar waveguide thin type structure of the invention
The first grounding pattern Gnd of side introducing (such as Fig. 2 is to set the first grounding pattern Gnd in signal lead Sgn both sides), and every
The grounding pattern of dielectric layer and signal lead/first place layer set oppositely possess it is multiple at a predetermined interval along flexible high
The ground connection segmentation Gnd ' of frequency flat wire bearing of trend arrangement the second grounding pattern (as main reference ground), herein, will be grounded
Segmentation Gnd ' is arranged to intersect (in such as Fig. 2, Gnd ' intersects mutual vertically with Sgn) with signal lead Sgn bearing of trend,
And it is grounded segmentation Gnd ' each respectively by via (via) with the first grounding pattern Gnd to be connected so as to form the complete of unification
Whole reference ground.
In order to realize that this structure to reach target, should follow following process.First, determine flat wire has
The slim section physical size of limit, including length and width etc., in a preferred embodiment, total height is no more than 0.3mm, Sgn/
Media plate thickness between Gnd layers and Gnd ' layers are limited within 0.1mm, and the overall width of flat wire is no more than 2.0mm；The
Two, the second grounding pattern is not considered, and preliminary characteristic impedance is calculated with traditional coplanar waveguide structure：It is predetermined possible by previous step
Maximum signal lead Sgn width Ws, the Sgn and the first grounding pattern Gnd between minimum clearance g, predetermined medium
Empirical equations of the plate thickness h by conventional co-planar waveguiding structure according to summaryObtain spy
Levy impedance (or corresponding parameter is inputted by Linecalc instruments and calculated)；3rd, determine that the second ground connection is schemed according to highest frequency
The ground connection section length Lg of case, to suppress unwanted transmission mode：Highest frequency used in flat wire is determined, preferred real
Apply in example, the highest frequency of transmission is 6GHz, and corresponding wavelength is 27.5mm in the transmission for it, in order to suppress unwanted transmission
Pattern, described ground connection section length Lg are at least a quarter of highest frequency corresponding wavelength, the ground connection section length Lg
5mm is preferably set in a preferred embodiment；4th, according to the impedance of obtained coplanar waveguide structure calculated above and ground connection point
Segment length Lg, with 50 ohm of characteristic impedance for design object, confirm that the clearance G g of final described ground connection segmentation is (similarly, small
In highest frequency corresponding wavelength 1/4), and using HFSS Microwave simulations software to structure carry out RF index analog simulation, then
Need to be finely adjusted predetermined media plate thickness h according to simulation result, reach the final target for realizing 50 ohm characteristic impedances.
According to the co-planar waveguide thin type structure of foregoing description, on the one hand, signal lead (can be classified as in signal routing pattern
Single-ended transmission line) electrical characteristic mainly will be influenceed by the first grounding pattern around it and the second grounding pattern, work as letter
When number routing line width degree broadens, the area due to being grounded segmentation itself it is smaller and they between be spaced a distance, thus, letter
Overlapping region area number between cabling and the second map interlinking case will not increase, and the electric capacity of circuit will not be caused to increase, impedance will not
Therefore significant change occurs and keeps preferable impedance matching effect.Meanwhile first grounding pattern not only made by via (via)
Originally the integral ground of ground connection segmentation series connection spaced apart from each other, also the first grounding pattern and signal can be changed according to being actually needed
The distance between wiring pattern, electric capacity between the two is set to change, so as to further finely tune the impedance matching of whole circuit
Effect；On the other hand, because the second grounding pattern is the ground connection segmentation that mutual complete parttion disconnects, and cut-off rule is perpendicular to flat
The overbending direction (namely length bearing of trend) of line, completely eliminates surface tension when the second grounding pattern is bent, thorough
Bottom avoids the problem of stress concentration that can usually occur during the bending of full wafer grounding pattern, adds the flexibility of flat wire, i.e.,
Make to bend repeatedly, wider signal lead of the invention is also less likely to occur to be broken abnormal risk.
According to the above-mentioned imagination of the present invention on, the following a variety of forms of implementation that may have are included：
If Fig. 3~Fig. 6 is the figure of the flat wire 100 of the first embodiment of the present invention
Reference picture 3 and with reference to shown in Fig. 4~Fig. 6, the flat wire 100 are the elongate in shape extended along a direction
FPC, including signal lead 101 (being herein single-ended transmission line, or difference transmission lines) as signal routing pattern, set
It is placed in the first grounding pattern 102 of the side of signal lead 101, dielectric layer 103 and possesses multiple ground connection segmentation 104a compositions
Second grounding pattern 104, wherein, the first described grounding pattern 102 possesses certain width and is equally spacedly distributed in described
The both sides of signal lead 101, the first described grounding pattern 102 are equal with the development length of the signal lead 101.Described
Signal lead 101, the first grounding pattern 102, the grounding pattern 104 of dielectric layer 103 and second are sequentially laminated in the same direction
And extension.Described signal lead 101 is formed by such as conductive metal foil material, the first described grounding pattern 102 and the
Two grounding patterns 104 are formed by such as conductive metal foil material, described dielectric layer 103 by such as polyimides dielectric material
Material is formed.
Further, the place layer of described signal lead 101 and first grounding pattern 102 is located at dielectric layer 103
Upper epidermis, described second ground connection Figure 104 place layer is located at the layer of the opposite dielectric layer 103, and this second
D arranges ground to each ground connection segmentation 104a mutually disconnected of grounding pattern 104 along the straight line of bearing of trend at a predetermined interval
Lay, herein, described ground connection is segmented 104a perpendicular to the signal transmssion line 101 (i.e. its bearing of trend), certainly, described
The angle of intersection Q of ground connection segmentation 104a and the signal transmssion line 101 can be any angle value of non-zero (with specific reference to Fig. 8
It is shown).Along on the bearing of trend, set between described ground connection segmentation 104a and the first described grounding pattern 102
There is at least one set of via 105 (alternatively referred to as via hole, via) with certain intervals, all ground connection is segmented 104a and the
One grounding pattern 102 forms a unified reference ground together.
The effect of implementation：By arrangement above, signal transmssion line 101 can be increased in the case where keeping impedance matching
Width, with reference to shown in figure 4 and Fig. 5, One function unit F, the flexibility are used as using two ground connection segmentation 104a of arbitrary neighborhood
Circuit board 100, which can be regarded as, is divided into multiple identical functional unit F, it is assumed that W1 and W2 represents two kinds of signal lead 101
Different in width is (as shown in figure 4, W2>W1), L, G represent ground connection segmentation 104a length and spacing distance respectively, due to transmission line
The size of electric capacity in road is decided by the face of the overlapping region between the signal lead 101 and second grounding pattern 104
Product (it is assumed that constant, described dielectric layers 103 of spacing d between first grounding pattern 102 and the signal transmssion line 101
Material and thickness are constant), only need the signal lead 101 in more each functional unit F and second grounding pattern 104
Between overlapping region area S (S=L*W), when the width of signal lead 101 increases to W2 from W1, that is, add
Δ W (=W2-W1), now, the signal lead 101 and the overlapping region area of second grounding pattern 104 add Δ S
(=L* Δ W), functional unit F regional extent can be increased, the spacing distance G between ground connection segmentation 104a is increased to reduction
Overlapping region area just offset Δ S so that the impedance in each functional unit F is held essentially constant；Or keep work(
The regional extent of energy unit F is constant, is reduced at least length L of one of ground connection segmentation 104, and the overlapping region area of reduction is firm
Δ S is offset well, it is preferable that during by setting L=W, only total Δ L=Δs W of reduction can need to be ensured the signal transmssion line 101
Totally keep constant with the overlapping region area of second grounding pattern 104；Or as shown in fig. 7, will at least therein one
Individual ground connection segmentation 104a and the signal transmssion line 101 overlapping region set an opening 106, make the area and Δ S of opening 106
It is equal, so, it also can guarantee that the signal lead 101 and the overlapping region area of second grounding pattern 104 are totally kept
It is constant.Furthermore it is also possible to the spacing d increased between first grounding pattern 102 and the signal lead 101 further changes
It is apt to described capacitance characteristic and inductance characteristic, contracting is upper described, can be by multiple means above easily in holding impedance
Increase the width of signal transmssion line 101 in the case of matching somebody with somebody, can not only obtain relatively low insertion loss, reflection loss will not also increase
Add.
In the nature of things, (embodiment one is the rectangle of strip to the shape of the ground connection segmentation 104a, or can be other
Ellipse, L-shaped, rhombus etc.), size and the angle of intersection Q between signal lead can arbitrarily lay as needed,
Adhesive linkage, articulamentum of other ground plane or other techniques needs etc. can be increased as needed, can equally realize this hair
Bright purpose, specifically refer in the second embodiment shown in Fig. 7, make in ground connection segmentation 104a and signal wire view field
Otch 106 is with micro-adjustment feature impedance, and in fig. 8 in shown 3rd embodiment, ground connection segmentation 104a extends with signal lead 101
The angle of intersection in direction is acute angle, and in fig.9 in shown fourth embodiment, shown ground connection segmentation 104a is dumb-bell shape.
Significantly, since the second grounding pattern 104 is segmented 104a along flat using the ground connection of multiple mutually disjunctions
The bearing of trend of line 100 is laid, and when flat wire 100 is bent, the collection mutually pullled is not present between each ground connection segmentation 104a
Middle stress, therefore, easy bending is easily facilitated, because the width of signal lead 101 increases, bending action is not easy to make signal lead
101 fractures, further increase the bending life-span of flat wire 100.
If Figure 10~Figure 11 is the figure of the flat wire 200 of the fifth embodiment of the present invention
Shown in reference picture 10 and Figure 11, flat wire 200 is the elongate in shape FPC extended along a direction, and material is substantially
It is upper identical with the first embodiment, including at least upper strata grounding pattern layer 201, top dielectric layer 202, middle conduct signal
Wiring pattern 203 and the first grounding pattern 204, underlying dielectric layers 205 and the lower floor ground connection for being arranged at signal routing pattern both sides
Patterned layer 206, wherein, described signal routing pattern 203 is single-ended signal transmission line, described upper strata grounding pattern layer 201
Including being grounded at predetermined intervals along multiple upper stratas mutually disconnected of the bearing of trend arranged of the signal routing pattern 203
201a is segmented, described lower floor's grounding pattern layer 206 is included at predetermined intervals along the bearing of trend of the signal routing pattern 203
Multiple lower floor ground connection segmentation 206a mutually disconnected of arranged, each upper strata ground connection segmentation 201a connect with each lower floor
Ground segmentation 206a is adjacent to two-by-two along bearing of trend to be staggered, and is grounded respectively by the via 207 and first of metallic conduction
Pattern 204 is connected.
The effect of implementation：With above-mentioned first embodiment except that, described top dielectric layer 202 and described lower floor
Can have different thickness between dielectric layer 205, therefore, upper strata grounding pattern layer 201, lower floor's grounding pattern layer 206 respectively with
There is different electrical characteristics (inductively or capacitively) between signal routing pattern 203, in conjunction with the spacing of the first grounding pattern 204
Different configurations so that flat wire 200 has the means of more regulation electrical characteristics compared to flexible PCB 100, thus has
There is preferably applicability.
What deserves to be explained is each upper strata ground connection segmentation 201a is grounded segmentation 206a along extension side with each lower floor
It is staggered to being adjacent to two-by-two, changes of each ground connection segmentation 201a and 206a to the electrical characteristic of flat wire 200 can be made
With more obvious influence.
If Figure 12 is the figure of the flat wire 00 of the sixth embodiment of the present invention
Shown in reference picture 12, flat wire 300 is the elongate in shape FPC extended along a direction, with second embodiment not
With with the bearing of trend along the grounding pattern 302 of signal routing pattern 301 or first with two kinds of different lengths
Ground connection segmentation:Long ground connection is segmented 304 with being segmented 303 and short circuit, and described long ground connection segmentation 303 is on the bearing of trend
Length is segmented 304 with being significantly greater tnan described short circuit, it will be apparent that, according to different needs, described two ground connection segmentations 303,
304 can be configured in upper and lower layer grounding pattern layer in any combination, theoretical according to radio frequency transmission, by described long ground connection point
Section 303 is designed in transmission line mainly play inductance, for example, long ground connection can be segmented in 303 by signal routing pattern
The regions design of 301 coverings reticulates, rhombus or the mode such as hollows out, and shows diamond structure in this example Figure 11, it has water chestnut
Shape cabling 303a, the rhombus cabling 303a are with the signal routing pattern 301 on both overlapping region interior edge bearing of trends
With longer lateral separation, so as to obtain larger inductance characteristic, and segment design helps ground ground plane by short circuit
(solid ground) for adjust circuit capacitance characteristic so that reaching the design requirement that flat wire 300 reaches different.
It is worth noting that, multiple ground planes can be increased in the embodiment above, the stable work of main electrical characteristic is played
With, or the electrical characteristic effect of part improvement circuit, the ground plane for shielding EMI effects can also be increased.
It should be evident that in above-mentioned all embodiments, partial earthing can be segmented and be not connected with the first grounding pattern
Connect, position and the size of the via (via) for connecting first grounding pattern and ground connection segmentation can also be adjusted, obtained more
Improve the effect of electrical characteristic.
<Manufacture method on flat wire>
The manufacture method of the exemplary embodiments of flat wire is illustrated below.It should be noted that in the following description,
The described process carried out successively, in actual processing manufacture, it is possibility to have other various processes in addition to above-mentioned operation.
(1) first process：Form signal routing pattern and the first grounding pattern
In the base conductive layers of foil of the two-sided surface side for covering conductive layer pressing plate by intermediate symmetry in a manner of grooving formed phase
The signal routing patterned conductive paper tinsel and the first grounding pattern conductive foil being mutually spaced a distance, make first grounding pattern
Conductive foil is equally spacedly distributed in the both sides of the signal routing patterned conductive paper tinsel.
(2) second processes：Form ground connection segmentation pattern
With with stating signal routing pattern in the base conductive layers of foil of the two-sided another surface side for covering conductive layer pressing plate
The intersecting predetermined angular of bearing of trend makees beveling groove action, the base conductive layers of foil is thoroughly cut off and is mutually disconnected, so as to
Formation is parallel to each other on the two-sided another surface side for covering conductive layer pressing plate and multiple ground connection spaced a predetermined distance are segmented
Conductive foil.
(3) the 3rd processes：It is laminated single-sided conductive laminate
The processing of the conductive layer predetermined pattern of single-sided conductive laminate, two-sided cover conduction with above-mentioned together with adhesive linkage
Laminate layer forces together.
(4) the 4th processes：Form through hole
On the intermediate product of above-mentioned formation, insertion hole machined is carried out using NC drill bits or laser etc., carries out the first ground connection
Interlayer between patterned layer and ground connection segmentation connects.
(5) the 5th processes：Form conductive film
Parcel plating, the mistake of the interlayer connection being electrically connected with to each other after being electroplated are implemented to above-mentioned through hole
Hole (via).
(5) the 6th processes：Coating is formed, finally gives flexible PCB
, can be as needed to uncovered layer in the coating that the upper and lower surface covering of above-mentioned formation shields
Implement the surface treatment of electroless gold plating etc. in the position of covering.Flexible PCB after being completed after above-mentioned operation.
<Application on flat wire>
A kind of high frequency flat wire of multilayer co-planar waveguide thin type structure of the present invention is shown below according to Figure 13 and Figure 15
Application Example applied to the sub-assembly (hereinafter referred to as flat wire sub-assembly) of device is described in detail.
Such as Figure 13 and Figure 14, with reference to shown in Figure 15 and Figure 16, described flat wire sub-assembly 10 includes flat wire 30 and weldering
Be connected on two connectors 20 at the both ends of the flat wire 30 in succession, the width of its two-side-ends part extended along its length compared with
Width, to provide the switching interface as signal input/output, and center section is the extension of a long and narrow narrower width
Line, to transmission signal under the premise of as space-saving as possible, described flat wire 30 is that sandwich construction passes through laminar manner
The transmission structure of formation, including uppermost upper insulating cover 31, signal transmitting layer 32, dielectric layer 33, the second ground plane 34
And nethermost lower insulating cover 35, wherein, described signal transmitting layer 32 is located at the upper surface of the dielectric layer 33, bag
Include the first ground connection figure positioned at middle signal pattern cabling 321, the both sides for being symmetrically arranged at the signal pattern cabling 321
Case 322 and the ground connection installation portion for being connected from the both sides of the first map interlinking case 322 and surrounding the signal pattern cabling 321
322a, the both sides of the first described grounding pattern cabling 321 have the signal installation portion 321a of wider width；Second ground connection
Layer 34 is located at the lower surface of the dielectric layer 33, including grounding points 341 positioned at both sides, by the grounding points 341
Be surrounded on inside and be insulated from arrangement signal connecting element 342 and multiple bearing of trends along flat wire at regular intervals
Second ground section 343 of arrangement；The two side ends of described upper insulating cover 31 are symmetrically provided with signal opening 311 and three
Ground connection opening 312.
Further referring to the annexation shown in Figure 14 dotted portion, the signal installation portion of the signal transmitting layer 32
321a and second ground plane 34 signal connecting element 342 are electrically connected by the first via 303, the connection
The signal of device 20 connects end (being not explicitly depicted in figure) and welded by the signal opening 311 and the signal installation portion 321a
Connection, so as to form a bars transmission channel together with the first grounding pattern cabling 321；The signal transmitting layer 32
Ground connection installation portion 322a and second ground plane 34 grounding points 341 are electrically connected by the second via 302
Connect, it is described second ground connection segmentation 343 by be listed in the two of the bearing of trend center line both sides ranked third via 301 with it is described
First grounding pattern 322 is electrically connected, so as to provide the complete of larger impedance ranges optimization for the first grounding pattern cabling 321
Whole reference ground, the earthing of casing end (being not explicitly depicted in figure) of the connector 20 pass through described three ground connection openings 312 and institute
State ground connection installation portion 322a to be welded to connect, stereochemical structure is referred to so as to form complete ground connection.
Configured more than, described flat wire sub-assembly 10 has the advantages that pliable, impedance is controllable.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.
Claims (14)
1. the flexible high frequency flat wire of a kind of multilayer co-planar waveguide thin type structure, it is characterised in that it possesses extends along a direction
Signal routing pattern, with the signal routing pattern with layer arrange and along the first grounding pattern of equidirectional extension and across medium
Layer and at least one layer second grounding pattern opposite with the signal routing pattern or the first grounding pattern, this second ground connection scheme
Case possesses the multiple ground connection segmentation for arranging along the bearing of trend and intersecting with the signal routing pattern at a predetermined interval, described
Ground connection segmentation mutually disconnects and is connected respectively by via with first grounding pattern.
2. the flexible high frequency flat wire of a kind of multilayer co-planar waveguide thin type structure, it is characterised in that it possesses extends along a direction
Signal routing pattern, with the signal routing pattern with layer arrange and along the first grounding pattern of equidirectional extension, across upper strata
Dielectric layer and the upper strata grounding pattern opposite with the signal routing pattern or the first grounding pattern and across layer dielectric
Layer and the lower floor grounding pattern opposite with the signal routing pattern or the first grounding pattern, the signal routing pattern and the
In between layers, the upper strata connects for layer where layer where one grounding pattern is located at the upper strata grounding pattern and grounding pattern institute of lower floor
Ground pattern and lower floor's grounding pattern possess multiple upper strata ground connection segmentations mutually disconnected respectively and multiple lower floors mutually disconnected connect
Ground is segmented, and the upper strata ground connection segmentation and lower floor's ground connection segmentation are arranged by respective predetermined space along the bearing of trend respectively
Arrangement, upper strata ground connection segmentation intersect with least one that lower floor ground connection is segmented with the signal routing pattern and
It is connected by via with first grounding pattern.
3. the flexible high frequency flat wire of multilayer co-planar waveguide thin type structure according to claim 2, it is characterised in that described
Each upper strata ground connection segmentation is grounded to be segmented two-by-two to be adjacent to along bearing of trend with each lower floor to be staggered.
4. the flexible high frequency flat wire of multilayer co-planar waveguide thin type structure according to claim 1 or 2, it is characterised in that
At least also include the 3rd ground plane, the 3rd ground plane configures master together with the signal routing pattern and the first grounding pattern
The electrical characteristic of whole circuit is formed, the four of wavelength corresponding to of length no more than highest frequency signal of described ground connection segmentation
/ be used to finely tune the electrical characteristic of whole circuit in the lump.
5. the flexible high frequency flat wire of multilayer co-planar waveguide thin type structure according to claim 1 or 2, it is characterised in that
Described ground connection segmentation is comprised at least along the longer long ground connection segmentation of the bearing of trend length and along the bearing of trend length
It is segmented, described long ground connection segmentation is used for the inductance characteristic for adjusting circuit, and described short ground connection segmentation is used shorter short circuit
In the capacitance characteristic of regulation circuit.
6. the flexible high frequency flat wire of multilayer co-planar waveguide thin type structure according to claim 2, it is characterised in that described
Upper strata ground connection segmentation (or lower floor's ground connection segmentation) is to be connect for adjusting the length longer along the bearing of trend length of inductance characteristic
Ground is segmented, lower floor ground connection segmentation (or upper strata ground connection segmentation) be for adjust capacitance characteristic along the bearing of trend length
It is segmented shorter short circuit.
7. the flexible high frequency flat wire of multilayer co-planar waveguide thin type structure according to claim 1 or 2, it is characterised in that
Described ground connection sectional vertical in the signal arrangement line pattern bearing of trend and be arranged in parallel it is in alignment, it is described
The spacing distance of ground connection segmentation arrangement is 1/10th of its highest frequency signal corresponding wavelength passed through.
8. the flexible high frequency flat wire of multilayer co-planar waveguide thin type structure according to claim 1 or 2, it is characterised in that
The signal routing pattern is single-ended transmission line or difference transmission lines with preset width, and first grounding pattern is with phase
With arranged for interval in the ground connection conductive foil of the single-ended transmission line or difference transmission lines both sides.
9. the flexible high frequency flat wire of multilayer co-planar waveguide thin type structure according to claim 1 or 2, it is characterised in that
Described ground connection is segmented into the strip conductive foil extended along its length.
10. the flexible high frequency flat wire of multilayer co-planar waveguide thin type structure according to claim 1 or 2, it is characterised in that
Described ground connection is segmented into dumb-bell shape conductive foil, and the width at the both ends of the dumb-bell shape conductive foil is equal to the two of middle width
Times.
11. the flexible high frequency flat wire of multilayer co-planar waveguide thin type structure according to claim 1 or 2, it is characterised in that
At least one of described ground connection segmentation is provided with opening, it is described be open to ensure the flexible high frequency flat wire along
The capacitance characteristic of the bearing of trend totally keeps constant.
12. the flexible high frequency flat wire of multilayer co-planar waveguide thin type structure according to claim 1 or 2, it is characterised in that
At least one of described ground connection segmentation is network structure.
13. a kind of device for the flexible high frequency flat wire for possessing multilayer co-planar waveguide thin type structure, it is characterised in that at least wrap
Include：
The flexible high frequency flat wire of multilayer co-planar waveguide thin type structure,
And it is electrically connected to the connector at the flexible high frequency flat wire both ends of the multilayer co-planar waveguide thin type structure；
Wherein, the flexible high frequency flat wire of the multilayer co-planar waveguide thin type structure is the strip shape extended along a direction
Shape, it possesses the signal routing patterned conductive paper tinsel along direction extension, arranged with the signal routing patterned conductive paper tinsel with layer and edge
First grounding pattern conductive foil of equidirectional extension and connect across dielectric layer with the signal routing patterned conductive paper tinsel or first
Opposite at least one layer the second grounding pattern conductive foil of ground pattern conductive foil, the second grounding pattern conductive foil is by between predetermined
Composition, the ground connection are segmented every the one group of ground connection for arranging along the bearing of trend and intersecting with the signal routing patterned conductive paper tinsel
Segmentation mutually disconnects and is connected respectively by via with the first grounding pattern conductive foil.
14. the device of the flexible high frequency flat wire according to claim 13 for possessing multilayer co-planar waveguide thin type structure, its
It is characterised by, the flexible high frequency flat wire of the multilayer co-planar waveguide thin type structure is formed by laminated multi-layer technique, is at least wrapped
Insulating cover, signal transmitting layer, dielectric layer, the second ground plane and lower insulating cover are included, wherein：
The signal transmitting layer possesses the signal routing patterned conductive paper tinsel and the first grounding pattern conductive foil, and is located at institute
State the upper surface of dielectric layer, the signal transmitting layer also includes connecting the first map interlinking case conductive foil and by the letter from both sides
Ground connection installation portion that number patterned conductive paper tinsel surrounds and be connected to the signal routing patterned conductive paper tinsel both sides have width compared with
Wide signal installation portion；
Second ground plane possesses the second grounding pattern conductive foil and its ground connection segmentation, and under the dielectric layer
Surface, second ground plane are also included positioned at the grounding points of the second grounding pattern conductive foil both sides and described
Grounding points surround and are insulated from the signal connecting element of arrangement；
The two side ends of described upper insulating cover are symmetrically provided with signal opening and ground connection is open；
The signal connecting element of the signal installation portion of the signal transmitting layer and second ground plane is entered by the first via
Row electrical connection, the signal of the connector connect end and are welded to connect by the signal opening and the signal installation portion；
The grounding points of the ground connection installation portion and second ground plane of the signal transmitting layer are entered by the second via
Row electrical connection, the ground connection segmentation of the second grounding pattern conductive foil is by along symmetrical two row of the bearing of trend center line
3rd via is electrically connected with first grounding pattern respectively, and the frame ground end of the connector is open by the ground connection
It is welded to connect with the ground connection installation portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610819390.4A CN107819177B (en) | 2016-09-10 | 2016-09-10 | Flexible high-frequency flat wire with multilayer coplanar waveguide thin structure and device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610819390.4A CN107819177B (en) | 2016-09-10 | 2016-09-10 | Flexible high-frequency flat wire with multilayer coplanar waveguide thin structure and device thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107819177A true CN107819177A (en) | 2018-03-20 |
| CN107819177B CN107819177B (en) | 2020-04-03 |
Family
ID=61601185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610819390.4A Active CN107819177B (en) | 2016-09-10 | 2016-09-10 | Flexible high-frequency flat wire with multilayer coplanar waveguide thin structure and device thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107819177B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108550969A (en) * | 2018-05-25 | 2018-09-18 | 深圳市深大唯同科技有限公司 | A kind of tunable dielectric integrated RF transmission line, coupler and feeding network |
| CN110364798A (en) * | 2019-06-29 | 2019-10-22 | 瑞声精密制造科技(常州)有限公司 | A kind of transmission line |
| CN111430863A (en) * | 2019-12-16 | 2020-07-17 | 瑞声科技(新加坡)有限公司 | Transmission line and terminal device |
| CN112423467A (en) * | 2020-10-28 | 2021-02-26 | 中国电子科技集团公司第五十五研究所 | Suspended sectional type coplanar waveguide film circuit structure |
| CN117497990A (en) * | 2024-01-02 | 2024-02-02 | 上海安其威微电子科技有限公司 | Slow wave delay line and chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007281145A (en) * | 2006-04-05 | 2007-10-25 | Kenwood Corp | Flexible wiring member |
| CN103650236A (en) * | 2011-05-31 | 2014-03-19 | 住友大阪水泥股份有限公司 | High-frequency electrical signal transmission line |
| CN103781275A (en) * | 2010-12-03 | 2014-05-07 | 株式会社村田制作所 | High-frequency signal transmission line |
| CN104377415A (en) * | 2014-10-08 | 2015-02-25 | 石以瑄 | Coplanar waveguide for microwave transmission and manufacturing method thereof |
| CN204333194U (en) * | 2012-06-29 | 2015-05-13 | 株式会社村田制作所 | High-frequency signal circuit |
-
2016
- 2016-09-10 CN CN201610819390.4A patent/CN107819177B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007281145A (en) * | 2006-04-05 | 2007-10-25 | Kenwood Corp | Flexible wiring member |
| CN103781275A (en) * | 2010-12-03 | 2014-05-07 | 株式会社村田制作所 | High-frequency signal transmission line |
| CN103650236A (en) * | 2011-05-31 | 2014-03-19 | 住友大阪水泥股份有限公司 | High-frequency electrical signal transmission line |
| CN204333194U (en) * | 2012-06-29 | 2015-05-13 | 株式会社村田制作所 | High-frequency signal circuit |
| CN104377415A (en) * | 2014-10-08 | 2015-02-25 | 石以瑄 | Coplanar waveguide for microwave transmission and manufacturing method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108550969A (en) * | 2018-05-25 | 2018-09-18 | 深圳市深大唯同科技有限公司 | A kind of tunable dielectric integrated RF transmission line, coupler and feeding network |
| CN110364798A (en) * | 2019-06-29 | 2019-10-22 | 瑞声精密制造科技(常州)有限公司 | A kind of transmission line |
| WO2021000075A1 (en) * | 2019-06-29 | 2021-01-07 | 瑞声声学科技(深圳)有限公司 | Transmission line |
| CN111430863A (en) * | 2019-12-16 | 2020-07-17 | 瑞声科技(新加坡)有限公司 | Transmission line and terminal device |
| CN112423467A (en) * | 2020-10-28 | 2021-02-26 | 中国电子科技集团公司第五十五研究所 | Suspended sectional type coplanar waveguide film circuit structure |
| CN117497990A (en) * | 2024-01-02 | 2024-02-02 | 上海安其威微电子科技有限公司 | Slow wave delay line and chip |
| CN117497990B (en) * | 2024-01-02 | 2024-03-08 | 上海安其威微电子科技有限公司 | Slow wave delay line and chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107819177B (en) | 2020-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107819177A (en) | Flexible the high frequency flat wire and its device of multilayer co-planar waveguide thin type structure | |
| KR100283508B1 (en) | Non-solid reference plane with bidirectional impedance control | |
| JP6526069B2 (en) | Signal Coupling in Multilayer Substrates | |
| US9059491B2 (en) | Double microstrip transmission line having common defected ground structure and wireless circuit apparatus using the same | |
| CN101752343B (en) | Integrated circuit structure | |
| CN203040005U (en) | Printed circuit board | |
| US10770774B2 (en) | Microstrip-waveguide transition for transmitting electromagnetic wave signal | |
| US8536464B2 (en) | Multilayer substrate | |
| CN102687600A (en) | High-frequency signal line | |
| CN104821429A (en) | Antenna board | |
| US20100282503A1 (en) | Multi-layer substrate | |
| WO2008104501B1 (en) | Improved noise isolation in high-speed digital systems on packages and printed circuit boards (pcbs) | |
| CN104798248B (en) | Transmission line and electronic equipment | |
| CN206441554U (en) | A kind of signal transmssion line and electronic equipment | |
| CN103165228A (en) | Flexible flat cable | |
| US20050083147A1 (en) | Circuit board and method in which the impedance of a transmission-path is selected by varying at least one opening in a proximate conductive plane | |
| CN108054505A (en) | Circuit board assemblies and antenna assembly | |
| US20100244999A1 (en) | Transmission line | |
| CN103167719A (en) | Novel wiring method of printed circuit board, printed circuit board and electronic device | |
| TW201503482A (en) | Electronic circuit and electronic device | |
| WO2020095092A1 (en) | Electromagnetic waveguide and microwave-frequency circuit | |
| CN204994053U (en) | High -frequency transmission line and electronic apparatus | |
| CN104981087B (en) | Signal transmission cable architecture and its electronic device of application | |
| JP2008205099A (en) | Multilayer wiring board | |
| CN107360663B (en) | Circuit board structure capable of selecting corresponding grounding layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |