CN107818311A - A kind of method for packing of optical fingerprint sensor - Google Patents
A kind of method for packing of optical fingerprint sensor Download PDFInfo
- Publication number
- CN107818311A CN107818311A CN201711122326.1A CN201711122326A CN107818311A CN 107818311 A CN107818311 A CN 107818311A CN 201711122326 A CN201711122326 A CN 201711122326A CN 107818311 A CN107818311 A CN 107818311A
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- CN
- China
- Prior art keywords
- fingerprint sensor
- optical fingerprint
- packing
- present
- smooth surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
Abstract
The invention discloses a kind of method for packing of optical fingerprint sensor, in the film that one layer of the smooth surface direct plating of optical fingerprint sensor is used to obstruct infrared ray.Glass is saved, in optical fingerprint sensor surface direct plating IR CUT films, the translucency of optical fingerprint sensor is improved, reduces the thickness of optical fingerprint sensor.
Description
Technical field
The present invention relates to a kind of optical fingerprint identification technology, more particularly to a kind of method for packing of optical fingerprint sensor.
Background technology
With the development in the fields such as smart mobile phone, mobile payment, Information Security is also of great interest, internet
Mobile terminal changes from conventional cipher, gesture identification to fingerprint recognition.Optical fingerprint sensor wants specific capacitance formula sensor to have more
High resolution ratio, and unlike condenser type corrosion-vulnerable, abrasion and electrostatic interference are destroyed.But optical fingerprint sensor is by environment
The picking rate of fingerprint and precision can decline when light influences；In particular by the optical fingerprint sensor of conventional package mode.
In the prior art, as shown in figure 1, the method for packing of conventional optical fingerprint sensor is：In optical fingerprint sensor
Smooth surface paste clear glass, one layer is then plated on glass and is used to obstruct the film (IR CUT films) of infrared ray.It is this
Method for packing in the smooth surface of optical fingerprint sensor due to that will paste glass, so as to generate at least two drawbacks：
1. the translucency of optical fingerprint sensor is deteriorated；2. add the thickness of optical fingerprint sensor.
The content of the invention
It is an object of the invention to provide a kind of method for packing of optical fingerprint sensor.
The purpose of the present invention is achieved through the following technical solutions：
The method for packing of the optical fingerprint sensor of the present invention, in one layer of use of smooth surface direct plating of optical fingerprint sensor
In the film of barrier infrared ray.
As seen from the above technical solution provided by the invention, optical fingerprint sensor envelope provided in an embodiment of the present invention
Dress method, saves glass, in optical fingerprint sensor surface direct plating IR CUT films, improves the printing opacity of optical fingerprint sensor
Property, reduce the thickness of optical fingerprint sensor.
Brief description of the drawings
Fig. 1 is the structural representation of the encapsulation of optical fingerprint sensor in the prior art.
Fig. 2 is the structural representation of the encapsulation of optical fingerprint sensor provided in an embodiment of the present invention.
Embodiment
The embodiment of the present invention will be described in further detail below.What is be not described in detail in the embodiment of the present invention is interior
Appearance belongs to prior art known to professional and technical personnel in the field.
The method for packing of the optical fingerprint sensor of the present invention, its preferable embodiment are as shown in Figure 2：
In the film that one layer of the smooth surface direct plating of optical fingerprint sensor is used to obstruct infrared ray.
Do not have between the smooth surface of the optical fingerprint sensor and film for obstructing infrared ray any other saturating
Cross material.
The optical fingerprint sensor method for packing of the present invention, saves glass, in optical fingerprint sensor surface direct plating
IRCUT films, the translucency of optical fingerprint sensor is improved, reduce the thickness of optical fingerprint sensor.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art is in the technical scope of present disclosure, the change or replacement that can readily occur in,
It should all be included within the scope of the present invention.Therefore, protection scope of the present invention should be with the protection model of claims
Enclose and be defined.
Claims (2)
1. a kind of method for packing of optical fingerprint sensor, it is characterised in that in the smooth surface direct plating of optical fingerprint sensor
One layer of film for being used to obstruct infrared ray.
2. the method for packing of optical fingerprint sensor according to claim 1, it is characterised in that the optical finger print sensing
There is no any other permeable material between the smooth surface of device and film for obstructing infrared ray.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711122326.1A CN107818311B (en) | 2017-11-14 | 2017-11-14 | Packaging method of optical fingerprint sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711122326.1A CN107818311B (en) | 2017-11-14 | 2017-11-14 | Packaging method of optical fingerprint sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107818311A true CN107818311A (en) | 2018-03-20 |
| CN107818311B CN107818311B (en) | 2021-11-02 |
Family
ID=61609203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711122326.1A Active CN107818311B (en) | 2017-11-14 | 2017-11-14 | Packaging method of optical fingerprint sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107818311B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110175493A (en) * | 2018-07-13 | 2019-08-27 | 神盾股份有限公司 | Optical finger print sensing device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101110438A (en) * | 2006-07-19 | 2008-01-23 | 育霈科技股份有限公司 | Structure of image sensor module and a method for manufacturing of wafer level package |
| CN102625907A (en) * | 2009-08-17 | 2012-08-01 | 松下电器产业株式会社 | Infrared sensor |
| US20120223909A1 (en) * | 2011-03-02 | 2012-09-06 | Smart Technologies Ulc | 3d interactive input system and method |
| CN102903726A (en) * | 2012-09-29 | 2013-01-30 | 格科微电子（上海）有限公司 | Wafer level packaging method for image sensor |
| CN103178023A (en) * | 2013-02-28 | 2013-06-26 | 格科微电子（上海）有限公司 | Mixed substrate encapsulation method and mixed substrate encapsulation structure for semiconductor device |
| CN205071131U (en) * | 2015-06-09 | 2016-03-02 | 上海与德通讯技术有限公司 | Camera module |
| CN205067775U (en) * | 2015-09-22 | 2016-03-02 | 浙江水晶光电科技股份有限公司 | Electronic equipment and camera module thereof |
| CN206022366U (en) * | 2016-09-21 | 2017-03-15 | 苏州科阳光电科技有限公司 | Sensor module |
| CN106991366A (en) * | 2016-01-21 | 2017-07-28 | 上海箩箕技术有限公司 | Optical fingerprint sensor |
-
2017
- 2017-11-14 CN CN201711122326.1A patent/CN107818311B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101110438A (en) * | 2006-07-19 | 2008-01-23 | 育霈科技股份有限公司 | Structure of image sensor module and a method for manufacturing of wafer level package |
| CN102625907A (en) * | 2009-08-17 | 2012-08-01 | 松下电器产业株式会社 | Infrared sensor |
| US20120223909A1 (en) * | 2011-03-02 | 2012-09-06 | Smart Technologies Ulc | 3d interactive input system and method |
| CN102903726A (en) * | 2012-09-29 | 2013-01-30 | 格科微电子（上海）有限公司 | Wafer level packaging method for image sensor |
| CN103178023A (en) * | 2013-02-28 | 2013-06-26 | 格科微电子（上海）有限公司 | Mixed substrate encapsulation method and mixed substrate encapsulation structure for semiconductor device |
| CN205071131U (en) * | 2015-06-09 | 2016-03-02 | 上海与德通讯技术有限公司 | Camera module |
| CN205067775U (en) * | 2015-09-22 | 2016-03-02 | 浙江水晶光电科技股份有限公司 | Electronic equipment and camera module thereof |
| CN106991366A (en) * | 2016-01-21 | 2017-07-28 | 上海箩箕技术有限公司 | Optical fingerprint sensor |
| CN206022366U (en) * | 2016-09-21 | 2017-03-15 | 苏州科阳光电科技有限公司 | Sensor module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110175493A (en) * | 2018-07-13 | 2019-08-27 | 神盾股份有限公司 | Optical finger print sensing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107818311B (en) | 2021-11-02 |
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