CN107815652B - 一种可旋转靶材装夹装置 - Google Patents
一种可旋转靶材装夹装置 Download PDFInfo
- Publication number
- CN107815652B CN107815652B CN201710894748.4A CN201710894748A CN107815652B CN 107815652 B CN107815652 B CN 107815652B CN 201710894748 A CN201710894748 A CN 201710894748A CN 107815652 B CN107815652 B CN 107815652B
- Authority
- CN
- China
- Prior art keywords
- clamping
- turntable
- fixedly connected
- spring
- rotating shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000003292 glue Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000007246 mechanism Effects 0.000 abstract description 4
- 239000000155 melt Substances 0.000 abstract description 4
- 239000012790 adhesive layer Substances 0.000 abstract description 2
- 239000013077 target material Substances 0.000 description 10
- 239000010410 layer Substances 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 2
- 235000010585 Ammi visnaga Nutrition 0.000 description 1
- 244000153158 Ammi visnaga Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Clamps And Clips (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710894748.4A CN107815652B (zh) | 2017-09-28 | 2017-09-28 | 一种可旋转靶材装夹装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710894748.4A CN107815652B (zh) | 2017-09-28 | 2017-09-28 | 一种可旋转靶材装夹装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107815652A CN107815652A (zh) | 2018-03-20 |
CN107815652B true CN107815652B (zh) | 2020-05-19 |
Family
ID=61607566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710894748.4A Active CN107815652B (zh) | 2017-09-28 | 2017-09-28 | 一种可旋转靶材装夹装置 |
Country Status (1)
Country | Link |
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CN (1) | CN107815652B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109014978A (zh) * | 2018-08-08 | 2018-12-18 | 芜湖易测自动化设备有限公司 | 一种工件加工用夹持旋转工作台 |
CN113322435B (zh) * | 2021-08-02 | 2021-10-22 | 江苏拓创新材料科技有限公司 | 一种导电氧化锆旋转靶材制造装置 |
CN115930059A (zh) * | 2022-09-30 | 2023-04-07 | 湖南兆丰信息技术有限公司 | 一种信息系统集成优化平台 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19508406A1 (de) * | 1995-03-09 | 1996-09-12 | Leybold Ag | Kathodenanordnung für eine Vorrichtung zum Zerstäuben eines Target-Paares |
US6375815B1 (en) * | 2001-02-17 | 2002-04-23 | David Mark Lynn | Cylindrical magnetron target and apparatus for affixing the target to a rotatable spindle assembly |
DE502005006841D1 (de) * | 2005-12-22 | 2009-04-23 | Applied Materials Gmbh & Co Kg | Zerstäubungsvorrichtung mit einer Rohrkathode und Verfahren zum Betreiben dieser Zerstäubungsvorrichtung |
EP2276870A4 (en) * | 2008-04-14 | 2012-07-25 | Angstrom Sciences Inc | CYLINDRICAL MAGNETRON |
CN102108490B (zh) * | 2009-12-29 | 2012-10-03 | 中国科学院沈阳科学仪器研制中心有限公司 | 一种磁控溅射靶 |
CN201626979U (zh) * | 2010-01-29 | 2010-11-10 | 东莞宏威数码机械有限公司 | 精准定位溅镀装置 |
CN102796990A (zh) * | 2011-05-26 | 2012-11-28 | 鸿富锦精密工业(深圳)有限公司 | 镀膜承载架 |
CN205046192U (zh) * | 2015-10-15 | 2016-02-24 | 广东耐信镀膜科技有限公司 | 一种新型免维护高效靶材机构 |
-
2017
- 2017-09-28 CN CN201710894748.4A patent/CN107815652B/zh active Active
Also Published As
Publication number | Publication date |
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CN107815652A (zh) | 2018-03-20 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200422 Address after: 518000 Shenzhen, Guangdong Guangming New District Gongming street village community Liantang industrial city C area thirty-ninth building on the first floor. Applicant after: SHENZHEN APG MATERIAL TECHNOLOGY Co.,Ltd. Address before: 210000 No. 89, double high road, Gaochun Economic Development Zone, Jiangsu, Nanjing, China Applicant before: NANJING BAOLIJING ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A rotatable target clamping device Effective date of registration: 20210813 Granted publication date: 20200519 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: SHENZHEN APG MATERIAL TECHNOLOGY Co.,Ltd. Registration number: Y2021980007675 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230524 Granted publication date: 20200519 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: SHENZHEN APG MATERIAL TECHNOLOGY Co.,Ltd. Registration number: Y2021980007675 |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 518000 1st floor, No.16, second industrial zone, Xiacun community, Gongming street, Guangming District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Zhongchengda Applied Materials Co.,Ltd. Address before: 518000, 1st floor, building 39, Liantang Industrial City, Shangcun community, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN APG MATERIAL TECHNOLOGY Co.,Ltd. |