CN107813433A - A kind of special construction steel wire method for cutting silicon chips of NTC PV800H silicon chip cutters - Google Patents

A kind of special construction steel wire method for cutting silicon chips of NTC PV800H silicon chip cutters Download PDF

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Publication number
CN107813433A
CN107813433A CN201710345764.8A CN201710345764A CN107813433A CN 107813433 A CN107813433 A CN 107813433A CN 201710345764 A CN201710345764 A CN 201710345764A CN 107813433 A CN107813433 A CN 107813433A
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China
Prior art keywords
steel wire
mortar
special construction
cutting
silicon chip
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CN201710345764.8A
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Chinese (zh)
Inventor
刘进
王丽
郝延蔚
赵辉
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Kaifeng University
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Kaifeng University
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Priority to CN201710345764.8A priority Critical patent/CN107813433A/en
Publication of CN107813433A publication Critical patent/CN107813433A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • B24B27/0633Grinders for cutting-off using a cutting wire

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

A kind of special construction steel wire method for cutting silicon chips of NTC PV800H silicon chip cutters, invention are related to photovoltaic industry.The cutting machine home roll slot pitch is 0.348mm, and special construction steel wire diameter is 0.115mm;Using unidirectional cutting technique, technological parameter is:Steel wire tension force:15N~23N, feed velocity:0.24mm/min~0.47mm/min, steel wire speed:640m/min~760m/min, line sending distance:70m/min~120m/min, mortar temperature:20 DEG C~23 DEG C, mortar flow:80l/min~100l/min;Steel wire hilted broadsword dosage 290km~400km, often cut two knives and change a mortar, mortar replacing amount is controlled in 600kg~800kg.

Description

A kind of special construction steel wire method for cutting silicon chips of NTC-PV800H silicon chip cutters
Technical field
The present invention relates to photovoltaic industry, the special construction steel wire silicon chip of specifically a kind of NTC-PV800H silicon chip cutters is cut Segmentation method.
Background technology
Cost is most important for photovoltaic industry, and wherein silicon chip processing cost accounts for more than 30%, improves multi-wire saw Technique and lifting cutting power, be the ring of key one for reducing silicon chip integrated cost, strengthen multi-wire saw new technology and improve to research and develop, Reduce the lifeline that production cost is long-term development of enterprise.
The content of the invention
The technical problems to be solved by the invention are:How to improve cutting power and then lift rate of cutting, reduce cutting Time, the yields of stable silicon chip, cost is prepared so as to reduce silicon chip.
The technical solution adopted in the present invention is:A kind of special construction steel wire silicon chip of NTC-PV800H silicon chip cutters is cut Segmentation method, carried out according to the steps:
Step 1, the home roll slot pitch for changing the cutting machine are 0.348mm, from a kind of special construction steel wire (Fig. 1), steel wire diameter For 0.115mm;
Step 2, using unidirectional cutting technique, technological parameter is:Steel wire tension force:15N~23N, feed velocity:0.24mm/min ~0.47mm/min, steel wire speed:640m/min~800m/min, line sending distance:70m/min~120m/min, mortar temperature: 20 DEG C~23 DEG C, mortar flow:80l/min~100l/min;
Step 3, steel wire hilted broadsword dosage 290km~400km, often cut two knives and change a mortar, the control of mortar replacing amount exists 600kg~800kg.
In described silicon chip cutting technique, mortar is by carborundum with the weight of cutting liquid 1: 0.9~0.97 than preparing;Wherein cut Cut liquid to be made up of 100% recovered liquid, carborundum is made up of the recovery sand of 75% weight and the fresh sand of 25% weight.
In described silicon chip cutting technique, the performance of carborundum is as follows in mortar:The granularity of carborundum:D50 be 8.2 ± 0.2 μm, that is, represent to account for the particle diameter of 50% ratio between 8-8.4 μm in silicon-carbide particle particle diameter distribution.
The beneficial effects of the invention are as follows:Effectively improve cutting power and then lift rate of cutting, reduce clipping time, reduce Silicon material line cuts loss, the yields of Simultaneous Stabilization silicon chip, cost is prepared so as to reduce silicon chip.
Brief description of the drawings
Technical solution of the present invention is described further below in conjunction with the accompanying drawings:
Fig. 1:The special construction steel wire organigram of the present invention, special construction steel wire are characterized as meander line structure, and broken line angle is 150 °, steel wire diameter 0.115mm.
Embodiment
The present invention carries out silicon chip cutting using NTC-PV800H silicon chip cutters, and current NTC-PV800H silicon chip cutters enter Knife speed is 8.5 hours in 0.15mm/min~0.37mm/min, clipping time, shows special construction steel wire using Fig. 1, will can enter Knife speed is promoted to 0.24mm/min~0.47mm/min, and clipping time is reduced into 6.5 hours.But a system occurs after adjusting Row problem:Mortar flow not enough causes steel wire abrasion increase in cutting process, and cutting power deficiency causes stria piece, steel wire tension Remitted its fury, broken string phenomenon easily occurs.How satisfaction lifts the technological requirement of cutting power, present invention discover that using a kind of Special construction steel wire, 0.348mm slot pitches are kept, is set according to certain technological parameter, can meet to require, it is specific as follows:
Step 1, shows special construction steel wire from Fig. 1 first, and setting steel wire diameter is 0.115mm;
Step 2, using unidirectional cutting technique, technological parameter is:Steel wire tension force:15N~23N, feed velocity:0.24mm/min ~0.47mm/min, steel wire speed:640m/min~760m/min, line sending distance:70m/min~120m/min, mortar temperature: 20 DEG C~23 DEG C, mortar flow:80l/min~100l/min;
Step 3, steel wire hilted broadsword dosage 290km~400km, slurry density are maintained at 1.66g/cm~1.68g/cm, start to cut Cut, often cut two knives and change a mortar, mortar replacing amount is controlled in 600kg~800kg.
Mortar:By carborundum and the weight of cutting liquid 1: 0.9~0.97 than preparing;Wherein cutting liquid is by 100% recovery Liquid is formed, and carborundum is made up of the recovery sand of 75% weight and the fresh sand of 25% weight.
Cooling water temperature is kept for 10 DEG C~12 DEG C, and factory building temperature is kept for 25 ± 2 DEG C.
Silicon chip cutting technique according to claim, the performance of carborundum is as follows in described mortar:Carborundum Granularity:D50 is 8.2 ± 0.2 μm, that is, represent to account in silicon-carbide particle particle diameter distribution the particle diameter of 50% ratio 8-8.4 μm it Between.

Claims (2)

  1. A kind of 1. special construction steel wire method for cutting silicon chips of NTC-PV800H silicon chip cutters, it is characterised in that:According to as follows The step of carry out:
    Step 1, the home roll slot pitch for changing the cutting machine are 0.348mm, from a kind of special construction steel wire (Fig. 1), steel wire diameter For 0.115mm;
    Step 2, using unidirectional cutting technique, technological parameter is:Steel wire tension force:15N~23N, feed velocity:0.33mm/min ~0.47mm/min, steel wire speed:640m/min~760m/min, line sending distance:70m/min~120m/min, mortar temperature: 20 DEG C~23 DEG C mortar flows:80l/min~100l/min;
    Step 3, often cut two knives and change a mortar, mortar replacing amount is controlled in 600kg~800kg.
  2. 2. in claim 1, a kind of special construction steel wire is characterized as meander line structure, broken line angle is 150 °, and steel wire diameter is 0.115mm。
CN201710345764.8A 2017-05-15 2017-05-15 A kind of special construction steel wire method for cutting silicon chips of NTC PV800H silicon chip cutters Pending CN107813433A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710345764.8A CN107813433A (en) 2017-05-15 2017-05-15 A kind of special construction steel wire method for cutting silicon chips of NTC PV800H silicon chip cutters

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710345764.8A CN107813433A (en) 2017-05-15 2017-05-15 A kind of special construction steel wire method for cutting silicon chips of NTC PV800H silicon chip cutters

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CN107813433A true CN107813433A (en) 2018-03-20

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109352845A (en) * 2018-10-23 2019-02-19 开封大学 A kind of NTC-MWM442DM silicon materials cutting machine method for cutting silicon chips
CN109551651A (en) * 2018-10-23 2019-04-02 开封大学 A kind of special construction steel wire method for cutting silicon chips being applicable in NTC-MWM442DM silicon materials cutting machine
CN114770779A (en) * 2022-04-29 2022-07-22 浙江晶盛机电股份有限公司 Mortar cutting process of silicon carbide crystal and silicon carbide sheet

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Publication number Priority date Publication date Assignee Title
JP2004276207A (en) * 2003-03-18 2004-10-07 Kanai Hiroaki Saw wire for multi-wire saw
CN102205563A (en) * 2011-05-25 2011-10-05 镇江耐丝新型材料有限公司 Spiral waveform cutting metal wire as well as manufacturing method and equipment thereof
CN202283752U (en) * 2011-06-03 2012-06-27 凡登(常州)新型金属材料技术有限公司 Linear cutting steel wire of solar silicon chip
CN202592555U (en) * 2012-05-10 2012-12-12 江苏聚能硅业有限公司 Steel wire used for free cutting of silicon rod
CN103817810A (en) * 2014-03-11 2014-05-28 山西潞安太阳能科技有限责任公司 Silicon wafer cutting method of NTC-PV 800 silicon wafer cutting machine
CN204912935U (en) * 2014-02-04 2015-12-30 弘德产业株式会社 Structure sawline that keeps fold characteristic under segmentation tension
CN105459280A (en) * 2015-12-30 2016-04-06 盛利维尔(中国)新材料技术有限公司 Cutting steel wire with sawtooth elements
JP2016150393A (en) * 2015-02-16 2016-08-22 ジャパンファインスチール株式会社 Saw wire
CN105940132A (en) * 2014-01-29 2016-09-14 株式会社神户制钢所 Steel wire for springs having excellent fatigue properties, and spring
CN106217665A (en) * 2016-08-12 2016-12-14 上海申和热磁电子有限公司 A kind of method of ultra-fine steel wire cutting ultra thin silicon wafers

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004276207A (en) * 2003-03-18 2004-10-07 Kanai Hiroaki Saw wire for multi-wire saw
CN102205563A (en) * 2011-05-25 2011-10-05 镇江耐丝新型材料有限公司 Spiral waveform cutting metal wire as well as manufacturing method and equipment thereof
CN202283752U (en) * 2011-06-03 2012-06-27 凡登(常州)新型金属材料技术有限公司 Linear cutting steel wire of solar silicon chip
CN202592555U (en) * 2012-05-10 2012-12-12 江苏聚能硅业有限公司 Steel wire used for free cutting of silicon rod
CN105940132A (en) * 2014-01-29 2016-09-14 株式会社神户制钢所 Steel wire for springs having excellent fatigue properties, and spring
CN204912935U (en) * 2014-02-04 2015-12-30 弘德产业株式会社 Structure sawline that keeps fold characteristic under segmentation tension
CN103817810A (en) * 2014-03-11 2014-05-28 山西潞安太阳能科技有限责任公司 Silicon wafer cutting method of NTC-PV 800 silicon wafer cutting machine
JP2016150393A (en) * 2015-02-16 2016-08-22 ジャパンファインスチール株式会社 Saw wire
CN105459280A (en) * 2015-12-30 2016-04-06 盛利维尔(中国)新材料技术有限公司 Cutting steel wire with sawtooth elements
CN106217665A (en) * 2016-08-12 2016-12-14 上海申和热磁电子有限公司 A kind of method of ultra-fine steel wire cutting ultra thin silicon wafers

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109352845A (en) * 2018-10-23 2019-02-19 开封大学 A kind of NTC-MWM442DM silicon materials cutting machine method for cutting silicon chips
CN109551651A (en) * 2018-10-23 2019-04-02 开封大学 A kind of special construction steel wire method for cutting silicon chips being applicable in NTC-MWM442DM silicon materials cutting machine
CN114770779A (en) * 2022-04-29 2022-07-22 浙江晶盛机电股份有限公司 Mortar cutting process of silicon carbide crystal and silicon carbide sheet

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Application publication date: 20180320