CN107809842A - FPC electrocondution slurry - Google Patents
FPC electrocondution slurry Download PDFInfo
- Publication number
- CN107809842A CN107809842A CN201711247310.3A CN201711247310A CN107809842A CN 107809842 A CN107809842 A CN 107809842A CN 201711247310 A CN201711247310 A CN 201711247310A CN 107809842 A CN107809842 A CN 107809842A
- Authority
- CN
- China
- Prior art keywords
- mass percent
- fpc
- electrocondution slurry
- epoxy resin
- copper powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Abstract
The invention discloses a kind of FPC electrocondution slurry, it is 78% to 82% copper powder, 8% to 12% epoxy resin, 1% to 2% acid anhydride type curing agent, 0.1% to 1.5% methylimidazole, 5% to 5.5% butyl acetate, 0.1% to 0.5% polyamide wax including mass percent, the particle diameter of the copper powder is less than 0.1 μm.Using the raw material and its proportioning of this programme, the pliability of flexible PCB can be effectively improved.
Description
Technical field
The present invention relates to conductive copper paste field, and in particular to a kind of FPC electrocondution slurry.
Background technology
Flexible PCB is also known as " soft board ", is the printed circuit made of flexible insulating substrate.Flexible circuit provides excellent
Good electrical property, smaller and more high-density installation design needs can be met, it helps reduce assembling procedure and enhancing can
By property.Flexible PCB is the only solution method for meeting miniaturization of electronic products and movement requirement.Can be with free bend, volume
Around, fold, millions of time dynamic bendings can be born without damaging wire, any arrangement can be required according to space layout, and
Arbitrarily moved and flexible in three dimensions, so as to reach the integration that components and parts assembling connects with wire；Flexible PCB can be big
The big volume and weight for reducing electronic product, is applicable the needs that electronic product develops to high density, miniaturization, highly reliable direction.
The pliability of flexible PCB is to concern a very crucial factor of its life-span and quality.
The content of the invention
In order to solve the above-mentioned technical problem the present invention provides a kind of FPC electrocondution slurry, it can improve flexible circuit
The pliability of plate.
The present invention is achieved through the following technical solutions：
FPC electrocondution slurry, including mass percent be 78% to 82% copper powder, 8% to 12% asphalt mixtures modified by epoxy resin
Fat, 1% to 2% acid anhydride type curing agent, 0.1% to 1.5% methylimidazole, 5% to 5.5% butyl acetate, 0.1% to
0.5% polyamide wax, the particle diameter of the copper powder are less than 0.1 μm.
The epoxy resin is bisphenol A type epoxy resin.
The mass percent of the copper powder is 80% to 81%, the mass percent of epoxy resin is 8% to 10%, acid anhydrides
The mass percent of class curing agent be to 2%, methylimidazole mass percent be 1.5%, the mass percent of butyl acetate
Mass percent for 5.5%, polyamide wax is 0.5%.
Also include the reactive diluent that mass percent is 1% to 2%.
The mass percent of the copper powder is 81%, the mass percent of epoxy resin is 8% to 10%, anhydrides solidification
The mass percent of agent be to 2%, methylimidazole mass percent be 1.5%, the mass percent of butyl acetate be
5.5%th, the mass percent of polyamide wax is 0.5%.
The mass percent of the reactive diluent is 1.5%.
The present invention compared with prior art, has the following advantages and advantages：
1st, using the raw material and its proportioning of this programme, the pliability of flexible PCB can effectively be improved.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, with reference to embodiment, the present invention is made
Further to describe in detail, exemplary embodiment of the invention and its explanation are only used for explaining the present invention, are not intended as to this
The restriction of invention.
Embodiment 1
FPC electrocondution slurry, including mass percent be 78% to 82% copper powder, 8% to 12% asphalt mixtures modified by epoxy resin
Fat, 1% to 2% acid anhydride type curing agent, 0.1% to 1.5% methylimidazole, 5% to 5.5% butyl acetate, 0.1% to
0.5% polyamide wax, the particle diameter of the copper powder are less than 0.1 μm.
Embodiment 2
Based on above-described embodiment, the present embodiment discloses an embodiment in the principle of above-described embodiment.
Specifically, epoxy resin can use bisphenol A type epoxy resin, other epoxy resin can be also adopted, using bisphenol-A type ring
Oxygen tree fat is only a kind of preferred embodiment.
The mass percent of copper powder is 80% to 81%, the mass percent of epoxy resin is 8% to 10%, anhydrides are solid
The mass percent of agent be to 2%, methylimidazole mass percent be 1.5%, the mass percent of butyl acetate be
5.5%th, the mass percent of polyamide wax is 0.5%.
Embodiment 3
The reactive diluent that mass percent is 1% to 2% can also be added in electrocondution slurry.Now, the quality hundred of copper powder
Point than be the 81%, mass percent of epoxy resin be 8% to 10%, the mass percent of acid anhydride type curing agent is to 2%, first
The mass percent of base imidazoles is 1.5%, the mass percent of butyl acetate is 5.5%, the mass percent of polyamide wax is
0.5%.
Preferably, the mass percent of reactive diluent is 1.5%.
Above-described embodiment, the purpose of the present invention, technical scheme and beneficial effect are carried out further
Describe in detail, should be understood that the embodiment that the foregoing is only the present invention, be not intended to limit the present invention
Protection domain, within the spirit and principles of the invention, any modification, equivalent substitution and improvements done etc., all should include
Within protection scope of the present invention.
Claims (6)
1. FPC electrocondution slurry, it is characterised in that including mass percent be 78% to 82% copper powder, 8% to
12% epoxy resin, 1% to 2% acid anhydride type curing agent, 0.1% to 1.5% methylimidazole, 5% to 5.5% acetic acid
Butyl ester, 0.1% to 0.5% polyamide wax, the particle diameter of the copper powder are less than 0.1 μm.
2. FPC electrocondution slurry according to claim 1, it is characterised in that the epoxy resin is bisphenol A-type
Epoxy resin.
3. FPC electrocondution slurry according to claim 2, it is characterised in that the mass percent of the copper powder is
80% to 81%, the mass percent of epoxy resin be 8% to 10%, the mass percent of acid anhydride type curing agent be to 2%, first
The mass percent of base imidazoles is 1.5%, the mass percent of butyl acetate is 5.5%, the mass percent of polyamide wax is
0.5%.
4. FPC electrocondution slurry according to claim 1, it is characterised in that also including mass percent be 1%
To 2% reactive diluent.
5. FPC electrocondution slurry according to claim 5, it is characterised in that the quality hundred of the reactive diluent
Divide than being 1.5%.
6. FPC electrocondution slurry according to claim 4, it is characterised in that the mass percent of the copper powder is
81%th, the mass percent of epoxy resin be 8% to 10%, the mass percent of acid anhydride type curing agent be to 2%, methylimidazole
Mass percent be 1.5%, the mass percent of butyl acetate is 5.5%, the mass percent of polyamide wax is 0.5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711247310.3A CN107809842A (en) | 2017-12-01 | 2017-12-01 | FPC electrocondution slurry |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711247310.3A CN107809842A (en) | 2017-12-01 | 2017-12-01 | FPC electrocondution slurry |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107809842A true CN107809842A (en) | 2018-03-16 |
Family
ID=61590300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711247310.3A Pending CN107809842A (en) | 2017-12-01 | 2017-12-01 | FPC electrocondution slurry |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107809842A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5099272B1 (en) * | 2011-12-26 | 2012-12-19 | パナソニック株式会社 | Multilayer wiring board and manufacturing method thereof |
| CN104479462A (en) * | 2014-12-23 | 2015-04-01 | 睿芯(大连)股份有限公司 | Conductive ink and application thereof |
| CN107301887A (en) * | 2017-05-14 | 2017-10-27 | 成都才盖科技有限公司 | A kind of silver-colored conductive silver paste composition of the novel solar battery back of the body and preparation method |
-
2017
- 2017-12-01 CN CN201711247310.3A patent/CN107809842A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5099272B1 (en) * | 2011-12-26 | 2012-12-19 | パナソニック株式会社 | Multilayer wiring board and manufacturing method thereof |
| CN104479462A (en) * | 2014-12-23 | 2015-04-01 | 睿芯(大连)股份有限公司 | Conductive ink and application thereof |
| CN107301887A (en) * | 2017-05-14 | 2017-10-27 | 成都才盖科技有限公司 | A kind of silver-colored conductive silver paste composition of the novel solar battery back of the body and preparation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180712 Address after: 621000 261 east section of Fei Yun Road, hi tech Zone, Mianyang, Sichuan. Applicant after: Mianyang Zhong Ye science and Technology Co., Ltd. Address before: No. 39, Sanjiang Avenue, Mianyang, Sichuan, Sichuan Applicant before: MIANYANG QIFAN TECHNOLOGY CO., LTD. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180316 |