CN107768324A - 具有冷却功能的车辆电力模块组件 - Google Patents

具有冷却功能的车辆电力模块组件 Download PDF

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CN107768324A
CN107768324A CN201710717974.5A CN201710717974A CN107768324A CN 107768324 A CN107768324 A CN 107768324A CN 201710717974 A CN201710717974 A CN 201710717974A CN 107768324 A CN107768324 A CN 107768324A
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radiator
vehicle electrical
electrical system
dielectric
coolant channel
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CN107768324B (zh
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雷光寅
迈克尔·W·德格内尔
纪昌俊
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Ford Global Technologies LLC
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H01L23/367Cooling facilitated by shape of device
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    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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    • H01ELECTRIC ELEMENTS
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Abstract

公开一种具有冷却功能的车辆电力模块组件。一种车辆电力系统可包括电力模块组件,所述电力模块组件具有布置成平台的多个交替的散热器和相脚。每个相脚均包括与介电层接触的半导体开关。介电层夹在所述开关和所述散热器中的一个之间,使得由所述开关产生的热经由介电层而传递到散热器。所述散热器中的至少一个可限定冷却剂通道。所述冷却剂通道可呈U形。所述冷却剂通道可具有入口区域和出口区域。所述入口区域可以与出口区域相对。所述冷却剂通道可具有将流入冷却剂路径和流出冷却剂路径分隔开的分隔件。所述冷却剂通道可具有形成曲折路径的阻扰件。所述阻扰件可以是波状翅片。

Description

具有冷却功能的车辆电力模块组件
技术领域
本公开涉及电力模块的冷却和设计。
背景技术
车辆可包括用于发电和推进的电机。发电和推进需要开关和控制器的组合来适当地控制电流。可堆叠开关以形成电力模块组件。电力模块组件的性能可由开关的冷却性能限制。
发明内容
一种车辆电力系统可包括电力模块组件,所述电力模块组件具有布置成平台的多个交替的散热器和相脚,每个相脚均包括被设置为与介电层接触的半导体开关,介电层夹在所述开关和所述散热器中的一个之间,使得由所述开关产生的热经由介电层而传递到散热器。所述散热器中的至少一个可限定冷却剂通道。所述冷却剂通道可呈U形。所述冷却剂通道可具有入口区域和出口区域。所述入口区域可以与出口区域相对。所述冷却剂通道可具有将流入冷却剂路径和流出冷却剂路径分隔开的分隔件。所述冷却剂通道可具有形成曲折路径的阻扰件。所述阻扰件可以是波状翅片。
一种用于构造电力模块组件的方法可包括交替地堆叠多个介电-相脚-介电三重体和散热器,使得每个散热器均被夹在一对介电-相脚-介电三重体之间。所述方法可包括使所述多个介电-相脚-介电三重体和散热器整体地固化,以融合所述介电-相脚-介电三重体和散热器,从而形成电力模块组件。所述散热器可限定冷却剂通道。所述方法可包括将冷却剂歧管附连到冷却剂通道。所述冷却剂歧管包括流入路径和流出路径。
附图说明
图1是电力模块组件的透视图;
图2是包括散热器(heatsink)、介电层(dielectric layer)以及开关的电力模块组件的侧视图;
图3是包括散热器、介电层以及开关的电力模块组件的侧视图;
图4A示出了具有最少的流体控制特征的贯通腔体式散热器(through cavityheatsink);
图4B示出了具有中央分隔件的贯通腔体式散热器;
图4C示出了具有中央分隔件和定向翅片(fin)或导向件的贯通腔体式散热器;
图5A示出了具有冷却剂通道和闭合顶部的闭合腔体式散热器;
图5B示出了具有U形冷却剂通道和闭合顶部的闭合腔体式散热器;
图5C示出了具有U形冷却剂通道、闭合顶部和定向翅片的闭合腔体式散热器;
图6A示出了容纳电力模块组件的电力模块组件底座(chasis);
图6B示出了以环氧树脂或树脂封装以保护电力模块组件的相脚(phase leg)的电力模块组件;
图6C示出了电力模块组件冷却剂歧管,所述歧管适于与电力模块组件配合以向冷却剂通道提供冷却剂。
具体实施方式
在此描述本公开的实施例。然而,应当理解的是,所公开的实施例仅为示例,其它实施例可采取多种替代形式。附图不一定按比例绘制;可夸大或最小化一些特征以示出特定组件的细节。因此,此处所公开的具体结构和功能细节不应被解释为限制,而仅仅作为用于教导本领域技术人员以多种形式利用本发明的代表性基础。如本领域普通技术人员将理解的,参照任一附图示出和描述的各个特征可与一个或更多个其它附图中示出的特征组合以产生未明确示出或描述的实施例。示出的特征的组合提供用于典型应用的代表性实施例。然而,与本公开的教导一致的特征的各种组合和变型可被期望用于特定的应用或实施方式。
车辆可包括用于发电和推进的电机。发电和推进需要开关和控制器的组合来适当地控制流向电机的电流。可堆叠开关以形成单元式电力模块组件。每个电力模块可包括H桥(H-bridge)的相脚。电力模块可被配置提供多余的开关用于增大的电流负载或给全H桥或半H桥提供额外的相脚。开关通常以热的形式释放电阻性损耗。热会在组件中累积,这限制了电力模块的吞吐量(throughput)。
可将散热器添加到组件,以散去在使用期间产生的热。散热器可附连到电力模块,以从模块汲取热。为了改善热传递,可使用具有高导热率的材料。例如,金属和金属合金具有高导热率。遗憾的是,具有高导热率的材料通常具有高导电率。高导电率可能不利于电力模块组件,高导电率使高电流和高电压通过。为了防止电力模块和散热器之间短路,可在散热器和电力模块之间放置介电材料。可选择具有高导热率和低导电率的介电材料。例如,可在介电层中嵌入金刚石以电绝缘而传导热。
使用电介质会要求电力模块的组件需要固化(curing)。其他电力模块组件设计可能要求针对组件的每个相脚完成电介质的固化。由于组件位置的轻微的变化可能会导致总体的大偏差,所以设计公差可能会要求对电力模块组件进行昂贵的制造。例如,制造过程的精确性可满足具有几个相脚的组件的设计公差,但是对于具有许多相脚的组件而言是不可接受的。为了满足工程公差,可使组件整体地固化。整体固化减少了制造过程中的变化,由于冷却的要求和设计约束,整体固化在以前是难以实现的。如所公开的,电力组件可提供充分的冷却并允许有成本效益的组件,同时满足设计约束。
该组件可被环氧树脂环围绕并在底座中密封。底座可包括冷却剂歧管。冷却剂歧管可具有位于底座的相同侧的入口和出口。在另一实施例中,冷却剂歧管可具有位于底座一侧的入口和位于底座的另一侧的出口。歧管可将冷却剂分配到每个冷却剂通道,以确保对开关的充分冷却。
电力模块组件可包括多个半导体开关。开关可位于一对介电层内,以形成介电-相脚-介电三重体(DPD triplet,dielectric-phase leg-dielectric triplet)。DPD三重体与散热器在任一侧面上结合,以去除来自相脚的开关在使用期间的热。多个DPD三重体和散热器可形成平台(deck)。平台可由从前向后堆叠的DPD三重体和散热器形成。
散热器可通过对流或传导来去除来自半导体开关的热。散热器可基于对流或传导而运行。散热器可限定用于热传导的冷却剂通道。冷却剂通道可以以各种方式构造。冷却剂通道可用作允许流体从一端流入并在另一端流出的通道。冷却剂通道的流入区域和流出区域可位于冷却剂通道上的任意地方。例如,流体可从通道的底部进入通道并从底部以90°离开。在另一示例中,流体还可沿相同方向进入并离开冷却剂通道。冷却剂通道被构造为允许冷却剂的流入和流出,以确保去除来自该电子器件的热。
冷却剂通道可具有被设计为控制流体流动或冷却剂流动的特征。所述特征可具有导流或扰流的各种实施方式。在一个实施例中,冷却剂通道可具有U形,以将流入位置和流出位置设置在同一端。在另一实施例中,入口区域和出口区域可以是相对的。冷却剂通道可包括将新加的冷却剂与耗用过的冷却剂分隔开的分隔件。例如,分隔件可具有匹配冷却剂的流量的尺寸。于是,在冷却剂或流体沿相似方向被排出之前,冷却剂或流体能够穿过整个通道。
现参照图1到图3,示出了电力模块组件100。该电力模块组件具有多个相脚或半导体开关102。半导体开关被夹在多个散热器106之间。尽管被示出为每个半导体开关102均被夹在散热器106之间,但是可使用更少的散热器106。介电层104可将半导体开关102与散热器106隔开。半导体开关102可位于一对介电层104内,以形成DPD三重体105。每个元件的尺寸可不同,以平衡热的去除和组件的尺寸。如所示出的,组件可根据组件的预期用途而具有几个相脚或许多相脚。
现参照图4A到图4C,散热器106可具有改善热传递的不同的构造。散热器106是具有在整个散热器106中限定的冷却剂通道108的贯通通道式腔体。组件歧管(未示出)可具有位于散热器106一侧的入口和位于散热器106相对侧的出口。散热器206是具有在整个散热器206中限定的冷却剂通道208的贯通通道式腔体。散热器206可包括分隔冷却剂或流体的分隔件210。在一些实施例中,冷却剂可被引导至相对侧或相邻侧,以进行再循环。分隔件210可将单独的流动路径212和214分隔开以限制热点。散热器306是具有在整个散热器306中限定的冷却剂通道308的贯通通道式腔体。散热器306可包括分隔冷却剂或流体的分隔件310。分隔件310可将单独的流动路径312和314分隔开以限制热点。散热器306可包括多个翅片或导向件316。翅片316被构造为搅动冷却剂流,以减少冷却剂流体的隔绝升温(isolatedwarming)。可使用任何类型的阻扰件(obstruction)来产生曲折路径并搅动冷却剂。作为非限制性示例,可使用销、翅片、挡块、导向件、挡板(baffle)或曲形件(curve)。
现参照图5A到图5C,U形散热器406可具有改善热传递的不同的构造。散热器406包括在整个散热器406中限定的U形冷却剂通道408。U形散热器406可具有位于散热器406一侧的入口或流入口和位于散热器406的相同侧的出口或流出口。散热器406可包括遮挡冷却剂通道408的一端的盖407。散热器506包括在整个散热器506中限定的U形冷却剂通道508。散热器506可包括分隔冷却剂或流体并形成U形冷却剂通道508的分隔件510。U形散热器506可具有位于散热器506一侧的入口或流入口512和位于散热器506的相同侧的出口或流出口514。分隔件510可将单独的流动路径512和514分隔开以限制热点。散热器506可包括遮挡冷却剂通道508的一端的盖507。散热器606包括在整个散热器606中限定的U形冷却剂通道608。散热器606可包括分隔冷却剂或流体并形成U形冷却剂通道608的分隔件610。U形散热器606可具有位于散热器606一侧的入口或流入口612和位于散热器606的相同侧的出口或流出口614。分隔件610可将单独的流动路径612和614分隔开以限制热点。散热器606可包括遮挡冷却剂通道608的一端的盖607。散热器606可包括多个翅片或导向件616。翅片616被构造为搅动冷却剂流,以减少冷却剂流体的隔绝升温。
现参照图6A到图6C,示出了用于歧管的底座101。底座可以是环氧树脂涂层的或保水(retention)材料。底座101可包括具有多个冷却剂通道108的电力模块组件100。冷却剂通道108可由组件100内的散热器形成。底座101还可包括冷却剂歧管103,冷却剂歧管103被构造为给冷却剂通道108供以冷却剂。冷却剂歧管103可包括引导冷却剂的流动的多个端口109。在另一实施例中,冷却剂歧管103可具有位于组件100的多个侧面上的多个端口109,以确保对开关的适当的冷却。
说明书中使用的词语为描述性词语而非限制性词语,并且应理解的是,在不脱离本公开的精神和范围的情况下可做出各种改变。如前所述,可将各种实施例的特征组合以形成本发明可能没有明确描述或示出的进一步的实施例。尽管各种实施例可能被描述为在一个或更多个期望特性方面提供优点或者优于其它实施例或现有技术实施方式,但是本领域普通技术人员应该认识到,根据具体应用和实施方式,一个或更多个特征或特性可被折衷,以实现期望的总体系统属性。这些属性可包括但不限于成本、强度、耐用性、生命周期成本、可销售性、外观、封装、尺寸、可维护性、重量、可制造性、易组装性等。因此,被描述为在一个或更多个特性方面不如其它实施例或现有技术实施方式合意的实施例并不在本公开的范围之外,并可被期望用于特定应用。

Claims (20)

1.一种车辆电力系统,包括:
电力模块组件,包括布置成平台的多个交替的散热器和相脚,每个相脚均包括被设置为与介电层接触的半导体开关,介电层夹在所述散热器中的一个和所述开关之间,使得由所述开关产生的热经由介电层而传递到散热器。
2.如权利要求1所述的车辆电力系统,其中,所述散热器中的每个均限定冷却剂通道。
3.如权利要求2所述的车辆电力系统,其中,所述冷却剂通道呈U形。
4.如权利要求2所述的车辆电力系统,其中,所述冷却剂通道具有入口区域和出口区域。
5.如权利要求4所述的车辆电力系统,其中,所述入口区域与所述出口区域相对。
6.如权利要求2所述的车辆电力系统,其中,所述冷却剂通道具有将流入冷却剂路径和流出冷却剂路径分隔开的分隔件。
7.如权利要求2所述的车辆电力系统,其中,所述冷却剂通道具有用于形成曲折路径的阻扰件。
8.如权利要求7所述的车辆电力系统,其中,所述阻扰件是波状翅片。
9.一种用于构造电力模块组件的方法,包括:
交替地堆叠多个介电-相脚-介电三重体和散热器,使得每个散热器均被夹在一对介电-相脚-介电三重体之间;
使所述多个介电-相脚-介电三重体和散热器整体地固化,以融合所述介电-相脚-介电三重体和散热器,从而形成电力模块组件。
10.如权利要求9所述的方法,其中,所述散热器限定冷却剂通道。
11.如权利要求10所述的方法,还包括将冷却剂歧管附连到冷却剂通道。
12.如权利要求11所述的方法,其中,所述冷却剂歧管包括流入路径和流出路径。
13.一种车辆电力系统,包括:
电力模块组件,包括与多个散热器交替地布置的多个介电-相脚-介电三重体,使得每个散热器均被夹在一对介电-相脚-介电三重体之间,每个介电-相脚-介电三重体均包括与介电-相脚-介电三重体的介电层接触的半导体开关,并且,每个介电层均被夹在所述散热器中的一个和半导体开关之间,使得半导体开关所产生的热经由介电层而传递到散热器。
14.如权利要求13所述的车辆电力系统,其中,所述散热器中的每个均限定冷却剂通道。
15.如权利要求14所述的车辆电力系统,其中,所述冷却剂通道呈U形。
16.如权利要求14所述的车辆电力系统,其中,所述冷却剂通道具有入口区域和出口区域。
17.如权利要求16所述的车辆电力系统,其中,所述入口区域与所述出口区域相对。
18.如权利要求14所述的车辆电力系统,其中,所述冷却剂通道具有将流入冷却剂路径和流出冷却剂路径分隔开的分隔件。
19.如权利要求14所述的车辆电力系统,其中,所述冷却剂通道具有用于形成曲折路径的阻扰件。
20.如权利要求19所述的车辆电力系统,其中,所述阻扰件是波状翅片。
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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11357139B2 (en) * 2019-04-24 2022-06-07 Hyundai Motor Corporation Cooling system for power conversion device
US10874037B1 (en) * 2019-09-23 2020-12-22 Ford Global Technologies, Llc Power-module assembly with cooling arrangement
US11134590B2 (en) * 2020-01-13 2021-09-28 Ford Global Technologies, Llc Automotive power inverter with cooling channels and cooling pins
US11502349B2 (en) 2020-08-31 2022-11-15 Borgwarner, Inc. Cooling manifold assembly

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5504378A (en) * 1994-06-10 1996-04-02 Westinghouse Electric Corp. Direct cooled switching module for electric vehicle propulsion system
US20020134419A1 (en) * 2000-09-18 2002-09-26 Chris Macris Heat dissipating IC devices
US20050259402A1 (en) * 2004-05-18 2005-11-24 Denso Corporation Power stack
US20080239663A1 (en) * 2007-03-27 2008-10-02 Denso Corporation Cooling device for electronic component and power converter equipped with the same
WO2012054041A1 (en) * 2010-10-21 2012-04-26 Hewlett-Packard Development Company, L.P. Metal-insulator transition switching devices
GB201503707D0 (en) * 2014-03-28 2015-04-22 Deere & Co Electronic assembly for an inverter
US20160056373A1 (en) * 2014-08-25 2016-02-25 Qualcomm Switch Corp. Integrated phase change switch

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002098454A (ja) * 2000-07-21 2002-04-05 Mitsubishi Materials Corp 液冷ヒートシンク及びその製造方法
DE60045389D1 (de) 2000-10-20 2011-01-27 Mitsubishi Electric Corp Kühlvorrichtung, halbleiterlaser-lichtquellenvorrichtung und halbleiterlaser-lichtquelleneinheit
JP4089595B2 (ja) 2002-12-16 2008-05-28 株式会社デンソー 冷媒冷却型両面冷却半導体装置
US7835151B2 (en) * 2004-11-24 2010-11-16 Danfoss Silicon Power Gmbh Flow distribution module and a stack of flow distribution modules
US7353859B2 (en) * 2004-11-24 2008-04-08 General Electric Company Heat sink with microchannel cooling for power devices
JP5392196B2 (ja) 2010-06-30 2014-01-22 株式会社デンソー 半導体装置
WO2014058501A1 (en) * 2012-10-11 2014-04-17 Laird Technologies, Inc. Systems and methods for cooling x-ray tubes and detectors
WO2017031596A1 (en) * 2015-08-27 2017-03-02 Dana Canada Corporation Heat exchanger with plate-like conduits for cooling electronic components
KR102519046B1 (ko) * 2015-10-05 2023-04-06 현대모비스 주식회사 수냉식 배터리 시스템의 냉각수 온도 조절 장치 및 방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5504378A (en) * 1994-06-10 1996-04-02 Westinghouse Electric Corp. Direct cooled switching module for electric vehicle propulsion system
US20020134419A1 (en) * 2000-09-18 2002-09-26 Chris Macris Heat dissipating IC devices
US20050259402A1 (en) * 2004-05-18 2005-11-24 Denso Corporation Power stack
US20080239663A1 (en) * 2007-03-27 2008-10-02 Denso Corporation Cooling device for electronic component and power converter equipped with the same
WO2012054041A1 (en) * 2010-10-21 2012-04-26 Hewlett-Packard Development Company, L.P. Metal-insulator transition switching devices
GB201503707D0 (en) * 2014-03-28 2015-04-22 Deere & Co Electronic assembly for an inverter
US20160056373A1 (en) * 2014-08-25 2016-02-25 Qualcomm Switch Corp. Integrated phase change switch

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