CN1077470A - The adhesion promoter that is used for photosensitive solder resist - Google Patents
The adhesion promoter that is used for photosensitive solder resist Download PDFInfo
- Publication number
- CN1077470A CN1077470A CN 93105071 CN93105071A CN1077470A CN 1077470 A CN1077470 A CN 1077470A CN 93105071 CN93105071 CN 93105071 CN 93105071 A CN93105071 A CN 93105071A CN 1077470 A CN1077470 A CN 1077470A
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- CN
- China
- Prior art keywords
- solder resist
- adhesion promoter
- tetramethylolmethane
- photosensitive solder
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The present invention relates to a kind of adhesion promoter that is used for photosensitive solder resist, belong to technical field of polymer chemistry.This promotor obtains by following reaction formula:
Wherein IV is tetramethylolmethane three-acrylate or tetramethylolmethane three-methacrylic ester, and V is Vanadium Pentoxide in FLAKES, phosphoric acid or Phosphorus Oxychloride, m=1 or 2, n=2 or 1, and m+n=3, R=H or-CH
3This promotor can be in the photocuring process fast setting, but also can improve the heat resistance of soldering-resistance layer, make soldering-resistance layer anti-comparatively high temps in welding process impact and not come off.
Description
The present invention relates to a kind of adhesion promoter that is used for the photosensitive solder resist of printed circuit board (PCB) production, belong to the organic molecular compound technical field.
In the printed circuit board (PCB) production process; in order to prevent in welding process to take tin, short circuit between lead or the figure; and parts are caused the decline of printing plate electrical property and are caused machinery breakdown by moisture, chemical atmosphere etc. in environment for use; need to use solder resist; so that the position that will not need to weld protects, and only solder joint is stayed.Press the difference of solidification process, solder resist can be divided into two kinds of thermohardening type and light-cured types.Photosensitive solder resist is an instantaneous solidification under UV-irradiation, owing to volumetric shrinkage in the solidification process local stress is increased thereby light-curable ink not high to the sticking power of base material, particularly on copper-clad plate, tin plate and figure and substrate intersection stress bigger, sticking power is poorer, thereby make the soldering-resistance layer thermal shock resistance poor, after welding, peel off or come off.Be head it off, the someone proposes to add a spot of adhesion promoter, to improve the sticking power of soldering-resistance layer and base material.For example, the Japanese Patent spy opens the compound that clear 54-110002 proposes to add following structure
(m=1 in the formula, 2, n=2,1, and m+n=3)
As adhesion promoter.But experiment shows that though this promotor can be improved the sticking power of soldering-resistance layer and base material effectively, adding then has considerable influence to the glossy black laser curing velocity of photocuring welding resistance, for example add 2.0% this kind promotor after, make the photocuring time from 30 " extending to 45 ".
The objective of the invention is to develop a kind of novel adhesion promoter that is used for photosensitive solder resist, can be in the photocuring process fast setting, but also can improve the heat resistance of soldering-resistance layer, make the thermal shocking of soldering-resistance layer anti-comparatively high temps in welding process and do not come off.
Content of the present invention is: the adhesion promoter that is used for photosensitive solder resist obtains by following reaction formula:
Wherein: IV is tetramethylolmethane three-acrylate or tetramethylolmethane three-methacrylic ester;
V is any in Vanadium Pentoxide in FLAKES, phosphoric acid or the Phosphorus Oxychloride;
M=1,2; N=2,1 and m+n=3;
R＝H，-CH
3
Mol ratio (the compound IV is in phosphoric acid) is between 1: 1 to 1: 2 when compound (IV) and compound (V) reaction.If the ratio that compound (IV) accounts for is too low, then product acidity influences the performance of solder resist film greatly, if the sticking power facilitation effect of the too high then product of compound (V) ratio is poor.Reaction does not need catalyzer.For making speed of response be easy to control, need to add solvent so that it evenly carries out.Solvent can select for use boiling point to be higher than gasoline, kerosene, benzene, normal hexane, toluene, dimethylbenzene of 80 ℃ etc.Solvent adding amount is 1-5 a times of raw material volume.Be reflected under the heating condition and carry out, temperature of reaction is controlled between 30-90 ℃, and too then speed of response is too slow at the end for temperature, and polymerization takes place Tai Gaoyi.Reaction should under agitation be carried out.Reaction adds the pyrophosphate that a spot of water generates with hydrolysis when finishing.It is that general formula is the mixture of (I) that reaction produces thing.The ratio of two kinds of components is decided by material molar ratio in this mixture.This mixture can be without separating the adhesion promoter that directly is used as photosensitive solder resist.Also can utilize the difference in solubility of its metal-salt that they are separated.
Enumerate the building-up process that several examples of implementation illustrate this adhesion promoter down.
Embodiment 1
In the 2000ml three-necked bottle of agitator, temperature regulator and dropping funnel is housed, add 71g P
2O
5, 700ml benzene and 298g tetramethylolmethane three-acrylate stir down and slowly are warming up to 65 ℃, and stopped reaction after reaction half an hour slowly drips 25ml water.Tell the benzene layer, and wash solid sediment three times with benzene, the combined benzene layer, 60 ℃ of following pressure reducing and steaming benzene get faint yellow oily thing 232g.
Embodiment 2
All the other conditions are with embodiment 1, but change tetramethylolmethane three-acrylate into tetramethylolmethane three-methacrylic ester, and its add-on is 510g, and other condition is the same, faint yellow fluid 381g.
For verifying the result of use of adhesion promoter of the present invention, use example for two below.In each example, prepare photosensitive solder resist, on three-roller, be ground to granularity then less than 20 μ m in listed composition and ratio.To prepare solder resist and be divided into three parts: 1 ° no longer adds other reagent, add the 2%(weight ratio in 2 °) compound of the present invention, 3 ° add the 2%(weight ratios) mixture (self-control) of mono phosphoric acid ester-(ethylene glycol vinylformic acid) ester and phosphoric acid pair-(ethylene glycol vinylformic acid) ester.Then respectively by silk screen process to plate, film thickness is 30 μ m, solidifies with high voltage mercury lamp, energy 80w/cm, irradiation distance are 15cm, the sticking power of cured film press GB9286-88 " cross-hatching " mensuration sticking power.Film hardness is measured by GB6739-86 " the pencil hardness test method of filming ", and " method 2, floating weldering method " processing among the GB4677.11 " printed board heatproof impact test method " is pressed in the test of soldering-resistance layer heatproof degree, surveys its sticking power by GB4677.7 " adhesive tape method " again.
Make use-case 1
Press column weight amount ratio and prepare photosensitive solder resist:
20 parts of bisphenol-a epoxy acrylates
5 parts of urethane acrylates
15 parts of Triethylene glycol diacrylates
15 parts of Viscoat 295s
11 parts of pentaerythritol triacrylates
3 parts of diethyl anthraquinones
1 part of phthalocyanine green
1 part of dimethyl silicone oil
28 parts of talcum powder
Gas phase SiO
21 part
The solder resist for preparing is divided into three parts, and wherein 1 °, 3 ° as previously mentioned, and 2 ° add embodiment 1 sintetics 2%.Test result is as follows:
Make use-case 2
Use-case 1 solder resist composition is identical with making, and is divided into three parts, and 1 °, 3 ° with making 1,2 ° of use-case add embodiment 2 synthetic products 2%, test result with make use-case 1 identical.
Claims (1)
1, a kind of adhesion promoter that is used for photosensitive solder resist is characterized in that described promotor obtains by following reaction formula:
Wherein IV is tetramethylolmethane three-acrylate or tetramethylolmethane three-methacrylic ester;
V is any in Vanadium Pentoxide in FLAKES, phosphoric acid or the Phosphorus Oxychloride;
m=1，2；
N=2,1; And m+n=3;
R=H，-CH
3
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 93105071 CN1077470A (en) | 1993-05-20 | 1993-05-20 | The adhesion promoter that is used for photosensitive solder resist |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 93105071 CN1077470A (en) | 1993-05-20 | 1993-05-20 | The adhesion promoter that is used for photosensitive solder resist |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1077470A true CN1077470A (en) | 1993-10-20 |
Family
ID=4985526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 93105071 Pending CN1077470A (en) | 1993-05-20 | 1993-05-20 | The adhesion promoter that is used for photosensitive solder resist |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1077470A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104086748A (en) * | 2014-06-27 | 2014-10-08 | 京东方科技集团股份有限公司 | Modified epoxy acrylate, photoresistor composition and preparation method thereof, transparent photoresistor |
| CN104250470A (en) * | 2014-09-03 | 2014-12-31 | 安徽雅美油墨有限公司 | Antistatic environment-friendly printing ink prepared by reutilizing waste plant oil residue |
| CN108196428A (en) * | 2018-01-29 | 2018-06-22 | 深圳市华星光电技术有限公司 | A kind of photoetching compositions and colored filter |
-
1993
- 1993-05-20 CN CN 93105071 patent/CN1077470A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104086748A (en) * | 2014-06-27 | 2014-10-08 | 京东方科技集团股份有限公司 | Modified epoxy acrylate, photoresistor composition and preparation method thereof, transparent photoresistor |
| US9772553B2 (en) | 2014-06-27 | 2017-09-26 | Boe Technology Group Co., Ltd. | Modified epoxy acrylate, photoresist composition and method for producing the same, transparent photoresist |
| CN104250470A (en) * | 2014-09-03 | 2014-12-31 | 安徽雅美油墨有限公司 | Antistatic environment-friendly printing ink prepared by reutilizing waste plant oil residue |
| CN104250470B (en) * | 2014-09-03 | 2016-05-18 | 安徽雅美油墨有限公司 | The antistatic environment-friendly ink of waste vegetable oil pin for a kind of huge profit |
| CN108196428A (en) * | 2018-01-29 | 2018-06-22 | 深圳市华星光电技术有限公司 | A kind of photoetching compositions and colored filter |
| CN108196428B (en) * | 2018-01-29 | 2020-03-31 | 深圳市华星光电技术有限公司 | Photoresist composition and color filter |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C01 | Deemed withdrawal of patent application (patent law 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |