CN107742618A - Preparation method, flexible panel and the display device of flexible panel - Google Patents

Preparation method, flexible panel and the display device of flexible panel Download PDF

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Publication number
CN107742618A
CN107742618A CN201711002040.XA CN201711002040A CN107742618A CN 107742618 A CN107742618 A CN 107742618A CN 201711002040 A CN201711002040 A CN 201711002040A CN 107742618 A CN107742618 A CN 107742618A
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China
Prior art keywords
substrate
flexible
reactive material
flexible substrate
gap
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CN201711002040.XA
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CN107742618B (en
Inventor
徐元杰
高山
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods

Abstract

The present invention discloses a kind of preparation method of flexible panel, including:One substrate is provided, is distributed hole on the first surface of the substrate;Reactive material is filled in described hole;Flexible substrate is formed on the first surface of the substrate;Display device layer is formed in the flexible substrate;The reactive material is handled, makes the reactive material that chemical change and/or physical change occur, gap is formed between the first surface of the substrate and the flexible substrate.Flexible panel is prepared using this method, technique is simple, and flexible substrate can be easily separated with substrate, the destruction of flexible substrate will not be caused to cause to show bad, and substrate can reuse, and be advantageous to volume production, save material.

Description

Preparation method, flexible panel and the display device of flexible panel
Technical field
The present invention relates to display technology field, more particularly to a kind of preparation method of flexible panel, flexible panel and shows Showing device.
Background technology
With the development of Display Technique, flexible display panels are progressively used in display technology field, for Flexible Displays Panel has the advantages that ultra-thin, light weight, durable, storage is big, design is free, can wind, and in recent years, flexible display technologies obtain Huge advance, it is widely used in showing on product.
, it is necessary to first adhere to flexible substrate on the glass substrate, then in flexible substrate in the preparation process of flexible panel The upper other structures for forming flexible display panels, are finally peeled off again.But existing stripping technology, easily to flexible substrate Damage, or excessive residue etc. is formed on flexible substrate surface, influence the electric property of flexible panel device, cause The problems such as yield declines.
The content of the invention
The invention provides a kind of preparation method of flexible panel, flexible panel and display device, to solve prior art Middle flexible substrate is difficult to separate with substrate, easily causes the problem of display is bad.
In a first aspect, the present invention provides a kind of preparation method of flexible panel, including:One substrate, the substrate are provided First surface on be distributed hole;
Reactive material is filled in described hole;
Flexible substrate is formed on the first surface of the substrate;
Display device layer is formed in the flexible substrate;
The reactive material is handled, makes the reactive material that chemical change and/or physical change occur, described Gap is formed between the first surface of substrate and the flexible substrate.
Alternatively, the reactive material includes organic matter and catalyst.
Alternatively, the substrate is the substrate that catalyst material is made, and the reactive material is organic matter.
Alternatively, the reactive material is handled, makes the reactive material that chemical change and/or physics change occur Change, gap is formed between the first surface of the substrate and the flexible substrate, including:
Illumination is carried out to the reactive material, the reactive material is decomposed and produces gas, described the of the substrate Gap is formed between one surface and the flexible substrate.
Alternatively, the reactive material is scalable material.
Alternatively, the reactive material is handled, makes the reactive material that chemical change and/or physics change occur Change, gap is formed between the first surface of the substrate and the flexible substrate, including:
The scalable material is handled, shrinks the scalable material, in first table of the substrate Gap is formed between face and the flexible substrate.
Alternatively, the scalable material is electrostriction material or magnetostriction material or photo-induced telescopic material.
Alternatively, the substrate is mesoporous substrate.
Second aspect, present invention also offers a kind of flexible panel, the flexible panel prepares to be formed using the above method.
The third aspect, present invention also offers a kind of display device, including above-mentioned flexible panel.
Compared with prior art, the embodiment of the present invention has advantages below:
The preparation method of the flexible panel of the embodiment of the present invention, reactive material is filled in the hole of substrate, to reactant Matter is acted on, and makes reactive material that chemical change and/or physical change occur, can be in the first surface with hole of substrate Gap is formed between flexible substrate, so that flexible substrate separates with substrate, flexible panel, technique letter are prepared using this method Single, flexible substrate can be easily separated with substrate, will not cause the destruction of flexible substrate cause to show it is bad, and substrate can repeat it is sharp With being advantageous to volume production, save material.
Brief description of the drawings
Fig. 1 show a kind of flow chart of the preparation method of the flexible panel of the invention for applying example;
Fig. 2-6 show a kind of structural representation of the different phase of the preparation process of flexible panel of the embodiment of the present invention Figure;
Fig. 7, which show reactant of embodiment of the present invention generation gas, makes substrate separate schematic diagram with flexible substrate;
Fig. 8, which show reactant of the embodiment of the present invention and shunk, makes substrate separate schematic diagram with flexible substrate.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is part of the embodiment of the present invention, rather than whole embodiments.Based on this hair Embodiment in bright, those of ordinary skill in the art's every other implementation acquired under the premise of creative work is not made Example, belongs to the scope of protection of the invention.
It is a kind of flow chart of the preparation method of flexible panel of the embodiment of the present invention as shown in Figure 1, Fig. 2-6 is to prepare The structural representation of different phase in journey.Referring to Figures 1 and 2-6, the system of flexible panel according to an embodiment of the invention Preparation Method comprises the following steps:
Step 100 a, there is provided substrate, be distributed hole on the first surface of substrate.
Shown in reference picture 2, for the structural representation of substrate corresponding to the step, hole 11 is distributed on the base 1, it is corresponding Size, the quantity present invention of hole are not limited, however, to ensure that good separating effect, hole is uniformly distributed most preferably.Base The material at bottom generally selects glass material, but can also be according to the substrate being actually needed from unlike material.
Step 200, reactive material is filled in hole.
Shown in reference picture 3, for the corresponding structural representation of the step, reactant is filled with the hole 11 of substrate 1 Chemical change and/or physical change can occur under certain condition for matter 12, the reactive material so that the first surface of substrate with Gap is formed between flexible substrate.
Step 300, flexible substrate is formed on the first surface of substrate.
Shown in reference picture 4, for structural representation corresponding to the step, flexible substrate 2 can be made up of polyimides (PI), It can also be made up of other flexible materials, this present invention is not limited.
Step 400, display device layer is formed on flexible substrates.
Shown in reference picture 5, for structural representation corresponding to the step, it is to be understood that display device layer 3 can include Such as film crystal tube drive circuit, image element circuit, organic luminous layer, common electrode layer various functions Rotating fields, can also be wrapped The structures such as detection circuit, drive circuit are included, this present invention is not limited, and it is that those skilled in the art are known to form said structure Technique, will not be repeated here.
Step 500, reactive material is handled, makes reactive material that chemical change and/or physical change occur, in substrate First surface and flexible substrate between form gap.
Shown in reference picture 6, for structural representation corresponding to the step, when the reactive material 12 being filled in hole 11 occurs When chemical change and/or physical change, cause to produce gap between substrate 1 and flexible substrate 2, adhesion therebetween subtracts It is small, the two separation may finally be made.
Can reduce adhesion therebetween it is understood that producing gap between substrate 1 and flexible substrate 2, If the generation chemical change of reactant and/or physical change can be directly separated the two, strip operation is not needed, if reaction When thing occurs chemical change and/or physical change and can not be directly separated the two, then the mechanical stripping by prior art is needed Method, substrate 1 is set to be separated with flexible substrate 2, because gap therebetween be present, adhesion substantially reduces, interior caused by stripping Stress is smaller, is not easy to damage flexible substrate.
The preparation method of the flexible panel of the embodiment of the present invention, reactive material is filled in the hole of substrate, to reactant Matter is handled, and makes reactive material that chemical change and/or physical change occur, can be in the first surface with hole of substrate Gap is formed between flexible substrate, so that flexible substrate separates with substrate, flexible panel, flexible liner are prepared using this method Bottom can be easily separated with substrate, the destruction of flexible substrate will not be caused to cause to show bad, and substrate can reuse, and be advantageous to Volume production, save material.
In one embodiment of this invention, shown in reference picture 7, above-mentioned substrate 11 can be mesoporous substrate, mesoporous substrate tool There are larger specific surface area, relatively large aperture and regular pore passage structure, larger molecule or group can be handled, be very Good shape-selective catalyst, reactant is filled in mesoporous substrate, can be uniformly distributed reactant, uniform force when making stripping. In the mesoporous middle above-mentioned reactant 11 of filling of mesoporous substrate, above-mentioned reactant 11 can specifically include organic matter and catalyst.Have Machine thing and catalyst can decompose under certain condition produces gas 13, makes to form gap between substrate 1 and flexible substrate 2.Tool Body, organic matter can be anion neopelex (DBS) or cation benzene lauryl ammonium chloride (BDDAC), Catalyst is titanium dioxide (TiO2), use TiO2Oxide and aldehyde can be formed under illumination condition by being catalyst, DBS or BDDAC Deng intermediate product, final carbonization is carbon dioxide (CO2), CO caused by organic matter decomposition2Gas makes substrate 1 and flexible liner Gap is formed between bottom 2, substrate 1 is separated with flexible substrate 2.
Mesoporous substrate in above-described embodiment can specifically select the mesoporous substrate of catalyst material, such as use TiO2It is made Mesoporous substrate, then it is mesoporous in 11 addition organic matters of reactive material, specific organic matter can be DBS or BDDAC, Likewise, under illumination condition, it is mesoporous in organic matter DBS or BDDAC in TiO2Catalytic action under decompose release CO2, make base Gap is formed between bottom 1 and flexible substrate 2, substrate 1 is separated with flexible substrate 2.
In above-described embodiment, organic matter and catalyst discharge gas 13 under illumination effect, and gas release is uniform, therefore, Internal stress caused by being separated in substrate 1 with flexible substrate 2 is smaller, will not produce destruction to flexible substrate 2, and when substrate 1 with Flexible substrate 2 separates, and after completing the preparation of flexible panel, substrate 1 can reuse, and is advantageous to volume production, saves material.
In another embodiment of the invention, it is substrate and flexibility that reactive material is scalable material shown in reference picture 8 Substrate separates schematic diagram, and the reactive material 12 filled in the hole 11 of substrate 1 is specifically as follows scalable material, to collapsible Material is handled, and shrinks shrinkable substance, forms gap 14 in the opening position of hole 11 of substrate 1 and flexible substrate 2, finally Substrate 1 can be made to be separated with flexible substrate 2.
In this embodiment, substrate 1 can be mesoporous substrate, and the material of substrate 1 can select conventional substrate of glass, The substrate of other materials can be selected, on the other hand, the present embodiment is not limited, scalable material is specifically as follows electrostriction material Or magnetostriction material or photo-induced telescopic material.
When flexible material is electrostriction material, such as mud magnesium lead plumbate system (PMN), lanthanum zirconium titanium acid lead (PLZT), niobium zincic acid The material that the binary such as lead (PZN), ternary solid solution material are formed, by changing the electric field of the local environment of substrate 1, when electric field reaches During preset value, it can shrink electrostriction material, produce uniform gap, make the bonding force between substrate 1 and flexible substrate 2 It is greatly reduced, so as to be easier to separate;When flexible material is magnetostriction material, such as Ni-Zn-Co ferrite magnetostriction The material of the compositions such as material, pure nickel, nickel cobalt (alloy), iron-nickel alloy, ferroaluminium, ferrocobalt, by changing ring residing for substrate 1 The magnetic field intensity in border, when electric field reaches preset value, can make magnetostriction material shrink, produce uniform gap, make substrate 1 with Flexible substrate 2 separates;When flexible material is photo-induced telescopic material, such as lanthanum zirconium titanium acid lead (PLZT) material after polarizing, pass through Change the light intensity of the local environment of substrate 1, when light intensity reaches preset value, can shrink photo-induced telescopic material, production Raw uniform gap, makes substrate 1 be separated with flexible substrate 2.
In above-described embodiment, scalable material is filled in the hole of substrate, scalable material under certain condition can be with Shrink so that forming gap between substrate and flexible substrate, interstitial site is more, and is evenly distributed, and can make substrate and flexibility The bonding force of substrate is greatly reduced, and can be easily separated the two, and scalable material can restore to the original state again under other conditions, base Bottom can reuse, and save material.
It is appreciated that above-mentioned is only for example, not forming to the present invention to the specific kind of of scalable material Limitation, scalable material can also be other materials scalable material, to this present invention be not limited.
The embodiment of the present invention additionally provides a kind of flexible panel, and the flexible panel is the method using any of the above-described embodiment It is prepared.
The embodiment of the present invention additionally provides a kind of display device, including above-mentioned flexible panel.
Each embodiment in this specification is described by the way of progressive, what each embodiment stressed be with The difference of other embodiment, between each embodiment identical similar part mutually referring to.For system embodiment For, because it is substantially similar to embodiment of the method, so description is fairly simple, referring to the portion of embodiment of the method in place of correlation Defend oneself bright.
Although preferred embodiments of the present invention have been described, but those skilled in the art once know basic creation Property concept, then can make other change and modification to these embodiments.So appended claims be intended to be construed to include it is excellent Select embodiment and fall into having altered and changing for range of embodiment of the invention.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be defined by scope of the claims.

Claims (10)

  1. A kind of 1. preparation method of flexible panel, it is characterised in that including:
    One substrate is provided, is distributed hole on the first surface of the substrate;
    Reactive material is filled in described hole;
    Flexible substrate is formed on the first surface of the substrate;
    Display device layer is formed in the flexible substrate;
    The reactive material is handled, makes the reactive material that chemical change and/or physical change occur, in the substrate The first surface and the flexible substrate between form gap.
  2. 2. according to the method for claim 1, it is characterised in that the reactive material includes organic matter and catalyst.
  3. 3. according to the method for claim 1, it is characterised in that the substrate is the substrate that catalyst material is made, described Reactive material is organic matter.
  4. 4. according to the method in claim 2 or 3, it is characterised in that the reactive material is handled, makes the reaction Chemical change and/or physical change occur for material, are formed between the first surface of the substrate and the flexible substrate Gap, including:
    Illumination is carried out to the reactive material, the reactive material is decomposed and produces gas, in first table of the substrate Gap is formed between face and the flexible substrate.
  5. 5. according to the method for claim 1, it is characterised in that the reactive material is scalable material.
  6. 6. according to the method for claim 5, it is characterised in that the reactive material is handled, makes the reactant Chemical change and/or physical change occur for matter, between being formed between the first surface of the substrate and the flexible substrate Gap, including:
    The scalable material is handled, shrinks the scalable material, the substrate the first surface with Gap is formed between the flexible substrate.
  7. 7. according to the method for claim 5, it is characterised in that the scalable material is that electrostriction material or mangneto are stretched Contracting material or photo-induced telescopic material.
  8. 8. according to the method for claim 1, it is characterised in that the substrate is mesoporous substrate.
  9. 9. a kind of flexible panel, it is characterised in that the flexible panel is prepared using the method described in claim any one of 1-8 Formed.
  10. 10. a kind of display device, it is characterised in that including the flexible panel described in claim 9.
CN201711002040.XA 2017-10-24 2017-10-24 Preparation method of flexible panel, flexible panel and display device Active CN107742618B (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109037152A (en) * 2018-08-09 2018-12-18 京东方科技集团股份有限公司 A kind of production method of flexible display panels, flexible display panels and display device
CN109216572A (en) * 2018-09-17 2019-01-15 京东方科技集团股份有限公司 A kind of flexible compound film and preparation method thereof, flexible base board, display device
CN110299466A (en) * 2019-06-17 2019-10-01 纳晶科技股份有限公司 A kind of substrate and stripping means
CN111276637A (en) * 2020-03-19 2020-06-12 合肥鑫晟光电科技有限公司 Flexible display substrate, manufacturing method thereof and display device
US11086155B2 (en) 2019-07-04 2021-08-10 Boe Technology Group Co., Ltd. Flexible device and method of manufacturing the same, and display apparatus
WO2022047895A1 (en) * 2020-09-03 2022-03-10 深圳市华星光电半导体显示技术有限公司 Flexible substrate and manufacturing method therefor, and flexible display device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103441087A (en) * 2013-03-22 2013-12-11 友达光电股份有限公司 Method and device for manufacturing flexible substrate
CN104409408A (en) * 2014-12-02 2015-03-11 昆山国显光电有限公司 Manufacture method of rigid substrate and flexible display
CN104880846A (en) * 2015-06-15 2015-09-02 京东方科技集团股份有限公司 Flexible substrate, production method thereof and display device
CN105428312A (en) * 2015-11-18 2016-03-23 上海大学 Production and separation method for flexible substrate
CN105690974A (en) * 2016-01-21 2016-06-22 京东方科技集团股份有限公司 Flexible thin film attaching method, flexible thin film stripping method, flexible substrate preparation method and base substrate
CN105702625A (en) * 2016-04-12 2016-06-22 武汉华星光电技术有限公司 Stripping method for flexible substrate
CN106711049A (en) * 2016-12-22 2017-05-24 武汉华星光电技术有限公司 Porous substrate and manufacturing method thereof and manufacturing method of thin film transistor

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103441087A (en) * 2013-03-22 2013-12-11 友达光电股份有限公司 Method and device for manufacturing flexible substrate
CN104409408A (en) * 2014-12-02 2015-03-11 昆山国显光电有限公司 Manufacture method of rigid substrate and flexible display
CN104880846A (en) * 2015-06-15 2015-09-02 京东方科技集团股份有限公司 Flexible substrate, production method thereof and display device
CN105428312A (en) * 2015-11-18 2016-03-23 上海大学 Production and separation method for flexible substrate
CN105690974A (en) * 2016-01-21 2016-06-22 京东方科技集团股份有限公司 Flexible thin film attaching method, flexible thin film stripping method, flexible substrate preparation method and base substrate
CN105702625A (en) * 2016-04-12 2016-06-22 武汉华星光电技术有限公司 Stripping method for flexible substrate
CN106711049A (en) * 2016-12-22 2017-05-24 武汉华星光电技术有限公司 Porous substrate and manufacturing method thereof and manufacturing method of thin film transistor

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109037152A (en) * 2018-08-09 2018-12-18 京东方科技集团股份有限公司 A kind of production method of flexible display panels, flexible display panels and display device
CN109216572A (en) * 2018-09-17 2019-01-15 京东方科技集团股份有限公司 A kind of flexible compound film and preparation method thereof, flexible base board, display device
CN110299466A (en) * 2019-06-17 2019-10-01 纳晶科技股份有限公司 A kind of substrate and stripping means
US11086155B2 (en) 2019-07-04 2021-08-10 Boe Technology Group Co., Ltd. Flexible device and method of manufacturing the same, and display apparatus
CN110310914B (en) * 2019-07-04 2021-12-31 京东方科技集团股份有限公司 Flexible device and manufacturing method thereof, and flexible device
CN111276637A (en) * 2020-03-19 2020-06-12 合肥鑫晟光电科技有限公司 Flexible display substrate, manufacturing method thereof and display device
CN111276637B (en) * 2020-03-19 2023-08-25 合肥鑫晟光电科技有限公司 Flexible display substrate, manufacturing method thereof and display device
WO2022047895A1 (en) * 2020-09-03 2022-03-10 深圳市华星光电半导体显示技术有限公司 Flexible substrate and manufacturing method therefor, and flexible display device
US11925099B2 (en) 2020-09-03 2024-03-05 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Flexible substrate, manufacturing method thereof, and flexible display device

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