CN107742615B - Intelligent tool structure for integrated circuit packaging - Google Patents
Intelligent tool structure for integrated circuit packaging Download PDFInfo
- Publication number
- CN107742615B CN107742615B CN201711136180.6A CN201711136180A CN107742615B CN 107742615 B CN107742615 B CN 107742615B CN 201711136180 A CN201711136180 A CN 201711136180A CN 107742615 B CN107742615 B CN 107742615B
- Authority
- CN
- China
- Prior art keywords
- tool body
- tool
- integrated circuit
- side plate
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 13
- 238000004140 cleaning Methods 0.000 claims abstract description 17
- 239000000126 substance Substances 0.000 claims abstract description 7
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000009439 industrial construction Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 21
- 230000006698 induction Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005520 cutting process Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 230000007306 turnover Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 2
- 235000016936 Dendrocalamus strictus Nutrition 0.000 description 1
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Abstract
The invention discloses an integrated circuit packaging intelligent chemical structure, which comprises a tool body, wherein the tool body comprises four side plates which are enclosed into a rectangle, the inner surfaces of two opposite side plates are provided with matched grooves, the outer surface of the tool body is provided with a group of positioning structures, the outer surface of the side plate is also provided with an RF identification sensing module, an on-line identification bar code and a cutting port, the side plate is also provided with a plurality of plasma cleaning flow passage ports for cleaning objects in the tool body, and the cleaning flow passage ports are in one-to-one correspondence with the grooves. The risk of manual identification errors in the production process is avoided through intelligent remote RF identification induction; the induction recognition and positioning structure and the positioning and robot grabbing structure on the tool can realize production automation; the plasma cleaning flow passage structural design can effectively enhance the cleaning effect of the product in the tool, so that the product is cleaned more comprehensively.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging, in particular to an intelligent chemical structure.
Background
Most of the existing integrated circuit packaging tools are in a cartridge clip structure, as shown in fig. 1, and mainly comprise a frame body surrounded by four side plates, wherein a plurality of grooves are formed in the frame body for loading articles, and in the actual production process of semiconductor packaging, the cartridge clip tools are used as production main transportation and turnover carriers to participate in most of the packaging production processes, such as: the whole process participates in the production of chip loading link, the production of bonding wire link and the production of plastic packaging ring segment, and the existing structure needs a large amount of manpower to participate in the production at present, such as: the initial positioning of the cartridge clip needs manual positioning, and the information of the cartridge clip is also paper information. Under the condition, the production of the large-scale high-speed tablet machine is complicated in operation of workers, low in efficiency, large in manual operation amount and large in manual work requirement.
Disclosure of Invention
The invention aims to solve the technical problems of low automation, low intellectualization and large manual demand of the existing integrated circuit packaging tool.
In order to solve the technical problems, the invention adopts the following technical scheme: the utility model provides an integrated circuit encapsulation intelligence industrial construction, includes the frock body, and it is including enclosing four curb plates of rectangle, and wherein two relative curb plate internal surfaces are provided with matched with recess and are used for placing the article, be provided with a set of location structure on the surface of one of its kind of curb plate of frock body, location structure is used for cooperating with external equipment and is used for fixing a position the frock body, still is provided with the RF discernment sensing module and the online discernment bar code of storing the inside article information of frock body on the surface of this curb plate, still be provided with on another curb plate of frock body and cut the arm that presss from both sides and get the frock body and cooperate, still be provided with a plurality of plasma cleaning runner mouth on this curb plate and be used for wasing the inside article of frock body, and wash runner mouth and recess one-to-one.
Further, the positioning mechanism comprises two circular positioning holes and a triangular positioning hole.
Further, the end part of the tool body is further provided with a rotatable fluctuation rod, a clamping groove for limiting the fluctuation rod and a fluctuation rod spring, one end of the fluctuation rod spring is fixed on the tool body, the other end of the fluctuation rod spring is fixed on the fluctuation rod, the clamping groove is positioned on the inner side of one of the side plates, and the fluctuation rod can rotate to the outer side of the side plate.
Furthermore, the clamping groove is arc-shaped, and the arc line where the clamping groove is located is on the rotation circumference of the fluctuation rod.
Further, the outer surface on the curb plate is provided with the direction instruction strip, and the instruction strip can rotate the setting.
From the technical scheme, the invention has the following advantages: traditional manual identification is banned by an intelligent remote RF identification induction structure, and the risk of manual identification errors in the production process is avoided; the induction identification and positioning structure and the positioning on the tool and the robot grabbing structure can realize production automation without manual transportation and turnover, so that a series of production problems caused by manual transportation are effectively avoided, the production efficiency is improved, and the labor cost is greatly reduced; the plasma cleaning flow passage structural design can effectively enhance the cleaning effect of the product in the tool, so that the product is cleaned more comprehensively; the invention realizes automation and transportation automation of the loading and unloading of the semiconductor packaging equipment, and lays a foundation for comprehensive and intelligent automation of the production of semiconductor packaging workshops.
Drawings
FIG. 1 side view of the present invention
FIG. 2 is a top view of the present invention;
fig. 3 is a schematic view of one side plate of the present invention.
Detailed Description
The following describes the embodiments of the present invention in detail with reference to the drawings.
As shown in fig. 1, 2 and 3, the integrated circuit package intelligent chemical structure of the invention comprises a tool body 5, which comprises four side plates enclosing a rectangle, wherein the inner surfaces of two opposite side plates are provided with matched grooves 9 for placing objects, the outer surface of one side plate of the tool body is provided with a group of positioning structures, the positioning structures are used for being matched with external equipment to position the tool body, and the positioning mechanisms comprise two circular positioning holes 6 and a triangular positioning hole 4. When the tool reaches a designated position, the positioning hole of the tool is matched with the positioning pin on the external equipment, so that the initial position of the tool is positioned.
The outer surface of the side plate is also provided with an RF identification induction module 2 for storing the information of the articles in the tool body and an online identification bar code 1. External equipment such as an intelligent mechanical arm recognizes product information in the tool by recognizing information stored in the RF recognition sensing module 2, and recognizes the tool body by scanning an online recognition bar code, thereby selecting a required tool.
The other side plate of the tool body 5 is also provided with a cut-in opening 7 which is matched with a mechanical arm for clamping the tool body, and the mechanical arm can stretch two clamping jaws into the cut-in opening, so that the clamping of the tool body is completed. The side plate is also provided with a plurality of plasma cleaning runner ports 8 for cleaning objects inside the tool body, cleaning is convenient, the cleaning runner ports are in one-to-one correspondence with the grooves, each object can be cleaned, the contact area is large, and no dead angle is left.
The tool is characterized in that a rotatable fluctuation rod 11, a clamping groove for limiting the fluctuation rod and a fluctuation rod spring 10 are further arranged at the end of the tool body, one end of the fluctuation rod spring 10 is fixed on the tool body, the other end of the fluctuation rod spring is fixed on the fluctuation rod 11, the clamping groove is located on the inner side of one side plate, and the fluctuation rod can rotate to the outer side of the side plate. The draw-in groove can be set up to convex, when the frock body received the material, can dial out the fluctuation pole, dials back when the material is full, can play the fender material effect. And the arc-shaped clamping groove is arranged, and the arc line where the clamping groove is positioned is arranged on the rotation circumference of the fluctuation rod.
The outer surface on the curb plate is provided with direction indicator 3, and indicator 3 can be fixed on the curb plate through the rivet to realize rotatory setting, thereby set up the arrow indication direction according to required direction.
The invention has the following advantages:
1. the intelligent remote RF identification induction structure bans the traditional manual identification and eliminates the risk of manual identification errors in the production process.
2. The induction recognition and positioning structure and the tooling are provided with the positioning and robot grabbing structure, so that production automation can be realized, manual transportation and turnover are not needed, a series of production problems caused by manual transportation are effectively avoided, the production efficiency is improved, and the labor cost is greatly reduced.
3. The plasma cleaning flow passage structural design can effectively enhance the cleaning effect of the product in the tool, so that the product is cleaned more comprehensively.
4. The design structure of the invention has stable operation in actual production and simple cooperation with the intelligent robot.
5. The invention realizes automation and transportation automation of the loading and unloading of the semiconductor packaging equipment, and lays a foundation for comprehensive and intelligent automation of the production of semiconductor packaging workshops.
Claims (5)
1. The utility model provides an integrated circuit encapsulation intelligence industrial construction, includes the frock body, and it is including enclosing four curb plates of rectangle, and wherein two relative curb plate internal surfaces are provided with matched with recess and are used for placing the article, characterized in that: the tool comprises a tool body, and is characterized in that a set of positioning structures are arranged on the outer surface of one side plate of the tool body, the positioning structures are used for being matched with external equipment to position the tool body, an RF identification sensing module for storing information of objects inside the tool body and an online identification bar code are further arranged on the outer surface of the side plate, an inlet is further formed in the other side plate of the tool body and is matched with a mechanical arm for clamping the tool body, a plurality of plasma cleaning flow passage openings are further formed in the side plate and are used for cleaning the objects inside the tool body, and the cleaning flow passage openings correspond to the grooves one by one.
2. The integrated circuit package intelligent chemical structure according to claim 1, wherein: the positioning structure comprises two circular positioning holes and a triangular positioning hole.
3. The integrated circuit package intelligent chemical structure according to claim 2, wherein: the tool is characterized in that a rotatable fluctuation rod, a clamping groove for limiting the fluctuation rod and a fluctuation rod spring are further arranged at the end part of the tool body, one end of the fluctuation rod spring is fixed on the tool body, the other end of the fluctuation rod spring is fixed on the fluctuation rod, the clamping groove is located on the inner side of one of the side plates, and the fluctuation rod can rotate to the outer side of the side plate.
4. The integrated circuit package intelligent chemical structure according to claim 3, wherein: the clamping groove is arc-shaped, and an arc line where the clamping groove is located is arranged on the rotating circumference of the fluctuation rod.
5. The integrated circuit package intelligent chemical structure according to claim 4, wherein: the outer surface on the curb plate is provided with the direction instruction strip, and the instruction strip rotates the setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711136180.6A CN107742615B (en) | 2017-11-16 | 2017-11-16 | Intelligent tool structure for integrated circuit packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711136180.6A CN107742615B (en) | 2017-11-16 | 2017-11-16 | Intelligent tool structure for integrated circuit packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107742615A CN107742615A (en) | 2018-02-27 |
| CN107742615B true CN107742615B (en) | 2024-03-29 |
Family
ID=61233422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711136180.6A Active CN107742615B (en) | 2017-11-16 | 2017-11-16 | Intelligent tool structure for integrated circuit packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107742615B (en) |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4724963A (en) * | 1985-02-20 | 1988-02-16 | Empak, Inc. | Wafer processing cassette |
| US5445171A (en) * | 1992-09-25 | 1995-08-29 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor cleaning apparatus and wafer cassette |
| CN1163683A (en) * | 1994-10-11 | 1997-10-29 | 渐进系统技术公司 | Substrate housing and docking system |
| KR20000014481U (en) * | 1998-12-30 | 2000-07-25 | 마이클 디. 오브라이언 | Magazine for Semiconductor Package |
| CN1408621A (en) * | 2001-09-29 | 2003-04-09 | 索尼电脑娱乐公司 | Packaging box, method for producing said packaging box, method for using said package box and method for reading information on said package box |
| JP2003133407A (en) * | 2001-10-29 | 2003-05-09 | Disco Abrasive Syst Ltd | Cassette discriminating device and plate-shape work loading/unloading system |
| JP2006282242A (en) * | 2005-04-01 | 2006-10-19 | Dainippon Printing Co Ltd | Packing method for non-contact ic tag, and cushioning sheet for packin non-contact ic tag |
| JP2007157998A (en) * | 2005-12-05 | 2007-06-21 | Miraial Kk | Installation tray and sheet holding container |
| JP2008112804A (en) * | 2006-10-30 | 2008-05-15 | Shin Etsu Polymer Co Ltd | Wafer cassette |
| JP2009302414A (en) * | 2008-06-17 | 2009-12-24 | Shin Etsu Polymer Co Ltd | Substrate storing container |
| KR101496303B1 (en) * | 2013-10-25 | 2015-03-02 | 표우열 | Magazine for semiconductor package |
| DE202015104876U1 (en) * | 2015-09-14 | 2015-10-19 | Chung King Enterprise Co., Ltd. | Substrate carrier for solar cells |
| CN205613783U (en) * | 2016-05-14 | 2016-10-05 | 东莞伟时科技有限公司 | Adjustable washs tool basket |
| CN106847734A (en) * | 2017-03-23 | 2017-06-13 | 江苏吉星新材料有限公司 | A kind of Sapphire Substrate cleans basket device |
| CN207765408U (en) * | 2017-11-16 | 2018-08-24 | 无锡麟力科技有限公司 | Integrated antenna package intelligence tool structure |
-
2017
- 2017-11-16 CN CN201711136180.6A patent/CN107742615B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4724963A (en) * | 1985-02-20 | 1988-02-16 | Empak, Inc. | Wafer processing cassette |
| US5445171A (en) * | 1992-09-25 | 1995-08-29 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor cleaning apparatus and wafer cassette |
| CN1163683A (en) * | 1994-10-11 | 1997-10-29 | 渐进系统技术公司 | Substrate housing and docking system |
| KR20000014481U (en) * | 1998-12-30 | 2000-07-25 | 마이클 디. 오브라이언 | Magazine for Semiconductor Package |
| CN1408621A (en) * | 2001-09-29 | 2003-04-09 | 索尼电脑娱乐公司 | Packaging box, method for producing said packaging box, method for using said package box and method for reading information on said package box |
| JP2003133407A (en) * | 2001-10-29 | 2003-05-09 | Disco Abrasive Syst Ltd | Cassette discriminating device and plate-shape work loading/unloading system |
| JP2006282242A (en) * | 2005-04-01 | 2006-10-19 | Dainippon Printing Co Ltd | Packing method for non-contact ic tag, and cushioning sheet for packin non-contact ic tag |
| JP2007157998A (en) * | 2005-12-05 | 2007-06-21 | Miraial Kk | Installation tray and sheet holding container |
| JP2008112804A (en) * | 2006-10-30 | 2008-05-15 | Shin Etsu Polymer Co Ltd | Wafer cassette |
| JP2009302414A (en) * | 2008-06-17 | 2009-12-24 | Shin Etsu Polymer Co Ltd | Substrate storing container |
| KR101496303B1 (en) * | 2013-10-25 | 2015-03-02 | 표우열 | Magazine for semiconductor package |
| DE202015104876U1 (en) * | 2015-09-14 | 2015-10-19 | Chung King Enterprise Co., Ltd. | Substrate carrier for solar cells |
| CN205613783U (en) * | 2016-05-14 | 2016-10-05 | 东莞伟时科技有限公司 | Adjustable washs tool basket |
| CN106847734A (en) * | 2017-03-23 | 2017-06-13 | 江苏吉星新材料有限公司 | A kind of Sapphire Substrate cleans basket device |
| CN207765408U (en) * | 2017-11-16 | 2018-08-24 | 无锡麟力科技有限公司 | Integrated antenna package intelligence tool structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107742615A (en) | 2018-02-27 |
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