CN107735473A - Packaging plastic for solar opto-electronic board - Google Patents
Packaging plastic for solar opto-electronic board Download PDFInfo
- Publication number
- CN107735473A CN107735473A CN201780001758.9A CN201780001758A CN107735473A CN 107735473 A CN107735473 A CN 107735473A CN 201780001758 A CN201780001758 A CN 201780001758A CN 107735473 A CN107735473 A CN 107735473A
- Authority
- CN
- China
- Prior art keywords
- packaging plastic
- weight
- electronic board
- solar opto
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 32
- 229920003023 plastic Polymers 0.000 title claims abstract description 32
- 239000004033 plastic Substances 0.000 title claims abstract description 32
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 22
- 229920001577 copolymer Polymers 0.000 claims abstract description 7
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 6
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 6
- 239000004642 Polyimide Substances 0.000 claims abstract description 5
- 229920001721 polyimide Polymers 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 4
- 229920006226 ethylene-acrylic acid Polymers 0.000 claims description 7
- -1 hydroxyl ethyl Chemical group 0.000 claims description 7
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000178 monomer Substances 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims description 2
- CSSYLTMKCUORDA-UHFFFAOYSA-N barium(2+);oxygen(2-) Chemical compound [O-2].[Ba+2] CSSYLTMKCUORDA-UHFFFAOYSA-N 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims 1
- 125000004494 ethyl ester group Chemical group 0.000 claims 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 abstract description 5
- 238000002834 transmittance Methods 0.000 abstract description 4
- 230000004048 modification Effects 0.000 abstract description 3
- 238000012986 modification Methods 0.000 abstract description 3
- ZNCPFRVNHGOPAG-UHFFFAOYSA-L sodium oxalate Chemical compound [Na+].[Na+].[O-]C(=O)C([O-])=O ZNCPFRVNHGOPAG-UHFFFAOYSA-L 0.000 abstract description 3
- 229940039790 sodium oxalate Drugs 0.000 abstract description 3
- 239000012752 auxiliary agent Substances 0.000 abstract description 2
- 239000005977 Ethylene Substances 0.000 abstract 2
- 239000005336 safety glass Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 206010023126 Jaundice Diseases 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Photovoltaic Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
This case discloses a kind of packaging plastic for solar opto-electronic board, includes the material of following parts by weight：The parts by weight of polyethyl methacrylate 50；The parts by weight of polyimides 50；The parts by weight of ethylene acrylic hydroxyl ethyl ester copolymer 1 0~12；The parts by weight of polyethylene glycol 5~6 and the parts by weight of sodium oxalate 2~3.This case improves the weather resistance of packaging plastic by introducing polyimides in polyethyl methacrylate system；Simultaneously, ethylene acrylic hydroxyl ethyl ester copolymer, polyethylene glycol and sodium oxalate are as Aided Modification auxiliary agent, the weatherability and stability for improving packaging plastic can not only be cooperateed with, adhesion strength of the packaging plastic when being exposed to outdoor for a long time can also be effectively improved, reduce the packaging plastic influence to light transmittance in itself, ensure the generating efficiency and service life of photovoltaic panel.
Description
Technical field
The present invention relates to one kind to encapsulate PUR, and in particular to one kind is used to bond in solar opto-electronic board assembly technology
The packaging plastic of safety glass and cell piece.
Background technology
In solar energy photovoltaic panel, power generation main body is crystalline silicon battery plate, in order to protect this cell piece, it is necessary in battery
Transparent safety glass is covered once on piece, and connect this safety glass and cell piece is exactly packaging plastic.In the prior art,
Mainly using EVA resin as this encapsulation PUR, but EVA exposes jaundice easy to aging in atmosphere, can influence light transmittance, from
And influence generating efficiency, also, when being exposed to for a long time in air, EVA and safety glass, cell piece adhesion strength also can be significantly
Decline, so as to influence the life-span of photovoltaic board component.
The content of the invention
In view of the deficiencies of the prior art, it is an object of the invention to provide a kind of encapsulation for solar opto-electronic board
Glue, it has high light transmittance, excellent resistance to ag(e)ing, weatherability and high bond strength.
Technical scheme is summarized as follows：
A kind of packaging plastic for solar opto-electronic board, include the material of following parts by weight：
Preferably, the described packaging plastic for solar opto-electronic board, wherein, the ethylene-acrylic acid hydroxyl ethyl ester is total to
In polymers, the content of vinyl monomer is 33~35wt%, and remaining is Vinyl Acetate Monomer.
Preferably, the described packaging plastic for solar opto-electronic board, wherein, the ethylene-acrylic acid hydroxyl ethyl ester is total to
The number-average molecular weight of polymers is 16000~20000g/mol.
Preferably, the described packaging plastic for solar opto-electronic board, wherein, the number of the polyethyl methacrylate
Average molecular weight is 30000~35000g/mol.
Preferably, the described packaging plastic for solar opto-electronic board, wherein, the number-average molecular weight of the polyimides
For 23000~26000g/mol.
Preferably, the described packaging plastic for solar opto-electronic board, wherein, the number-average molecular weight of the polyethylene glycol
For 4000~5000g/mol.
Preferably, the described packaging plastic for solar opto-electronic board, wherein, include the oxygen of 0.2~0.3 parts by weight
Change barium.
Preferably, the described packaging plastic for solar opto-electronic board, wherein, include the oxygen of 0.2~0.3 parts by weight
Change magnesium.
The beneficial effects of the invention are as follows：This case is improved by introducing polyimides in polyethyl methacrylate system
The weather resistance of packaging plastic；Meanwhile ethylene-acrylic acid hydroxyl ethyl ester copolymer, polyethylene glycol and sodium oxalate are as Aided Modification
Auxiliary agent, it can not only cooperate with the weatherability and stability for improving packaging plastic, moreover it is possible to effectively improve packaging plastic and be exposed to family for a long time
Adhesion strength when outer, reduce the packaging plastic influence to light transmittance in itself, ensure the generating efficiency and service life of photovoltaic panel.
Embodiment
With reference to embodiment, the present invention is described in further detail, to make those skilled in the art with reference to specification
Word can be implemented according to this.
This case proposes the packaging plastic for solar opto-electronic board of an embodiment, includes the material of following parts by weight：
Wherein, in ethylene-acrylic acid hydroxyl ethyl ester copolymer, the content of vinyl monomer is preferably 33~35wt%, and remaining is
Vinyl Acetate Monomer.
Wherein, the number-average molecular weight of ethylene-acrylic acid hydroxyl ethyl ester copolymer is preferably 16000~20000g/mol.
Wherein, the number-average molecular weight of polyethyl methacrylate is preferably 30000~35000g/mol.Wherein, polyamides is sub-
The number-average molecular weight of amine is preferably 23000~26000g/mol.
Wherein, the number-average molecular weight of polyethylene glycol is preferably 4000~5000g/mol.
Wherein, it may preferably further comprise the barium monoxide of 0.2~0.3 parts by weight.
Wherein, it may preferably further comprise the magnesia of 0.2~0.3 parts by weight.
Table one lists the concrete composition and its performance parameter of the packaging plastic of different embodiments：
Table one
* limit tolerance time of ultraviolet irradiation/25W, 20 DEG C refer to：At 20 DEG C, irradiate, encapsulate under 25W UV intensity
Glue meets non-yellowing, does not harden, does not ftracture, the adhesion strength range of decrease is less than the 5% most long irradiation time that can bear.Following table is same.
Table two lists the concrete composition and its performance parameter of the packaging plastic of different comparative examples：
Table two
Although embodiment of the present invention is disclosed as above, it is not restricted in specification and embodiment listed
With it can be applied to various suitable the field of the invention completely, can be easily for those skilled in the art
Other modification is realized, therefore under the universal limited without departing substantially from claim and equivalency range, it is of the invention and unlimited
In specific details.
Claims (8)
1. a kind of packaging plastic for solar opto-electronic board, include the material of following parts by weight：
2. the packaging plastic according to claim 1 for solar opto-electronic board, it is characterised in that the ethylene-acrylic acid
In hydroxyl ethyl ester copolymer, the content of vinyl monomer is 33~35wt%, and remaining is Vinyl Acetate Monomer.
3. the packaging plastic according to claim 1 for solar opto-electronic board, it is characterised in that the ethylene-acrylic acid
The number-average molecular weight of hydroxyl ethyl ester copolymer is 16000~20000g/mol.
4. the packaging plastic according to claim 1 for solar opto-electronic board, it is characterised in that the polymethylacrylic acid
The number-average molecular weight of ethyl ester is 30000~35000g/mol.
5. the packaging plastic according to claim 1 for solar opto-electronic board, it is characterised in that the number of the polyimides
Average molecular weight is 23000~26000g/mol.
6. the packaging plastic according to claim 1 for solar opto-electronic board, it is characterised in that the number of the polyethylene glycol
Average molecular weight is 4000~5000g/mol.
7. the packaging plastic according to claim 1 for solar opto-electronic board, it is characterised in that also including 0.2~0.3 weight
Measure the barium monoxide of part.
8. the packaging plastic according to claim 7 for solar opto-electronic board, it is characterised in that also including 0.2~0.3 weight
Measure the magnesia of part.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/086810 WO2018218594A1 (en) | 2017-06-01 | 2017-06-01 | Packaging adhesive for solar photovoltaic board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107735473A true CN107735473A (en) | 2018-02-23 |
Family
ID=61220309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780001758.9A Pending CN107735473A (en) | 2017-06-01 | 2017-06-01 | Packaging plastic for solar opto-electronic board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107735473A (en) |
| WO (1) | WO2018218594A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018218594A1 (en) * | 2017-06-01 | 2018-12-06 | 苏州佳亿达电器有限公司 | Packaging adhesive for solar photovoltaic board |
| CN114989748A (en) * | 2022-07-05 | 2022-09-02 | 苏州地枢新材料科技有限公司 | Adhesive for mounting luminous floor tiles and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1124754A (en) * | 1995-03-23 | 1996-06-19 | 张福增 | Flash set adhesive and its preparing process |
| CN101275059A (en) * | 2007-03-28 | 2008-10-01 | 刘萍 | Heat-resistant strippable micro-viscous pressure-sensitive adhesive film and preparation thereof |
| CN104745109A (en) * | 2015-04-16 | 2015-07-01 | 中天光伏材料有限公司 | White EVA adhesive film for photovoltaic module encapsulation |
| CN106010422A (en) * | 2016-06-29 | 2016-10-12 | 龚灿锋 | Binding agent for assembling solar panel |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5352716A (en) * | 1992-12-16 | 1994-10-04 | Ecostar International, L.P. | Degradable synthetic polymeric compounds |
| JP2005036077A (en) * | 2003-07-18 | 2005-02-10 | Sumitomo Chemical Co Ltd | Adhesive film |
| JP6427947B2 (en) * | 2014-05-15 | 2018-11-28 | 凸版印刷株式会社 | Gas barrier packaging materials |
| WO2018218594A1 (en) * | 2017-06-01 | 2018-12-06 | 苏州佳亿达电器有限公司 | Packaging adhesive for solar photovoltaic board |
-
2017
- 2017-06-01 WO PCT/CN2017/086810 patent/WO2018218594A1/en active Application Filing
- 2017-06-01 CN CN201780001758.9A patent/CN107735473A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1124754A (en) * | 1995-03-23 | 1996-06-19 | 张福增 | Flash set adhesive and its preparing process |
| CN101275059A (en) * | 2007-03-28 | 2008-10-01 | 刘萍 | Heat-resistant strippable micro-viscous pressure-sensitive adhesive film and preparation thereof |
| CN104745109A (en) * | 2015-04-16 | 2015-07-01 | 中天光伏材料有限公司 | White EVA adhesive film for photovoltaic module encapsulation |
| CN106010422A (en) * | 2016-06-29 | 2016-10-12 | 龚灿锋 | Binding agent for assembling solar panel |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018218594A1 (en) * | 2017-06-01 | 2018-12-06 | 苏州佳亿达电器有限公司 | Packaging adhesive for solar photovoltaic board |
| CN114989748A (en) * | 2022-07-05 | 2022-09-02 | 苏州地枢新材料科技有限公司 | Adhesive for mounting luminous floor tiles and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018218594A1 (en) | 2018-12-06 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180223 |