CN107734862A - A kind of construction method of three-dimensional paper substrate multifunctional circuit - Google Patents
A kind of construction method of three-dimensional paper substrate multifunctional circuit Download PDFInfo
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- CN107734862A CN107734862A CN201711234732.7A CN201711234732A CN107734862A CN 107734862 A CN107734862 A CN 107734862A CN 201711234732 A CN201711234732 A CN 201711234732A CN 107734862 A CN107734862 A CN 107734862A
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- board
- paper substrate
- paper
- circuit
- multifunctional circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0386—Paper sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of construction method of three-dimensional paper substrate multifunctional circuit.The paper substrate multifunctional circuit is made up of transmission board, division board and feature board three parts.Preparation process comprises the following steps:Design the integral layout of three-dimensional paper substrate multifunctional circuit;Solid state wax prints and dewaxing shaping;Grow golden nanometer particle;Secondary solid state wax print processing;Assembled folding.The paper circuit built using cheap, foldable paper base material as base material has certain flexibility, and flexible, foldable is environmentally friendly.The paper circuit prepared by this method not only has excellent transverse conductance performance, and overcomes the conductive problem in paper substrate longitudinal direction, is had broad application prospects in flexible electronic device field.
Description
Technical field
The present invention relates to a kind of three-dimensional paper substrate multifunctional circuit, belong to the preparing technical field of paper substrate circuit.
Background technology
In recent years, electronic product develops towards the direction of lightweight, flexibility, and traditional rigid circuit can not meet
The demand of current electronics.Paper base material main component is usually inert cellulose, abundance, cheap and easy to get, and having can
The advantages that regeneration, reusable edible, disposable, easily biological-degradable, it is easy to use and transport, is the good base for building flexible circuit
Bottom selects material.Paper substrate circuit have it is in light weight, biodegradable, three-dimensional circuit can be folded into, for following flexible electronic
The development of device has great importance.Therefore, the conductive ink related to paper substrate circuit, Study on Preparation Technology are carried out to closing again
Will.
Traditional method for preparing paper substrate circuit mainly paints painting, conductive matrices including printing, silk-screen printing, spin coating, pencil
The methods of transfer.Being had been obtained for by paper circuit prepared by above method in fields such as analysis detection, electronic device structures should
With.However, still suffering from that easy to fall off, cost is high, electrical conductivity is undesirable or the problems such as complex operation.Therefore, it is badly in need of development
A kind of method of structure paper substrate flexible circuit simple to operate, cost is cheap.
The content of the invention
The problem of for presently, there are, we select to grow conductive material in paper base material situ, pass through secondary solid state wax
Method of printing builds multi-functional-area, and by paper folding technology, constructs three-dimensional paper substrate multifunctional circuit.The invention provides one kind into
This three-dimensional paper substrate flexible circuit construction method cheap, simple to operate.This technique avoids using expensive mould and setting
Standby, the expanded application for the flexible electronic device based on paper base material is laid a good foundation.
The preparation method of the three-dimensional paper substrate multifunctional circuit has the characteristics of time saving, laborsaving, environment-friendly, specific to prepare step
It is rapid as follows:
1. use Photoshop CS6 either CorelDRAW X6 or Aillustrator CS6 Software for Design three-dimensional paper
The integral layout of Quito functional circuit.As shown in Figure 1, it is followed successively by from left to right along the long side direction of the paper substrate multifunctional circuit
Transmission board, division board and feature board.
2. the pattern for designing step 1 by solid state wax printer is printed on the copy paper of A4 sizes.
3. the paper that step 2 is obtained is placed in heating plate or baking oven, heat in 60-120 DEG C of environment
The 30-120 seconds so that the wax of printing melts and is impregnated with the thickness of whole paper in corresponding region, forms hydrophobic wall;Wax is not printed
Water-wet behavior is presented in the region of pattern;There are 2 pieces, 4 pieces, 6 pieces of hydrophilic regions respectively on transmission board, division board and feature board.
4. measuring 100 mL deionized waters in three-necked flask, 1.0 mL mass fractions are added dropwise after being heated to 90 DEG C as 1%
HAuCl4Solution, it is heated to 96 DEG C and is kept for 1 minute;The sodium citrate solution that 3.0 mL mass fractions are 1% is added afterwards,
Continue stirring reaction 15 minutes;Naturally cool to room temperature and can obtain the golden nanometer particle that particle diameter is 12-15 nm.
5. the solution of gold nanoparticles for taking a certain amount of step 4 to obtain is added dropwise to transmission board, the division board that step 3 obtains
With feature board hydrophilic region, dropwise addition is repeated after drying 2 hours at room temperature and is used as seed using immobilized more golden nanometer particles twice.
6. after being washed with secondary water to above-mentioned zone, freshly prepared growth-promoting media is added dropwise, contain in the growth-promoting media
Volume ratio is 1:1 200 mM hydroxylamine hydrochloride and mass fraction is 1% HAuCl4Solution, reaction repeat to be added dropwise after 2 hours
State growth-promoting media 2 times.
7. the solution of gold nanoparticles that equivalent is added dropwise at the back side of the hydrophilic region of the paper chip Jing Guo above-mentioned processing is laid equal stress on
Multiple step 5 and step 6, finally give paper substrate gold conductor wire and paper with excellent transverse conduction and good longitudinal electric conductivity
Fund electrode.According to the difference of institute's function of dominant, 6 pieces on feature board grow the hydrophilic region for having golden nanometer particle and can be divided into just
Square external electrode a, rectangle gold conductor wire b and the multifunctional electrodes c for thering is circular and rectangular area to be combined into.
8. one is printed respectively with rectangular area junction by circle of the solid state wax printer in two multifunctional electrodes c
The wax pattern of rectangle;Obtained paper is placed in above electronics universal furnace and moved back and forth, uniformly heating causes the wax pattern of printing
Melting and being impregnated with growth has the electrode of golden nanometer particle, not only conductive but also hydrophobic paper substrate multifunctional electrodes is formed, such as the institute of accompanying drawing 2
Show.
9. enter along the white space between the white space and division board and feature board between transmission board and division board
Row folds, and then forms three-dimensional paper substrate multifunctional circuit.
Transmission board, division board, the size of feature board are identical in step 1, are length of side 65-75 mm square.
Hydrophilic region size in step 3 in transmission board is wide 5-8 mm, long 50-60 mm;Square parent in division board
The aqua region length of side is 5-8 mm;The square hydrophilic region length of side in feature board is 5-8 mm;Rectangle in feature board is hydrophilic
Wide 5-8 mm in region, long 60-65 mm;Diameter of a circle is in the hydrophilic region that circle and rectangular area in feature board are combined into
7-9 mm, rectangle region field width 5-8 mm, long 8-12 mm.
The size of the wax pattern printed in step 8 is wide 2-4 mm, long 7-9 mm.
Beneficial effects of the present invention:
(1)The paper substrate gold conductor wire and paper substrate gold electrode of this method structure not only have excellent transverse conductance ability, and prominent
The conductive problem in longitudinal direction of paper substrate is broken;
(2)Because paper base material has certain flexibility, the paper substrate circuit based on paper base material structure also has flexibility;
(3)By changing the global design of circuit, the paper circuit that the number of plies is more, function is more complicated can be built;
(4)Print the both conductions obtained after solid wax and heating and melting again in the privileged site of the paper substrate gold conductor wire of preparation
Hydrophobic circuit has broad application prospects in flexible circuit field again, further improves the function of paper substrate circuit.
Brief description of the drawings
Fig. 1 paper substrate multifunctional circuit integral layout schematic diagrames;
Fig. 2 growths have golden nanometer particle and carry out the paper substrate multifunctional circuit schematic diagram after secondary solid state wax print processing.
Embodiment
In order to be better understood from the present invention, with reference to embodiment and the accompanying drawing content that the present invention is furture elucidated, but this
The content of invention is not limited solely to the following examples.
Embodiment 1.
A kind of construction method of three-dimensional paper substrate multifunctional circuit has the characteristics of time saving, laborsaving, environment-friendly, specific preparation process
It is as follows:
(1)Using Photoshop CS6 either CorelDRAW X6 or Aillustrator CS6 Software for Design three-dimensional paper
The integral layout of Quito functional circuit.As shown in Figure 1, it is followed successively by from left to right along the long side direction of the paper substrate multifunctional circuit
Transmission board, division board and feature board.
(2)By solid state wax printer by step(1)The pattern of design is printed on the copy paper of A4 sizes.
(3)By step(2)Obtained paper is placed in heating plate or baking oven, is heated in 60-120 DEG C of environment
The 30-120 seconds, the wax of printing is melted and is impregnated with the thickness of whole paper in corresponding region, form hydrophobic wall;Wax figure is not printed
Water-wet behavior is presented in the region of case;There are 2 pieces, 4 pieces, 6 pieces of hydrophilic regions respectively on transmission board, division board and feature board.
(4)100 mL deionized waters are measured in three-necked flask, 1.0 mL mass fractions are added dropwise after being heated to 90 DEG C as 1%
HAuCl4Solution, it is heated to 96 DEG C and is kept for 1 minute;The sodium citrate solution that 3.0 mL mass fractions are 1% is added afterwards,
Continue stirring reaction 15 minutes;Naturally cool to room temperature and can obtain the golden nanometer particle that particle diameter is 12-15 nm.
(5)Take a certain amount of step(4)Obtained solution of gold nanoparticles is added dropwise to step(3)Obtained transmission board, every
From plate and feature board hydrophilic region, repeated after drying 2 hours at room temperature dropwise addition twice using immobilized more golden nanometer particles as
Seed.
(6)After being washed with secondary water to above-mentioned zone, freshly prepared growth-promoting media is added dropwise, contains in the growth-promoting media
Volume ratio is 1:1 200 mM hydroxylamine hydrochloride and mass fraction is 1% HAuCl4Solution, reaction repeat to be added dropwise after 2 hours
State growth-promoting media 2 times.
(7)The solution of gold nanoparticles that equivalent is added dropwise at the back side of the hydrophilic region of the paper chip Jing Guo above-mentioned processing is laid equal stress on
Multiple step(5)And step(6), finally give the paper substrate gold conductor wire with excellent transverse conduction and good longitudinal electric conductivity
With paper substrate gold electrode.According to the difference of institute's function of dominant, 6 pieces on feature board grow the hydrophilic region for having golden nanometer particle and can divide
For square external electrode a, rectangle gold conductor wire b and the multifunctional electrodes c for thering is circular and rectangular area to be combined into.
(8)One is printed respectively with rectangular area junction by circle of the solid state wax printer in two multifunctional electrodes c
The wax pattern of bar rectangle;Obtained paper is placed in above electronics universal furnace and moved back and forth, uniformly heating causes the wax figure of printing
Case, which is melted and is impregnated with growth, the electrode of golden nanometer particle, not only conductive but also hydrophobic paper substrate multifunctional electrodes is formed, such as the institute of accompanying drawing 2
Show.
(9)Enter along the white space between the white space and division board and feature board between transmission board and division board
Row folds, and then forms three-dimensional paper substrate multifunctional circuit.
(10)In feature board rectangle gold conductor wire b one end connection energy supply device, other end connects blue LED lamp,
It can be seen that blue LED lamp is lit;At the same time multifunctional electrodes c is connected with red LED lamp, in square external electrode
Connection energy supply device at a, it can be seen that red LED lamp is lit, it was demonstrated that two circuits do not influence between each other.
Transmission board, division board, the size of feature board are identical in step 1, are the mm of the length of side 70 square.
Hydrophilic region size in step 3 in transmission board is wide 6 mm, long 58 mm;Square hydrophilic area in division board
The domain length of side is 6 mm;The square hydrophilic region length of side in feature board is 6 mm;Rectangle hydrophilic area field width 6 in feature board
Mm, long 60 mm;Diameter of a circle is 7 mm in circle and the hydrophilic region that is combined into of rectangular area in feature board, rectangular area
Wide 6 mm, long 8 mm.
The size of the wax pattern printed in step 8 is wide 3 mm, long 7 mm.
Claims (4)
- A kind of 1. construction method of three-dimensional paper substrate multifunctional circuit, it is characterized in that including following preparation process:(1)Using Photoshop CS6 either CorelDRAW X6 or Aillustrator CS6 Software for Design three-dimensional paper The integral layout of Quito functional circuit;Transmission board, isolation are followed successively by from left to right along the long side direction of the paper substrate multifunctional circuit Plate and feature board;(2)By solid state wax printer by step(1)The pattern of design is printed on the copy paper of A4 sizes;(3)By step(2)Obtained paper is placed in heating plate or baking oven, heats 30- in 60-120 DEG C of environment 120 seconds, the wax of printing is melted and is impregnated with the thickness of whole paper in corresponding region, form hydrophobic wall;Wax pattern is not printed Region present water-wet behavior;There are 2 pieces, 4 pieces, 6 pieces of hydrophilic regions respectively on transmission board, division board and feature board;(4)100 mL deionized waters are measured in three-necked flask, it is 1% to be heated to that 1.0 mL mass fractions are added dropwise after 90 DEG C HAuCl4Solution, it is heated to 96 DEG C and is kept for 1 minute;The sodium citrate solution that 3.0 mL mass fractions are 1% is added afterwards, after Continuous stirring reaction 15 minutes;Naturally cool to room temperature and can obtain the golden nanometer particle that particle diameter is 12-15 nm;(5)Take a certain amount of step(4)Obtained solution of gold nanoparticles is added dropwise to step(3)Obtained transmission board, division board With feature board hydrophilic region, dropwise addition is repeated after drying 2 hours at room temperature and is used as seed using immobilized more golden nanometer particles twice;(6)After being washed with secondary water to above-mentioned zone, freshly prepared growth-promoting media is added dropwise, contains volume in the growth-promoting media Than for 1:1 200 mM hydroxylamine hydrochloride and mass fraction is 1% HAuCl4Solution, reaction after 2 hours repeat that above-mentioned life is added dropwise Long liquid 2 times;(7)The solution of gold nanoparticles of equivalent is added dropwise at the back side of the hydrophilic region of the paper chip Jing Guo above-mentioned processing and repeats to walk Suddenly(5)And step(6), finally give paper substrate gold conductor wire and paper with excellent transverse conduction and good longitudinal electric conductivity Fund electrode;According to the difference of institute's function of dominant, 6 pieces on feature board grow the hydrophilic region for having golden nanometer particle and can be divided into just Square external electrode a, rectangle gold conductor wire b and there is a border circular areas and a multifunctional electrodes c that rectangular area is combined into;(8)A square is printed respectively with rectangular area junction by circle of the solid state wax printer in two multifunctional electrodes c The wax pattern of shape;Obtained paper is placed in above electronics universal furnace and moved back and forth, uniformly heating causes the wax pattern of printing to melt Changing and being impregnated with growth has the electrode of golden nanometer particle, forms not only conductive but also hydrophobic paper substrate multifunctional electrodes;(9)Rolled over along the white space between the white space and division board and feature board between transmission board and division board It is folded, and then form three-dimensional paper substrate multifunctional circuit.
- A kind of 2. construction method of three-dimensional paper substrate multifunctional circuit as claimed in claim 1, it is characterized in that being transmitted in step 1 Plate, division board, the size of feature board are identical, are length of side 65-75 mm square.
- A kind of 3. construction method of three-dimensional paper substrate multifunctional circuit as claimed in claim 1, it is characterized in that transmission board in step 3 In hydrophilic region size be wide 5-8 mm, long 50-60 mm;The square hydrophilic region length of side in division board is 5-8 mm;Work( The square hydrophilic region length of side in energy plate is 5-8 mm;Rectangle hydrophilic area field width 5-8 mm, long 60-65 in feature board mm;Diameter of a circle is 7-9 mm, rectangle region field width 5-8 in the hydrophilic region that circle and rectangular area in feature board are combined into Mm, long 8-12 mm.
- 4. a kind of construction method of three-dimensional paper substrate multifunctional circuit as claimed in claim 1, it is characterized in that printed in step 8 The size of wax pattern is wide 2-4 mm, long 7-9 mm.
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109012770A (en) * | 2018-07-12 | 2018-12-18 | 中国科学院成都生物研究所 | Multi-ply paper chip structure, manufacturing equipment and method and fluid interlayer current method |
CN110306225A (en) * | 2019-08-21 | 2019-10-08 | 济南大学 | A kind of preparation method of paper base zinc oxide nano mitron |
CN110628996A (en) * | 2019-09-17 | 2019-12-31 | 清远市正通金属制品有限公司 | Metal hot working production line and use method |
CN111471348A (en) * | 2020-04-28 | 2020-07-31 | 浙江大学 | Wax-dispersed liquid metal solid ink and preparation method and application thereof |
CN111542173A (en) * | 2020-04-28 | 2020-08-14 | 浙江大学 | Paper-based electronic circuit printing method using wax-based solid conductive ink |
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JP2000037793A (en) * | 1998-07-23 | 2000-02-08 | Ichihara:Kk | Production of sutra copying paper |
CN103869087A (en) * | 2012-12-18 | 2014-06-18 | 中国科学院大连化学物理研究所 | Three-dimensional paper-based microfluidics and manufacture method thereof |
CN104483310A (en) * | 2014-12-03 | 2015-04-01 | 济南大学 | Construction method of visual self-energized glucose biosensor |
CN106248767A (en) * | 2016-07-15 | 2016-12-21 | 济南大学 | One is used for detecting H in cancerous cell2the preparation method of the three-dimensional paper analysis device of S |
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2017
- 2017-11-30 CN CN201711234732.7A patent/CN107734862B/en not_active Expired - Fee Related
Patent Citations (4)
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JP2000037793A (en) * | 1998-07-23 | 2000-02-08 | Ichihara:Kk | Production of sutra copying paper |
CN103869087A (en) * | 2012-12-18 | 2014-06-18 | 中国科学院大连化学物理研究所 | Three-dimensional paper-based microfluidics and manufacture method thereof |
CN104483310A (en) * | 2014-12-03 | 2015-04-01 | 济南大学 | Construction method of visual self-energized glucose biosensor |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109012770A (en) * | 2018-07-12 | 2018-12-18 | 中国科学院成都生物研究所 | Multi-ply paper chip structure, manufacturing equipment and method and fluid interlayer current method |
CN109012770B (en) * | 2018-07-12 | 2021-05-14 | 中国科学院成都生物研究所 | Multilayer paper chip structure, manufacturing apparatus and method, and fluid interlayer flow method |
CN110306225A (en) * | 2019-08-21 | 2019-10-08 | 济南大学 | A kind of preparation method of paper base zinc oxide nano mitron |
CN110628996A (en) * | 2019-09-17 | 2019-12-31 | 清远市正通金属制品有限公司 | Metal hot working production line and use method |
CN111471348A (en) * | 2020-04-28 | 2020-07-31 | 浙江大学 | Wax-dispersed liquid metal solid ink and preparation method and application thereof |
CN111542173A (en) * | 2020-04-28 | 2020-08-14 | 浙江大学 | Paper-based electronic circuit printing method using wax-based solid conductive ink |
CN111471348B (en) * | 2020-04-28 | 2022-03-01 | 浙江大学 | Wax-dispersed liquid metal solid ink and preparation method and application thereof |
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