CN107734430A - A kind of ESS voicefrequency circuits denoising structure and noise-reduction method - Google Patents
A kind of ESS voicefrequency circuits denoising structure and noise-reduction method Download PDFInfo
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- CN107734430A CN107734430A CN201711038287.7A CN201711038287A CN107734430A CN 107734430 A CN107734430 A CN 107734430A CN 201711038287 A CN201711038287 A CN 201711038287A CN 107734430 A CN107734430 A CN 107734430A
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- ess
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- agnd2
- audio chips
- mainboard
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
- H04R3/04—Circuits for transducers, loudspeakers or microphones for correcting frequency response
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2430/00—Signal processing covered by H04R, not provided for in its groups
Abstract
The invention provides a kind of ESS voicefrequency circuits denoising structure and noise-reduction method, described structure includes mainboard and A lesser calories, the mainboard is provided with ESS audio chips, GND pin and the first AGND2 pins, described ESS audio chips pass through the first AGND2 pin independent groundings, described GND pin independent grounding；Described A lesser calories are provided with receiver, GND_A pins and the 2nd AGND2 pins, and described receiver passes through the 2nd AGND2 pin independent groundings, described GND_A pin independent groundings.Described method includes：S1：First AGND2 pins are set on mainboard, and connect ESS audio chips and ground connection respectively；S2：2nd AGND2 pins, and lug machine and ground connection respectively are set on A platelets.By the way that individual pin AGND2 is separately configured for ESS audio chips and receiver, it is possible to prevente effectively from the interference between circuit, reduces noise.
Description
Technical field
The present invention relates to noise cancellation technique field, specifically a kind of ESS voicefrequency circuits denoising structure and noise reduction side
Method.
Background technology
The earphone system of ESS companies, mainly contains DAC and Amplifier, because with good compatible and higher
Cost performance, used at present as sound card in many servers.
At present, in the prior art, as shown in figure 1, whole ESS earphone system is divided into master on the circuit of voicefrequency circuit
Plate is with A lesser calories, main placement ESS audio chips (ESS CHIP) on mainboard, and receiver (Headphone), mainboard are set on A lesser calories
With among A lesser calories through cable come be main chip ESS CHIP the reason for connecting relative position, two planks can be divided into from
Sound interface is too remote, therefore is realized using CABLE and A lesser calories.
However, connecting mainboard and A lesser calories by the way of single cable, mainboard and A lesser calories are all connected as a single entity, particularly
The GND_A pins of GND pin on mainboard and A lesser calories are also connected together with ESS audio chips, receiver, cause mainboard and A small
Produce and interfere between card, generate certain noise.
The content of the invention
In order to solve the above problems, there is provided a kind of ESS voicefrequency circuits denoising structure and noise-reduction method, by for ESS sounds
Individual pin AGND2 is separately configured in frequency chip and receiver, it is possible to prevente effectively from the interference between circuit, reduces noise.
The embodiments of the invention provide a kind of ESS voicefrequency circuits denoising structure, described structure includes mainboard and A lesser calories,
The mainboard is provided with ESS audio chips, GND pin and the first AGND2 pins, and described ESS audio chips pass through first
AGND2 pin independent groundings, described GND pin independent grounding；Described A lesser calories are provided with receiver, GND_A pins and second
AGND2 pins, described receiver pass through the 2nd AGND2 pin independent groundings, described GND_A pin independent groundings.
Further, the INL pins connection DACL of the ESS audio chips, described INBL pins connection DACLB, and
DACL and DACLB uses difference cabling.
Further, the INR pins connection DACR of the ESS audio chips, described INBR pins connection DACRB, and
DACR and DACRB uses difference cabling.
Further, described ESS audio chips pass through 0 Ohmic resistance connection server CPU SCL pins respectively
With SDA pins.
The embodiment of the present invention additionally provides a kind of ESS voicefrequency circuits noise-reduction method, and described method includes：
S1：First AGND2 pins are set on mainboard, and connect ESS audio chips and ground connection respectively；
S2：2nd AGND2 pins, and lug machine and ground connection respectively are set on A platelets.
Further, described method also includes：
S3：The INL pins of ESS audio chips and INBL pins are connected into DACL and DACLB respectively, and by DACL and
DACLB is arranged to difference cabling.
Further, described method also includes：
S4：The INR pins of ESS audio chips and INBR pins are connected into DACR and DACRB respectively, and by DACR and
DACRB is arranged to difference cabling.
Further, described method also includes：
S5：Between ESS audio chips and server CPU SCL pins, and ESS audio chips and server CPU
One 0 Ohmic resistance is set respectively between SDA pins.
The effect provided in the content of the invention is only the effect of embodiment, rather than whole effects that invention is all, above-mentioned
A technical scheme in technical scheme has the following advantages that or beneficial effect：
1st, this programme is for ESS audio chips and receiver by by being separately configured individual pin AGND2, it is possible to prevente effectively from
Interference between circuit, noise is reduced, by actual test, the THD+N after improvement improves 38dB.
2nd, DACL/DACLB, ACR/DACRB are set to difference cabling, and the error of 2 cablings, can be effective within 10mal
The interference between circuit is prevented, lifts audio quality.
3rd, by between ESS audio chips and server CPU SCL pins, and ESS audio chips and server
One 0 Ohmic resistance is set respectively between CPU SDA pins, it is ensured that in test, is carried out wire jumper, is allowed ESS audio chips
Do not disturbed by ESS Filter.
Brief description of the drawings
Fig. 1 is ESS earphone systems structural representation in the prior art；
Fig. 2 is the structural representation of embodiment 1；
Fig. 3 is the method flow diagram of embodiment 1；
Fig. 4 is middle DACL, DACLB, DACR, DACRB connection diagram of embodiment 2；
Fig. 5 is the method flow diagram of embodiment 2；
Fig. 6 is that ESS audio chips are illustrated with server CPU SCL pins and the attachment structure of SDA pins in embodiment 3
Figure；
Fig. 7 is the method flow diagram of embodiment 4.
Embodiment
For the technical characterstic for illustrating this programme can be understood, below by embodiment, and its accompanying drawing is combined, to this hair
It is bright to be described in detail.Following disclosure provides many different embodiments or example is used for realizing the different knots of the present invention
Structure.In order to simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.In addition, the present invention can be with
Repeat reference numerals and/or letter in different examples.This repetition is that for purposes of simplicity and clarity, itself is not indicated
Relation between various embodiments are discussed and/or set.It should be noted that part illustrated in the accompanying drawings is not necessarily to scale
Draw.Present invention omits the description to known assemblies and treatment technology and process to avoid being unnecessarily limiting the present invention.
Embodiment 1
A kind of ESS voicefrequency circuits denoising structure as shown in Figure 2, described structure include mainboard and A lesser calories, the mainboard
ESS audio chips, GND pin and the first AGND2 pins are provided with, described ESS audio chips pass through the first AGND2 pin lists
Solely ground connection, described GND pin independent grounding；Described A lesser calories are provided with receiver, GND_A pins and the 2nd AGND2 pins,
Described receiver passes through the 2nd AGND2 pin independent groundings, described GND_A pin independent groundings.
As shown in figure 3, the embodiment of the present invention additionally provides a kind of ESS voicefrequency circuits noise-reduction method, described method includes：
S1：First AGND2 pins are set on mainboard, and connect ESS audio chips and ground connection respectively.
S2：2nd AGND2 pins, and lug machine and ground connection respectively are set on A platelets.
Embodiment 2
A kind of ESS voicefrequency circuits denoising structure as shown in Figure 2, described structure include mainboard and A lesser calories, the mainboard
ESS audio chips, GND pin and the first AGND2 pins are provided with, described ESS audio chips pass through the first AGND2 pin lists
Solely ground connection, described GND pin independent grounding；Described A lesser calories are provided with receiver, GND_A pins and the 2nd AGND2 pins,
Described receiver passes through the 2nd AGND2 pin independent groundings, described GND_A pin independent groundings.
As shown in figure 4, U12 is ESS chip master chips, the INL pins of the ESS audio chips connect DACL, described
INBL pins connect DACLB, and DACL and DACLB uses difference cabling.The INR pins connection DACR of the ESS audio chips,
Described INBR pins connection DACRB, and DACR and DACRB uses difference cabling.
As shown in figure 5, the embodiment of the present invention additionally provides a kind of ESS voicefrequency circuits noise-reduction method, described method includes：
S1：First AGND2 pins are set on mainboard, and connect ESS audio chips and ground connection respectively.
S2：2nd AGND2 pins, and lug machine and ground connection respectively are set on A platelets.
S3：The INL pins of ESS audio chips and INBL pins are connected into DACL and DACLB respectively, and by DACL and
DACLB is arranged to difference cabling.
S4：The INR pins of ESS audio chips and INBR pins are connected into DACR and DACRB respectively, and by DACR and
DACRB is arranged to difference cabling.
Embodiment 3
A kind of ESS voicefrequency circuits denoising structure as shown in Figure 2, described structure include mainboard and A lesser calories, the mainboard
ESS audio chips, GND pin and the first AGND2 pins are provided with, described ESS audio chips pass through the first AGND2 pin lists
Solely ground connection, described GND pin independent grounding；Described A lesser calories are provided with receiver, GND_A pins and the 2nd AGND2 pins,
Described receiver passes through the 2nd AGND2 pin independent groundings, described GND_A pin independent groundings.
As shown in figure 4, the INL pins connection DACL of the ESS audio chips, described INBL pins connection DACLB, and
DACL and DACLB uses difference cabling.The INR pins connection DACR of the ESS audio chips, the connection of described INBR pins
DACRB, and DACR and DACRB uses difference cabling.As shown in fig. 6, R527/R528 is concatenation SUS_SMBCLK and SUS_SMB_
DAT, the CPU mainly allowed on mainboard can pass through this group of signal and ESS CHIP communications and then obtain information.ESS tone color adjustment
(ESS Filter) is a digital filter, and this section of code is added in BIOS code, and it can change earphone tone color, but so
Signal can be disturbed, so R527and R528 must be reserved, such ESS can allow ESS DAC not by ESS in test with wire jumper
Filter is disturbed.
As shown in fig. 7, the embodiment of the present invention additionally provides a kind of ESS voicefrequency circuits noise-reduction method, described method includes：
S1：First AGND2 pins are set on mainboard, and connect ESS audio chips and ground connection respectively.
S2：2nd AGND2 pins, and lug machine and ground connection respectively are set on A platelets.
S3：The INL pins of ESS audio chips and INBL pins are connected into DACL and DACLB respectively, and by DACL and
DACLB is arranged to difference cabling.
S4：The INR pins of ESS audio chips and INBR pins are connected into DACR and DACRB respectively, and by DACR and
DACRB is arranged to difference cabling.
S5：Between ESS audio chips and server CPU SCL pins, and ESS audio chips and server CPU
One 0 Ohmic resistance is set respectively between SDA pins.
Although specification and drawings and examples have been carried out being described in detail to the invention, this area skill
Art personnel should be appreciated that and still the invention can be modified or equivalent substitution；And all do not depart from wound of the present invention
The technical scheme for the spirit and scope made and its improvement, it is encompassed by among the protection domain of the invention patent.
Claims (8)
1. a kind of ESS voicefrequency circuits denoising structure, described structure includes mainboard and A lesser calories, and the mainboard is provided with ESS audios
Chip, GND pin, described A lesser calories are provided with receiver, GND_A pins, it is characterized in that：First is additionally provided with the mainboard
AGND2 pins, described ESS audio chips are grounded by the first AGND2 pins, described GND pin ground connection；Described A is small
Card is provided with the 2nd AGND2 pins, and described receiver is grounded by the 2nd AGND2 pins, described GND_A pins ground connection.
2. a kind of ESS voicefrequency circuits denoising structure according to claim 1, it is characterized in that：The ESS audio chips
INL pins connect DACL, described INBL pins connection DACLB, and DACL and DACLB uses difference cabling.
3. a kind of ESS voicefrequency circuits denoising structure according to claim 1, it is characterized in that：The ESS audio chips
INR pins connect DACR, described INBR pins connection DACRB, and DACR and DACRB uses difference cabling.
4. a kind of ESS voicefrequency circuits denoising structure according to claim 1-3 any one, it is characterized in that：Described ESS
Audio chip passes through a 0 Ohmic resistance connection server CPU SCL pins and SDA pins respectively.
5. a kind of ESS voicefrequency circuits noise-reduction method, it is characterized in that：Described method includes：
S1：First AGND2 pins are set on mainboard, and connect ESS audio chips and ground connection respectively；
S2：2nd AGND2 pins, and lug machine and ground connection respectively are set on A platelets.
6. a kind of ESS voicefrequency circuits noise-reduction method according to claim 5, it is characterized in that：Described method also includes：
S3：The INL pins of ESS audio chips and INBL pins are connected into DACL and DACLB respectively, and DACL and DACLB are set
It is set to difference cabling.
7. a kind of ESS voicefrequency circuits noise-reduction method according to claim 6, it is characterized in that：Described method also includes：
S4：The INR pins of ESS audio chips and INBR pins are connected into DACR and DACRB respectively, and DACR and DACRB are set
It is set to difference cabling.
8. a kind of ESS voicefrequency circuits noise-reduction method according to claim 7, it is characterized in that：Described method also includes：
S5：Between ESS audio chips and server CPU SCL pins, and ESS audio chips and server CPU SDA
One 0 Ohmic resistance is set respectively between pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711038287.7A CN107734430B (en) | 2017-10-27 | 2017-10-27 | ESS audio circuit noise reduction structure and noise reduction method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711038287.7A CN107734430B (en) | 2017-10-27 | 2017-10-27 | ESS audio circuit noise reduction structure and noise reduction method |
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| Publication Number | Publication Date |
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| CN107734430A true CN107734430A (en) | 2018-02-23 |
| CN107734430B CN107734430B (en) | 2020-08-25 |
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| CN107734430B (en) | 2020-08-25 |
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Effective date of registration: 20200727 Address after: 215100 No. 1 Guanpu Road, Guoxiang Street, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province Applicant after: SUZHOU LANGCHAO INTELLIGENT TECHNOLOGY Co.,Ltd. Address before: 450018 Henan province Zheng Dong New District of Zhengzhou City Xinyi Road No. 278 16 floor room 1601 Applicant before: ZHENGZHOU YUNHAI INFORMATION TECHNOLOGY Co.,Ltd. |
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