CN107731357A - Round wire formula busbar structure and preparation method thereof - Google Patents

Round wire formula busbar structure and preparation method thereof Download PDF

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Publication number
CN107731357A
CN107731357A CN201711007521.XA CN201711007521A CN107731357A CN 107731357 A CN107731357 A CN 107731357A CN 201711007521 A CN201711007521 A CN 201711007521A CN 107731357 A CN107731357 A CN 107731357A
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CN
China
Prior art keywords
layer
round wire
insulating layer
intermediate insulating
insulation film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711007521.XA
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Chinese (zh)
Inventor
朱国清
杨建锋
周瑾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU CURRENT POWER TECHNOLOGY Co Ltd
Original Assignee
SUZHOU CURRENT POWER TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU CURRENT POWER TECHNOLOGY Co Ltd filed Critical SUZHOU CURRENT POWER TECHNOLOGY Co Ltd
Priority to CN201711007521.XA priority Critical patent/CN107731357A/en
Publication of CN107731357A publication Critical patent/CN107731357A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/0045Cable-harnesses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/0009Details relating to the conductive cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/02Disposition of insulation
    • H01B7/0208Cables with several layers of insulating material
    • H01B7/0225Three or more layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/04Flexible cables, conductors, or cords, e.g. trailing cables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/08Flat or ribbon cables
    • H01B7/0838Parallel wires, sandwiched between two insulating layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/17Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/18Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
    • H01B7/1805Protections not provided for in groups H01B7/182 - H01B7/26

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Conductors (AREA)

Abstract

The invention discloses round wire formula busbar structure and preparation method thereof,Including an at least round wire,Intermediate insulating layer,Conductive plate,Upper-layer insulation film and underlying insulating layer,The upper-layer insulation film,Round wire,Intermediate insulating layer,Conductive plate and underlying insulating layer are sequentially laminated fixation up and down,Glue is filled between the upper-layer insulation film and intermediate insulating layer,So that round wire is fixed between upper-layer insulation film and intermediate insulating layer,The end of the round wire is flat structure,This product arranged stacked in the plane of conductive plate by round wire,Centre is isolated using insulating materials,Form the multi-path set of multilayer above and below conductor,Make it have certain rigidity,Production bending can be carried out in advance by connection request of the electrical equipment on vehicle locus under certain bending angle and radius bend,Then can be taken in vehicle factor using manipulator,Positioning,Installation,Check,The automated production of electrical connection to vehicle factor has obvious help.

Description

Round wire formula busbar structure and preparation method thereof
Technical field
The present invention relates to a kind of conducting transmission structure, more particularly to round wire formula busbar structure and preparation method thereof.
Background technology
In vehicle or other equipment installation environment, it is electrically connected, is being automated using the wire harness of softness at present It is not suitable for manipulator in production to take, positions, install, checks, the electrical connection automated production to vehicle or other equipment Efficiency, quality, cost, the reliability of life cycle management have large effect.
The content of the invention
A kind of manipulator is facilitated to take the round wire formula busbar structure of installation present invention solves the technical problem that being to provide.
The technical solution adopted for the present invention to solve the technical problems is:Round wire formula busbar structure, including at least one Root round wire, intermediate insulating layer, busbar, upper-layer insulation film and underlying insulating layer, the upper-layer insulation film, round wire, centre Insulating barrier, busbar and underlying insulating layer are sequentially laminated fixation up and down, are filled between the upper-layer insulation film and intermediate insulating layer There is glue so that round wire is fixed between upper-layer insulation film and intermediate insulating layer, and the end of the round wire is flat Structure, the upper plane and lower plane of the flat structure are bonded with upper-layer insulation film and intermediate insulating layer respectively.
It is further:The round wire has more, and the more round wires are located at same layer or different layers, described every layer Intermediate insulating layer is provided between round wire.
It is further:Also include upper strata screen layer and underlying shield layer, the upper strata screen layer is located at upper-layer insulation film Downside, the underlying shield layer is located at the upside of busbar, centre is additionally provided between the upper strata screen layer and round wire Insulating barrier, intermediate insulating layer is additionally provided between the underlying shield layer and busbar.
It is further:The conductive plate is aluminium, and the thickness of conductive plate is 1mm~3mm.
It is further:The intermediate insulating layer, upper-layer insulation film and underlying insulating layer are PET or PI materials, in described Between the thickness of insulating barrier, upper-layer insulation film and underlying insulating layer be 0.05mm~0.4mm.
It is further:The material of the upper strata screen layer and underlying shield layer is aluminium foil or copper foil, and the upper strata shields The thickness of layer or underlying shield layer is 0.05~0.2mm.
The invention also discloses the preparation method of round wire formula busbar structure:
A, underlying insulating layer, conductive plate, screen layer, intermediate insulating layer, round wire are passed sequentially through into adhesive glue lamination to fix, Thick glue is spooned on round wire again, then again circle glue on respectively by adhesive glue lamination be fixed with intermediate insulating layer, on Layer screen layer and upper-layer insulation film so that when round wire is pressed together between two layers of intermediate insulating layer, removed between two layers of intermediate layer Filled by glue in other spaces outside round wire;
B, the round wire formula busbar structure in step A is bent into required mounting structure.
The beneficial effects of the invention are as follows:This product by round wire in the plane of conductive plate, two layers or multilayer layer laying up Put, centre is isolated using insulating materials, forms the multi-path set of multilayer above and below conductor.The conductor sets of the tabular have Certain rigidity, it can be wanted under certain bending angle and radius bend by connection of the electrical equipment on vehicle locus Ask and carry out production bending in advance, then can be taken in vehicle factor using manipulator, positioned, installed, checked, to vehicle factor The automated production of electrical connection has obvious help.
Brief description of the drawings
Fig. 1 is round wire formula busbar structural representation.
Fig. 2 is round wire formula busbar structure top view.
In figure mark for:Round wire 1, intermediate insulating layer 2, conductive plate 3, upper-layer insulation film 4, underlying insulating layer 5, upper strata screen Cover layer 6, underlying shield layer 7.
Embodiment
The present invention is further described with reference to the accompanying drawings and detailed description.
Round wire formula busbar structure as depicted in figs. 1 and 2, including an at least round wire 1, intermediate insulating layer 2, lead Electroplax 3, upper-layer insulation film 4 and underlying insulating layer 5, the upper-layer insulation film 4, round wire 1, intermediate insulating layer 2, the and of conductive plate 3 Underlying insulating layer is sequentially laminated fixation about 5, glue is filled between the upper-layer insulation film 4 and intermediate insulating layer 2 so that circle Wire 1 is fixed between upper-layer insulation film 4 and intermediate insulating layer 2, and the end of the round wire 1 is flat structure, described The upper plane and lower plane of flat structure are bonded with upper-layer insulation film 4 and intermediate insulating layer 2 respectively, and such a structure causes circle to lead Line 1 and conductive plate 3 are laminated between upper-layer insulation film 4 and underlying insulating layer 5 so that whole line conductor row structure all has certain Rigidity, before being installed, can under certain bending angle and radius bend by electrical equipment in vehicle locus On connection request carry out production bending in advance, then can be taken in vehicle factor using manipulator, position, install, check, The automated production of electrical connection to vehicle factor has obvious help, and because round wire 1 is pressed together on upper-layer insulation film 4 When between intermediate insulating layer 2, other spaces between dielectric layers in addition to round wire are filled by glue, due to round wire with The contact area of upper-layer insulation film and intermediate insulating layer is small, may be such that in bending process round wire 1 will not by glue filling Generation position is offset, so as to ensure the quality of busbar structure.
On the basis of the above, as shown in figure 1, the round wire 1 has more, the more round wires 1 be located at same layer or Different layers, intermediate insulating layer 2 is provided between every layer of round wire 1, in design, can be tied according to specific electrical connection Structure, diverse location and the different numbers of plies round wire being laminated in the structure of conductive plate 3 can be as shown in figure 1, three round wires be divided Two layers of diverse location is not arranged on, it is played transmission signal and transmission electric current respectively so that connection line obtains height Spend integrated.
On the basis of the above, as shown in figure 1, also including upper strata screen layer 6 and underlying shield layer 7, the upper strata screen layer 6 Positioned at the downside of upper-layer insulation film 4, the underlying shield layer 7 is located at the upside of conductive plate 3, and the upper strata screen layer 6 and circle are led Intermediate insulating layer 2 is additionally provided between line 1, intermediate insulating layer is additionally provided between the underlying shield layer 7 and conductive plate 3, when , can be as shown in figure 1, round wire be designed in upper strata screen layer 6 with when round wire in the structure of conductive plate 3 is used for transmission signal Between layer screen layer 7, so as to ensure accuracy during signal transmission.
On the basis of the above, for the conductive plate for that can be all conductive materials such as aluminium, copper, used herein be aluminium, conductive The thickness of plate is 1mm~3mm, and the round wire 1 is the conductive metal materials such as aluminium, copper, and the intermediate insulating layer 2, upper strata are insulated Layer 4 and underlying insulating layer 5 are PET or PI materials, the PET molecular structure high degree of symmetry, have certain crystalline orientation Ability, so with higher film forming and becoming second nature, the PET has good optical property and weatherability, amorphous state PET there is good optical transparence, in addition PET have excellent abrasion performance frictional property and dimensional stability and Electrical insulating property, the PI are the abbreviations of polyimides, and performance characteristics main PI have high temperature resistant, wear-resistant, insulating properties etc., described The thickness of intermediate insulating layer 2, upper-layer insulation film 4 and underlying insulating layer 5 is 0.05mm~0.4mm, and the upper strata screen layer 6 is with The material of layer screen layer 7 is aluminium foil or copper foil, and the thickness of the upper strata screen layer 6 or underlying shield layer 7 is 0.05~0.2mm, Using above-mentioned material and the restriction by the thickness to each material so that the manufactured structural rigidity of conductive plate 3 is moderate, can carry out Bending, and will not be rebounded after bending, while will not be broken during bending situations such as.
The invention also discloses the preparation method of round wire formula busbar structure:
A, underlying insulating layer, conductive plate, screen layer, intermediate insulating layer, round wire are passed sequentially through into adhesive glue lamination to fix, Thick glue is spooned on round wire again, then again circle glue on respectively by adhesive glue lamination be fixed with intermediate insulating layer, on Layer screen layer and upper-layer insulation film so that when round wire is pressed together between two layers of intermediate insulating layer, removed between two layers of intermediate layer Filled by glue in other spaces outside round wire;
B, the round wire formula busbar structure in step A is bent into required mounting structure.
For this product by round wire in the plane of conductive plate, two layers or multilayer laminated arrangement, centre use insulating materials Isolated, form the multi-path set of multilayer above and below conductor.The conductor sets of the tabular have certain rigidity, can be one Production bending is carried out in advance by connection request of the electrical equipment on vehicle locus under fixed bending angle and radius bend, Then it can be taken, positioned using manipulator in vehicle factor, installed, checked, the automatic metaplasia of the electrical connection to vehicle factor Production has obvious help.
Following embodiments for round wire formula busbar structure:
Embodiment 1:
Structure of the round wire formula busbar structure under upper is followed successively by:Upper-layer insulation film 4, round wire 1, intermediate insulating layer 2nd, the material of conductive plate 3 and underlying insulating layer 5, upper-layer insulation film 4 and intermediate insulating layer 2 is PET, and strip conductor 1 is aluminium, screen layer It is aluminium sheet for aluminium foil, conductive plate 3.
Embodiment 2:
As shown in figure 1, the round wire formula busbar structure be divided into the superstructure being laminated under upper, media layer damage and Understructure, the understructure include underlying insulating layer 5, conductive plate and the intermediate insulating layer set gradually from bottom to up 2, shown media layer damage is divided into left field and right side area, and the left field includes the upper strata screen set gradually from top to bottom Cover layer 6, intermediate insulating layer 2, two round wires 1 being arranged side by side and underlying shield layer 7, the right side area is led including a circle Line, the superstructure include upper-layer insulation film 4, and the material of upper-layer insulation film, underlying insulating layer and intermediate insulating layer 2 is PET, Strip conductor 1 is aluminium, and screen layer is aluminium foil, conductive plate 3 is aluminium sheet.
Particular embodiments described above, the purpose of the present invention, technical scheme and beneficial effect are carried out further in detail Describe in detail it is bright, should be understood that the foregoing is only the present invention specific embodiment, be not intended to limit the invention, it is all Within the spirit and principles in the present invention, any modification, equivalent substitution and improvements done etc., it should be included in the guarantor of the present invention Within the scope of shield.

Claims (7)

1. round wire formula busbar structure, it is characterised in that:Including an at least round wire (1), intermediate insulating layer (2), conduction Plate (3), upper-layer insulation film (4) and underlying insulating layer (5), the upper-layer insulation film (4), strip conductor (1), intermediate insulating layer (2), Conductive plate (3) and underlying insulating layer (5) are sequentially laminated fixation up and down, between the upper-layer insulation film (4) and intermediate insulating layer (2) Filled with glue so that round wire (1) is fixed between upper-layer insulation film (4) and intermediate insulating layer (2), the round wire (1) end is flat structure, the upper plane and lower plane of the flat structure respectively with upper-layer insulation film (4) and centre Insulating barrier (2) is bonded.
2. round wire formula busbar structure as claimed in claim 1, it is characterised in that:The round wire (1) has more, described More round wires (1) are located at same layer or different layers, and intermediate insulating layer (2) is provided between every layer of round wire (1).
3. round wire formula busbar structure as claimed in claim 1, it is characterised in that:Also include upper strata screen layer (6) and under Layer screen layer (7), the upper strata screen layer (6) are located at the downside of upper-layer insulation film (4), and the underlying shield layer (7), which is located at, leads The upside of electroplax (3), intermediate insulating layer (2), the lower floor are additionally provided between the upper strata screen layer (6) and strip conductor (1) Intermediate insulating layer is additionally provided between screen layer (7) and conductive plate (3).
4. round wire formula busbar structure as claimed in claim 1, it is characterised in that:The conductive plate is aluminium, conductive plate Thickness is 1mm~3mm.
5. round wire formula busbar structure as claimed in claim 1, it is characterised in that:The intermediate insulating layer (2), upper strata are exhausted Edge layer (4) and underlying insulating layer (5) are PET or PI materials, and the intermediate insulating layer (2), upper-layer insulation film (4) and lower floor insulate The thickness of layer (5) is 0.05mm~0.4mm.
6. round wire formula busbar structure as claimed in claim 1, it is characterised in that:The upper strata screen layer (6) and lower floor The material of screen layer (7) is aluminium foil or copper foil, the thickness of the upper strata screen layer (6) or underlying shield layer (7) for 0.05~ 0.2mm。
7. the preparation method of round wire formula busbar structure:It is characterized in that:
A, underlying insulating layer, conductive plate, screen layer, intermediate insulating layer, round wire are passed sequentially through into adhesive glue lamination to fix, then Thick glue is spooned on round wire, intermediate insulating layer, upper strata screen are then fixed with by adhesive glue lamination respectively on circle glue again Cover layer and upper-layer insulation film so that when round wire is pressed together between two layers of intermediate insulating layer, except circle is led between dielectric layers Filled by glue in other spaces outside line;
B, the round wire formula busbar structure in step A is bent into required mounting structure.
CN201711007521.XA 2017-10-25 2017-10-25 Round wire formula busbar structure and preparation method thereof Pending CN107731357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711007521.XA CN107731357A (en) 2017-10-25 2017-10-25 Round wire formula busbar structure and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711007521.XA CN107731357A (en) 2017-10-25 2017-10-25 Round wire formula busbar structure and preparation method thereof

Publications (1)

Publication Number Publication Date
CN107731357A true CN107731357A (en) 2018-02-23

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ID=61212728

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Application Number Title Priority Date Filing Date
CN201711007521.XA Pending CN107731357A (en) 2017-10-25 2017-10-25 Round wire formula busbar structure and preparation method thereof

Country Status (1)

Country Link
CN (1) CN107731357A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002150848A (en) * 2000-11-10 2002-05-24 Fujikura Ltd Shield flat cable and connection method of the same
US20160079714A1 (en) * 2014-09-12 2016-03-17 Foxconn Interconnect Technology Limited Cable connector assembly with an improved cable
CN206451523U (en) * 2016-12-30 2017-08-29 东莞市道诚绝缘材料有限公司 A kind of dielectric film and its high frequency transmission line and drying plant for FFC winding displacements

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002150848A (en) * 2000-11-10 2002-05-24 Fujikura Ltd Shield flat cable and connection method of the same
US20160079714A1 (en) * 2014-09-12 2016-03-17 Foxconn Interconnect Technology Limited Cable connector assembly with an improved cable
CN206451523U (en) * 2016-12-30 2017-08-29 东莞市道诚绝缘材料有限公司 A kind of dielectric film and its high frequency transmission line and drying plant for FFC winding displacements

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