CN107722929A - Assembled architecture low modulus fluid sealant and preparation method thereof - Google Patents
Assembled architecture low modulus fluid sealant and preparation method thereof Download PDFInfo
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- CN107722929A CN107722929A CN201711003549.6A CN201711003549A CN107722929A CN 107722929 A CN107722929 A CN 107722929A CN 201711003549 A CN201711003549 A CN 201711003549A CN 107722929 A CN107722929 A CN 107722929A
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- fluid sealant
- end block
- vinyltrimethoxy silane
- assembled architecture
- low modulus
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09J201/10—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention discloses a kind of assembled architecture low modulus fluid sealant and preparation method thereof, the fluid sealant includes the raw material of following parts by weight：100 parts of end block resins, 90~110 parts of plasticizer, 10~20 parts of polyamide sodium, 100~150 parts of fillers, 5~10 parts of vinyltrimethoxy silanes.The present invention is with end block resins, plasticizer, polyamide sodium, filler, vinyltrimethoxy silane, light stabilizer, silane coupler, catalyst is that fluid sealant elongation made from raw material is high, resistance to yellow side, good weatherability, modulus is low, to ceramics, glass, concrete structure, timber, plastic-steel, painted steel sheet, aluminium alloy has high adhesive property, roofing available for building, exterior wall, basement, the sealing of the seam of toilet, and the shrinkage factor of fluid sealant is low, avoid the problem of shrinkage factor causes greatly fluid sealant rupture and adhesive surface breakage, extend the service life of fluid sealant.
Description
Technical field
The present invention relates to fluid sealant field, especially a kind of assembled architecture low modulus fluid sealant and preparation method thereof.
Background technology
Fluid sealant used in civil construction field mainly has silicone sealant, silyl-terminated polyether sealant, polysulfide close
Sealing, acrylic sealant, polyurethane sealant, above-mentioned fluid sealant can improve waterproof, sound insulation, energy-conservation, the anti-corrosion of building
The functions such as erosion, anti-pollution, fire prevention, decoration, structural elasticity connection, structure safety durable.But the mould of current building sealant
Amount is high, and shrinkage is big, easily causes fluid sealant rupture and adhesive surface is damaged so that the service life of fluid sealant greatly reduces.
The content of the invention
In view of this, it is an object of the invention to provide a kind of assembled architecture low modulus fluid sealant and preparation method thereof,
It can solve the problem that building sealant modulus height, the big technical problem of shrinkage.
To achieve these goals, the invention provides following technical scheme：
A kind of low modulus fluid sealant of assembled architecture, include the raw material of following parts by weight：
Preferably, the end group of the end block resins is trimethoxy end-blocking or triethoxy.
Preferably, the plasticizer is diisooctyl phthalate.
Preferably, the filler is one in silica, bentonite, titanium dioxide, aluminium dioxide, calcium carbonate and talcum powder
Kind is a variety of.
Preferably, the light stabilizer be phenylaminomethyl triethoxysilane, γ-aminopropyltrimethoxysilane or
Gamma-aminopropyl-triethoxy-silane.
Preferably, the silane coupler is aminopropyl triethoxysilane or glycidol fan's epoxide propyl trimethoxy
Silane.
Preferably, the catalyst be dibutyl tin laurate, dibutyl tin acetate, tin dilaurate dioctyl tin or
Stannous octoate.
Preparation method present invention also offers a kind of above-mentioned assembled architecture with low modulus fluid sealant, including following step
Suddenly：
A) end block resins are divided into first part of end block resins and second part of end block resins；Vinyltrimethoxy silane is divided into
First part of vinyltrimethoxy silane, second part of vinyltrimethoxy silane and the 3rd part of vinyltrimethoxy silane；
B) first part of end block resins, plasticizer, first part of vinyltrimethoxy silane and filler will be added in glue making machine,
In the case where temperature is 70 DEG C, high-speed stirred under vacuum environment, compound is obtained；
C) temperature of compound made from step b) is down to 60 DEG C, and add thereto polyamide sodium, light stabilizer and
Second part of vinyltrimethoxy silane, after stirring 30min；50 DEG C of additions, second part of end block resins are cooled to, are stirred under vacuum
After 15min；40 DEG C are cooled to, adds the 3rd part of vinyltrimethoxy silane, silane coupler, catalyst, is stirred under vacuum
30min, assembled architecture is produced with low modulus fluid sealant.
Preferably, the mass ratio of first part of end block resins and second part of end block resins is 1:1.
Preferably, first part of vinyltrimethoxy silane, second part of vinyltrimethoxy silane and institute
The mass ratio for stating the 3rd part of vinyltrimethoxy silane is 1:4:5.
A kind of assembled architecture provided by the invention low modulus fluid sealant and preparation method thereof, the fluid sealant include with
The raw material of lower parts by weight：100 parts of end block resins, 90~110 parts of plasticizer, 10~20 parts of polyamide sodium, 100~150 parts fill out
Material, 5~10 parts of vinyltrimethoxy silanes.The present invention is with end block resins, plasticizer, polyamide sodium, filler, vinyl front three
TMOS, light stabilizer, silane coupler, catalyst are that fluid sealant elongation made from raw material is high, resistance to yellow side, weatherability
Good, modulus is low, has high adhesive property to ceramics, glass, concrete structure, timber, plastic-steel, painted steel sheet, aluminium alloy, can
For the roofing of building, exterior wall, basement, toilet seam sealing, and the shrinkage factor of fluid sealant is low, avoids contraction
Rate causes greatly the problem of fluid sealant rupture and adhesive surface breakage, extends the service life of fluid sealant.
Embodiment
A kind of low modulus fluid sealant of assembled architecture provided by the invention, include the raw material of following parts by weight：
In above-mentioned technical proposal, with end block resins, plasticizer, polyamide sodium, filler, vinyltrimethoxy silane, light
Stabilizer, silane coupler, catalyst are that fluid sealant elongation made from raw material is high, and resistance to yellow side, good weatherability, modulus is low, right
Ceramics, glass, concrete structure, timber, plastic-steel, painted steel sheet, aluminium alloy have high adhesive property, available for building
Roofing, exterior wall, basement, toilet seam sealing, and the shrinkage factor of fluid sealant is low, and avoiding shrinkage factor causes to seal greatly
The problem of glue rupture and adhesive surface breakage, extend the service life of fluid sealant.
End block resins can improve the compatibility of fluid sealant and concrete.In an embodiment of the present invention, end block resins
End group is trimethoxy end-blocking or triethoxy.
Plasticizer and vinyltrimethoxy silane are used for the shrinkage factor for reducing fluid sealant.In an embodiment of the present invention,
Plasticizer is diisooctyl phthalate.
Polyimides and silane coupler are used to increase the adhesion strength of fluid sealant.
In an embodiment of the present invention, silane coupler is aminopropyl triethoxysilane or glycidol fan's epoxide propyl group
Trimethoxy silane.
Filler plays a part of reinforcement.In an embodiment of the present invention, filler is silica, bentonite, titanium dioxide, two
One or more in aluminum oxide, calcium carbonate and talcum powder.
Light stabilizer is used for the anti-yellowing energy for improving fluid sealant, extends the service life of fluid sealant；In the reality of the present invention
Apply in example, light stabilizer is 2,4-DihydroxyBenzophenone, ESCALOL 567,2- (2 '-hydroxyls -3 '-uncle
Butyl -5 '-aminomethyl phenyl) -5- chlorobenzotriazoles or decanedioic acid two (2,2,6- tetramethyl -4- piperidyls) ester.
In an embodiment of the present invention, catalyst is dibutyl tin laurate, dibutyl tin acetate, tin dilaurate two
Tin octylate or stannous octoate.
Preparation method present invention also offers a kind of above-mentioned assembled architecture with low modulus fluid sealant, including following step
Suddenly：
A) end block resins are divided into first part of end block resins and second part of end block resins；Vinyltrimethoxy silane is divided into
First part of vinyltrimethoxy silane, second part of vinyltrimethoxy silane and the 3rd part of vinyltrimethoxy silane；
B) first part of end block resins, plasticizer, first part of vinyltrimethoxy silane and filler will be added in glue making machine,
In the case where temperature is 70 DEG C, high-speed stirred under vacuum environment, compound is obtained；
C) temperature of compound made from step b) is down to 60 DEG C, and add thereto polyamide sodium, light stabilizer and
Second part of vinyltrimethoxy silane, after stirring 30min；50 DEG C of additions, second part of end block resins are cooled to, are stirred under vacuum
After 15min；40 DEG C are cooled to, adds the 3rd part of vinyltrimethoxy silane, silane coupler, catalyst, is stirred under vacuum
30min, assembled architecture is produced with low modulus fluid sealant.
Here, end block resins, plasticizer, polyamide sodium, filler, vinyltrimethoxy silane, light stabilizer, silane are even
Connection agent, catalyst are same as above, will not be repeated here.
In above-mentioned technical proposal, method is simple, and the fluid sealant elongation being prepared is high, resistance to yellow side, good weatherability, modulus
It is low, there is high adhesive property to ceramics, glass, concrete structure, timber, plastic-steel, painted steel sheet, aluminium alloy, available for building
Build the roofing of thing, exterior wall, basement, toilet seam sealing, and the shrinkage factor of fluid sealant is low, avoids shrinkage factor and leads greatly
The problem of fine and close sealing rupture and adhesive surface breakage, extend the service life of fluid sealant.
In an embodiment of the present invention, the mass ratio of first part of end block resins and second part of end block resins is 1:1.
In an embodiment of the present invention, first part of vinyltrimethoxy silane, second part of vinyltrimethoxy silane
Mass ratio with the 3rd part of vinyltrimethoxy silane is 1:4:5.
It is close with low modulus to assembled architecture provided by the invention with reference to embodiment in order to further illustrate the present invention
Sealing and preparation method thereof is described in detail, but they can not be interpreted as into limiting the scope of the present invention.
Embodiment 1
Assembled architecture includes the raw material of following parts by weight with low modulus fluid sealant：
100 parts of end block resins, 90 parts of plasticizer, 10 parts of polyamide sodium, 135 parts of fillers, 5 parts of vinyl trimethoxy silicon
Alkane, 0.5 part of light stabilizer, 2 parts of silane couplers, 0.5 part of catalyst；
The assembled architecture preparation method of low modulus fluid sealant, comprises the following steps：
A) end block resins are divided into first part of end block resins and second part of end block resins；Vinyltrimethoxy silane is divided into
First part of vinyltrimethoxy silane, second part of vinyltrimethoxy silane and the 3rd part of vinyltrimethoxy silane；
The mass ratio of first part of end block resins and second part of end block resins is 1:1；First part of vinyltrimethoxy silane, second part of second
The mass ratio of alkenyl trimethoxy silane and the 3rd part of vinyltrimethoxy silane is 1:4:5；
B) first part of end block resins, plasticizer, first part of vinyltrimethoxy silane and filler will be added in glue making machine,
In the case where temperature is 70 DEG C, high-speed stirred under vacuum environment, compound is obtained；
C) temperature of compound made from step b) is down to 60 DEG C, and add thereto polyamide sodium, light stabilizer and
Second part of vinyltrimethoxy silane, after stirring 30min；50 DEG C of additions, second part of end block resins are cooled to, are stirred under vacuum
After 15min；40 DEG C are cooled to, adds the 3rd part of vinyltrimethoxy silane, silane coupler, catalyst, is stirred under vacuum
30min, assembled architecture is produced with low modulus fluid sealant.
Embodiment 2
Assembled architecture includes the raw material of following parts by weight with low modulus fluid sealant：
100 parts of end block resins, 110 parts of plasticizer, 13 parts of polyamide sodium, 115 parts of fillers, 6.5 parts of vinyl trimethoxies
Silane, 0.7 part of light stabilizer, 3 parts of silane couplers, 0.7 part of catalyst；
The assembled architecture preparation method of low modulus fluid sealant, comprises the following steps：
A) end block resins are divided into first part of end block resins and second part of end block resins；Vinyltrimethoxy silane is divided into
First part of vinyltrimethoxy silane, second part of vinyltrimethoxy silane and the 3rd part of vinyltrimethoxy silane；
The mass ratio of first part of end block resins and second part of end block resins is 1:1；First part of vinyltrimethoxy silane, second part of second
The mass ratio of alkenyl trimethoxy silane and the 3rd part of vinyltrimethoxy silane is 1:4:5；
B) first part of end block resins, plasticizer, first part of vinyltrimethoxy silane and filler will be added in glue making machine,
In the case where temperature is 70 DEG C, high-speed stirred under vacuum environment, compound is obtained；
C) temperature of compound made from step b) is down to 60 DEG C, and add thereto polyamide sodium, light stabilizer and
Second part of vinyltrimethoxy silane, after stirring 30min；50 DEG C of additions, second part of end block resins are cooled to, are stirred under vacuum
After 15min；40 DEG C are cooled to, adds the 3rd part of vinyltrimethoxy silane, silane coupler, catalyst, is stirred under vacuum
30min, assembled architecture is produced with low modulus fluid sealant.
Embodiment 3
Assembled architecture includes the raw material of following parts by weight with low modulus fluid sealant：
100 parts of end block resins, 95 parts of plasticizer, 20 parts of polyamide sodium, 100 parts of fillers, 8.5 parts of vinyl trimethoxy silicon
Alkane, 0.9 part of light stabilizer, 4 parts of silane couplers, 1.3 parts of catalyst；
The assembled architecture preparation method of low modulus fluid sealant, comprises the following steps：
A) end block resins are divided into first part of end block resins and second part of end block resins；Vinyltrimethoxy silane is divided into
First part of vinyltrimethoxy silane, second part of vinyltrimethoxy silane and the 3rd part of vinyltrimethoxy silane；
The mass ratio of first part of end block resins and second part of end block resins is 1:1；First part of vinyltrimethoxy silane, second part of second
The mass ratio of alkenyl trimethoxy silane and the 3rd part of vinyltrimethoxy silane is 1:4:5；
B) first part of end block resins, plasticizer, first part of vinyltrimethoxy silane and filler will be added in glue making machine,
In the case where temperature is 70 DEG C, high-speed stirred under vacuum environment, compound is obtained；
C) temperature of compound made from step b) is down to 60 DEG C, and add thereto polyamide sodium, light stabilizer and
Second part of vinyltrimethoxy silane, after stirring 30min；50 DEG C of additions, second part of end block resins are cooled to, are stirred under vacuum
After 15min；40 DEG C are cooled to, adds the 3rd part of vinyltrimethoxy silane, silane coupler, catalyst, is stirred under vacuum
30min, assembled architecture is produced with low modulus fluid sealant.
Embodiment 4
Assembled architecture includes the raw material of following parts by weight with low modulus fluid sealant：
100 parts of end block resins, 105 parts of plasticizer, 17 parts of polyamide sodium, 150 parts of fillers, 10 parts of vinyl trimethoxy silicon
Alkane, 1 part of light stabilizer, 5 parts of silane couplers, 1.5 parts of catalyst；
The assembled architecture preparation method of low modulus fluid sealant, comprises the following steps：
A) end block resins are divided into first part of end block resins and second part of end block resins；Vinyltrimethoxy silane is divided into
First part of vinyltrimethoxy silane, second part of vinyltrimethoxy silane and the 3rd part of vinyltrimethoxy silane；
The mass ratio of first part of end block resins and second part of end block resins is 1:1；First part of vinyltrimethoxy silane, second part of second
The mass ratio of alkenyl trimethoxy silane and the 3rd part of vinyltrimethoxy silane is 1:4:5；
B) first part of end block resins, plasticizer, first part of vinyltrimethoxy silane and filler will be added in glue making machine,
In the case where temperature is 70 DEG C, high-speed stirred under vacuum environment, compound is obtained；
C) temperature of compound made from step b) is down to 60 DEG C, and add thereto polyamide sodium, light stabilizer and
Second part of vinyltrimethoxy silane, after stirring 30min；50 DEG C of additions, second part of end block resins are cooled to, are stirred under vacuum
After 15min；40 DEG C are cooled to, adds the 3rd part of vinyltrimethoxy silane, silane coupler, catalyst, is stirred under vacuum
30min, assembled architecture is produced with low modulus fluid sealant.
Embodiment 5
Assembled architecture includes the raw material of following parts by weight with low modulus fluid sealant：
100 parts of end block resins, 100 parts of plasticizer, 15 parts of polyamide sodium, 125 parts of fillers, 7.5 parts of vinyl trimethoxies
Silane, 0.75 part of light stabilizer, 3.5 parts of silane couplers, 1 part of catalyst；
The assembled architecture preparation method of low modulus fluid sealant, comprises the following steps：
A) end block resins are divided into first part of end block resins and second part of end block resins；Vinyltrimethoxy silane is divided into
First part of vinyltrimethoxy silane, second part of vinyltrimethoxy silane and the 3rd part of vinyltrimethoxy silane；
The mass ratio of first part of end block resins and second part of end block resins is 1:1；First part of vinyltrimethoxy silane, second part of second
The mass ratio of alkenyl trimethoxy silane and the 3rd part of vinyltrimethoxy silane is 1:4:5；
B) first part of end block resins, plasticizer, first part of vinyltrimethoxy silane and filler will be added in glue making machine,
In the case where temperature is 70 DEG C, high-speed stirred under vacuum environment, compound is obtained；
C) temperature of compound made from step b) is down to 60 DEG C, and add thereto polyamide sodium, light stabilizer and
Second part of vinyltrimethoxy silane, after stirring 30min；50 DEG C of additions, second part of end block resins are cooled to, are stirred under vacuum
After 15min；40 DEG C are cooled to, adds the 3rd part of vinyltrimethoxy silane, silane coupler, catalyst, is stirred under vacuum
30min, assembled architecture is produced with low modulus fluid sealant.
The shrinkage factor of low modulus fluid sealant of assembled architecture made from testing example 1~5, modulus, tensile strength and
Elongation, it the results are shown in Table 1.
The test result of the embodiment 1~5 of table 1
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or using this to institute's public affairs
The described above for the embodiment opened, professional and technical personnel in the field are enable to realize or using the present invention.To these embodiments
A variety of modifications will be apparent for those skilled in the art, and generic principles defined herein can be
In the case of not departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention is not intended to be limited to
The embodiments shown herein, and it is to fit to the most wide model consistent with principles disclosed herein and novel features
Enclose.
Claims (10)
1. the low modulus fluid sealant of a kind of assembled architecture, it is characterised in that include the raw material of following parts by weight：
2. the low modulus fluid sealant of assembled architecture as claimed in claim 1, it is characterised in that the end group of the end block resins
For trimethoxy end-blocking or triethoxy.
3. the low modulus fluid sealant of assembled architecture as claimed in claim 1, it is characterised in that the plasticizer is adjacent benzene two
The isodecyl ester of formic acid two.
4. the low modulus fluid sealant of assembled architecture as claimed in claim 1, it is characterised in that the filler is titanium dioxide
One or more in silicon, bentonite, titanium dioxide, aluminium dioxide, calcium carbonate and talcum powder.
5. the low modulus fluid sealant of assembled architecture as claimed in claim 1, it is characterised in that the light stabilizer is phenylamino
Ylmethyl triethoxysilane, γ-aminopropyltrimethoxysilane or gamma-aminopropyl-triethoxy-silane.
6. the low modulus fluid sealant of assembled architecture as claimed in claim 1, it is characterised in that the silane coupler is ammonia
Propyl-triethoxysilicane or glycidyl ester oxy propyl trimethoxysilane.
7. the low modulus fluid sealant of assembled architecture as claimed in claim 1, it is characterised in that the catalyst is two bays
Sour dibutyl tin, dibutyl tin acetate, tin dilaurate dioctyl tin or stannous octoate.
8. a kind of assembled architecture as described in any one of claim 1~7 preparation method of low modulus fluid sealant, its feature
It is, comprises the following steps：
A) end block resins are divided into first part of end block resins and second part of end block resins；Vinyltrimethoxy silane is divided into first
Part vinyltrimethoxy silane, second part of vinyltrimethoxy silane and the 3rd part of vinyltrimethoxy silane；
B) first part of end block resins, plasticizer, first part of vinyltrimethoxy silane and filler will be added in glue making machine, in temperature
Spend at 70 DEG C, high-speed stirred under vacuum environment, to obtain compound；
C) temperature of compound made from step b) is down to 60 DEG C, and adds polyamide sodium, light stabilizer and second thereto
Part vinyltrimethoxy silane, after stirring 30min；50 DEG C of additions, second part of end block resins are cooled to, are stirred under vacuum 15min
Afterwards；40 DEG C are cooled to, adds the 3rd part of vinyltrimethoxy silane, silane coupler, catalyst, is stirred under vacuum 30min, i.e.,
Obtain the low modulus fluid sealant of assembled architecture.
9. preparation method as claimed in claim 8, it is characterised in that first part of end block resins and described second part end-blocking
The mass ratio of resin is 1:1.
10. preparation method as claimed in claim 8, it is characterised in that first part of vinyltrimethoxy silane, described
The mass ratio of second part of vinyltrimethoxy silane and the 3rd part of vinyltrimethoxy silane is 1:4:5.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711003549.6A CN107722929A (en) | 2017-10-24 | 2017-10-24 | Assembled architecture low modulus fluid sealant and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711003549.6A CN107722929A (en) | 2017-10-24 | 2017-10-24 | Assembled architecture low modulus fluid sealant and preparation method thereof |
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| CN107722929A true CN107722929A (en) | 2018-02-23 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103408941A (en) * | 2013-08-23 | 2013-11-27 | 山东永安胶业有限公司 | Transparent dealcoholized single-component room temperature vulcanized silicone rubber and preparation method thereof |
| CN105111992A (en) * | 2015-06-15 | 2015-12-02 | 深圳市隆邦工业材料有限公司 | Mildew-proof silane-modified polyether sealant and preparation method therefor |
-
2017
- 2017-10-24 CN CN201711003549.6A patent/CN107722929A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103408941A (en) * | 2013-08-23 | 2013-11-27 | 山东永安胶业有限公司 | Transparent dealcoholized single-component room temperature vulcanized silicone rubber and preparation method thereof |
| CN105111992A (en) * | 2015-06-15 | 2015-12-02 | 深圳市隆邦工业材料有限公司 | Mildew-proof silane-modified polyether sealant and preparation method therefor |
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