CN107719959A - A kind of antistatic antidetonation electronic package pack and preparation method thereof - Google Patents
A kind of antistatic antidetonation electronic package pack and preparation method thereof Download PDFInfo
- Publication number
- CN107719959A CN107719959A CN201710750018.7A CN201710750018A CN107719959A CN 107719959 A CN107719959 A CN 107719959A CN 201710750018 A CN201710750018 A CN 201710750018A CN 107719959 A CN107719959 A CN 107719959A
- Authority
- CN
- China
- Prior art keywords
- interlayer
- antidetonation
- antistatic
- preparation
- electronic package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D31/00—Bags or like containers made of paper and having structural provision for thickness of contents
- B65D31/04—Bags or like containers made of paper and having structural provision for thickness of contents with multiple walls
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a kind of pack of antistatic antidetonation electronic package, the first inner surface, the first interlayer, the first outer surface, the second inner surface, the second interlayer, the second outer surface are included.First inner surface and the second inner surface are conducting film, first interlayer and the second interlayer are bubble PE films, first outer surface and the second outer surface are brown paper, first outer surface has the tongue part of extension compared to the second outer surface, the tongue is partially coated with sticky glue, the sticky tearable oiliness paper of glue surface mount.Packaging bag inner surface uses conducting film, can guide caused electrostatic in transportation, protect electrostatic sensitive type electronic component well.
Description
Technical field
The present invention relates to electronic component packaging bag technique field, more particularly to a kind of antistatic antidetonation electronic package to pack
And preparation method thereof.
Background technology
Packaging bag refers to the sack for packing various articles for use, makes goods convenience in transport in the process of circulation is produced, easily
Storage.It is widely used in daily life and industrial production, in use often by the product for being actually needed packaging
Demand formulates different packaging bags.
Electronic component is the basis for forming electronic product, when these electronic components are installed in production, it usually needs Jiang Qibao
Install and transported, but because electronic component is relatively fragile in itself, be easily damaged, therefore spy is needed in transportation
Not careful, prior art carries out packed and transported with usually using bubble bags to electronic component, so as to avoid electronic component because by
The problem of shaking the unfavorable factors such as friction and causing damage, but in actual use, bubble bags are easily damaged gas leakage, from
It is unable to protection well and arrives electronic component, service life is short, and bubble bags can not be to electronics member in transportation
Part plays waterproof, moistureproof effect, and the effect of radiation proof is poor, easily makes electronic component by radiation injury, particularly pin
To the electronic component of some electrostatic sensitives, bubble bags are easy to produce electrostatic, so as to cause the damage of electronic component, it is therefore desirable to
A kind of preferably scheme is proposed to solve this problem.
The content of the invention
The technical problem to be solved of the present invention is to provide a kind of antistatic antidetonation electronic package pack, existing to solve
There is caused drawbacks described above in technology.
In order to realize the purpose of the present invention, a kind of antistatic antidetonation electronic package pack and its making provided by the invention
Method, it is characterized in that：The antistatic antidetonation electronic package, which packs, includes the first inner surface, the first interlayer, the first outer surface,
Second inner surface, the second interlayer, the second outer surface.First inner surface and the second inner surface are conducting film, first folder
Layer and the second interlayer are bubble PE films, and first outer surface and the second outer surface are brown paper, and first outer surface is compared
There is the tongue part of extension in the second outer surface, the tongue is partially coated with sticky glue, the sticky tearable oil of glue surface mount
Property paper.
Preferably, described preparation method comprises the following steps：First outer surface and the preparation of the second outer surface：By sheet
Brown paper is cut according to size, obtains the first outer surface and the second outer surface, first outer surface and the second outer surface
Width is identical, and the first outer surface length is longer than the second outer surface, has more tongue part.Sticky glue is smeared in tongue part, is cut
With the oiliness paper of sticky glue suitable size, oiliness paper is pasted onto on sticky glue.The preparation of first interlayer and the second interlayer：By gas
Bubble PE films are cut according to size.Size is more slightly smaller than outer surface, and two plate inner surfaces are in the same size.First inner surface and second
The preparation of inner surface：The conducting film of sheet is cut according to the first interlayer, 2 size, table in the first inner surface and second
Face is in the same size, and identical with the first interlayer size.The preparation of antistatic antidetonation electronic package pack：With sticky glue elder generation handle
First inner surface, the first interlayer, the first outer surface are sticked together, then with sticky glue the second inner surface, the second interlayer, and
Two outer surfaces are sticked together, finally its excess-three side of the first outer surface and the second outer surface along removing tongue opening portion
Edge together, that is, prepares the pack of antistatic antidetonation electronic package with tack adhesive.
Preferably, first interlayer and the second interlayer are conducting film, and the conducting film can be plating metal packaging film, high
Molecule conducting film, metal conductive film is preferably plated, conducting film of more preferably aluminizing.
Preferably, the outer surface is brown paper, and the brown paper one side is mat surface, and another side is oiliness face.
Preferably, during inner surface and the interlayer adhesion, the oiliness face for outer surface of adhesion.
Preferably, the inner surface is identical with interlayer size, during adhesion by the way of overlapping.
The beneficial effects of the present invention are：Packaging bag inner surface uses conducting film, can be by caused electrostatic in transportation
Guide, protect electrostatic sensitive type electronic component well.Bubble PE film interlayers are set among inner surface and outer surface, prevented
Damage of the vibrations to electronic component during transport.The tongue with toughness glue is provided with the first outer surface, and
It is stained with oiliness paper on tongue, oiliness paper need to be only torn off during closing, tongue, which folds pressing, can complete the sealing of packaging bag, side
Just it is quick.Outer surface one side is mat surface, is simultaneously oiliness face, and mat surface can conveniently print, and oiliness face can be moistureproof, avoids
Damage of the environment of external humidification to element.
Brief description of the drawings
Fig. 1 is the second outer surface, the second interlayer, schematic diagram after the second inner surface adhesion；
Fig. 2 is the first outer surface, the first interlayer, schematic diagram after the first inner surface adhesion；
Fig. 3 is the first outer surface, the first interlayer, the first inner surface decomposing schematic representation；
In figure：1 is the second outer surface；2 be the second interlayer；3 be the second inner surface；4 be the first outer surface；5 be tongue；6
For oiliness paper；7 be the first interlayer, and 8 be the first inner surface.
Embodiment
The present invention is described in further details with reference to the accompanying drawings and detailed description.
Fig. 1 illustrates the embodiment of the present invention：First outer surface and the preparation of the second outer surface：By large stretch of ox-hide
Paper is cut according to size, obtains the first outer surface 4 and the second outer surface 1, the outer surface 1 of the first outer surface 4 and second
Width is identical, and the length of the first outer surface 4 is longer than the second outer surface 1, has more tongue part 5.Sticky glue is smeared in tongue part 5,
The oiliness paper 6 with sticky glue suitable size is cut, oiliness paper 6 is pasted onto on sticky glue.
The preparation of first interlayer 7 and the second interlayer 2：Bubble PE films are cut according to size.Size will than outer surface
Slightly smaller, two plate inner surfaces are in the same size.
The preparation of first inner surface 8 and the second inner surface 3：The conducting film of sheet is carried out according to the first interlayer, 2 size
Cut, the first inner surface 8 and the second inner surface 3 are in the same size, and identical with the size of the first interlayer 7.
The preparation of antistatic antidetonation electronic package pack：With sticky glue first the first inner surface 8, the first interlayer 7, first
Outer surface 4 is sticked together, and then the second inner surface 3, the second interlayer 2, the second outer surface 1 are sticked together with sticky glue,
Finally its excess-three edge tack adhesive of the first outer surface 4 and the second outer surface 1 along removing tongue opening portion one
Rise, that is, prepare the pack of antistatic antidetonation electronic package.
As known by the technical knowledge, the present invention can pass through the embodiment party of other essence without departing from its spirit or essential feature
Case is realized.Therefore, embodiment disclosed above, for each side, all it is merely illustrative, is not only.Institute
Have within the scope of the present invention or be included in the invention in the change being equal in the scope of the present invention.
Claims (6)
1. a kind of antistatic antidetonation electronic package pack, it is characterized in that：The antistatic antidetonation electronic package pack includes
First inner surface, the first interlayer, the first outer surface, the second inner surface, the second interlayer, the second outer surface, first inner surface
It is conducting film with the second inner surface, first interlayer and the second interlayer are bubble PE films, outside first outer surface and second
Surface is brown paper, and first outer surface has the tongue part of extension compared to the second outer surface, and the tongue is partially coated with
Sticky glue, the sticky tearable oiliness paper of glue surface mount.
A kind of 2. antistatic antidetonation electronic package pack according to claim 1, it is characterised in that：Above-mentioned packaging bag
Preparation method is as follows：
(1) first outer surface and the preparation of the second outer surface：Large stretch of brown paper is cut according to size, obtains the first appearance
Face and the second outer surface, first outer surface is identical with the second outer surface width, and the first outer surface length is than the second outer surface
It is long, have more tongue part；Sticky glue is smeared in tongue part, the oiliness paper with sticky glue suitable size is cut, oiliness paper is glued
It is attached on sticky glue；
The preparation of (2) first interlayers and the second interlayer：Bubble PE films are cut according to size；Size will be slightly than outer surface
Small, two plate inner surfaces are in the same size；
The preparation of (3) first inner surfaces and the second inner surface：The conducting film of sheet is cut out according to the first interlayer, 2 size
Cut, the first inner surface and the second inner surface are in the same size, and identical with the first interlayer size；
(4) preparation of antistatic antidetonation electronic package pack：With sticky glue first the first inner surface, the first interlayer, outside first
Surfaces stick together, is then sticked together the second inner surface, the second interlayer, the second outer surface with sticky glue, finally handle
First outer surface and the second outer surface prepare along together with removing its excess-three edge tack adhesive of tongue opening portion
Antistatic antidetonation electronic package packs.
A kind of 3. antistatic antidetonation electronic package pack according to claim 1 and preparation method thereof, it is characterised in that：
First interlayer and the second interlayer are conducting film, and the conducting film is plating metal packaging film or macromolecule conductive film.
A kind of 4. antistatic antidetonation electronic package pack according to claim 1 and preparation method thereof, it is characterised in that：
The outer surface is brown paper, and the brown paper one side is mat surface, and another side is oiliness face.
A kind of 5. antistatic antidetonation electronic package pack according to claim 1 and preparation method thereof, it is characterised in that：
During inner surface and the interlayer adhesion, the oiliness face for outer surface of adhesion.
A kind of 6. antistatic antidetonation electronic package pack according to claim 1 and preparation method thereof, it is characterised in that：
The inner surface is identical with interlayer size, during adhesion by the way of overlapping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710750018.7A CN107719959A (en) | 2017-08-28 | 2017-08-28 | A kind of antistatic antidetonation electronic package pack and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710750018.7A CN107719959A (en) | 2017-08-28 | 2017-08-28 | A kind of antistatic antidetonation electronic package pack and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107719959A true CN107719959A (en) | 2018-02-23 |
Family
ID=61205453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710750018.7A Pending CN107719959A (en) | 2017-08-28 | 2017-08-28 | A kind of antistatic antidetonation electronic package pack and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107719959A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997028064A1 (en) * | 1996-01-29 | 1997-08-07 | Instar Pty. Ltd. | Portable flexible container for keeping articles cold |
| US5791485A (en) * | 1994-10-24 | 1998-08-11 | Raytheon Company | Electrostatic discharge protection bag |
| CN2730771Y (en) * | 2004-08-24 | 2005-10-05 | 陈日铃 | Vibration-proof package bag |
| CN202686995U (en) * | 2012-06-21 | 2013-01-23 | 深圳市天源丰塑胶厂 | Bubble bag envelope |
| CN203094681U (en) * | 2012-12-26 | 2013-07-31 | 曹友 | Bubble bag packaging envelope |
| CN205525598U (en) * | 2016-01-30 | 2016-08-31 | 深圳市英菲尼迪纸品包装材料有限公司 | Multi -functional bubble bag |
-
2017
- 2017-08-28 CN CN201710750018.7A patent/CN107719959A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5791485A (en) * | 1994-10-24 | 1998-08-11 | Raytheon Company | Electrostatic discharge protection bag |
| WO1997028064A1 (en) * | 1996-01-29 | 1997-08-07 | Instar Pty. Ltd. | Portable flexible container for keeping articles cold |
| CN2730771Y (en) * | 2004-08-24 | 2005-10-05 | 陈日铃 | Vibration-proof package bag |
| CN202686995U (en) * | 2012-06-21 | 2013-01-23 | 深圳市天源丰塑胶厂 | Bubble bag envelope |
| CN203094681U (en) * | 2012-12-26 | 2013-07-31 | 曹友 | Bubble bag packaging envelope |
| CN205525598U (en) * | 2016-01-30 | 2016-08-31 | 深圳市英菲尼迪纸品包装材料有限公司 | Multi -functional bubble bag |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180223 |
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| RJ01 | Rejection of invention patent application after publication |