CN107717164A - PCB positioning hot melting device and method - Google Patents
PCB positioning hot melting device and method Download PDFInfo
- Publication number
- CN107717164A CN107717164A CN201711192645.XA CN201711192645A CN107717164A CN 107717164 A CN107717164 A CN 107717164A CN 201711192645 A CN201711192645 A CN 201711192645A CN 107717164 A CN107717164 A CN 107717164A
- Authority
- CN
- China
- Prior art keywords
- hot
- pcb
- movable plate
- positions
- control cabinet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000002844 melting Methods 0.000 title claims abstract description 33
- 230000008018 melting Effects 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 15
- 208000006011 Stroke Diseases 0.000 claims description 18
- 230000000153 supplemental effect Effects 0.000 claims description 12
- 230000004927 fusion Effects 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/0478—Heating appliances electric comprising means for controlling or selecting the temperature or power
Abstract
The invention discloses a PCB positioning hot melting device and a method, comprising a rack, wherein the rack is provided with an operation table and a control box, and a stroke mechanism, a hot melting mechanism and a positioning mechanism for fixing a device to be hot melted are arranged between the operation table and the control box; the stroke mechanism comprises a driving motor, a moving plate and a stroke shaft which can reciprocate in the height direction under the driving of the driving motor, one end of the stroke shaft is connected with the control box, and the other end of the stroke shaft is connected with the upper end surface of the moving plate; the hot melting mechanism is connected to the lower end face of the moving plate, and the positioning mechanism is fixed on the operating table and located below the hot melting mechanism; the operation table is provided with an operation key, and the operation key, the driving motor and the hot melting mechanism are all electrically connected with the control box. The invention realizes the accurate control of the transmission pressure and the hot melting temperature automatically by operating on the operating console to input various parameter data; can realize welding a plurality of welding points at one time, save time.
Description
Technical field
The present invention relates to a kind of location technology, more particularly to a kind of PCB positioning thermofusion devices and method.
Background technology
At present, the positioning to PCB, technique for fixing are that directly pcb board is fixed on plastics or metal shell by screw,
The either fixation by bump on metal shell or using more button bit forms, or entered by way of thermoplastic cement
Row welding.
But there is following defect in existing mode of operation：
A position can only be once fixed, simultaneously because no professional device causes temperature and pressure in stroke
It is uncontrollable.
The content of the invention
For overcome the deficiencies in the prior art, an object of the present invention is to provide a kind of PCB positioning thermofusion device, its
Hot melting temperature and drive train pressure are controllable.
The second object of the present invention is that providing a kind of PCB positions melt process, and its hot melting temperature and drive train pressure are controllable.
An object of the present invention adopts the following technical scheme that realization：
A kind of PCB positions thermofusion device, including frame, and the frame is provided with operating desk and control cabinet, operating desk and control
Strok mechanism, hot-melting mechanism and the detent mechanism for fixed device to be heated are provided between case processed；The Strok mechanism includes
Motor, movable plate and under the drive of motor can reciprocating stroke shaft in the height direction, stroke shaft
One end connects control cabinet, and the other end connects the upper surface of movable plate；Hot-melting mechanism is connected to the lower surface of movable plate, detent mechanism
It is fixed on operating desk, and positioned at the lower section of hot-melting mechanism；Operating desk is provided with Cao Zuoanjian, Cao Zuoanjian, motor and
Hot-melting mechanism is electrically connected with control cabinet.
Further, the hot-melting mechanism includes the plumb joint of multiple lower surfaces for being connected to movable plate and connected with plumb joint
The heat-generating pipe connect, heat-generating pipe are electrically connected with control cabinet.
Further, hot-melting mechanism also includes being used for the travel mechanism for controlling plumb joint to move.
Further, the travel mechanism include cylinder, drive shaft, sliding block and be arranged on movable plate lower surface cunning
Rail, one end connection cylinder of drive shaft, other end connection sliding block, so that sliding block moves on slide rail, and sliding block connecting welding head, gas
Cylinder connects control cabinet.
Further, the bearing of trend of the slide rail is X-direction.
The second object of the present invention adopts the following technical scheme that realization：
A kind of PCB positions melt process, positions thermofusion device applied to above-mentioned PCB, comprises the following steps：
Setting procedure：The supplemental characteristic of user's input is received, the supplemental characteristic includes drive train pressure, hot melting temperature and weldering
Connect the time；
Moving step：Movable plate is moved to by corresponding position with the drive train pressure control stroke shaft set according to supplemental characteristic
Put；
Heat fusion step：Heat-generating pipe work is controlled according to supplemental characteristic, makes plumb joint under the hot melting temperature of setting and sets
Butt welding contact is welded in fixed weld interval.
Compared with prior art, the beneficial effects of the present invention are：
(1) present invention is realized automatically to drive train pressure, hot melt temperature by being operated in operating desk to input various parameters data
Degree is precisely controlled；
(2) it can realize and disposably multiple pads are welded, save the time.
Brief description of the drawings
Fig. 1 is that a kind of PCB of the present invention positions the structural representation of thermofusion device.
In figure：1st, frame；2nd, operating desk；21st, Cao Zuoanjian；3rd, control cabinet；4th, detent mechanism；5th, stroke shaft；6th, it is mobile
Plate；7th, plumb joint；8th, cylinder.
Embodiment
Below, with reference to accompanying drawing and embodiment, the present invention is described further, it is necessary to which explanation is, not
Under the premise of afoul, new implementation can be formed between various embodiments described below or between each technical characteristic in any combination
Example.
As shown in figure 1, the present invention provides a kind of PCB positioning thermofusion device, it includes frame 1, and the frame 1 is provided with behaviour
Make platform 2 and control cabinet 3, operating desk 2 is located at the lower section of control cabinet 3, and control cabinet 3 is arranged on the top of frame 1, and operating desk 2 is set
In the bottom of frame 1.Strok mechanism, hot-melting mechanism and detent mechanism 4 are provided between operating desk 2 and control cabinet 3.Detent mechanism 4
For fixed device to be heated, in of the invention, detent mechanism 4, which first fixes shell, to be positioned, then pcb board is corresponding outer
Shell plastics locating dowel position is placed on shell, coordinates other mechanism butt welding contacts to carry out sweat soldering afterwards.Strok mechanism bag
Include motor, movable plate 6 and under the drive of motor can reciprocating stroke shaft 5 in the height direction, stroke
One end connection control cabinet 3 of axle, the other end connect the upper surface of movable plate 6.The installation site of motor may be set in control
Inside case 3 processed.Hot-melting mechanism is connected to the lower surface of movable plate 6, and detent mechanism 4 is fixed on operating desk 2, and is located at fuse machine
The lower section of structure；Operating desk 2 is provided with Cao Zuoanjian 21, and Cao Zuoanjian 21, motor and hot-melting mechanism are electrical with control cabinet 3
Connection.Cao Zuoanjian 21 is used to supply user's input parameter data, or is controlled operation, output operational order to control cabinet
3。
In the present invention, hot-melting mechanism includes the plumb joint 7 of multiple lower surfaces for being connected to movable plate 6 and connected with plumb joint 7
The heat-generating pipe connect, heat-generating pipe are electrically connected with control cabinet 3.Hot-melting mechanism also includes being used for the moving machine for controlling plumb joint 7 to move
Structure.Specifically.Travel mechanism include cylinder 8, drive shaft, sliding block and be arranged on movable plate lower surface slide rail, drive shaft
One end connection cylinder 8, other end connection sliding block so that sliding block moves on slide rail, sliding block connecting welding head.Wherein, slide rail
Bearing of trend be X-direction.It is, cylinder 8 is under the manipulation of control cabinet 3, it is final to drive plumb joint 7 in the X-axis direction
It is mobile, so as to the butt welding contact positioning welding in X-axis.
Still further aspect, the present invention also provide a kind of PCB based on PCB positioning thermofusion devices and position melt process, including
Step is as follows：
S1：The supplemental characteristic of user's input is received, when the supplemental characteristic includes drive train pressure, hot melting temperature and welding
Between；User passes through operating desk input parameter data, setting drive train pressure value, hot melting temperature value and weld interval value.
S2：Movable plate is moved to by correspondence position with the drive train pressure control stroke shaft set according to supplemental characteristic；According to
Drive train pressure control stroke shaft drives pressure of the movable plate when down moving.
S3：Heat-generating pipe work, the weldering for making plumb joint under the hot melting temperature of setting and setting are controlled according to supplemental characteristic
Butt welding contact in the time is connect to be welded.
Above-mentioned embodiment is only the preferred embodiment of the present invention, it is impossible to the scope of protection of the invention is limited with this,
The change and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention
Claimed scope.
Claims (6)
1. a kind of PCB positions thermofusion device, it is characterised in that including frame, the frame is provided with operating desk and control cabinet, behaviour
Make to be provided with Strok mechanism, hot-melting mechanism and the detent mechanism for fixed device to be heated between platform and control cabinet；The stroke
Mechanism include motor, movable plate and under the drive of motor can reciprocating stroke shaft in the height direction,
One end connection control cabinet of stroke shaft, the other end connect the upper surface of movable plate；Hot-melting mechanism is connected to the lower surface of movable plate,
Detent mechanism is fixed on operating desk, and positioned at the lower section of hot-melting mechanism；Operating desk is provided with Cao Zuoanjian, Cao Zuoanjian, drive
Dynamic motor and hot-melting mechanism are electrically connected with control cabinet.
2. PCB as claimed in claim 1 positions thermofusion device, it is characterised in that the hot-melting mechanism includes multiple be connected to
The plumb joint of the lower surface of movable plate and the heat-generating pipe being connected with plumb joint, heat-generating pipe are electrically connected with control cabinet.
3. PCB as claimed in claim 2 positions thermofusion device, it is characterised in that hot-melting mechanism also includes being used to control welding
The mobile travel mechanism of head.
4. PCB as claimed in claim 3 positions thermofusion device, it is characterised in that the travel mechanism includes cylinder, driving
Axle, sliding block and be arranged on movable plate lower surface slide rail, drive shaft one end connection cylinder, other end connection sliding block so that
Sliding block moves on slide rail, sliding block connecting welding head, cylinder connection control cabinet.
5. PCB as claimed in claim 4 positions thermofusion device, its feature exists, and the bearing of trend of the slide rail is X-direction.
6. a kind of PCB positions melt process, it is characterised in that positions thermofusion device, bag applied to the PCB described in claim 2
Include following steps：
Setting procedure：The supplemental characteristic of user's input is received, when the supplemental characteristic includes drive train pressure, hot melting temperature and welding
Between；
Moving step：Movable plate is moved to by correspondence position with the drive train pressure control stroke shaft set according to supplemental characteristic；
Heat fusion step：According to supplemental characteristic control heat-generating pipe work, make plumb joint under the hot melting temperature of setting and setting
Butt welding contact is welded in weld interval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711192645.XA CN107717164A (en) | 2017-11-24 | 2017-11-24 | PCB positioning hot melting device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711192645.XA CN107717164A (en) | 2017-11-24 | 2017-11-24 | PCB positioning hot melting device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107717164A true CN107717164A (en) | 2018-02-23 |
Family
ID=61219192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711192645.XA Withdrawn CN107717164A (en) | 2017-11-24 | 2017-11-24 | PCB positioning hot melting device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107717164A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113857613A (en) * | 2021-10-25 | 2021-12-31 | 深圳市联智波峰焊配件有限公司 | Welding equipment for automatic focusing module and use method thereof |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000246801A (en) * | 1999-02-26 | 2000-09-12 | Takiron Co Ltd | Thermal welding device for plastic plate |
| US20050034302A1 (en) * | 2003-07-17 | 2005-02-17 | Naoto Hosotani | Component connecting apparatus and method and component mounting apparatus |
| CN201511526U (en) * | 2009-09-25 | 2010-06-23 | 梅木精密工业(珠海)有限公司 | Novel multifunctional hot press |
| CN102601998A (en) * | 2012-03-09 | 2012-07-25 | 太仓市皓荣化工科技有限公司 | Hot melting device and hot melting method thereof |
| CN202608057U (en) * | 2012-03-30 | 2012-12-19 | 苏州凯尔博精密机械有限公司 | Hollow plate edge sealing machine |
| CN203936979U (en) * | 2014-05-13 | 2014-11-12 | 东莞劲胜精密组件股份有限公司 | Moulding hot melt mouth of a river machine |
| CN206010253U (en) * | 2016-08-31 | 2017-03-15 | 江苏伟康洁婧医疗器械股份有限公司 | A kind of scalpel sweating welder |
| WO2017114090A1 (en) * | 2015-12-29 | 2017-07-06 | 江西鑫田车业有限公司 | Welding apparatus |
| CN206415777U (en) * | 2017-01-18 | 2017-08-18 | 昆山咏联电子塑胶有限公司 | Heat ironware all-in-one |
| CN207681683U (en) * | 2017-11-24 | 2018-08-03 | 广东菲柯特电子科技有限公司 | PCB location hot melting device |
-
2017
- 2017-11-24 CN CN201711192645.XA patent/CN107717164A/en not_active Withdrawn
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000246801A (en) * | 1999-02-26 | 2000-09-12 | Takiron Co Ltd | Thermal welding device for plastic plate |
| US20050034302A1 (en) * | 2003-07-17 | 2005-02-17 | Naoto Hosotani | Component connecting apparatus and method and component mounting apparatus |
| CN201511526U (en) * | 2009-09-25 | 2010-06-23 | 梅木精密工业(珠海)有限公司 | Novel multifunctional hot press |
| CN102601998A (en) * | 2012-03-09 | 2012-07-25 | 太仓市皓荣化工科技有限公司 | Hot melting device and hot melting method thereof |
| CN202608057U (en) * | 2012-03-30 | 2012-12-19 | 苏州凯尔博精密机械有限公司 | Hollow plate edge sealing machine |
| CN203936979U (en) * | 2014-05-13 | 2014-11-12 | 东莞劲胜精密组件股份有限公司 | Moulding hot melt mouth of a river machine |
| WO2017114090A1 (en) * | 2015-12-29 | 2017-07-06 | 江西鑫田车业有限公司 | Welding apparatus |
| CN206010253U (en) * | 2016-08-31 | 2017-03-15 | 江苏伟康洁婧医疗器械股份有限公司 | A kind of scalpel sweating welder |
| CN206415777U (en) * | 2017-01-18 | 2017-08-18 | 昆山咏联电子塑胶有限公司 | Heat ironware all-in-one |
| CN207681683U (en) * | 2017-11-24 | 2018-08-03 | 广东菲柯特电子科技有限公司 | PCB location hot melting device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113857613A (en) * | 2021-10-25 | 2021-12-31 | 深圳市联智波峰焊配件有限公司 | Welding equipment for automatic focusing module and use method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180223 |
|
| WW01 | Invention patent application withdrawn after publication |