CN107715932B - Microfluidic device - Google Patents
Microfluidic device Download PDFInfo
- Publication number
- CN107715932B CN107715932B CN201711184950.4A CN201711184950A CN107715932B CN 107715932 B CN107715932 B CN 107715932B CN 201711184950 A CN201711184950 A CN 201711184950A CN 107715932 B CN107715932 B CN 107715932B
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- CN
- China
- Prior art keywords
- substrate
- thin film
- cover plate
- microfluidic device
- film electrode
- Prior art date
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- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000010409 thin film Substances 0.000 claims abstract description 27
- 238000004806 packaging method and process Methods 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 239000012530 fluid Substances 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 2
- 230000000007 visual effect Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 208000015181 infectious disease Diseases 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000011112 process operation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/12—Specific details about manufacturing devices
Abstract
The invention provides a microfluidic device, which comprises a substrate and a cover plate connected with the substrate, wherein a groove is arranged on the surface of the substrate opposite to the cover plate; the substrate is provided with a chamfer inclined plane at two ends parallel to the groove; a thin film electrode is further arranged on the surface of the base plate, which is opposite to the cover plate; the thin film electrodes extend from two sides of the notch of the groove to one side of the chamfer inclined plane away from the cover plate; the cover plate and the groove form a microfluidic channel, and microfluid passes through the microfluidic channel to generate a current which is led out by the thin film electrode on the chamfer inclined surface; the thin film electrode is further connected with an external circuit to form an electrical connection with the external circuit. According to the microfluidic device provided by the invention, the thin film electrode is led out from the side surface of the microfluidic device, so that the operation difficulty is reduced, the visual interference of the lead wire on the inside of the observation device is eliminated, the packaging yield of the product is effectively improved, and the production cost is reduced.
Description
Technical Field
The present invention relates to the field of microfluidics, and in particular, to a microfluidic device.
Background
Microfluidic devices are fluidic paths with one or more what are commonly referred to as channels, microchannels, grooves or recesses, with cross-sectional dimensions below 1000 μm, and provide benefits for chemical analysis such as increased flow and reduced reaction volume.
Currently, microfluidic devices for biomedical and biochemical applications are generally composed of a substrate with fluid channels and electrodes and a cover plate integrated with the substrate by an anodic bonding process. The conventional process draws the thin film electrode connected to the fluid channel by punching holes in designated locations of the cover plate and bonding wire bonds. The extraction mode increases the complexity of the processing technology of the microfluidic device, thereby leading to low packaging yield of products and high production cost.
Therefore, compared with the traditional wire bonding method, the novel extraction method is needed, through the method, the microfluidic device with the novel structure can be formed, the thin film electrode is extracted from the side face of the microfluidic device, the wire bonding is not needed, the operation difficulty is reduced, meanwhile, the visual interference of the wire on the inside of the observation device is eliminated, the packaging yield of the product is effectively improved, and the production cost is reduced.
Disclosure of Invention
In order to overcome the technical defects, the invention aims to provide the micro-fluid device with the novel structure, and the substrate of the micro-fluid device is provided with the chamfer inclined plane, so that the thin film electrode is led out from the side surface of the micro-fluid.
The invention provides a microfluidic device, which comprises a substrate and a cover plate connected with the substrate, wherein a groove is arranged on the surface of the substrate opposite to the cover plate;
the substrate is provided with a chamfer inclined plane at two ends parallel to the groove;
a thin film electrode is further arranged on the surface of the base plate, which is opposite to the cover plate;
the thin film electrodes extend from two sides of the notch of the groove to one side of the chamfer inclined plane away from the cover plate;
the cover plate and the groove form a microfluidic channel, and microfluid passes through the microfluidic channel to generate a current which is led out by the thin film electrode on the chamfer inclined surface;
the thin film electrode is further connected with an external circuit to form an electrical connection with the external circuit.
Preferably, the microfluidic device is further provided with a bottom plate;
the bottom plate and the thin film electrode are electrically connected through solder.
Preferably, the bottom plate is a package frame or a PCB board.
Preferably, the solder is silver paste solder.
Preferably, the material of the substrate is selected from one of silicon, germanium, gallium arsenide, ceramics, glass and high molecular polymer materials.
Compared with the prior art, the invention has the technical advantages that:
the film electrode is led out from the side surface of the micro-fluid device, and the cover plate of the micro-fluid device is not required to be perforated, compared with the traditional wire bonding method, the process operation difficulty is greatly reduced, meanwhile, the visual infection of the wire to the inside of the observation device is eliminated, and the packaging yield of the product can be effectively improved.
Drawings
FIG. 1 is a diagram of a cover plate structure of a microfluidic device according to an embodiment of the present invention;
fig. 2 is a substrate structure diagram of a microfluidic device according to an embodiment of the present invention;
FIG. 3 is a perspective view of a microfluidic device according to an embodiment of the present invention;
fig. 4 is a cross-sectional view of fig. 3 in the AA' direction.
Reference numerals:
1-a groove;
2-a thin film electrode;
3-chamfering the inclined plane;
4-a bottom plate;
5-silver paste solder;
6-welding spots.
Detailed Description
Advantages of the invention are further illustrated in the following description, taken in conjunction with the accompanying drawings and detailed description.
Referring to fig. 1, 2 and 3, a cover plate, a substrate and a microfluidic device structure of a microfluidic device according to an embodiment of the present invention are shown. The invention provides a microfluidic device, which comprises a substrate and a cover plate. In a preferred embodiment, the material of the substrate is selected from one of silicon, germanium, gallium arsenide, ceramic, glass, and polymeric materials.
As shown in fig. 1 and 2, the cover plate and the base plate are both rectangular structures. As shown in fig. 2, a groove 1, two chamfer inclined planes 3 and two thin film electrodes 2 are arranged on the substrate, and are all arranged on the surface of the substrate opposite to the cover plate.
Specifically, a rectangular groove 1 is arranged on the surface of the substrate opposite to the cover plate, and transversely penetrates through the whole substrate. Two chamfer slopes 3 are respectively arranged at two ends of the substrate at the left side and the right side of the groove 1, and the two chamfer slopes 3 are parallel to the groove 1. Two thin film electrodes 2 arranged on the substrate extend from two sides of a notch of the groove 1 to the left and right ends of the substrate respectively, extend to chamfer inclined planes 3 arranged at the left and right ends of the substrate, and cover one side, far away from the cover plate, of the chamfer inclined planes 3 so as to increase the contact area of the thin film electrodes 2 when the thin film electrodes are led out.
Referring to fig. 3, when the cover plate and the substrate are integrated by anodic bonding, the cover plate above the substrate and the groove 1 provided on the substrate form a rectangular microfluidic channel for flowing microfluid. When the microfluid passes through the microfluidic channel, the generated current is led out from the membrane electrode 2 covered on the chamfer bevel 3. Further, the thin film electrode 2 is connected to an external circuit, and current is led from the thin film electrode 2 to the external circuit to electrically connect the inside of the trench 1 with the external circuit.
In a preferred embodiment, as shown in fig. 3, the microfluidic device is further connected to a base plate, and after the base plate and the cover plate are combined into a whole by anodic bonding, the whole is further fixed to the base plate by connection of the membrane electrode 2 to the base plate, so as to realize electrical connection between the inside of the base plate and the base plate.
In a preferred embodiment, the base plate may comprise a package frame or a PCB board.
Referring to fig. 3 and 4, fig. 4 is a cross-sectional view of fig. 3 in the AA' direction. In a preferred embodiment, the substrate and the cover plate are integrally formed by anodic bonding and the film electrode positioned on the chamfer inclined surface 3 is connected with the welding spot 6 on the packaging frame or the PCB board by using the coating of silver paste solder 5, and the film electrode 2, the packaging frame or the PCB board is well electrically connected by the solidified silver paste solder 5, so that the inner part of the groove 1 in the substrate is electrically connected with an external circuit arranged on the packaging frame or the PCB board.
Unlike available technology, the present invention has no need of opening hole in the cover board and wire bonding process to establish the connection between the inside groove of the base board and the outer circuit. According to the micro-fluidic device, the thin film electrode is led out from the side face of the micro-fluidic device through the arrangement of the chamfer inclined plane on the substrate, and the thin film electrode is connected with an external circuit through silver paste solder, so that the electric connection between the inside of a groove in the substrate and the external circuit is realized, the process operation difficulty is greatly reduced, meanwhile, the visual infection of a lead wire to the inside of an observation device is eliminated, and the packaging yield of a product can be effectively improved.
It should be noted that the embodiments of the present invention are preferred and not limited in any way, and any person skilled in the art may make use of the above-disclosed technical content to change or modify the same into equivalent effective embodiments without departing from the technical scope of the present invention, and any modification or equivalent change and modification of the above-described embodiments according to the technical substance of the present invention still falls within the scope of the technical scope of the present invention.
Claims (4)
1. A microfluidic device comprising a substrate and a cover plate connected to the substrate, characterized in that,
grooves are formed in the surface, opposite to the cover plate, of the base plate;
the substrate is provided with a chamfer inclined plane at two ends parallel to the groove;
a thin film electrode is further arranged on the surface of the base plate, which is opposite to the cover plate;
the thin film electrodes extend from two sides of the notch of the groove to one side of the chamfer inclined plane away from the cover plate;
the cover plate and the groove form a microfluidic channel, and microfluid passes through the microfluidic channel to generate a current which is led out by the thin film electrode on the chamfer inclined surface;
the thin film electrode is further connected with an external circuit to form electric connection with the external circuit, wherein the micro-fluid device is further provided with a bottom plate, the bottom plate is positioned below the substrate, the periphery of the bottom plate extends outwards along the substrate, and the bottom plate is electrically connected with the thin film electrode through solder.
2. The microfluidic device of claim 1, wherein the microfluidic device comprises,
the bottom plate is a packaging frame or a PCB.
3. The microfluidic device of claim 1, wherein the microfluidic device comprises,
the solder is silver paste solder.
4. The microfluidic device of claim 1, wherein the microfluidic device comprises,
the material of the substrate is selected from one of silicon, germanium, gallium arsenide, ceramic, glass and high polymer materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711184950.4A CN107715932B (en) | 2017-11-23 | 2017-11-23 | Microfluidic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711184950.4A CN107715932B (en) | 2017-11-23 | 2017-11-23 | Microfluidic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107715932A CN107715932A (en) | 2018-02-23 |
| CN107715932B true CN107715932B (en) | 2023-06-16 |
Family
ID=61218233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711184950.4A Active CN107715932B (en) | 2017-11-23 | 2017-11-23 | Microfluidic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107715932B (en) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5000817A (en) * | 1984-10-24 | 1991-03-19 | Aine Harry E | Batch method of making miniature structures assembled in wafer form |
| JP4090939B2 (en) * | 2002-05-29 | 2008-05-28 | ニッタ株式会社 | Capacitive sensor and manufacturing method thereof |
| TWI257914B (en) * | 2004-03-01 | 2006-07-11 | Univ Nat Cheng Kung | Micro-fluid controller and method of making the same |
| CN1319617C (en) * | 2005-04-20 | 2007-06-06 | 中国科学技术大学 | Active mode mixer for microflow and mixing method |
| RU2422204C2 (en) * | 2006-03-20 | 2011-06-27 | Конинклейке Филипс Электроникс Н.В. | Encased carrier system for electronic micro fluid devices |
| US8256285B2 (en) * | 2007-08-21 | 2012-09-04 | BELIMO Holding, AG | Flow sensor including a base member with a resilient region forming a flow channel and a cover member covering the flow channel |
| JP5433453B2 (en) * | 2010-02-08 | 2014-03-05 | 株式会社堀場製作所 | Liquid sample analyzer |
| JP5453174B2 (en) * | 2010-06-01 | 2014-03-26 | Ｎｅｃトーキン株式会社 | Bottom electrode type solid electrolytic multilayer capacitor and its mounting body |
| TW201242246A (en) * | 2011-02-25 | 2012-10-16 | Seiko Epson Corp | Piezoelectric vibration element, piezoelectric vibrator, piezoelectric oscillator, vibration gyro element, vibration gyro sensor, and electronic apparatus |
| CN103913489B (en) * | 2013-01-09 | 2015-06-10 | 北京怡成生物电子技术股份有限公司 | Micro biochip for real-time detection of substances in body fluids |
| US9795963B2 (en) * | 2014-09-26 | 2017-10-24 | Picosys Incorporated | Method and apparatus for taped interlayer flow cell with masking and conductive traces |
| CN107118938B (en) * | 2017-04-07 | 2019-11-29 | 中北大学 | Fluid enhances the unicellular arrangement of dielectrophoresis and control chip and preparation method thereof |
| CN207694829U (en) * | 2017-11-23 | 2018-08-07 | 昌微系统科技(上海)有限公司 | A kind of microfluidic device |
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| CN107715932A (en) | 2018-02-23 |
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Effective date of registration: 20230921 Address after: 200331, Room 206, Building 6, No. 2653 Zhenbei Road, Putuo District, Shanghai Patentee after: Ningkasai Technology (Shanghai) Co.,Ltd. Address before: 200025 room 316, 105 Sinan Road, Huangpu District, Shanghai Patentee before: CHANG HE BIO-MEDICAL SCIENCE (YANGZHOU) CO.,LTD. |