JP2006090910A - Microchemical chip and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a microchemical chip manufacturable inexpensively, and having little contamination of an impurity and high reliability. <P>SOLUTION: This microchemical chip 10 is equipped with the first passage 3 for circulating a fluid to be treated, formed from a cavity 14 to the main surface of a semiconductor substrate 8, and having an opening part 12 on the main surface; a fine electronic machine mechanism 6 in the cavity 14; an electrode 7 on the main surface of the semiconductor substrate 8; an external connection member 1 wherein the second passage 9 having one open end 2 on the upper surface and having the other open end 5 on the other surface is formed inside and one open end 2 is arranged oppositely to the opening part 12; and a connection material 11 for communicating the first and second passages together by enclosing airtightly and the interval between the opening part 12 of the first passage 13 and one open end 2 of the second passage 15 and connecting them. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a microchemical chip comprising a microelectromechanical mechanism formed on a semiconductor substrate, and a flow path for flowing a fluid to be processed, and a manufacturing method thereof.

  In recent years, with the background of higher precision and higher efficiency in chemical analysis, the measurement of potential, flow rate, injection, discharge, and evaluation required for chromatographs and electrophoresis, which have been performed in conventional laboratories, are very small. So-called microchemical chips have been proposed that can be implemented in various sizes.

  Conventionally, as a general microchemical chip, a substrate made of a semiconductor, glass or the like in which a flow path is formed, a power source such as a micropump for flowing a processed fluid through the flow path, and a processed fluid And a functional part for performing various measurements and analyses.

  Among the micro chemical chips, what is called MEMS (Micro Electro Mechanical System) is one that can perform functions such as measurement of potential and mechanical movement such as sample transfer on a single semiconductor substrate. Proposed. For example, MEMS for microchemical chips are sensors such as accelerometers, pressure sensors, actuators, etc. for detecting changes in pressure of gases and liquids generated in response to chemical changes on the main surface of one semiconductor substrate. A micromirror device, which is a movable micro mirror that is used to change the optical axis for the purpose of high-precision detection when optically detecting changes that occur in response to chemical changes, light It has a structure in which a micropump or the like is formed and incorporated in a functional part such as a device, and has a very wide variety of structures.

  By connecting a flow path substrate or the like in which a flow path is formed to a semiconductor substrate in which such a MEMS is formed, and a structure in which the flow path and the part in which the MEMS or functional part is formed are communicated, It is possible to flow the fluid to be processed through the flow path by the power of the micro pump or the like provided in the MEMS, and the micro fluid capable of analyzing and measuring the fluid to be processed supplied through the flow path by the functional part provided in the MEMS. A chemical chip is formed.

  The MEMS includes, for example, fine protrusions for electrodes and DNA adsorption, fine structures such as a micro reaction tank, a micro mirror, and a micro pump, a movable body, and the like.

  The channel substrate is a channel that forms a groove-like channel on one main surface of a semiconductor such as silicon, PDMS (polydimethylsiloxane), or glass, or penetrates from one main surface to another main surface. It is the structure which formed.

  Note that the MEMS and the flow path are covered with a lid made of a glass plate or the like in order to prevent foreign substances from entering from outside air and perform chemical processing such as analysis and measurement with high accuracy. After being covered with the lid, the opening portion of the flow channel exposed to the outside serves as a supply port and a discharge port for the fluid to be processed, and the fluid to be processed is supplied from the supply port.

  Supply of a fluid to be processed (liquid containing a sample such as a biological material) to a supply port opened in a substrate made of silicon, PDMS, or the like is performed under pressure using a liquid delivery device such as a liquid nozzle or a liquid ejection device from the outside. Then, a fluid to be treated is caused to flow through the MEMS through the flow path to cause chemical reaction, detection, or the like.

  In addition, the microchemical chip is generally formed by connecting a connection pad for external connection to the main surface of the semiconductor substrate and the like and electrically connected to the MEMS portion, and the connection pad is connected to an external electric circuit such as a printed circuit board. By electrically connecting to the electrical circuit of the substrate, an electrical signal transmitted from the MEMS according to the result of chemical processing such as analysis and measurement is transmitted from the connection pad to an external electrical circuit.

  This microchemical chip using MEMS is formed on a silicon substrate or PDMS substrate by downsizing a chemical reaction / analysis system, and includes a microchannel, a micropump, a microreactor, and the like. By making the chemical reaction part of the flow path substrate micro and increasing the surface area per unit volume, the reaction time can be greatly reduced. In addition, since the flow rate can be precisely controlled, highly accurate detection can be performed.

  Note that the MEMS used in these conventional microchemical chips are, for example, fine projections for electrodes and DNA adsorption on the main surface of a semiconductor substrate such as silicon using so-called semiconductor micromachining techniques such as baking and etching. And a minute structure such as a micro reaction vessel, a micro mirror, and a micro pump, and a movable body.

In addition, the channel portion is formed with a groove-like or hole-like structure by applying so-called mold processing or stamping processing using photolithography to the main surface of a substrate such as silicon, PDMS, or glass. It is manufactured by.
JP 2002-214241 (page 4-5, FIG. 1) JP 2002-108619 A (page 4-5, FIG. 1)

  However, in the above-described conventional microchemical chip, the fluid to be processed used for detection or the like is supplied to the microchemical system by an external liquid nozzle, a liquid discharge device or the like, and the reagent as the fluid to be processed is once outside air. It was common to be exposed to For this reason, when the fluid to be treated is supplied to the flow path from the outside of the microchemical chip, there is a problem of contamination of foreign matters such as germs and dust (so-called contamination) into the fluid to be treated from the outside.

  In addition, since a large liquid supply apparatus is used, there is a limit to miniaturization of the flow rate of the fluid to be processed, and there is a problem that the processing speed is increased by limiting the fluid to be processed to be small.

  In addition, since it is necessary to separately prepare a large liquid supply apparatus, there is a problem that even if a microchemical system is manufactured at a low cost, the liquid supply apparatus is expensive.

  The present invention has been completed in view of the above-described conventional problems, and an object of the present invention is to provide a microchemical chip that can be manufactured at a low cost, has less impurities, and can employ various mounting forms, and a manufacturing method thereof. Is to provide.

  A microchemical chip according to the present invention is provided to circulate a semiconductor substrate having a cavity therein, and a fluid to be processed which is formed from the cavity to the main surface of the semiconductor substrate and has an opening in the main surface of the semiconductor substrate. A first flow path; a microelectromechanical mechanism formed in the cavity; an electrode formed on a main surface of the semiconductor substrate and electrically connected to the microelectromechanical mechanism; A second flow path having an end and the other open end on the other surface, and an external connection member disposed so that the one open end faces the opening; and A connecting member that allows the first and second flow paths to communicate with each other by hermetically surrounding and connecting between the opening of the first flow path and the one open end of the second flow path; It is characterized by that.

  The microchemical chip of the present invention is preferably characterized in that the second channel has a width in a cross section perpendicular to the flow direction of 0.05 to 0.5 mm.

  The microchemical chip of the present invention is preferably characterized in that the connecting material has an annular shape in cross section.

  In the microchemical chip of the present invention, preferably, the microelectromechanical mechanism is for chemically analyzing the fluid to be processed that has flowed out of the first flow path into the cavity. And

In the method for producing a microchemical chip of the present invention, a cavity formed in a semiconductor mother substrate and a fluid to be processed which is formed from the cavity to the main surface and has an opening in the main surface are circulated. A first micro-mechanical mechanism formed in the cavity and an electrode formed on the main surface and electrically connected to the micro-electromechanical mechanism. A step of preparing a multi-electron mechanical mechanism substrate in which a large number of mechanism areas are arranged vertically and horizontally;
An external connection member in which a second flow path having one open end on the upper surface and the other open end on the other surface is formed is disposed so that the one open end faces the opening. In addition, the first and second flow paths are communicated by airtightly surrounding and connecting the opening of the first flow path and one open end of the second flow path with a connecting material. A process of
Dividing the multi-chip microelectromechanical substrate to which the external connection member is connected into each microelectromechanical region to obtain individual microchemical chips.

  The microchemical chip of the present invention is a semiconductor substrate having a cavity inside, and a first fluid for forming a fluid to be processed which is formed from the cavity to the main surface of the semiconductor substrate and has an opening in the main surface of the semiconductor substrate. A flow path, a microelectromechanical mechanism formed in the cavity, an electrode formed on the main surface of the semiconductor substrate and electrically connected to the microelectromechanical mechanism, and the other surface having one open end on the upper surface A second flow path having the other opening end formed therein, and an external connection member disposed so that one opening end faces the opening, and the opening of the first flow path and the first flow path And a connecting material that allows the first and second flow paths to communicate with each other by hermetically surrounding and connecting between one open end of the two flow paths. Can keep sealed until reaction In, prevents foreign matter from the outside is mixed, it is possible to effectively prevent occurrence of problems such as so-called contamination.

  In addition, the liquid feeding function of the micro electromechanical mechanism (MEMS) part of the microchemical chip allows the fluid to be processed to flow through the flow path without using a separate large liquid supply device. A suitable amount of fluid to be treated may be prepared, and the cost required for the desired chemical treatment can be kept low.

  In addition, when the fluid to be processed is supplied from the outside to the flow path by using a liquid supply apparatus separately, it is not necessary to clean the external environment, and the amount of the fluid to be processed to be supplied can be further reduced. As a result, a generally expensive process fluid for chemical detection can be efficiently used in a small amount.

  Preferably, in the present invention, the width of the second flow path in the cross section perpendicular to the flow direction is 0.05 to 0.5 mm, so that the chemical reaction can be efficiently performed and the workability is improved. Therefore, it is easier to form a flow path in the insulating substrate, which is effective for controlling the liquid amount.

  Preferably, in the present invention, since the connecting member has an annular cross-sectional shape, the opening of the first flow path of the semiconductor substrate and one open end of the second flow path of the external connection member Since local stress concentration does not occur at the connection portion, the first and second flow paths can be connected more firmly and highly reliably, and a highly reliable microchemical chip can be obtained.

  In the present invention, preferably, the microelectromechanical mechanism is for chemically analyzing the fluid to be treated that has flowed out of the first flow path into the cavity, and therefore, the opening of the first flow path and Since a small amount of fluid to be processed flowing in a narrow space surrounded by the opening end of the second flow path and the connecting material can be efficiently analyzed chemically, chemical analysis can be efficiently performed with a small amount of fluid to be processed. You can do that.

  According to the method for producing a microchemical chip of the present invention, since each of the above steps is provided, a large number of microchemical chips arranged in rows and columns are taken and a micro-electromechanical substrate and each external connection portion are taken. And the sealing of the microelectromechanical mechanism can be performed simultaneously, so that the microchemical chip can be easily and reliably manufactured.

  Further, by dividing the multi-electron mechanical mechanism substrate to which the external connection member is connected into each micro electro mechanical mechanism region, the substrate is surrounded by the cavity, the first flow path, the second flow path, and the connection material. In addition to sealing the micro electromechanical mechanism in the micro space, each micro chemical chip comprising a flow path for supplying a fluid to be processed into the micro space and discharging the fluid to be processed from the micro space Many can be manufactured simultaneously. At the time of this division, each micro electro mechanical mechanism in the micro electro mechanical mechanism region is sealed by an external connection member, so that the cutting powder of the semiconductor substrate such as silicon generated by the dicing process is generated by the micro electro mechanical mechanism. The microelectromechanical mechanism can be reliably operated in the divided microchemical chip.

  In addition, since the microchemical chip obtained by dividing has an electrode led out to the main surface of the semiconductor substrate, it is possible to attach the terminal such as a metal bump to the leaded electrode to the external electronic circuit board. The microchemical chip can be mounted, and the mounting process can be made extremely short and easy.

  The microchemical chip and the manufacturing method thereof of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of a microchemical chip of the present invention. In FIG. 1, 1 is an external connection member, 2 is one open end, 3 is a first flow path, 4 is a cavity, 5 is the other open end, 6 is a microelectromechanical mechanism, 7 is an electrode, and 8 is a semiconductor. A substrate, 9 is a second flow path, 10 is a microchemical chip, 11 is a connecting material, and 12 is an opening.

  The external connection member 1 and the semiconductor substrate 8 are joined via a connection material 11 that connects the first flow path 3 in the semiconductor substrate 8 and the second flow path 9 in the external connection member 1. In addition, the cavity 4 exists inside the semiconductor substrate 8, and the microelectromechanical mechanism 6 is formed in the cavity 4. The fluid to be processed that is supplied to the space surrounded by the connecting material 11 through the second flow path 9 is processed by the microelectromechanical mechanism 6 in the cavity 4 via the first flow path 3. An electric signal generated in accordance with the process is transmitted from the electrode 7 to the outside, and the result of the process is known.

  The microelectromechanical mechanism 6 in the present invention has functions of various sensors such as a MEMS device using a fluid such as a biosensor, a DNA chip, a microreactor, and a print head, a chemical sensor, and a gas sensor. It is a part made by so-called micromachining based on technology, and has a size of about 10 μm to several 100 μm per element.

  The external connection member 1 functions as a member for sealing the microelectromechanical mechanism 6 and has one open end 2 and the other open end 5 to form the second flow path 9. Function as.

  This external connection member 1 is made of an iron-nickel alloy such as an iron-nickel-cobalt alloy or iron-nickel alloy (42 alloy), an oxygen-free copper, aluminum, stainless steel, a copper-tungsten alloy, a copper-molyb alloy, or the like. Materials or ceramic materials such as aluminum oxide sintered body (alumina ceramic), aluminum nitride sintered body, mullite sintered body, silicon carbide sintered body, silicon nitride sintered body, glass ceramic sintered body, etc. Alternatively, it is formed of an inorganic material such as Pyrex (registered trademark) glass, a resin material such as polyimide or glass epoxy resin, or a composite material obtained by bonding inorganic powder such as ceramics or glass with a resin such as epoxy resin.

  For example, the external connection member 1 is mechanically joined to the semiconductor substrate 8 via a connection material 11 that connects the second flow path 9 in the external connection member 1 and the first flow path 3 in the semiconductor substrate 8. Therefore, the reliability of bonding with the semiconductor substrate 8, that is, the shielding property to the outside of the space formed between the external connection member 1 and the semiconductor substrate 8, and the long-term use as the microchemical chip 10 are endured. In order to increase the long-term reliability, a mullite sintered body, or an aluminum oxide-borosilicate glass system in which the thermal expansion coefficient is approximated to the semiconductor substrate 8 by adjusting, for example, the kind and addition amount of the glass component. It is preferable to use a material having a small difference in thermal expansion coefficient from the semiconductor substrate 8, such as a glass ceramic sintered body.

  In addition, the external connection member 1 is made of an epoxy resin, a polyimide resin, or the like in order to enhance the heat retention of the fluid to be treated and to improve the stability of the treatment performed by the microelectromechanical mechanism 6, such as a chemical reaction. It is preferable to form with a material with low heat conductivity. In addition, the external connection member 1 may have a light-transmitting property such as a glass material when visually confirming the processing performed by the micro electro mechanical mechanism 6 or irradiating light for the processing. preferable.

  As described above, the microchemical chip 10 of the present invention uses the external connection member 1 that can select various materials according to the use and the like, has good characteristics such as mechanical strength and is easy to handle. In addition, since the open end of the second flow path 9 for allowing the fluid to be processed to flow through the external connection member 1 is formed, handling is easy.

  The external connection member 1 and the semiconductor substrate 8 are joined to each other via a connection material 11 that connects the second flow path 9 in the external connection member 1 and the first flow path 3 in the semiconductor substrate 8. In these joint portions, an internal space having the connecting material 11 as a sealed side wall is formed.

  The semiconductor substrate 8 is formed by processing a semiconductor material such as silicon or polysilicon into a plate shape. The cavity 4 exists inside, and the microelectromechanical mechanism 6 is formed in the cavity 4. The microelectromechanical mechanism 6 uses so-called maskless etching technology such as photolithography technology or laser processing, etching technology such as hydrofluoric acid etching, dry etching, etc. on one main surface of a semiconductor substrate 8 made of silicon, polysilicon or the like. To form a desired structure.

  For example, if the microelectromechanical mechanism 6 is for chemical processing, the surface state is changed using a coating technique such as spin coating or dip coating after being formed into a predetermined structure by etching according to the application. This makes it possible to control the wettability and chemical reactivity of chemicals, and is used for various analyzes such as chemical analysis, DNA identification, and chromatography.

  An electrode 7 electrically connected to the micro electro mechanical mechanism 6 is formed on one main surface of the semiconductor substrate 8. The electrode 7 has a function of transmitting an electrical signal transmitted in accordance with the result of processing such as chemical processing performed by the microelectromechanical mechanism 6 to the outside of the semiconductor substrate 8, and is made of a metal material such as aluminum or gold. It is made of a conductive material.

  The connection between the external connection member 1 and the semiconductor substrate 8 described above is performed via the connection material 11 that connects the second flow path 9 in the external connection member 1 and the first flow path 3 in the semiconductor substrate 8. It is done by doing.

  The connecting material 11 is composed of solder such as tin-silver alloy solder, tin-silver-copper alloy solder, low melting point brazing material such as gold-tin alloy brazing material, high melting point brazing material such as silver-germanium alloy brazing material, silver, It is formed of a conductive resin adhesive formed by bonding conductive powder such as copper with a resin.

  Further, inside the external connection member 1, one open end 2 is formed on the upper surface of the external connection member 1 so as to face the opening 12, and the other open end 5 is formed on the other surface of the external connection member 1. A second flow path 9 in which is formed is formed. The fluid to be processed is supplied to the space surrounded by the connecting material 11 through the second flow path 9, and then supplied to the microelectromechanical mechanism 6 in the cavity 4 through the first flow path 3. . As a result, a microchemical chip 10 having a processing function such as chemical processing such as potential measurement, detection and identification of DNA, chromatography, photochemical reaction, and the like is formed by flowing a fluid to be processed such as a sample for chemical analysis.

  The microchemical chip 10 of the present invention has a mechanical connection between the semiconductor substrate 8 side mainly having a processing function and the external connection member 1 side having a function of a fluid to be processed and an external connection. Bonding can be easily performed, and the productivity as the microchemical chip 10 can be improved.

  In the present invention, for example, it is also easy to arrange a large number of semiconductor substrates 8 and external connection members 1 in the vertical and horizontal directions, and to connect and bond them together. The individual can be hermetically sealed, and the productivity can be made extremely excellent.

  The second flow path 9 is produced using laser processing, drilling, or etching, or in the case of an inorganic material such as a ceramic material, a depression is formed on the green sheet using a press die, NC punching, or laser processing. And then stacking a plurality of green sheets.

  In addition, when the second channel 9 has a rectangular cross-sectional shape perpendicular to the flow direction, it is easy to observe and evaluate the cross section in a green sheet state using an SEM or a metal microscope. Accordingly, the cross-sectional shape perpendicular to the flow direction is preferably rectangular, and the width in the cross-section perpendicular to the flow direction is preferably 0.05 to 0.5 mm. When the thickness is less than 0.05 mm, it is difficult to process and form the second flow path 9, which may cause a decrease in productivity, an increase in cost, and the like. If the thickness exceeds 0.5 mm, the cross-sectional area of the second flow path 9 becomes large, which hinders miniaturization and efficient chemical reaction. Therefore, there is a possibility that the function as the microchemical chip 10 that performs high-precision and high-efficiency chemical analysis with a small amount of fluid to be processed may be deteriorated.

  Here, for the second flow path 9, the external connection member 1 is formed of a cylindrical aluminum oxide having a thickness of 0.5 mm, and has a cross section perpendicular to the flow direction from one main surface to the other main surface. Specific examples of testing the workability and chemical reactivity when a circular channel is formed are shown below.

  The green sheet was produced by forming a raw material powder mainly composed of aluminum oxide and silicon oxide into a sheet shape together with an organic solvent and a resin binder, and the second flow path 9 was formed by NC punching. Judgment criteria for workability were determined by visual inspection of whether a circular hole could be produced in the green sheet, and were observed and determined using a microscope. Whether or not the hole penetrates the entire region, and the inclination angle (so-called taper angle) of the inner surface of the hole from the vertical direction (axial direction) is completely parallel to the vertical direction in the vertical section of the hole. For the triangular shape formed between the imaginary line (taper angle = 0 °) and the line on the actual inner surface, the {width of the triangular portion (the bottom side of the triangle on the upper end side or the lower end side)} : The ratio of {length (the length of the side of the triangular hole in the axial direction: the depth of the hole)} is 1: 3 or less.

The chemical reactivity is such that when the chemical reaction is performed in the MEMS 6 manufactured on the Si substrate which is the semiconductor substrate 8, the amount of the fluid to be processed that is actually supplied to the MEMS 6 with respect to the minimum necessary liquid feeding amount. The case where it was 2 times or less was marked with ◯, and the case where it was doubled was marked with △. Table 1 shows the results of the above processability and chemical reactivity.

  From Table 1, if the width in the cross section perpendicular to the flow direction of the second flow path 9 is less than 0.05 mm, there is a tendency that defects are likely to occur in workability, and if it exceeds 0.5 mm, defects in chemical reactivity occur. There was a tendency to occur.

  In the present invention, the connecting member 11 preferably has an annular cross-sectional shape. As a result, local stress concentration occurs at the connection portion between the opening 12 of the first flow path 3 inside the semiconductor substrate 8 and one opening end 2 of the second flow path 9 inside the external connection member 1. Therefore, stronger and more reliable bonding is possible, and the highly reliable microchemical chip 10 can be obtained.

  In the present invention, the microelectromechanical mechanism 6 is preferably for chemically analyzing the fluid to be processed that has flowed out of the first flow path 3 into the cavity 4. As a result, a small amount of fluid to be processed that circulates in a narrow space surrounded by the opening 12 of the first flow path 3, the one open end 2 of the second flow path 9, and the connecting material 11 is efficiently produced. Since chemical analysis can be performed well, chemical analysis can be efficiently performed with a small amount of fluid to be processed.

  For chemical analysis, for example, a different standard sample of DNA is previously deposited on the exposed surface of a large number of pin-shaped projections, and the sample is treated by the projection that adsorbs the DNA in the fluid to be treated. A plurality of adsorbents that function as a so-called DNA chip for identifying DNA in a fluid or that trap molecules are arranged in the direction of flow of the fluid to be treated. Examples include those having a chromatographic analysis function for sequentially adsorbing molecules therein.

  Next, a method for manufacturing the microchemical chip 10 of the present invention will be described with reference to FIGS. FIG. 2 is a cross-sectional view showing an example of an embodiment of a method for producing a microchemical chip according to the present invention in the order of steps. In FIG. 2, the same parts as those in FIG.

  First, as shown in FIG. 2A, a large number of micro electro mechanical mechanism regions 29 each having a micro electro mechanical mechanism 6 and electrodes 7 electrically connected thereto are formed on one main surface of a semiconductor mother substrate 28. A plurality of micro-electromechanical mechanism substrates 30 that are arranged vertically and horizontally are prepared. The semiconductor mother substrate 28 is made of, for example, a silicon substrate such as single crystal or polycrystal. When a silicon oxide layer is formed on the surface of the silicon substrate, a microelectromechanical mechanism 6 such as a minute vibrating body is formed therein, and a microelectronic machine in which an electrode 7 made of a conductor such as a circular pattern is formed. By forming a large number of mechanism regions 29, a multi-electron mechanical mechanism substrate 30 is formed. In this example, the microelectromechanical mechanism 6 and the electrode 7 are electrically connected to each other through fine wiring (not shown) formed on one main surface of the semiconductor mother board 28.

  Next, as shown in FIG. 2B, one open end 2 is formed on the upper surface of the external connection member 1, and the other open end 5 is formed on the other surface of the external connection member 1. Two flow paths 9 are formed.

  For example, when the external connection member 1 is made of an aluminum oxide sintered body, the external connection member 1 is obtained by kneading raw material powders such as aluminum oxide, silicon oxide, and calcium oxide together with an organic solvent and a resin binder to obtain a slurry. The slurry is formed into a sheet shape by a doctor blade method, a lip coater method or the like to form a plurality of green sheets, and in the surface of the green sheet and in the through holes previously formed in the green sheet as necessary, It can be formed by printing and filling tungsten metallized paste, and then laminating and firing these green sheets.

  For example, when the external connection member 1 is made of an aluminum oxide sintered body, the second flow path 9 is formed by punching or punching a green sheet to be the external connection member 1 such as a press die, NC punching, or laser processing. It is formed by applying mechanical processing such as cutting to form an opening, a through hole, a groove or the like in the green sheet. For example, if the second flow path 9 is a through hole penetrating from one main surface to the other main surface as shown in FIG. 2B, a through hole is formed in each green sheet by NC punching. It is formed by laminating green sheets so that the through holes communicate from the uppermost layer to the lowermost layer.

  In addition, the 2nd flow path 9 does not need to be a through-hole over the full length, and is a horizontal groove shape from the center part etc. of the thickness direction of the external connection member 1 to the outer peripheral side surface in the state after dividing the external connection member 1 Other forms (not shown) such as those led to In this case, an elongated groove-like opening is formed at a predetermined portion of the green sheet by laser processing or the like, and another green sheet is laminated so as to cover the upper and lower sides of the opening, thereby forming the external connection member 1. A groove-shaped second flow path 9 can be formed inside.

  As the connecting material 11, solder such as tin-silver alloy solder, tin-silver (copper) -bismuth alloy solder, tin-lead alloy solder, metal powder such as silver, copper, gold, platinum, palladium, or the like A material such as a conductive resin adhesive formed by bonding a conductive filler powder obtained by coating a surface of a powder core material such as a resin by means of plating or the like with a resin such as an epoxy resin or an acrylic resin. it can.

  Moreover, the connection material 11 does not need to have electroconductivity. For example, a resin such as an epoxy resin or an acrylic resin, or a resin added with an inorganic powder such as glass or silica may be used.

  Next, as shown in FIG. 2C, in the micro electro mechanical mechanism substrate region 29 of the multi-chip micro electro mechanical mechanism substrate 30, one main surface of the semiconductor mother substrate 28 and one main surface of the external connection member 1 Are joined via the connecting material 11. In this step, a multi-chip microelectromechanical mechanism substrate 30 and the external connection member 1 are mechanically joined and connected, and a large number of microchemical chips formed for each microelectromechanical mechanism region 29 and the external connection member 1. 10 are formed in a state of being arranged vertically and horizontally.

  In this way, by performing the process of joining one main surface of the semiconductor mother board 28 and one main surface of the external connection member 1 via the connection material 11 in one step, the microchemical chip can be obtained in a multi-cavity state. 10 can be easily formed.

  Here, the joining performed by connecting one main surface of the semiconductor mother board 28 and one main surface of the external connecting member 1 via the connecting material 11 is, for example, when the connecting material 11 is made of tin-silver alloy solder. The external connection member 1 is positioned and placed on the surface 28, and these are heat-treated in a reflow furnace at a temperature of about 250 to 300 ° C.

  As described above, according to the method for manufacturing the microchemical chip 10 of the present invention, since the bonding of the semiconductor mother substrate 28 (semiconductor substrate 8) and the external connection member 1 can be performed in a state in which a large number are arranged, it takes several hours. It is possible to complete the joining process such as soldering that requires a certain degree in one time, and at the same time, it is possible to fabricate in a state where a large number of microchemical chips are arranged. Can be greatly enhanced.

  Then, as shown in FIG. 2D, the external connection member 1 and the micro electro mechanical mechanism region substrate 30 are divided into micro electro mechanical mechanism regions 29 and the external connection member 1 is joined to the semiconductor substrate 8. An individual microchemical chip 10 is obtained.

  The joined body of the external connection member 1 and the semiconductor mother substrate 28 joined to each other can be cut by subjecting the joined body to a cutting process such as dicing. In the manufacturing method of the microchemical chip 10 of the present invention, each microelectromechanical mechanism 6 is accommodated in an internal space formed by the semiconductor substrate 8 and the external connection member 1 during the cutting process such as dicing. Therefore, it is possible to effectively prevent silicon, metal, etc. generated by cutting the semiconductor substrate 8, the insulating substrate 1 and the like from adhering to the microelectromechanical mechanism 6, and the completed microchemical chip 10 Thus, the micro electro mechanical mechanism 6 can be operated normally with certainty.

  Further, by taking measures such as increasing the flow rate of cleaning water used at the time of cutting or making the flowing direction perpendicular to the opening end of the flow path, the microelectromechanical mechanism 6 can be more reliably configured. Can be operated normally.

  As described above, according to the method of manufacturing the microchemical chip 10 of the present invention, the formation of the internal space in which the microelectromechanical mechanism 6 is accommodated, and the step of opening the flow path for causing the fluid to be treated to flow into the internal space, Thus, the productivity of the microchemical chip 10 can be made extremely high. Further, since the microchemical chip 10 manufactured in this manner is already hermetically sealed and the electrode 7 is led out to the outside, an external terminal such as a solder ball is attached to an external electric circuit. It can be used by being mounted on an external electric circuit board simply by connecting via.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change is possible if it is in the range of the summary of this invention. For example, in the above-described embodiment, one microelectromechanical mechanism is hermetically sealed in one microchemical chip, but a plurality of microelectromechanical mechanisms may be hermetically sealed in one microchemical chip.

It is sectional drawing which shows an example of embodiment of the microchemical chip of this invention. (A)-(d) is sectional drawing which showed an example of embodiment of the manufacturing method of the microchemical chip of this invention in order of a process, respectively.

Explanation of symbols

1: external connection member 2: one open end 3: first flow path 4: cavity 5: other open end 6: micro electromechanical mechanism 7: electrode 8: semiconductor substrate 9: second flow path 10: micro Chemical chip 11: connecting material 12: opening

Claims (5)

A semiconductor substrate having a cavity therein, a first flow path for flowing a fluid to be processed formed from the cavity to the main surface of the semiconductor substrate and having an opening in the main surface of the semiconductor substrate; A microelectromechanical mechanism formed in the cavity; an electrode formed on the main surface of the semiconductor substrate and electrically connected to the microelectromechanical mechanism; and one open end on the upper surface and the other on the other surface. A second flow path having an opening end formed therein, and an external connection member disposed so that the one opening end faces the opening, and the opening of the first flow path And a connecting material that allows the first and second flow paths to communicate with each other by hermetically surrounding and connecting between the first opening end of the second flow path and the one open end of the second flow path. Micro chemical chip. The microchemical chip according to claim 1, wherein the second channel has a width in a cross section perpendicular to the flow direction of 0.05 to 0.5 mm. 3. The microchemical chip according to claim 1, wherein the connecting material has an annular cross-sectional shape. 4. The micro electro mechanical mechanism is for chemically analyzing the fluid to be treated that has flowed out of the first flow path into the cavity. A microchemical chip according to 1. A cavity formed in the semiconductor mother substrate; a first flow path for flowing a fluid to be processed formed from the cavity to the main surface and having an opening in the main surface; A large number of microelectromechanical mechanism regions formed by arranging a plurality of microelectromechanical mechanisms formed in the main surface and electrodes electrically connected to the microelectromechanical mechanism formed on the main surface, vertically and horizontally. A step of preparing a substrate for micro-electromechanical mechanism,
An external connection member in which a second flow path having one open end on the upper surface and the other open end on the other surface is formed is disposed so that the one open end faces the opening. In addition, the first and second flow paths are communicated by airtightly surrounding and connecting the opening of the first flow path and one open end of the second flow path with a connecting material. A process of
A step of dividing each of the micro-electromechanical mechanism substrates to which the external connection members are connected into each micro-electromechanical mechanism region to obtain individual microchemical chips. Chip manufacturing method.

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