CN107689300A - A kind of chip tantalum capacitor - Google Patents
A kind of chip tantalum capacitor Download PDFInfo
- Publication number
- CN107689300A CN107689300A CN201710786792.3A CN201710786792A CN107689300A CN 107689300 A CN107689300 A CN 107689300A CN 201710786792 A CN201710786792 A CN 201710786792A CN 107689300 A CN107689300 A CN 107689300A
- Authority
- CN
- China
- Prior art keywords
- tantalum
- chip
- nickel strap
- capacitor
- metal shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 229910052715 tantalum Inorganic materials 0.000 title claims abstract description 39
- 239000003990 capacitor Substances 0.000 title claims abstract description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 18
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 239000004332 silver Substances 0.000 claims abstract description 8
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000010422 painting Methods 0.000 claims description 3
- 229910001923 silver oxide Inorganic materials 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 12
- 239000008188 pellet Substances 0.000 abstract description 4
- 238000000605 extraction Methods 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0003—Protection against electric or thermal overload; cooling arrangements; means for avoiding the formation of cathode films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The present invention provides a kind of chip tantalum capacitor, including ceramic dielectric diaphragm, multiple ceramic dielectric diaphragms, which are sequentially overlapped, to be shifted to install in formation tantalum chip, the cohesive conducting resinl of one layer of tantalum chip outer wrapping, conducting resinl outer wrapping layer of metal shell is being bonded again, the tantalum chip lower end is provided with nickel strap, and nickel strap is fixedly welded on tantalum chip, it is adhered to after being welded and fixed by being bonded silver paste in metal shell body, and the cathode end with being fixedly installed on metal shell body connects.The present invention between anode tantalum core and bonding silver paste by increasing nickel strap, utilize temperature stress caused by nickel strap release tantalum core, improve the heat-resisting ability of capacitor, solve the problems, such as that existing capacitor can not meet high-temperature work environment, pellet anode tantalum wire draws the new extraction metal wire of welding one, and it is easy to welding welding.
Description
Technical field
The present invention relates to capacitor technology field, and in particular to a kind of chip tantalum capacitor.
Background technology
Tantalum electrolytic capacitor mainly plays energy storage, filtering, bypass, coupling, decoupling, phase inversion etc. in electronic circuit and electrically made
With being the essential part of electronic circuit, its maximum operating temperature scope is generally 125 DEG C, and oil drilling, geology
In the industries such as exploration, space probation, spacecraft, environment temperature when equipment works is considerably beyond 125 DEG C, existing tantalum electricity
Electrolysis condenser can not meet the requirement of above-mentioned field electronic equipment, although the nothing such as ceramic capacitor, glass glaze condenser
Electromechanical container can be used in 125 DEG C of high temperature above environment, but the capacitance of these capacitors is too small, it is impossible to substitute tantalum electricity
The effect of electrolysis condenser in the line, easily invaded under the harsh environment such as high temperature, high humidity by moisture or corrosivity gas-liquid
Device inside conducting circuit and fuse are destroyed, causes properties of product to deteriorate or even fail, also limit it in space flight, oil field etc.
Under complex environment and high reliability request use.
The content of the invention
(1) technical problem solved
In view of the shortcomings of the prior art, the invention provides a kind of chip tantalum capacitor, the deficiencies in the prior art are overcome,
It is reasonable in design, it is compact-sized, by increasing nickel strap between anode tantalum core and bonding silver paste, using caused by nickel strap release tantalum core
Temperature stress, the heat-resisting ability of capacitor is improved, solves the problems, such as that existing capacitor can not meet high-temperature work environment,
Pellet anode tantalum wire draws the new extraction metal wire of welding one, and it is easy to welding welding.
(2) technical scheme
To realize object above, the present invention is achieved by the following technical programs：
A kind of chip tantalum capacitor, including ceramic dielectric diaphragm, multiple ceramic dielectric diaphragms be sequentially overlapped shift to install in
Tantalum chip, the cohesive conducting resinl of one layer of tantalum chip outer wrapping are formed, then is bonding conducting resinl outer wrapping layer of metal shell, institute
State tantalum chip lower end and be provided with nickel strap, nickel strap is fixedly welded on tantalum chip, and metal is adhered to by being bonded silver paste after being welded and fixed
In shell body, and the cathode end with being fixedly installed on metal shell body connects.
It is cathode terminal that silver oxide is scribbled on the tantalum chip, and painting alumina layer is anode lead wire.
Gap is filled provided with resin between the tantalum chip and housing.
Multiple ceramic dielectric diaphragms have the part of dipping and heaving.
The nickel strap is soft state nickel strap.
Described metal shell is connected to the positive pole pin of " L " shape and the negative pin of " L " shape.
(3) beneficial effect
The embodiments of the invention provide a kind of chip tantalum capacitor.Possesses following beneficial effect：The present invention is by anode
Increase nickel strap between tantalum core and bonding silver paste, using temperature stress caused by nickel strap release tantalum core, improve the resistance to height of capacitor
Warm ability, solve the problems, such as that existing capacitor can not meet high-temperature work environment, it is new that pellet anode tantalum wire draws welding one
Metal wire is drawn, it is easy to welding welding.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 schematic structural views of the invention.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
A kind of chip tantalum capacitor, including ceramic dielectric diaphragm 1, multiple ceramic dielectric diaphragms 1, which are sequentially overlapped, to be shifted to install
In formation tantalum chip, the cohesive conducting resinl 2 of one layer of tantalum chip outer wrapping, then bonding conducting resinl outer wrapping layer of metal shell
3, the tantalum chip lower end is provided with nickel strap 4, and the nickel strap 4 is soft state nickel strap, and nickel strap 4 is fixedly welded on tantalum chip, and welding is solid
It is adhered to after fixed by being bonded silver paste in metal shell body 3, and the cathode end with being fixedly installed on metal shell body 3 connects
Logical, it is cathode terminal that silver oxide is scribbled on the tantalum chip, and painting alumina layer is anode lead wire, the tantalum chip and housing
Between gap filled provided with resin, multiple ceramic dielectric diaphragms 2 have the part of dipping and heaving, described metal shell point
The positive pole pin of " L " shape and the negative pin 5 of " L " shape are not connected with；The present invention is by between anode tantalum core and bonding silver paste
Increase nickel strap, using temperature stress caused by nickel strap release tantalum core, improve the heat-resisting ability of capacitor, solve existing electricity
Container can not meet the problem of high-temperature work environment, and pellet anode tantalum wire draws the new extraction metal wire of welding one, and it is easy to molten
Connect welding.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation make a distinction with another entity or operation, and not necessarily require or imply and deposited between these entities or operation
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Nonexcludability includes, so that process, method, article or equipment including a series of elements not only will including those
Element, but also the other element including being not expressly set out, or it is this process, method, article or equipment also to include
Intrinsic key element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that
Other identical element also be present in process, method, article or equipment including the key element.
The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
The present invention is described in detail, it will be understood by those within the art that：It still can be to foregoing each implementation
Technical scheme described in example is modified, or carries out equivalent substitution to which part technical characteristic；And these modification or
Replace, the essence of appropriate technical solution is departed from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (6)
1. a kind of chip tantalum capacitor, including ceramic dielectric diaphragm, it is characterised in that：Multiple ceramic dielectric diaphragms are sequentially overlapped mistake
Position is arranged to form tantalum chip, the cohesive conducting resinl of one layer of tantalum chip outer wrapping, then is bonding one layer of gold of conducting resinl outer wrapping
Belong to shell, the tantalum chip lower end is provided with nickel strap, and nickel strap is fixedly welded on tantalum chip, glued after being welded and fixed by being bonded silver paste
It is connected in metal shell body, and the cathode end with being fixedly installed on metal shell body connects.
2. chip tantalum capacitor as claimed in claim 1, it is characterised in that：Silver oxide is scribbled on the tantalum chip for negative electrode to draw
Outlet, painting alumina layer are anode lead wire.
3. chip tantalum capacitor as claimed in claim 1, it is characterised in that：Gap is provided with tree between the tantalum chip and housing
Fat is filled.
4. chip tantalum capacitor as claimed in claim 1, it is characterised in that：Multiple ceramic dielectric diaphragms have upper lower
The part of volt.
5. chip tantalum capacitor as claimed in claim 1, it is characterised in that：The nickel strap is soft state nickel strap.
6. chip tantalum capacitor as claimed in claim 1, it is characterised in that：Described metal shell is connected to " L " shape
Positive pole pin and " L " shape negative pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710786792.3A CN107689300A (en) | 2017-09-04 | 2017-09-04 | A kind of chip tantalum capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710786792.3A CN107689300A (en) | 2017-09-04 | 2017-09-04 | A kind of chip tantalum capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107689300A true CN107689300A (en) | 2018-02-13 |
Family
ID=61155804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710786792.3A Pending CN107689300A (en) | 2017-09-04 | 2017-09-04 | A kind of chip tantalum capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107689300A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102906835A (en) * | 2009-12-16 | 2013-01-30 | 艾普瑞特材料技术有限责任公司 | Capacitor with three-dimensional high surface area electrode and methods of manufacture |
| CN205016388U (en) * | 2015-09-25 | 2016-02-03 | 株洲宏达电子股份有限公司 | Metal packaging structure piece formula tantalum capacitor |
| CN105826080A (en) * | 2016-05-30 | 2016-08-03 | 中国振华（集团）新云电子元器件有限责任公司 | Hermetically-sealed solid electrolyte tantalum capacitor packaged through ceramic |
| CN106298803A (en) * | 2016-08-18 | 2017-01-04 | 深圳市华星光电技术有限公司 | Array base palte and preparation method thereof, display panels |
-
2017
- 2017-09-04 CN CN201710786792.3A patent/CN107689300A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102906835A (en) * | 2009-12-16 | 2013-01-30 | 艾普瑞特材料技术有限责任公司 | Capacitor with three-dimensional high surface area electrode and methods of manufacture |
| CN205016388U (en) * | 2015-09-25 | 2016-02-03 | 株洲宏达电子股份有限公司 | Metal packaging structure piece formula tantalum capacitor |
| CN105826080A (en) * | 2016-05-30 | 2016-08-03 | 中国振华（集团）新云电子元器件有限责任公司 | Hermetically-sealed solid electrolyte tantalum capacitor packaged through ceramic |
| CN106298803A (en) * | 2016-08-18 | 2017-01-04 | 深圳市华星光电技术有限公司 | Array base palte and preparation method thereof, display panels |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180213 |
|
| RJ01 | Rejection of invention patent application after publication |