CN107686634A - A kind of LED heat sink material and its preparation technology - Google Patents
A kind of LED heat sink material and its preparation technology Download PDFInfo
- Publication number
- CN107686634A CN107686634A CN201710970994.3A CN201710970994A CN107686634A CN 107686634 A CN107686634 A CN 107686634A CN 201710970994 A CN201710970994 A CN 201710970994A CN 107686634 A CN107686634 A CN 107686634A
- Authority
- CN
- China
- Prior art keywords
- parts
- heat sink
- sink material
- preparation technology
- lubricating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of LED heat sink material and its preparation technology, heat sink material component includes 10 20 parts of graphene, 5 15 parts of carbon nano-fiber, 39 parts of nano titanium oxide, 28 parts of polyamide, 4 12 parts of iron oxide, 8 18 parts of zinc oxide, 4 10 parts of boron nitride, 24 parts of lubricating and wear-resisting agent, 10 15 parts of glycolylurea epoxide resin, 39 parts of chlorphenyl silicone oil in parts by weight, preparation technology of the present invention is simple, obtained heat sink material has excellent radiating, resistance to elevated temperatures, can extend the service life of LED.
Description
Technical field
The present invention relates to heat sink material preparing technical field, specially a kind of LED heat sink material and its preparation technology.
Background technology
The fast development of LED industries, the development of upstream materials industry has been pulled significantly, has also further promoted high end materials
The breakthrough in field.Wherein, substantial amounts of heat sink material, including the potted element of LED chips, LED light can be used in LED light fixtures
Learn lens, light-scattering component, high efficiency and heat radiation element, light reflection and light diffusing board etc..
All the time, radiate bad the problems such as causing power supply damage, light decay quickening, reduced lifetime, be that LED shines all the time
The most important thing of bright systematic function lifting.Traditional three kinds are used for the material of LED radiators, including aluminium, plastics and ceramics,
Three respectively has quality, but can not still meet that the good insulating needed for LED radiator materials, the coefficient of expansion be low, heat conduction simultaneously
The advantages of coefficient is big, good heat dissipation effect, light and good mechanical property.
The content of the invention
It is an object of the invention to provide a kind of LED heat sink material and its preparation technology, to solve above-mentioned background technology
The problem of middle proposition.
To achieve the above object, the present invention provides following technical scheme:A kind of LED heat sink material, heat sink material component
Include graphene 10-20 parts, carbon nano-fiber 5-15 parts, nano titanium oxide 3-9 parts, polyamide 2-8 parts, oxygen in parts by weight
Change iron 4-12 parts, zinc oxide 8-18 parts, boron nitride 4-10 parts, lubricating and wear-resisting agent 2-4 parts, glycolylurea epoxide resin 10-15 parts, chlorobenzene
Base silicone oil 3-9 parts.
Preferably, the preferable composition proportion of heat sink material component includes 15 parts of graphene, part, nanometer two of carbon nano-fiber 10
6 parts of titanium oxide, 5 parts of polyamide, 8 parts of iron oxide, 13 parts of zinc oxide, 7 parts of boron nitride, 3 parts of lubricating and wear-resisting agent, glycolylurea epoxide resin
12 parts, 6 parts of chlorphenyl silicone oil.
Preferably, its preparation technology comprises the following steps:
A, add in grinder and grind after mixing iron oxide, zinc oxide, boron nitride, time 20min, obtain mixture A;
B, lubricating and wear-resisting agent, glycolylurea epoxide resin, chlorphenyl silicone oil are added in mixture A, is added after mixing low in stirred tank
Speed stirring, stir speed (S.S.) are 100 revs/min, time 10min, sequentially add graphene, carbon nano-fiber in whipping process, receive
Rice titanium dioxide, polyamide, continue to stir 20min, stand 5min, obtain mixture B;
C, mixture B is placed into 10h at normal temperatures, that is, obtains heat sink material.
Compared with prior art, the beneficial effects of the invention are as follows:Preparation technology of the present invention is simple, obtained heat sink material tool
There are excellent radiating, resistance to elevated temperatures, the service life of LED can be extended;The iron oxide that is added in the present invention, zinc oxide,
Boron nitride, it is possible to increase the resistance to elevated temperatures of heat sink material;Glycolylurea epoxide resin, the chlorphenyl silicone oil of addition, it is possible to increase dissipate
The greasy property of hot material;Obtained through overtesting, heat sink material thermal conductivity factor produced by the present invention reaches 3.8W/m.k, surface electricity
Resistance reaches 3.2*1011Ω/sq。
Embodiment
The technical scheme in the embodiment of the present invention is clearly and completely described below, it is clear that described embodiment
Only part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the common skill in this area
The every other embodiment that art personnel are obtained under the premise of creative work is not made, belong to the model that the present invention protects
Enclose.
The present invention provides following technical scheme:A kind of LED heat sink material, heat sink material component include stone in parts by weight
Black alkene 10-20 parts, carbon nano-fiber 5-15 parts, nano titanium oxide 3-9 parts, polyamide 2-8 parts, iron oxide 4-12 parts, oxidation
Zinc 8-18 parts, boron nitride 4-10 parts, lubricating and wear-resisting agent 2-4 parts, glycolylurea epoxide resin 10-15 parts, chlorphenyl silicone oil 3-9 parts.
Embodiment one:
Heat sink material component includes 10 parts of graphene, 5 parts of carbon nano-fiber, 3 parts of nano titanium oxide, polyamide in parts by weight
2 parts, 4 parts of iron oxide, 8 parts of zinc oxide, 4 parts of boron nitride, 2 parts of lubricating and wear-resisting agent, 10 parts of glycolylurea epoxide resin, chlorphenyl silicone oil 3
Part.
The preparation technology of the present embodiment comprises the following steps:
A, add in grinder and grind after mixing iron oxide, zinc oxide, boron nitride, time 20min, obtain mixture A;
B, lubricating and wear-resisting agent, glycolylurea epoxide resin, chlorphenyl silicone oil are added in mixture A, is added after mixing low in stirred tank
Speed stirring, stir speed (S.S.) are 100 revs/min, time 10min, sequentially add graphene, carbon nano-fiber in whipping process, receive
Rice titanium dioxide, polyamide, continue to stir 20min, stand 5min, obtain mixture B;
C, mixture B is placed into 10h at normal temperatures, that is, obtains heat sink material.
Embodiment two:
Heat sink material component includes 20 parts of graphene, 15 parts of carbon nano-fiber, 9 parts of nano titanium oxide, polyamides in parts by weight
8 parts of amine, 12 parts of iron oxide, 18 parts of zinc oxide, 10 parts of boron nitride, 4 parts of lubricating and wear-resisting agent, 15 parts of glycolylurea epoxide resin, chlorphenyl
9 parts of silicone oil.
The preparation technology of the present embodiment comprises the following steps:
A, add in grinder and grind after mixing iron oxide, zinc oxide, boron nitride, time 20min, obtain mixture A;
B, lubricating and wear-resisting agent, glycolylurea epoxide resin, chlorphenyl silicone oil are added in mixture A, is added after mixing low in stirred tank
Speed stirring, stir speed (S.S.) are 100 revs/min, time 10min, sequentially add graphene, carbon nano-fiber in whipping process, receive
Rice titanium dioxide, polyamide, continue to stir 20min, stand 5min, obtain mixture B;
C, mixture B is placed into 10h at normal temperatures, that is, obtains heat sink material.
Embodiment three:
Heat sink material component includes 12 parts of graphene, 7 parts of carbon nano-fiber, 4 parts of nano titanium oxide, polyamide in parts by weight
3 parts, 6 parts of iron oxide, 9 parts of zinc oxide, 5 parts of boron nitride, 3 parts of lubricating and wear-resisting agent, 11 parts of glycolylurea epoxide resin, chlorphenyl silicone oil 4
Part.
The preparation technology of the present embodiment comprises the following steps:
A, add in grinder and grind after mixing iron oxide, zinc oxide, boron nitride, time 20min, obtain mixture A;
B, lubricating and wear-resisting agent, glycolylurea epoxide resin, chlorphenyl silicone oil are added in mixture A, is added after mixing low in stirred tank
Speed stirring, stir speed (S.S.) are 100 revs/min, time 10min, sequentially add graphene, carbon nano-fiber in whipping process, receive
Rice titanium dioxide, polyamide, continue to stir 20min, stand 5min, obtain mixture B;
C, mixture B is placed into 10h at normal temperatures, that is, obtains heat sink material.
Example IV:
Heat sink material component includes 18 parts of graphene, 13 parts of carbon nano-fiber, 7 parts of nano titanium oxide, polyamides in parts by weight
7 parts of amine, 10 parts of iron oxide, 15 parts of zinc oxide, 8 parts of boron nitride, 3 parts of lubricating and wear-resisting agent, 13 parts of glycolylurea epoxide resin, chlorphenyl silicon
8 parts of oil.
The preparation technology of the present embodiment comprises the following steps:
A, add in grinder and grind after mixing iron oxide, zinc oxide, boron nitride, time 20min, obtain mixture A;
B, lubricating and wear-resisting agent, glycolylurea epoxide resin, chlorphenyl silicone oil are added in mixture A, is added after mixing low in stirred tank
Speed stirring, stir speed (S.S.) are 100 revs/min, time 10min, sequentially add graphene, carbon nano-fiber in whipping process, receive
Rice titanium dioxide, polyamide, continue to stir 20min, stand 5min, obtain mixture B;
C, mixture B is placed into 10h at normal temperatures, that is, obtains heat sink material.
Embodiment five:
Heat sink material component includes 15 parts of graphene, 10 parts of carbon nano-fiber, 6 parts of nano titanium oxide, polyamides in parts by weight
5 parts of amine, 8 parts of iron oxide, 13 parts of zinc oxide, 7 parts of boron nitride, 3 parts of lubricating and wear-resisting agent, 12 parts of glycolylurea epoxide resin, chlorphenyl silicon
6 parts of oil.
The preparation technology of the present embodiment comprises the following steps:
A, add in grinder and grind after mixing iron oxide, zinc oxide, boron nitride, time 20min, obtain mixture A;
B, lubricating and wear-resisting agent, glycolylurea epoxide resin, chlorphenyl silicone oil are added in mixture A, is added after mixing low in stirred tank
Speed stirring, stir speed (S.S.) are 100 revs/min, time 10min, sequentially add graphene, carbon nano-fiber in whipping process, receive
Rice titanium dioxide, polyamide, continue to stir 20min, stand 5min, obtain mixture B;
C, mixture B is placed into 10h at normal temperatures, that is, obtains heat sink material.
Preparation technology of the present invention is simple, and obtained heat sink material has excellent radiating, resistance to elevated temperatures, can extend
The service life of LED;Iron oxide, zinc oxide, the boron nitride added in the present invention, it is possible to increase the heat-resisting quantity of heat sink material
Energy;Glycolylurea epoxide resin, the chlorphenyl silicone oil of addition, it is possible to increase the greasy property of heat sink material;Obtained through overtesting, this hair
Bright obtained heat sink material thermal conductivity factor reaches 3.8W/m.k, and sheet resistance value reaches 3.2*1011Ω/sq。
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of changes, modification can be carried out to these embodiments, replace without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (3)
- A kind of 1. LED heat sink material, it is characterised in that:Heat sink material component includes graphene 10-20 parts, received in parts by weight Rice carbon fiber 5-15 parts, nano titanium oxide 3-9 parts, polyamide 2-8 parts, iron oxide 4-12 parts, zinc oxide 8-18 parts, boron nitride 4-10 parts, lubricating and wear-resisting agent 2-4 parts, glycolylurea epoxide resin 10-15 parts, chlorphenyl silicone oil 3-9 parts.
- A kind of 2. LED heat sink material according to claim 1, it is characterised in that:The preferable composition of heat sink material component Proportioning includes 15 parts of graphene, 10 parts of carbon nano-fiber, 6 parts of nano titanium oxide, 5 parts of polyamide, 8 parts of iron oxide, zinc oxide 13 parts, 7 parts of boron nitride, 3 parts of lubricating and wear-resisting agent, 12 parts of glycolylurea epoxide resin, 6 parts of chlorphenyl silicone oil.
- 3. realize a kind of preparation technology of LED heat sink material described in claim 1, it is characterised in that:Its preparation technology bag Include following steps:A, add in grinder and grind after mixing iron oxide, zinc oxide, boron nitride, time 20min, obtain mixture A;B, lubricating and wear-resisting agent, glycolylurea epoxide resin, chlorphenyl silicone oil are added in mixture A, is added after mixing low in stirred tank Speed stirring, stir speed (S.S.) are 100 revs/min, time 10min, sequentially add graphene, carbon nano-fiber in whipping process, receive Rice titanium dioxide, polyamide, continue to stir 20min, stand 5min, obtain mixture B;C, mixture B is placed into 10h at normal temperatures, that is, obtains heat sink material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710970994.3A CN107686634A (en) | 2017-10-18 | 2017-10-18 | A kind of LED heat sink material and its preparation technology |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710970994.3A CN107686634A (en) | 2017-10-18 | 2017-10-18 | A kind of LED heat sink material and its preparation technology |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107686634A true CN107686634A (en) | 2018-02-13 |
Family
ID=61154566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710970994.3A Pending CN107686634A (en) | 2017-10-18 | 2017-10-18 | A kind of LED heat sink material and its preparation technology |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107686634A (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104788909A (en) * | 2015-04-16 | 2015-07-22 | 四川大学 | Thermally conductive and insulating composite material and preparation method thereof |
CN105504823A (en) * | 2016-01-28 | 2016-04-20 | 天津凯华绝缘材料股份有限公司 | High-temperature-resistant organosilicone powder encapsulating material and preparation method thereof |
CN106191713A (en) * | 2016-08-17 | 2016-12-07 | 安徽福恩光电科技有限公司 | A kind of LED aluminum-base composite heat sink material |
-
2017
- 2017-10-18 CN CN201710970994.3A patent/CN107686634A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104788909A (en) * | 2015-04-16 | 2015-07-22 | 四川大学 | Thermally conductive and insulating composite material and preparation method thereof |
CN105504823A (en) * | 2016-01-28 | 2016-04-20 | 天津凯华绝缘材料股份有限公司 | High-temperature-resistant organosilicone powder encapsulating material and preparation method thereof |
CN106191713A (en) * | 2016-08-17 | 2016-12-07 | 安徽福恩光电科技有限公司 | A kind of LED aluminum-base composite heat sink material |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103555262B (en) | A kind of heat conduction hot melt adhesive and preparation method thereof | |
CN102471637A (en) | Heat-dissipating coating agent and heat-dissipating plate using the same | |
CN102123563B (en) | Method for manufacturing ceramic PCB (Printed Circuit Board) | |
CN104763901B (en) | Led daylight lamp | |
CN104531053B (en) | Solid crystal gel for LED as well as preparation method and application of solid crystal gel | |
CN103555251A (en) | High-heat-conductivity high-reliability ultraviolet-curing LED (light-emitting diode) electrically-conductive silver adhesive and preparation method thereof | |
CN106221665A (en) | A kind of LED organic silicon packaging glue of nano-cerium oxide nano aluminum nitride hybrid modification and preparation method thereof | |
CN105860900A (en) | Composite fine ceramic powder filled and modified high-heat-conducting epoxy pouring sealant for LED display screen | |
CN207181893U (en) | A kind of backlight module | |
CN102964948A (en) | Heat-curing heat-conduction heat-dissipation paint and preparation method thereof | |
CN100490201C (en) | White light LED | |
CN107686634A (en) | A kind of LED heat sink material and its preparation technology | |
CN107011631B (en) | One kind heat filling containing crystalline flake graphite and the preparation method and application thereof | |
WO2019037564A1 (en) | Non-metal composite nano heat dissipation material and preparation method therefor | |
CN105295588B (en) | A kind of compound heat radiating type coating and preparation method thereof | |
CN104788919A (en) | Heat-conducting electric-insulation flame-retardancy-enhanced PBT (polybutylene terephthalate) plastic and preparation method thereof | |
CN103660431A (en) | Heat-conducting fabric | |
CN105524550A (en) | Heat-conducting silicone grease and manufacturing method thereof | |
CN101761903A (en) | Cooling structure for LED lamp | |
CN105950091A (en) | Epoxy resin pouring sealant modified by composite silicon nitride thermal conductive filler and used for LED display screen | |
CN104180348B (en) | A kind of LED lamp comprising fin | |
CN110055028A (en) | A kind of low viscosity, high thermal conductivity casting glue and preparation method thereof | |
CN107820507B (en) | High-hardness LED packaging material and preparation method thereof | |
CN104696767B (en) | Led | |
CN102263185A (en) | Thermal radiation light emitting diode structure and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180213 |