CN110055028A - A kind of low viscosity, high thermal conductivity casting glue and preparation method thereof - Google Patents
A kind of low viscosity, high thermal conductivity casting glue and preparation method thereof Download PDFInfo
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- CN110055028A CN110055028A CN201910411941.7A CN201910411941A CN110055028A CN 110055028 A CN110055028 A CN 110055028A CN 201910411941 A CN201910411941 A CN 201910411941A CN 110055028 A CN110055028 A CN 110055028A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2003/1034—Materials or components characterised by specific properties
- C09K2003/1078—Fire-resistant, heat-resistant materials
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of low viscosities, high thermal conductivity casting glue, it includes the following components'mass percentage: vinyl silicone oil 11.2%-12.5%, spherical aluminium oxide 10%-20%, the ball-aluminium oxide 45%-55% of the ball-aluminium oxide 20%-30% and 70-80um of 5-15um, the preparation method of the above raw material includes: 1, mixing composition powder stuffing, 2, mixing composition base-material, 3, packing and storing, the present invention uses vinyl silicone oil for substrate, it is heat filling with compounding aluminium oxide, since aluminium oxide thermal coefficient itself is high, it is arranged in pairs or groups by the ball-aluminium oxide of different-grain diameter, surface treatment etc. reduces oil factor, when viscosity reaches 15000cps, thermal coefficient is up to 2.8w/mk, heating conduction greatly increases by force, encapsulating colloid itself is elasticity Body, toughness is preferable, convenient for removing from circuit board, when component needs to repair, encapsulating material is directly replaced, without scrapping entire electronic component.
Description
Technical field
The present invention relates to the fields of electronic product, more particularly, to a kind of low viscosity, high thermal conductivity casting glue and its preparation side
Method.
Background technique
Most of existing thermally conductive casting glue uses epoxy resin for substrate, is heat filling in conjunction with silica, sufficiently
It mixes, since silica thermal coefficient itself is lower, oil factor is higher, when viscosity is less than 20000cps, often leads
Hot coefficient only has 0.5-1.0w/mk, and heat transfer efficiency is lower；2. hardness is higher after epoxy resin cure, once electronics member after use
Device needs to repair, then can not replace, can only entire component scrap, therefore, develop a kind of low viscosity, high thermal conductivity casting glue is
Urgent problem to be solved at present.
Summary of the invention
The present invention is to overcome above situation insufficient, it is desirable to provide a kind of technical solution that can solve the above problem.
A kind of low viscosity, high thermal conductivity casting glue, the raw material including following parts by weight: vinyl silicone oil 11.2%-12.5%,
The spherical oxidation of spherical aluminium oxide 10%-20%, the ball-aluminium oxide 20%-30% of partial size 5-15um and partial size 70-80um
Aluminium 45%-55%.
As a further solution of the present invention: the raw material including following parts by weight: vinyl silicone oil 11.2%, spherical oxygen
Change aluminium 10%, the ball-aluminium oxide 28.8% of 5-15um and the ball-aluminium oxide 50% of 70-80um.
As a further solution of the present invention: the raw material including following parts by weight: vinyl silicone oil 12%, spherical oxidation
The ball-aluminium oxide 50% of aluminium 15%, the ball-aluminium oxide 23% of 5-15um and 70-80um.
As a further solution of the present invention: the raw material including following parts by weight: vinyl silicone oil 12.5%, spherical oxygen
Change aluminium 17.5%, the ball-aluminium oxide 20% of 5-15um and the ball-aluminium oxide 50% of 70-80um.
As a further solution of the present invention: the vinyl silicone oil is mainly by end-vinyl dimethyl silicone polymer (Vi-
PDMS it) is formed with end-vinyl Polymethyl methacrylate (Vi-PMVS).
As a further solution of the present invention: further including following composition: being the methyl-prop that mass percent is 1-5% respectively
The diisononyl phthalate of olefin(e) acid-beta-hydroxy ethyl ester, the dibutyl tin dilaurate of 1-5% and 1-5%.
A kind of low viscosity, the preparation method of high thermal conductivity casting glue, comprising the following steps:
S1, mixing composition powder stuffing: ratio is taken to the ball-aluminium oxide and 70-80um of spherical aluminium oxide, 5-15um
Ball-aluminium oxide be ground into smalls, mixing composition powder stuffing；
S2, mixing composition base-material: the powder stuffing formed in S1 and vinyl silicone oil are sufficiently mixed into base-material；
S3, packing and storing: the base-material formed in S2 being placed in chemical bottle and carries out packing and storing, so as to etc. it is to be used.
It is further comprising the steps of as a kind of improvement of preparation method of the present invention, between step poly- S2 and S3, in base-material
Methacrylic acid-beta-hydroxy ethyl ester, dibutyl tin dilaurate and the phthalic acid two of the equal 1-5% of mass ratio are inside added respectively
Different nonyl ester is simultaneously sufficiently mixed uniformly.
As a further solution of the present invention: chemical grinding machine being needed to be ground in the S1.
As a further solution of the present invention: the grinding rate of the chemical grinding machine is 700r/min.
As a further solution of the present invention: the ball-aluminium oxide has the spies such as spherical rate height, alpha-phase aluminum oxide content height
Point.
Compared with prior art, the present invention uses vinyl silicone oil for substrate, is heat filling with compounding aluminium oxide, due to
Aluminium oxide thermal coefficient itself is high, is arranged in pairs or groups by the ball-aluminium oxide of different-grain diameter, surface treatment etc. reduces oil factor, in viscosity
When reaching 15000cps, thermal coefficient is up to 2.8w/mk, and heating conduction greatly promotes, and is conducive to the heat dissipation of circuit board；It is preferred that
, methacrylic acid-beta-hydroxy ethyl ester, dibutyl tin dilaurate and diisononyl phthalate are added in base-material, it can
To improve the levelability in material potting process, when encapsulating, can be realized any thin on extremely complex small electronic component
The filling of small gap, the sealant formed after encapsulating has preferable fire-retardant and heating conduction, while hardness is lower, colloid toughness and
Elasticity is all relatively good, and encapsulating colloid is easier integrally to remove from circuit board, can replace at any time after use, when component needs
When repairing, directly replacement encapsulating material conveniently repairs circuit board without scrapping entire electronic component.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Specific embodiment
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
Embodiment one
A kind of low viscosity, high thermal conductivity casting glue, include the following components'mass percentage: vinyl silicone oil 11.2%, class
The ball-aluminium oxide 50% of ball-aluminium oxide 10%, the ball-aluminium oxide 28.8% of 5-15um and 70-80um.
The vinyl silicone oil mainly has end-vinyl dimethyl silicone polymer (Vi-PDMS) and the poly- methyl second of end-vinyl
Alkenyl siloxane (Vi-PMVS) composition, the ball-aluminium oxide have the characteristics that spherical rate is high, alpha-phase aluminum oxide content is high.
The casting glue the preparation method is as follows: S1, mixing composition powder stuffing: by weight ratio respectively take 10% it is spherical
Aluminium oxide, 28.8% partial size be 5-15um ball-aluminium oxide and 50% material diameter be 70-80um ball-aluminium oxide, changing
It learns and is ground into smalls (grinding rate 700r/min) in grinder, mixing composition powder stuffing；
S2, mixing composition base-material: the powder stuffing formed in S1 is sufficiently mixed with 11.2% vinyl silicone oil
At base-material；
S3, packing and storing: the base-material formed in S2 being placed in chemical bottle and carries out packing and storing, so as to etc. it is to be used.
Embodiment two
A kind of low viscosity, high thermal conductivity casting glue, the raw material including following parts by weight: vinyl silicone oil 12%, spherical oxygen
Change aluminium 15%, the ball-aluminium oxide 23% of 5-15um and the ball-aluminium oxide 50% of 70-80um.
Preparation method such as embodiment one is consistent.
Embodiment three
A kind of low viscosity, high thermal conductivity casting glue, the raw material including following parts by weight: vinyl silicone oil 12.5%, spherical
The ball-aluminium oxide 50% of aluminium oxide 17.5%, the ball-aluminium oxide 20% of 5-15um and 70-80um.
Preparation method such as embodiment one is consistent.
Example IV
A kind of low viscosity, high thermal conductivity casting glue, the raw material including following parts by weight: spherical aluminium oxide 10%, partial size
The ball-aluminium oxide 50% of the ball-aluminium oxide 20% of 5-15um, 70-80um, vinyl silicone oil 11.2%, methacrylic acid-β-
Hydroxyl ethyl ester 2.8%, dibutyl tin dilaurate 5% and diisononyl phthalate 1%.
The preparation method is as follows: S1, mixing composition powder stuffing: by weight ratio respectively take 10% spherical aluminium oxide,
Ball-aluminium oxide that 28.8% partial size is 5-15um and 50% material diameter be 70-80um ball-aluminium oxide, in chemical grinding
It is ground into machine smalls (grinding rate 700r/min), mixing composition powder stuffing；
S2, mixing composition base-material: the powder stuffing formed in S1 is sufficiently mixed with 11.2% vinyl silicone oil
At base-material；
S3,2.8% methacrylic acid-beta-hydroxy ethyl ester, 5% February are followed successively by adding mass ratio respectively in base-material
Dilaurylate and 1% diisononyl phthalate and be sufficiently mixed uniformly.
S4, packing and storing: the base-material formed in S3 being placed in chemical bottle and carries out packing and storing, so as to etc. it is to be used.
Embodiment five
A kind of low viscosity, high thermal conductivity casting glue, the raw material including following parts by weight: spherical aluminium oxide 10%, partial size
The ball-aluminium oxide 50% of the ball-aluminium oxide 20% of 5-15um, 70-80um, vinyl silicone oil 11.2%, methacrylic acid-β-
Hydroxyl ethyl ester 1%, dibutyl tin dilaurate 2.8% and diisononyl phthalate 5%.
Preparation method such as example IV is consistent.
Embodiment six
A kind of low viscosity, high thermal conductivity casting glue, the raw material including following parts by weight: spherical aluminium oxide 10%, partial size
The ball-aluminium oxide 50% of the ball-aluminium oxide 20% of 5-15um, 70-80um, vinyl silicone oil 11.2%, methacrylic acid-β-
Hydroxyl ethyl ester 5%, dibutyl tin dilaurate 1% and diisononyl phthalate 2.8%.
Preparation method such as example IV is consistent.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
Claims (8)
1. a kind of low viscosity, high thermal conductivity casting glue, which is characterized in that including following components by mass percentage: vinyl silicon
The ball-aluminium oxide 20%-30% and partial size of oily 11.2%-12.5%, spherical aluminium oxide 10%-20%, partial size 5-15um
The ball-aluminium oxide 45%-55% of 70-80um.
2. a kind of low viscosity according to claim 1, high thermal conductivity casting glue, which is characterized in that including by mass percentage
Following components: vinyl silicone oil 11.2%, spherical aluminium oxide 10%, 5-15um ball-aluminium oxide 28.8% and 70-
The ball-aluminium oxide 50% of 80um.
3. a kind of low viscosity according to claim 1, high thermal conductivity casting glue, which is characterized in that including by mass percentage
Following components: vinyl silicone oil 12%, spherical aluminium oxide 15%, the ball-aluminium oxide 23% of 5-15um and 70-80um
Ball-aluminium oxide 50%.
4. a kind of low viscosity according to claim 1, high thermal conductivity casting glue, which is characterized in that including by mass percentage
Following components: vinyl silicone oil 12.5%, spherical aluminium oxide 17.5%, 5-15um ball-aluminium oxide 20% and 70-
The ball-aluminium oxide 50% of 80um.
5. a kind of low viscosity according to claim 1, high thermal conductivity casting glue, which is characterized in that the vinyl silicone oil master
It to be made of end-vinyl dimethyl silicone polymer (Vi-PDMS) and end-vinyl Polymethyl methacrylate (Vi-PMVS).
6. a kind of low viscosity according to claim 1, high thermal conductivity casting glue, which is characterized in that further include following composition: point
It is not methacrylic acid-beta-hydroxy ethyl ester, the dibutyl tin dilaurate of 1-5% and the adjacent benzene of 1-5% that mass ratio is 1-5%
Dioctyl phthalate dinonyl.
7. the preparation method of a kind of low viscosity, high thermal conductivity casting glue is used to prepare the described in any item one kind of claims 1 to 4
Low viscosity, high thermal conductivity casting glue, which comprises the following steps:
S1, mixing composition powder stuffing: the ratio ball-aluminium oxide and 70- that respectively take spherical aluminium oxide, 5-15um by weight
The ball-aluminium oxide of 80um is ground into smalls, mixing composition powder stuffing in chemical grinding machine；
S2, mixing composition base-material: the powder stuffing formed in S1 and vinyl silicone oil are sufficiently mixed into base-material；
S3, packing and storing: the base-material formed in S2 being placed in chemical bottle and carries out packing and storing, so as to etc. it is to be used.
8. preparation method according to claim 7, which is characterized in that it is further comprising the steps of, between step poly- S2 and S3,
Add the methacrylic acid-beta-hydroxy ethyl ester, dibutyl tin dilaurate and adjacent benzene two of the equal 1-5% of mass ratio respectively in base-material
Formic acid dinonyl is simultaneously sufficiently mixed uniformly.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910411941.7A CN110055028A (en) | 2019-05-17 | 2019-05-17 | A kind of low viscosity, high thermal conductivity casting glue and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910411941.7A CN110055028A (en) | 2019-05-17 | 2019-05-17 | A kind of low viscosity, high thermal conductivity casting glue and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112457817A (en) * | 2020-11-18 | 2021-03-09 | 西安隆基绿能建筑科技有限公司 | Pouring sealant and preparation method thereof |
| WO2022000166A1 (en) * | 2020-06-29 | 2022-01-06 | Dow Global Technologies Llc | Thermally conductive polyurethane composition |
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| CN102093838A (en) * | 2010-12-03 | 2011-06-15 | 烟台德邦科技有限公司 | High-temperature cured two-component pouring sealant and preparation method thereof |
| CN103834352A (en) * | 2014-02-26 | 2014-06-04 | 北京天山新材料技术股份有限公司 | Double-component high heat-conducting pouring sealant with excellent mechanical properties and preparation method thereof |
| CN106753205A (en) * | 2017-01-11 | 2017-05-31 | 湖南博翔新材料有限公司 | A kind of low viscosity, the epoxy modified silicone casting glue of high heat conduction and its application |
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2019
- 2019-05-17 CN CN201910411941.7A patent/CN110055028A/en active Pending
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|---|---|---|---|---|
| CN101962528A (en) * | 2010-09-30 | 2011-02-02 | 烟台德邦科技有限公司 | Two-component sealing silica gel with low viscosity and high thermal conductivity and preparation method theref |
| CN102093838A (en) * | 2010-12-03 | 2011-06-15 | 烟台德邦科技有限公司 | High-temperature cured two-component pouring sealant and preparation method thereof |
| CN103834352A (en) * | 2014-02-26 | 2014-06-04 | 北京天山新材料技术股份有限公司 | Double-component high heat-conducting pouring sealant with excellent mechanical properties and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022000166A1 (en) * | 2020-06-29 | 2022-01-06 | Dow Global Technologies Llc | Thermally conductive polyurethane composition |
| CN112457817A (en) * | 2020-11-18 | 2021-03-09 | 西安隆基绿能建筑科技有限公司 | Pouring sealant and preparation method thereof |
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Application publication date: 20190726 |