CN107667427B - 用于将器件嵌入面朝上的工件中的系统、装置和方法 - Google Patents
用于将器件嵌入面朝上的工件中的系统、装置和方法 Download PDFInfo
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- CN107667427B CN107667427B CN201680029161.0A CN201680029161A CN107667427B CN 107667427 B CN107667427 B CN 107667427B CN 201680029161 A CN201680029161 A CN 201680029161A CN 107667427 B CN107667427 B CN 107667427B
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Abstract
通过在制造期间在模塑复合物(120)中创建空腔(130),可以按管芯(110)面朝上的取向来制造具有邻近于所附连的管芯的组件(140)的集成封装。该空腔在底部上创建有粘合层以支撑组件,以使得该组件的顶表面与所附连的管芯的顶表面共面。这可允许发生不会损坏该组件的背侧研磨,因为所附连的管芯与组件之间的顶表面对齐防止空腔的深度延伸到被磨掉的封装部分中。
Description
根据35U.S.C.§119的优先权要求
本专利申请要求于2015年5月22日提交且已转让给本申请受让人并由此通过援引明确纳入于此的题为“SYSTEM,APPARATUS,AND METHOD FOR EMBEDDING A DEVICE IN AFACEUP WORKPIECE(用于将器件嵌入面朝上的工件中的系统、装置和方法)”的临时申请No.62/165,809的优先权。
公开领域
本公开一般涉及集成封装,尤其但不排他地涉及面朝上的集成封装。
背景
诸如扇出晶片级封装(FOWLP)之类的集成封装一般被制造成其中器件的有源面在面朝下的取向上。然而,半导体制造中的最近趋势正朝在器件面朝上的取向上制造集成封装移动。在重分布线条(RDL)处理期间,面朝上技术在管芯的有源侧上实现非常平坦的表面,该非常平坦的表面促成精细的线条和间隔,并且由于覆盖器件的表面的模塑复合物和将管芯焊盘耦合至RDL的铜柱结构而与面朝下的封装相比可具有板级可靠性的益处。在形成RDL之前的模塑期间以及模塑研磨之后,面朝上的封装被制造成其中管芯的有源侧相对于工件载体面朝上。载体拥有临时的粘合层,该粘合层用于在模塑期间将管芯/组件保持在期望的位置处。在模塑之后,模塑材料的顶侧被研磨以显露有源器件。在顶侧的研磨之前或之后移除载体和临时粘合层。在RDL处理之后,从封装/管芯的背侧将工件研磨至最终厚度。使用厚的管芯和工件帮助在放置期间防止管芯损坏,可以在模塑期间减少管芯移动,以及在RDL处理期间降低工件损坏的风险和产出损失。如果传统的无源组件在载体的粘合层上紧邻管芯放置,则在不损坏无源组件且不损害其功能的情况下,不可能将封装研磨至期望的厚度。
相应地,存在对于允许用不损坏近旁组件的背侧研磨来制造面朝上的半导体的系统、装置和方法的需求,包括由此提供的方法、系统和装置。
概述
以下给出了与本文所公开的各装置和方法相关联的一个或多个方面和/或示例相关的简化概述。如此,以下概述既不应被视为与所有构想的方面和/或示例相关的详尽纵览,以下概述也不应被认为标识与所有构想的方面和/或示例相关的关键性或决定性要素或描绘与任何特定方面和/或示例相关联的范围。相应地,以下概述仅具有在以下给出的详细描述之前以简化形式呈现与关于本文所公开的装置和方法的一个或多个方面和/或示例相关的某些概念的目的。
在一个方面,一种集成封装包括:管芯,该管芯具有有源侧以及从该管芯的有源侧延伸的多个互连;具有空腔的模塑复合物,该模塑复合物至少部分地覆盖管芯;空腔中的组件;模塑复合物上的电介质层,该电介质层配置成延伸到空腔中以使得该组件与模塑复合物隔离;以及电介质层中的重分布层,该重分布层配置成将该多个互连耦合至该组件。
在另一个方面,一种用于制造集成封装的方法包括:在载体上放置管芯,该管芯具有有源侧;将多个互连耦合至该管芯的有源侧;在管芯上的载体上施加模塑复合物;移除模塑复合物的一部分以暴露该多个互连;在模塑复合物中形成空腔,其中形成空腔包括将空腔延伸到模塑复合物中达小于该模塑复合物的厚度的第一距离;在空腔的表面上形成粘合层;将组件放置在空腔中的粘合层上;在模塑复合物上形成电介质层,其中形成电介质层包括将电介质层延伸到空腔中并且将该组件与模塑复合物隔离;以及在电介质层中形成重分布层,该重分布层将该多个互连耦合至该组件。
在又一个方面,一种集成封装包括:具有有源侧的管芯;从管芯的有源侧延伸的用于管芯的互连的装置;用于封装管芯的至少一部分的装置;用于封装的装置的空腔中的组件;用于封装的装置上的用于隔离的装置,该用于隔离的装置延伸到空腔中以使得该组件与用于封装的装置隔离;以及用于将管芯耦合至该组件的装置,该用于耦合的装置在电介质层中。
基于附图和详细描述,与本文公开的各装置和方法相关联的其它特征和优点对本领域技术人员而言将是明了的。
附图简述
对本公开的各方面及其许多伴随优点的更完整领会将因其在参考结合附图考虑的以下详细描述时变得更好理解而易于获得,附图仅出于解说目的被给出而不对本公开构成任何限定,并且其中:
图1解说了根据本公开的一些示例的具有耦合至位于模塑复合物的空腔中的近旁组件的面朝上管芯的示例性集成封装。
图2A-G解说了根据本公开的一些示例的用于在形成空腔之前模塑复合物被部分移除的情况下制造具有耦合至近旁组件的面朝上管芯的集成封装的示例性方法。
图3A-F解说了根据本公开的一些示例的用于在形成空腔之后模塑复合物被部分移除的情况下制造具有耦合至近旁组件的面朝上管芯的集成封装的示例性方法。
图4A-D解说了根据本公开的一些示例的使用将所放置的组件与具有和不具有模压的模塑复合物的顶表面机械地对齐的组件放置工具来制造具有耦合至近旁组件的面朝上管芯的集成封装的示例性方法。
图5解说了根据本公开的一些示例的用于在形成空腔之前模塑复合物被部分移除的情况下制造具有耦合至近旁组件的面朝上管芯的集成封装的示例性方法。
图6解说了根据本公开的一些示例的用于在形成空腔之后模塑复合物被部分移除的情况下制造具有耦合至近旁组件的面朝上管芯的集成封装的示例性方法。
图7解说了根据本公开的一些示例的示例性用户装备(UE)。
图8解说了根据本公开的一些示例的具有耦合至位于模塑复合物的空腔中的近旁组件的面朝上管芯的示例性集成封装。
根据惯例,附图所描绘的特征可能并非按比例绘制。相应地,为了清晰起见,所描绘的特征的尺寸可能被任意放大或缩小。根据惯例,为了清晰起见,某些附图被简化。由此,附图可能未绘制特定装置或方法的所有组件。此外,类似附图标记贯穿说明书和附图标示类似特征。
详细描述
本文所公开的示例性方法、装置和系统有利地解决了业界需求以及其他先前未标识出的需求,并且缓解了常规方法、装置和系统的不足。例如,通过在制造期间在模塑复合物中创建空腔,可以按面朝上的取向来制造集成封装而不损坏邻近于所附连的管芯的组件。该空腔在底部上创建有粘合层以支撑组件(诸如另一管芯或像电容器那样的无源组件),以使得该组件的顶表面与所附连的管芯的顶表面共面。这可允许发生不会损坏该组件的背侧研磨,因为所附连的管芯与组件之间的顶表面对齐防止空腔的深度延伸到被磨掉的封装部分中。本公开优于传统解决方案的一些优点包括但不限于:允许研磨之后的平坦的模塑表面的面朝上管芯放置FOWLP导致能够制造出比面朝下的解决方案更加精细的线条和间隔;由于管芯表面上的绝缘层和管芯上的厚Cu柱,面朝上管芯具有较好的电性能;比传统的封装解决方案更小的占用面积;以及使用面朝上结构的较好的板级可靠性。
图1解说了根据本公开的一些示例的具有耦合至位于模塑复合物的空腔中的近旁组件的面朝上管芯的示例性集成封装。如图1中示出的,集成封装100可包括:具有有源侧115和从有源侧115延伸的多个互连112(例如,焊盘、迹线、通孔、柱、电导体等)的管芯110,以及至少部分地覆盖管芯110的模塑复合物120。有源侧115是管芯110的包含管芯110的有源组件(例如,晶体管、电阻器、电容器等)的部分,这些有源组件执行管芯110的操作或功能。模塑复合物120具有在管芯110近旁的或者与管芯110间隔开的空腔130以及位于该空腔130中的组件140。重分布层(例如,一个或多个金属层)可将管芯110电耦合至组件140或者可以将管芯110和组件140电耦合至耦合到集成封装100的任何其他器件(例如,通过互连112和/或通过焊球170)。电介质层160至少部分地围绕RDL层150并且可被形成在模塑复合物120的表面上。集成封装还可在电介质层160上具有耦合至重分布层150的用于外部连接的多个焊球170。
空腔130可具有与多个互连112共面的开口,并且空腔可以从开口延伸第一距离131进入模塑复合物120中,从而第一距离131小于模塑复合物120的厚度。组件140可位于空腔130中,以使得组件140的连接145(例如,端口、电极、互连等)的至少一部分与多个互连112共面。另外,空腔130在其表面的至少一部分上可具有粘合层132(例如,管芯附连膜或粘合糊剂),该粘合层132紧固空腔130中的组件140,并且电介质层160的一部分可延伸到空腔中以将组件140的侧面与模塑复合物120隔离。重分布层150可耦合至多个互连112和组件140,该多个互连112和组件140为管芯110与组件140之间的信号提供电通路以及提供外部连接。管芯110可以是逻辑管芯或类似的集成电路组件,且组件140可以是逻辑管芯、存储器、预形成的通孔条(例如,穿模通孔或印刷电路板通孔条)、或者无源组件(诸如电容器、电感器、或变压器)。管芯110的背侧或非有源侧可以是暴露的且不被模塑复合物120覆盖。
图2A-G解说了根据本公开的一些示例的用于在形成空腔之前模塑复合物被部分移除的情况下制造具有耦合至近旁组件的面朝上管芯的集成封装200的示例性方法。如图2A中示出的,该部分过程流开始于载体202。第一粘合层204被施加于载体202的第一表面,然后在第一粘合层204上放置第一管芯210、第二管芯211、以及第三管芯213,其中第一管芯210的有源侧215、第二管芯211的有源侧217、以及第三管芯213的有源侧219在面朝上的取向上。尽管该图示出了第一管芯210、第二管芯211、以及第三管芯213,但是应当理解,该过程可按需仅包括第一管芯210或多于三个管芯。如图2B中示出的,模塑复合物220被施加在第一粘合层204的顶部以覆盖第一管芯210、第二管芯211、以及第三管芯213。
如图2C中示出的,模塑复合物的第一部分被移除以将管芯的有源侧(诸如第一管芯210的有源侧215)上的多个互连212暴露。多个互连212可以是铜柱或类似的导电材料和结构。接下来在图2D中,在邻近于第一管芯210、第二管芯211、以及第三管芯213中的每一者的模塑复合物220中形成多个空腔230。尽管在该图中示出了三个空腔230,但是应当理解,可取决于可向集成封装200添加多少个附加组件而形成单个空腔230、两个空腔230、或者多于三个空腔230。例如,每个空腔230从模塑复合物220的表面延伸达小于第一管芯210的高度的第一距离231。这将允许后续的背侧研磨,而不会研磨该空腔并且不会潜在地损坏在背侧研磨之前放置在空腔中的任何组件。可通过激光烧蚀、机械钻孔、化学蚀刻或仅选择性地移除模塑复合物220的一部分的类似工艺来形成空腔230。
如图2E中示出的,该部分过程通过在空腔230的底部中施加第二粘合层232,然后分别在每个空腔230中放置第一组件240、第二组件241、以及第三组件243来继续。替换地,第二粘合层232可在放置之前施加于组件的底部。第一组件240、第二组件241、以及第三组件243可以是逻辑管芯(例如,类似于管芯210)、存储器、预形成的通孔条(例如,穿模通孔或印刷电路板通孔条)、或者无源组件(诸如电容器、电感器、或变压器)。第一组件240、第二组件241、以及第三组件243被放置成使得每个组件的顶表面与多个互连212的顶表面和模塑复合物220的顶表面共面。共面对齐将允许用于后续的RDL形成和处理的均匀表面,该均匀表面减少了制造复杂度和成本。如图2F中示出的,形成了RDL层250且将其耦合至多个互连212和第一组件240、第二组件241、以及第三组件243。RDL层250提供了例如将第一管芯210连同外部连接(诸如焊球270)一起耦合至第一组件240的电通路。在形成RDL层250之后或期间,在模塑复合物220上施加电介质层260以覆盖RDL 250并且填充第一组件240、第二组件241、以及第三组件243的侧面上的空的间隔,以使得第一组件240、第二组件241、以及第三组件243不直接接触模塑复合物220。第一组件240的这种隔离例如由于所添加的电介质材料而提供了电性质的增大,以及防止了后续的过程和操作期间第一组件的潜在的金属间降级,并且避免了后续热处理期间由气体空腔或间隙创建的问题。在形成RDL 250和电介质层260之后,可以形成多个焊球270且将其耦合至RDL 250以提供外部连接,诸如至印刷电路板或层叠封装结构中的另一集成封装。如图2G中示出的,从工件上移除载体202和粘合层204,并且进行背侧研磨工艺以将模塑复合物240的诸部分连同第一管芯210、第二管芯211、以及第三管芯213的诸部分一起移除,直至获得期望的封装厚度而不到达空腔230且没有对空腔230中的组件造成损坏的风险。可随后用锯子来将工件切单例如以形成个体集成封装200。
图3A-F解说了根据本公开的一些示例的用于在形成空腔之后模塑复合物被部分移除的情况下制造具有耦合至近旁组件的面朝上管芯的集成封装300的示例性方法。如图3A中示出的,该部分过程流开始于载体302。第一粘合层304被施加于载体302的第一表面,然后在第一粘合层304上放置第一管芯310、第二管芯311、以及第三管芯313,其中第一管芯310的有源侧315、第二管芯311的有源侧317、以及第三管芯313的有源侧319在面朝上的取向上。如图3B中示出的,模塑复合物320被施加在第一粘合层304的顶部以覆盖第一管芯310、第二管芯311、以及第三管芯313。接下来,在邻近于第一管芯310、第二管芯311、以及第三管芯313中的每一者的模塑复合物320中形成多个空腔330。例如,每个空腔330从模塑复合物320的表面延伸第一距离331至经过第一管芯330的有源侧315的点而不到达粘合层304。这将允许后续的背侧研磨,而不会研磨该空腔并且不会潜在地损坏在背侧研磨之前放置在空腔中的任何组件。
如图3C中示出的,模塑复合物的第一部分被移除以将管芯的有源侧(诸如第一管芯310的有源侧315)上的多个互连312暴露。多个互连312可以是铜柱或类似的导电材料和结构。接下来在图3D中,该部分过程通过在空腔330的底部中施加第二粘合层332,然后分别在每个空腔330中放置第一组件340、第二组件341、以及第三组件343来继续。第一组件340、第二组件341、以及第三组件343被放置成使得每个组件的顶表面与多个互连312的顶表面和模塑复合物320的顶表面共面。共面对齐将允许用于后续的RDL形成和处理的均匀表面,该均匀表面减少了制造复杂度和成本。如图3E中示出的,形成了RDL层350且将其耦合至多个互连312和第一组件340、第二组件341、以及第三组件343。RDL层350提供了例如将第一管芯310连同外部连接(诸如焊球370)一起耦合至第一组件340的电通路。在形成RDL层350之后或期间,在模塑复合物320上施加电介质层360以覆盖RDL 350并且填充第一组件340、第二组件341、以及第三组件343的侧面上的空的间隔,以使得第一组件340、第二组件341、以及第三组件343因为由围绕每个组件的第二粘合层332和电介质层360提供的隔离而不直接接触模塑复合物320。第一组件340的这种隔离例如由于所添加的电介质材料而提供了电性质的增大,以及防止了后续的过程和操作期间第一组件的潜在的金属间降级,并且避免了后续热处理期间由气体空腔或间隙创建的问题。在形成RDL 350和电介质层360之后,可以形成多个焊球370且将其耦合至RDL 350以提供外部连接,诸如至印刷电路板或层叠封装结构中的另一集成封装。如图3F中示出的,从工件上移除载体302和粘合层304,并且进行背侧研磨工艺以将模塑复合物340的诸部分连同第一管芯310、第二管芯311、以及第三管芯313的诸部分一起移除,直至获得期望的封装厚度而不到达空腔330且没有对空腔330中的组件造成损坏的风险。可随后用锯子来将工件切单例如以形成个体集成封装300。
图4A-D解说了根据本公开的一些示例的用于使用将所放置的组件与具有和不具有模压的模塑复合物的顶表面机械地对齐的组件放置工具来制造具有耦合至近旁组件的面朝上管芯的集成封装的示例性方法。如图4A中示出的,该部分过程开始于部分形成的结构,诸如图2D和图3C中示出的过程之后(即,放置任何组件之前)的结构。在这一阶段,该工件包括在模塑复合物420中邻近于空腔430的第一管芯410的多个经暴露的互连412。如图4B中示出的,该部分过程通过在空腔430的底部中施加第二粘合层430,然后分别在每个空腔430中放置第一组件440、第二组件441、以及第三组件443来继续。放置第一组件440、第二组件441、以及第三组件443是使用具有第一肩部435的放置工具433来完成的。第一肩部435提供了机械对齐机制,该机械对齐机制将接触模塑复合物420的表面以使得每个组件的顶表面与多个互连412和模塑复合物420的顶表面对齐(如图4B和4D中示出的)或者稍微地在多个互连412和模塑复合物420的顶表面的平面之上(如图4C中示出的)。第二粘合层432应当具有合适的性质以例如在放置工具433缩回之后将第三组件443保持在适当的位置。图4C示出了一个替换方案,其中第一组件440的放置稍微地在模塑复合物420的平面之上。在这一替换方案中,如图4D中所示的,用于将第一组件440例如推入第二粘合层432中的机械模压工艺使得第一组件440的顶表面与多个互连412和模塑复合物420的顶表面共面。共面对齐将允许用于后续的RDL形成和处理的均匀表面,该均匀表面减少了制造复杂度和成本。
图5解说了用于制造集成封装的示例性方法500。如框502中示出的,该方法开始于在载体上放置管芯,该管芯具有有源侧和有源侧上的多个互连。在框540中,该方法通过在覆盖管芯的载体上施加模塑复合物来继续。然后在框506中移除模塑复合物的一部分以暴露多个互连。在框508中,该方法通过在模塑复合物中形成邻近于管芯的空腔来继续,该空腔延伸到模塑复合物中达小于该模塑复合物的厚度的第一距离。在框510中,该方法通过在空腔的底部上形成粘合层来继续。在框512中,该方法通过将组件放置在空腔中的粘合层上来继续。在框514中,该方法通过在模塑复合物上形成电介质层来继续,该电介质层延伸到空腔中以使得组件与模塑复合物隔离。在框516中,该方法结束于在电介质层中形成重分布层,该重分布层将多个互连耦合至该组件。
图6解说了用于制造集成封装的示例性方法600。如框602中示出的,该方法开始于在载体上放置管芯,该管芯具有有源侧和有源侧上的多个互连。在框604中,该方法通过在覆盖管芯的载体上施加模塑复合物来继续。在框606中,然后在模塑复合物中形成毗邻管芯的空腔,该空腔延伸到模塑复合物中达小于该模塑复合物的厚度的第一距离。在框608中,该方法通过在形成空腔之后移除模塑复合物的一部分以暴露多个互连来继续。在框610中,该方法通过在空腔的底部上形成粘合层来继续。在框612中,该方法通过将组件放置在空腔中的粘合层上来继续。在框614中,该方法通过在模塑复合物上形成电介质层来继续,该电介质层延伸到空腔中以使得该组件与模塑复合物隔离。在框616中,该方法结束于在电介质层中形成重分布层,该重分布层将多个互连耦合至该组件。
在本说明书中,使用某些术语来描述某些特征。术语“移动设备”可描述但不限于音乐播放器、视频播放器、娱乐单元、导航设备、通信设备、移动设备、移动电话、智能电话、个人数字助理、固定位置终端、平板计算机、计算机、可穿戴设备、膝上型计算机、服务器、机动车辆中的车载设备、和/或通常由个人携带和/或具有通信能力(例如,无线、蜂窝、红外、短程无线电等)的其他类型的便携式电子设备。并且,术语“用户装备”(UE)、“移动终端”、“移动设备”和“无线设备”可以是可互换的。
根据以上示例的集成封装(例如,集成封装100、集成封装200、集成封装300、以及集成封装400)可被用于数个不同的应用,诸如移动设备的电路组件中。参照图7作为示例,系统700可包括UE 701(这里为无线设备),该UE 701具有平台702,其能接收并执行从无线电接入网(RAN)传送的、可能最终来自核心网、因特网、和/或其他远程服务器及网络的软件应用、数据和/或命令。平台702可以包括收发机706,其可操作地耦合至专用集成电路(“ASIC”708)或其他处理器、微处理器、逻辑电路、或其他数据处理设备。ASIC 708或其他处理器执行与无线设备的存储器712中的任何驻留程序对接的应用编程接口(“API”)710层。存储器712可以包括只读或随机存取存储器(RAM和ROM)、EEPROM、闪存卡、或计算机平台常用的任何存储器。平台702还可以包括能保存未在存储器712中活跃地使用的应用的本地数据库714。本地数据库714通常为闪存存储器单元,但也可以是如本领域已知的任何辅助存储设备(诸如磁介质、EEPROM、光学介质、带、软盘或硬盘等)。内部平台702组件也可以可操作地耦合至外部设备,诸如天线722、显示器724、即按即讲按钮728和按键板726、以及其他组件,如本领域中已知的。
如以上叙述的,根据以上示例的集成封装(例如,集成封装100、集成封装200、集成封装300、以及集成封装400)可被用于数个不同的应用,诸如UE 701的电路组件(包括但不限于收发机706、ASIC 708、存储器712、和本地数据库714)。
UE 701与RAN之间的无线通信可以基于不同的技术,诸如码分多址(CDMA)、W-CDMA、时分多址(TDMA)、频分多址(FDMA)、正交频分复用(OFDM)、全球移动通信系统(GSM)、3GPP长期演进(LTE)、或可在无线通信网络或数据通信网络中使用的其他协议。
图8解说了根据本公开的一些示例的具有耦合至位于用于封装的装置的空腔中的近旁组件的面朝上管芯的示例性集成封装。如图8中示出的,集成封装800可包括管芯810,该管芯810具有有源侧815以及从有源侧815延伸的用于管芯810的互连的装置812(例如,多个互连112、多个互连212、多个互连312、以及多个互连412),以及用于封装管芯810的至少一部分的装置820(例如,模塑复合物120、模塑复合物220、模塑复合物320、模塑复合物420)。有源侧815是管芯810的包含管芯810的有源组件(例如,晶体管、电阻器、电容器等)的部分,这些有源组件执行管芯810的操作或功能。用于封装的装置820具有在管芯810近旁的或者与管芯810间隔开的空腔830以及位于该空腔830中的组件840。用于耦合的装置850(例如,重分布层150、重分布层250、重分布层350、重分布层450)可将管芯810电耦合至组件840或者可以将管芯810和组件840电耦合至耦合到集成封装800的任何其他设备(例如,通过用于互连的装置812和/或通过焊球870)。用于隔离的装置860(例如,电介质层160、电介质层860、电介质层360、电介质层460)至少部分地围绕用于耦合的装置850,并且可被形成在用于封装的装置820的表面上。集成封装还可在用于隔离的装置860上具有耦合至用于耦合的装置850的用于外部连接的多个焊球870。
空腔830可具有与用于互连的装置812共面的开口,并且空腔可以从开口延伸第一距离831进入用于封装的装置820中,从而第一距离831小于用于封装的装置820的厚度。组件840可位于空腔830中以使得组件840的用于连接的装置845(例如连接145、连接245、连接345、连接445等)的至少一部分与用于互连的装置812共面。另外,空腔830可在其表面的至少一部分上具有粘合层832(例如,管芯附连膜或粘合糊剂),该粘合层832紧固空腔830中的组件840,并且用于隔离的装置860的一部分可延伸到空腔中以将组件840的侧面与用于封装的装置820隔离。用于耦合的装置850可耦合至用于互连的装置812和组件830,该用于互连的装置812和组件830为管芯810与组件830之间的信号提供电通路以及提供外部连接。管芯810可以是逻辑管芯或类似的集成电路组件,且组件840可以是逻辑管芯、存储器、预形成的通孔条(例如,通过模塑通孔或印刷电路板通孔条)、或者无源组件(诸如电容器、电感器、或变压器)。管芯810的背侧或非有源侧可以是暴露的且不被用于封装的装置820覆盖。
措辞“示例性”在本文中用于表示“用作示例、实例或解说”。本文中描述为“示例性”的任何细节不必被解释为优于或胜过其他示例。同样,术语“示例”并不要求所有示例都包括所讨论的特征、优点、或工作模式。术语“在一个示例中”、“示例”、“在一个特征中”和/或“特征”在本说明书中的使用并非必然引述相同特征和/或示例。此外,特定的特征和/或结构可与一个或多个其他特征和/或结构组合。并且,由此描述的装置的至少一部分可被配置成执行由此描述的方法的至少一部分。
本文中所使用的术语是仅出于描述特定示例的目的,且并非旨在限制本公开的各示例。如本文所使用的,单数形式的“一”、“某”和“该”旨在也包括复数形式,除非上下文另外明确指示。还将理解,术语“包括”、“具有”、“包含”和/或“含有”在本文中使用时指明所陈述的特征、整数、操作、元素、和/或组件的存在,但并不排除一个或多个其他特征、整数、操作、元素、组件和/或其群组的存在或添加。
应该注意,术语“连接”、“耦合”或其任何变体意指在元件之间的直接或间接的任何连接或耦合,且可涵盖两个元件之间中间元件的存在,这两个元件经由该中间元件被“连接”或“耦合”在一起。
本文中使用诸如“第一”、“第二”等之类的指定对元素的任何引述并不限定那些元素的数量和/或次序。确切而言,这些指定被用作区别两个或更多个元素和/或元素实例的便捷方法。由此,对第一元素和第二元素的引述并不意味着仅能采用两个元素,或者第一元素必须必然地位于第二元素之前。同样,除非另外声明,否则元素集合可包括一个或多个元素。
本申请中已描述或解说的任何内容都不旨在指定任何组件、特征、益处、优点、或等同物奉献给公众,无论这些组件、特征、益处、优点或等同物是否记载在权利要求中。
在以上详细描述中,可以看到不同特征在示例中被编组在一起。这种公开方式不应被理解为反映所要求保护的示例需要比相应权利要求中所明确提及的特征更多的特征的意图。确切而言,该情形是使得发明性的内容可驻留在少于所公开的个体示例的所有特征的特征中。因此,所附权利要求由此应该被认为是被纳入到该描述中,其中每项权利要求自身可为单独的示例。尽管每项权利要求自身可为单独示例,但应注意,尽管权利要求书中的从属权利要求可引用具有一个或多个权利要求的具体组合,但其他示例也可涵盖或包括所述从属权利要求与具有任何其他从属权利要求的主题内容的组合或任何特征与其他从属和独立权利要求的组合。此类组合在本文提出,除非显示表达了不以某一具体组合为目标。并且,还旨在使权利要求的特征可被包括在任何其他独立权利要求中,即使所述权利要求不直接从属于该独立权利要求。
此外还应注意,本描述或权利要求中公开的方法可由包括用于执行该方法的动作的装置的设备来实现。
此外,在一些示例中,个体动作可被细分为多个子动作或包含多个子动作。此类子动作可被包含在个体动作的公开中并且可以是个体动作的公开的一部分。
尽管前面的公开示出了本公开的解说性示例,但是应当注意,在其中可作出各种变更和修改而不会脱离如所附权利要求定义的本公开的范围。根据本文中所描述的本公开的各示例的方法权利要求中的功能和/或动作不一定要以任何特定次序执行。另外,众所周知的元素将不被详细描述或可被省去以免模糊本文所公开的各方面和示例的相关细节。此外,尽管本公开的要素可能是以单数来描述或主张权利的,但是复数也是已料想了的,除非显式地声明了限定于单数。
Claims (18)
1.一种封装,包括:
管芯,所述管芯具有有源侧以及从所述管芯的所述有源侧延伸的多个互连;
具有空腔的模塑复合物,所述模塑复合物至少部分地覆盖所述管芯,其中所述空腔延伸到所述模塑复合物中达小于所述模塑复合物的厚度的第一距离;
所述空腔中的组件,其中所述组件的顶表面与所述多个互连共面;
所述模塑复合物上的电介质层,所述电介质层配置成延伸到所述空腔中以使得所述组件与所述模塑复合物隔离;以及
所述电介质层中的重分布层,所述重分布层配置成将所述多个互连耦合至所述组件。
2.如权利要求1所述的封装,其特征在于,所述组件进一步包括:
连接,所述组件与所述多个互连共面,所述连接配置成将所述组件耦合至所述重分布层。
3.如权利要求1所述的封装,其特征在于,进一步包括在所述电介质层上的、耦合至所述重分布层的多个焊球。
4.如权利要求1所述的封装,其特征在于,进一步包括所述空腔的表面上的粘合层,所述粘合层紧固所述空腔中的所述组件。
5.如权利要求1所述的封装,其特征在于,所述组件是逻辑管芯、存储器、通孔条、电容器、电感器、或变压器中的一者。
6.如权利要求1所述的封装,其特征在于,所述管芯的非有源侧是暴露的。
7.如权利要求1所述的封装,其特征在于,所述封装被纳入到选自包括以下各项的组的设备中:音乐播放器、视频播放器、娱乐单元、导航设备、通信设备、移动设备、移动电话、智能电话、个人数字助理、固定位置终端、平板计算机、计算机、可穿戴设备、膝上型计算机、服务器、以及机动车辆中的车载设备,并且进一步包括所述设备。
8.一种用于制造封装的方法,所述方法包括:
在载体上放置管芯,所述管芯具有有源侧;
将多个互连耦合至所述管芯的所述有源侧;
在所述管芯上的所述载体上施加模塑复合物;
移除所述模塑复合物的一部分以暴露所述多个互连;
在所述模塑复合物中形成空腔,其中形成所述空腔包括将所述空腔延伸到模塑复合物中达小于所述模塑复合物的厚度的第一距离;
在所述空腔的表面上形成粘合层;
将组件放置在所述空腔中的所述粘合层上,其中所述组件的顶表面与所述多个互连共面;
在所述模塑复合物上形成电介质层,其中形成所述电介质层包括将所述电介质层延伸到所述空腔中并且将所述组件与所述模塑复合物隔离;以及
在所述电介质层中形成重分布层,所述重分布层将所述多个互连耦合至所述组件。
9.如权利要求8所述的用于制造封装的方法,其特征在于,放置所述组件包括将所述组件放置在所述空腔中以使得所述组件的连接与所述多个互连共面,所述连接将所述组件耦合至所述重分布层。
10.如权利要求8所述的用于制造封装的方法,其特征在于,进一步包括在所述电介质层上形成耦合至所述重分布层的多个焊球。
11.如权利要求8所述的用于制造封装的方法,其特征在于,所述组件是逻辑管芯、存储器、通孔条、电容器、电感器、或变压器中的一者。
12.如权利要求8所述的用于制造封装的方法,其特征在于,进一步包括移除所述模塑复合物的一部分以暴露所述管芯的非有源侧。
13.一种封装,包括:
具有有源侧的管芯;
从所述管芯的所述有源侧延伸的用于所述管芯的互连的装置;
用于封装所述管芯的至少一部分的装置;
所述用于封装的装置的空腔中的组件,其中所述空腔延伸到所述用于封装的装置中达小于所述用于封装的装置的厚度的第一距离,所述组件的顶表面与所述用于所述管芯的互连的装置共面;
所述用于封装的装置上的用于隔离的装置,所述用于隔离的装置延伸到所述空腔中以使得所述组件与所述用于封装的装置隔离;以及
用于将所述管芯耦合至所述组件的装置,所述用于将所述管芯耦合至所述组件的装置位于电介质层中。
14.如权利要求13所述的封装,其特征在于,所述组件进一步包括:
用于将所述组件连接至所述用于将所述管芯耦合至所述组件的装置的装置,所述组件与所述用于所述管芯的互连的装置共面。
15.如权利要求13所述的封装,其特征在于,进一步包括用于暴露所述管芯的非有源侧的装置。
16.如权利要求13所述的封装,其特征在于,进一步包括在所述用于隔离的装置上的、耦合至所述用于将所述管芯耦合至所述组件的装置的多个焊球。
17.如权利要求13所述的封装,其特征在于,进一步包括所述空腔的表面上的粘合层,所述粘合层紧固所述空腔中的所述组件。
18.如权利要求13所述的封装,其特征在于,所述组件是逻辑管芯、存储器、通孔条、电容器、电感器、或变压器中的一者。
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