CN107667142A - Light diffusion powder and preparation method thereof - Google Patents
Light diffusion powder and preparation method thereof Download PDFInfo
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- CN107667142A CN107667142A CN201680031294.1A CN201680031294A CN107667142A CN 107667142 A CN107667142 A CN 107667142A CN 201680031294 A CN201680031294 A CN 201680031294A CN 107667142 A CN107667142 A CN 107667142A
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- light diffusion
- diffusion powder
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- weight
- particle
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- 238000009792 diffusion process Methods 0.000 title claims abstract description 90
- 239000000843 powder Substances 0.000 title claims abstract description 79
- 238000002360 preparation method Methods 0.000 title abstract description 5
- 239000002245 particle Substances 0.000 claims abstract description 69
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 33
- 229920005990 polystyrene resin Polymers 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 23
- 239000004611 light stabiliser Substances 0.000 claims description 22
- 239000000725 suspension Substances 0.000 claims description 16
- 238000006116 polymerization reaction Methods 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- 238000003980 solgel method Methods 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 3
- 239000012964 benzotriazole Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 7
- 239000004793 Polystyrene Substances 0.000 abstract description 3
- 229920002223 polystyrene Polymers 0.000 abstract description 2
- 238000002834 transmittance Methods 0.000 description 18
- 239000012071 phase Substances 0.000 description 17
- 239000000243 solution Substances 0.000 description 15
- 239000003795 chemical substances by application Substances 0.000 description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 239000004594 Masterbatch (MB) Substances 0.000 description 7
- 238000009833 condensation Methods 0.000 description 7
- 230000005494 condensation Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000003595 mist Substances 0.000 description 7
- 229920005992 thermoplastic resin Polymers 0.000 description 7
- 230000007062 hydrolysis Effects 0.000 description 6
- 238000006460 hydrolysis reaction Methods 0.000 description 6
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 5
- 238000006253 efflorescence Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 239000008188 pellet Substances 0.000 description 5
- 206010037844 rash Diseases 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000010557 suspension polymerization reaction Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- -1 alkoxy silicon Alkane Chemical class 0.000 description 3
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 3
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000003921 particle size analysis Methods 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000003643 water by type Substances 0.000 description 2
- BOOBDAVNHSOIDB-UHFFFAOYSA-N (2,3-dichlorobenzoyl) 2,3-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC=CC(C(=O)OOC(=O)C=2C(=C(Cl)C=CC=2)Cl)=C1Cl BOOBDAVNHSOIDB-UHFFFAOYSA-N 0.000 description 1
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 1
- KEQGZUUPPQEDPF-UHFFFAOYSA-N 1,3-dichloro-5,5-dimethylimidazolidine-2,4-dione Chemical compound CC1(C)N(Cl)C(=O)N(Cl)C1=O KEQGZUUPPQEDPF-UHFFFAOYSA-N 0.000 description 1
- SSZOCHFYWWVSAI-UHFFFAOYSA-N 1-bromo-2-ethenylbenzene Chemical compound BrC1=CC=CC=C1C=C SSZOCHFYWWVSAI-UHFFFAOYSA-N 0.000 description 1
- HLOUDBQOEJSUPI-UHFFFAOYSA-N 1-ethenyl-2,3-dimethylbenzene Chemical compound CC1=CC=CC(C=C)=C1C HLOUDBQOEJSUPI-UHFFFAOYSA-N 0.000 description 1
- LHENQXAPVKABON-UHFFFAOYSA-N 1-methoxypropan-1-ol Chemical compound CCC(O)OC LHENQXAPVKABON-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- CISIJYCKDJSTMX-UHFFFAOYSA-N 2,2-dichloroethenylbenzene Chemical compound ClC(Cl)=CC1=CC=CC=C1 CISIJYCKDJSTMX-UHFFFAOYSA-N 0.000 description 1
- COXCGWKSEPPDAA-UHFFFAOYSA-N 2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)C#N COXCGWKSEPPDAA-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QROGIFZRVHSFLM-QHHAFSJGSA-N [(e)-prop-1-enyl]benzene Chemical compound C\C=C\C1=CC=CC=C1 QROGIFZRVHSFLM-QHHAFSJGSA-N 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 239000008346 aqueous phase Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 1
- XTHPWXDJESJLNJ-UHFFFAOYSA-N chlorosulfonic acid Substances OS(Cl)(=O)=O XTHPWXDJESJLNJ-UHFFFAOYSA-N 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- MWKFXSUHUHTGQN-UHFFFAOYSA-N n-decyl alcohol Natural products CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 235000019394 potassium persulphate Nutrition 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229920000638 styrene acrylonitrile Polymers 0.000 description 1
- 239000011145 styrene acrylonitrile resin Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 229940078499 tricalcium phosphate Drugs 0.000 description 1
- 229910000391 tricalcium phosphate Inorganic materials 0.000 description 1
- 235000019731 tricalcium phosphate Nutrition 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
Abstract
The light diffusion powder of the present invention includes：Polystyrene-based resin；With the organic poly sesquisiloxane particle with about 0.1 0.9 μm of average diameter (D50).The light diffusion powder has excellent light diffusivity energy and brightness, and its preparation method reduces losing and having excellent economic benefit and machinability for about 0.5 μm or less of organic poly sesquisiloxane particulate.
Description
Technical field
The present invention relates to a kind of light diffusion powder and a kind of method for preparing it.It is more particularly it relates to a kind of
The light diffusion powder used in light diffusing board.
Background technology
The silicone particles such as silica or organic poly sesquisiloxane generally with various fluoropolymer resins and organic material
Material has good compatibility, and is widely used as being used for coating, plastics, rubber, paper or coating liquid and activating agent
Additive, for improve high-quality video-tape operation stability.
Especially, organic poly sesquisiloxane particle have three-dimensional network molecular structure and good mobility and with tree
The excellent compatibility and refractive index of fat are low, and as lampshade, signboard and liquid crystal display backlight unit (light) diffusion agent with
And attracted attention as the additive of light guide plate.
For example, as disclosed in Japanese Unexamined Patent Publication 2000-186148 publications, this organic poly sesquisiloxane particle is logical
Cross what is prepared using the hydrolysis of methyl trialkoxysilane monomer and the sol-gel process of condensation mechanism.
, will be fine in order to which organic poly sesquisiloxane particle to be used as to the diffusion agent of light diffusing board in typical method
Organic poly sesquisiloxane particle is mixed to prepare masterbatch with thermoplastic resin such as styrene resin, then by masterbatch and another kind
Thermoplastic resin mixes, and is then extruded mixture to manufacture light diffusing board.Then, this method has a problem that,
The fine grained that particle diameter is less than about 0.5 μm is likely to lose during the efflorescence (such as dehydration) of organic poly sesquisiloxane particle
Lose, and need efflorescence diffusion agent in higher concentrations and prepare the masterbatch containing diffusion agent, thus cause process complications.
Inventor develops a kind of light diffusion powder, and it can make finely poly- organic sesquialter that particle diameter is less than about 0.5 μm
The minimization of loss of siloxane particles, so as to realize good light diffusion and brightness, and it can simplify manufacturing process,
So as to improve processability.
The content of the invention
Technical problem
It is an object of the present invention to provide a kind of light diffusion powder, and it can realize good light diffusion and brightness.
It is a further object of the present invention to provide a kind of method for preparing light diffusion powder, and it can make particle diameter be about 0.5 μm
Or the minimization of loss of following fine organic poly sesquisiloxane particle.
It is yet another object of the invention to provide a kind of method for preparing light diffusion powder, and it is able to ensure that good economy can
Row and machinability.
The another object again of the present invention is to provide a kind of light diffusing board, it uses light diffusion powder as above.
The above and other purpose of the present invention can be realized by the present invention described below.
Technical scheme
One aspect of the present invention is related to a kind of light diffusion powder.The light diffusion powder includes：Polystyrene resin；And tool
There is the organic poly sesquisiloxane particle of about 0.1 μm to about 0.9 μm of average grain diameter (D50).
In an exemplary embodiment, relative to 100 parts by weight polystyrene resins, organic poly sesquisiloxane particle
Can about 0.1 parts by weight to about 45 parts by weight amount exist.
In an exemplary embodiment, polystyrene resin can be with continuous phase presence and organic poly sesquisiloxane
Particle can exist with dispersed phase.
In an exemplary embodiment, the gross weight of the organic poly sesquisiloxane particle based on 100wt%, gather organic
Silsesquioxane particle can include about 30wt% to about 99.9wt% thin with about 0.05 μm to about 0.5 μm of particle diameter
Grain.
In an exemplary embodiment, light diffusion powder can be the spherical shape with about 0.01mm to about 10mm particle diameters
Shape, or can be the grain shape with about 0.01mm to about 10mm major diameters.
In an exemplary embodiment, light diffusion powder can also include light stabilizer.
In an exemplary embodiment, light stabilizer can be included in benzotriazole cpd and triaizine compounds extremely
Few one kind.
In an exemplary embodiment, light stabilizer can have dispersed phase and relative to about 100 parts by weight polyphenyl
Vinyl can about 0.1 parts by weight to about 45 parts by weight amount exist.
Another aspect of the present invention is related to a kind of method for preparing light diffusion powder.This method includes：By styrene monomer
Mixed with polymer solution (suspension), the polymer solution (suspension) is about 0.1 μm to about containing average grain diameter (D50)
0.9 μm of organic poly sesquisiloxane particle；Light diffusion powder, wherein light diffusion powder are prepared with by the polymerization of styrene monomer
End includes organic poly sesquisiloxane particle and polystyrene resin.
In an exemplary embodiment, organic poly sesquisiloxane polymer solution can be by making organic alkoxy silicon
Alkane is hydrolyzed and is condensed to prepare by sol-gel process.
In an exemplary embodiment, styrene monomer is mixed with organic poly sesquisiloxane polymer solution can be with
Including further addition light stabilizer.
In an exemplary embodiment, method may further include：Light diffusion powder is dehydrated；With drying and dehydrating
Light diffusion powder.
In an exemplary embodiment, measure after dewatering, light diffusion powder there can be about 5wt% water content.
Another aspect of the present invention is related to a kind of light diffusing board manufactured using above-mentioned light diffusion powder.
Beneficial effect
The present invention provides：A kind of light diffusion powder that can realize good light diffusion and brightness；One kind prepares light diffusion powder
End method, its can make the minimization of loss for the fine organic poly sesquisiloxane particle that particle diameter is less than about 0.5 μm and
It is able to ensure that good economic feasibility and machinability；With the light diffusing board using light diffusion powder.
Embodiment
Hereinafter, embodiments of the present invention will be described in detail.
According to an aspect of the present invention, light diffusion powder includes：Polystyrene resin；With with about 0.1 μm to about 0.9
μm average grain diameter (D50) organic poly sesquisiloxane particle.
Polystyrene resin can be included in any typical polystyrene resin for being used in light diffusing board and can be with
Styrene monomer polymerization is obtained by known polymerization.
In some embodiments, styrene monomer can include styrene, α-methylstyrene, Beta-methyl styrene,
P-methylstyrene, p-tert-butylstyrene, ethyl styrene, vinyl-dimethyl benzene, monochlorostyrene, dichlorostyrene, two
Bromstyrol and vinyl naphthalene, but not limited to this.These can be used alone or are used as its mixture.
In some embodiments, polystyrene resin can form the continuous phase (matrix) of light diffusion powder.For example, contain
It can be mixed with the organic poly sesquisiloxane suspension of organic poly sesquisiloxane particle hereafter with styrene monomer, then
The polymerization of styrene monomer is carried out, is derived from polystyrene resin (continuous phase), wherein organic poly sesquisiloxane particle (divides
Dephasing) it is scattered.
In some embodiments, being measured by gel permeation chromatography (GPC), polystyrene resin can have about 5,
000g/mol to about 50,000g/mol weight average molecular weight, e.g., from about 5,000g/mol to about 30,000g/mol.In this model
In enclosing, organic poly sesquisiloxane particle (dispersed phase) can be evenly dispersed in polystyrene resin (continuous phase), and
And during by extruding manufacture light diffusing board, light diffusion powder equably can spread and be distributed in the substrate.
Organic poly sesquisiloxane particle serves as light diffusing agent, and can have by laser diffraction particle size analysis measurement
About 0.1 μm to about 0.9 μm of average grain diameter (D50), e.g., from about 0.3 μm to about 0.6 μm.If organic poly sesquisiloxane particle
Average grain diameter be less than about 0.1 μm, then particle outside Rayleigh scattering region, cause light transmittance increase rather than diffusion performance increase
Add, and if the average grain diameter of organic poly sesquisiloxane particle is more than about 0.9 μm, light transmittance and brightness can not all obtain fully
Improve, it is necessary to using excessive light diffusing agent.
In some embodiments, organic poly sesquisiloxane particle contains the repeat unit represented by formula 1.
<Formula 1>
RSiO1.5-x(OH)x
In formula 1, R C1To C6Alkyl group, alkenyl group or aromatic yl group, and x is in the range of 0 to 1.5.Example
Such as, R can be methyl group, ethyl group, phenyl group etc..From the point of view of industrial point, preferred methyl group.
In some embodiments, organic poly sesquisiloxane particle can use organoalkoxysilane to lead to as monomer
Sol-gel process (hydrolysis and condensation) is crossed to prepare, but not limited to this.
In some embodiments, the gross weight of the organic poly sesquisiloxane particle based on 100wt%, organic sesquialter is gathered
Siloxane particles can be about 0.05 μ including about 30wt% to about 99.9wt% (e.g., from about 40wt% to about 99wt%) particle diameter
M to about 0.5 μm of fine grained.In the range of this, organic poly sesquisiloxane particle can have good light diffusion efficiency.This
Outside, (organic sesquialter is gathered due to the light diffusing agent used in light diffusing board can be reduced while identical light transmittance is kept
Siloxane particles) amount, can reduce due to strength deterioration or rupture caused by the poor compatibility between light diffusing agent and resin,
And manufacturing cost can be reduced.
In some embodiments, organic poly sesquisiloxane particle can be the dispersed phase of light diffusion powder.For example, can
So that organic poly sesquisiloxane suspension described below to be mixed with styrene monomer, the polymerization of styrene monomer is then carried out
, can be scattered (i.e. with dispersed phase presence) by organic poly sesquisiloxane particle without efflorescence organic poly sesquisiloxane suspension
In polystyrene resin (continuous phase).
In some embodiments, relative to about 100 parts by weight polystyrene resins, organic poly sesquisiloxane particle can
Exist with the amount of about 0.1 parts by weight to about 45 parts by weight, e.g., from about 3 parts by weight to about 10 parts by weight.In the range of this, light overflows
Good light diffusion and brightness can be provided by penetrating powder.
In one embodiment, light diffusion powder may further include light stabilizer.
In some embodiments, light stabilizer can have in toluene under about 20mg/L concentration in about 380nm
Wavelength under the about 0.25AU or higher absorbance that measures, e.g., from about 0.5AU to about 1.0AU.In the range of this, light diffusion
Powder can fully absorb about 380nm in extraneous light to the light of about 390nm wavelength, and light transmittance is low, so as to improve to aobvious
Show the stability of the exterior light of device.
In some embodiments, light stabilizer can include at least one in benzotriazole cpd and triaizine compounds
Kind.In addition, light stabilizer can include any suitable commercially available light stabilizer.Specifically, light stabilizer can include
Tinuvin-770, Tinuvin-P, Tinuvin-477 and Tinuvin-326 (Ciba-Geigy Corp.), but not limited to this.
In some embodiments, light stabilizer can be disperseed (i.e. with dispersed phase presence) in polystyrene resin (company
Continuous phase, matrix) in.For example, light stabilizer and organic poly sesquisiloxane suspension described below can be with styrene monomers
Mixing, the polymerization of styrene monomer is then carried out, be derived from light diffusion powder, wherein organic poly sesquisiloxane particle (divides
Dephasing) and light stabilizer (dispersed phase) be dispersed in polystyrene resin (continuous phase, matrix).
In some embodiments, can about 0.1 parts by weight relative to 100 parts by weight polystyrene resins, light stabilizer
Amount to about 45 parts by weight is present, e.g., from about 0.5 parts by weight to about 30 parts by weight, specifically about 1 parts by weight to about 20 parts by weight.
In the range of this, it can be improved pair by ensuring about less than 1% light transmittance under about 380nm to about 390nm wavelength
The stability of exterior light, and can prevent light excess stabilizer from precipitating into hickie.
In some embodiments, light diffusion powder can be the spherical form with about 0.01mm to about 10mm particle diameters,
E.g., from about 0.03mm to about 5mm, specifically about 0.03mm is to about 1mm, or can be straight greatly with about 0.01mm to about 10mm
The grain shape in footpath, e.g., from about 0.1mm are to about 5mm, specifically about 0.1mm to about 1mm.When light diffusion powder has grain shape
When, the ratio (major diameter of major diameter and minor diameter:Minor diameter) can be about 4:1 to about 1:In the range of 1, e.g., from about 2:1 to
About 1.5:1.In the range of this, light diffusion powder can provide good light diffusion and brightness.
According to another aspect of the present invention, preparing the method for light diffusion powder includes：By styrene monomer and comprising average
Particle diameter (D50) is polymeric solution (suspension) mixing of about 0.1 μm to about 0.9 μm of organic poly sesquisiloxane particle；Pass through
The polymerization of styrene monomer prepares light diffusion powder.
Method for preparing organic poly sesquisiloxane polymeric solution (suspension or latex) is those skilled in the art
It is well-known.For example, that organoalkoxysilane can be used to pass through as monomer is molten for organic poly sesquisiloxane polymeric solution
It is prepared by glue-gel method.Specifically, in the presence of acid or base catalyst organotrialkoxysilane can be made to enter in aqueous phase
Water-filling solution and condensation, so as to prepare organic poly sesquisiloxane polymeric solution.
In some embodiments, organotrialkoxysilane can be represented by formula 2.
<Formula 2>
RSi(OR1)3
In formula 2, the definition in R such as formula 1, and R1It is C1To C5Alkyl group.For example, R can be methyl group, second
Base group or phenyl group, and R1Can be methyl group, ethyl group, propyl group or butyl group.From the angle of industry
Degree sees, R and R1Both preferably methyl group.
Sol-gel process (hydrolysis and condensation) is well known to those skilled in the art.Specifically, hydrolysis and condensation can lead to
Cross and mix the monomer containing organoalkoxysilane to carry out with predetermined solvent.Herein, it is anti-to control to add catalyst
Answer speed.Catalyst can include acid catalyst such as hydrochloric acid, acetic acid, hydrofluoric acid, nitric acid, sulfuric acid, chlorosulfonic acid or acid iodide；Urged with alkali
Agent such as ammonia, potassium hydroxide, sodium hydroxide, barium hydroxide and imidazoles.More specifically, hydrolysis and condensation can use base catalyst
Carried out under the pH value of about 8.5 to about 13, e.g., from about 10 to about 13.When being hydrolyzed and be condensed under pH value within the range
When, it can obtain containing the poly- organic of the organic poly sesquisiloxane particle that average grain diameter (D50) is about 0.1 μm to about 0.9 μm
Silsesquioxane polymeric solution.Hydrolysis and condensation can be carried out about 1 to 24 hour at room temperature, or can be at about 60 DEG C to about
About 1 to 8 hour is carried out at 100 DEG C to promote reaction, but not limited to this.Solvent for hydrolyzing and being condensed is not particularly limited,
Such as water, methanol, ethanol, propyl alcohol, isopropanol, n-butanol, the tert-butyl alcohol and methoxypropanol can be included.These solvents can be single
Solely use or used as its mixture.
In some embodiments, water can be added into organic poly sesquisiloxane polymeric solution (suspension) to promote
The polymerization of styrene monomer.When water is added, the weight of organic poly sesquisiloxane particle and water ratio can be about 0.02:1 to
About 0.9:In the range of 1, but not limited to this.
It is then possible to which organic poly sesquisiloxane polymeric solution (suspension) is mixed with styrene monomer, then carry out
The polymerization of styrene monomer, thus prepares light diffusion powder, and wherein organic poly sesquisiloxane particle is dispersed in polystyrene
In resin.When organic poly sesquisiloxane suspension polymerize without efflorescence with styrene monomer, it is convenient to omit will be poly- organic times
Half silicone powder is mixed with polystyrene resin to prepare the process of masterbatch, so as to improve machinability.In addition, average grain diameter
The fine organic poly sesquisiloxane particle (not so will be lost during the efflorescence of suspension) for being about 0.5 μm can also aid in
Light diffusion, so that it is guaranteed that economic feasibility and light diffusion efficiency.
The polymerization of styrene monomer be well known to a person skilled in the art.It is, for example, possible to use known suspension polymerization
Method.Specifically, can be by the way that styrene monomer and optional polymerization initiator, chain-transferring agent etc. be incorporated into dissolved with scattered steady
Determine to carry out suspension polymerization in the aqueous solution of agent etc..Can be with gathering organic silsesquioxane according to the present invention, styrene monomer etc.
Alkane suspension mixes, and then carries out suspension polymerization.Herein, suspension polymerization can be carried out the scheduled time at a predetermined temperature.
For example, suspension polymerization can be carried out about 1 to 8 hour at about 65 DEG C to about 125 DEG C (at particularly from about 70 DEG C to about 120 DEG C),
But not limited to this.
In some embodiments, polymerization initiator can draw including any typical radical polymerization known in the art
Send out agent.The example of radical polymerization initiator may include potassium peroxydisulfate, sim peroxides, decanol peroxide, bay
Acyl peroxide, benzoyl peroxide, monochloro-benzene formoxyl peroxide, dichlorobenzoyl peroxide, to first
Base benzoyl peroxide, t-butyl perbenzoate, azodiisobutyronitrile and azo two (2,4- dimethyl)-valeronitrile, but not
It is limited to this.These initiators can be used alone or be used as its mixture.It polymerize relative to about 100 parts by weight of styrene
Thing, these polymerization initiators can about 0.01 parts by weight to about 10 parts by weight amount exist, e.g., from about 0.03 parts by weight to about 5 weights
Measure part, but not limited to this.
In one embodiment, when organic poly sesquisiloxane suspension mixes with styrene monomer, one can be entered
Step addition light stabilizer.In this way it is possible to obtain light diffusion powder, wherein organic poly sesquisiloxane particle (dispersed phase)
It is dispersed in light stabilizer (dispersed phase) in the polystyrene resin (continuous phase, matrix) prepared by styrene monomer.
In one embodiment, in order to obtain light diffusion powder, light diffusion powder can be subjected to being dehydrated.In dehydration,
By rinse purifying using whizzer, filter press or vibratory sieve preliminary hydro-extraction body refuse, then using fluidized bed dryer,
Spin flash dryer, vacuum desiccator or convection oven are entered under about 60 DEG C to about 200 DEG C (e.g., from about 70 DEG C to about 90 DEG C)
Row drying, so as to prepare the light diffusion powder of white powder.Light overflows hair powder end can be with the aqueous of about below 5wt%
Amount, e.g., from about 3wt% to about 5wt%.
According to further aspect of the invention, light diffusing board is manufactured using light diffusion powder as above.Using according to this hair
The light diffusing board of bright light diffusion powder manufacture can realize good brightness and light diffusion.Especially, light diffusing board can be used as
LCD-TV etc. diffusing panel.
In some embodiments, light diffusing board may include about 100 parts by weight thermoplastic resin and about 0.1 parts by weight extremely
The light diffusion powder of about 10 parts by weight (e.g., from about 0.5 parts by weight to about 8 parts by weight).In the range of these, light diffusing board due to
The low-transmittance of thermoplastic resin and be suitable as diffusing panel, and can be provided in terms of brightness, light diffusion and light resistance good
Good performance.
In some embodiments, thermoplastic resin can include any typical thermoplastic resin for diffusing panel,
Such as vinyl chloride resin, polystyrene resin, SAN, polyacrylic resin, acrylic-styrene resin,
Polyester resin, ABS resin or polycarbonate resin.
The method of manufacture light diffusing board can easily be carried out by those skilled in the art.For example,
Thermoplastic resin, light diffusion powder and optional other additives can be mixed, then melting extrusion in an extruder, so as to
Prepare pellet.The pellet of preparation can be produced as such as injection moulding, extrusion, vacuum forming and casting by various forming methods
Various light diffusing boards (mechanograph).
The embodiment of invention
Next, the present invention is more fully described in reference implementation example.It is noted, however, that these embodiments are only
For illustrating, and it should not be construed as in any way limiting the present invention.In addition, for the sake of clarity, it will omit to this area skill
The description of the obvious details of art personnel.
Embodiment
Prepare embodiment 1：The preparation of light diffusion powder
240g MTMSs are added in 1760g deionized waters, is subsequently agitated for 30 minutes, then adds ammonia
Then the mixture of gained is stood 4 hours by water so that pH is adjusted to 9.6, molten so as to prepare poly methyl silsesquioxane polymerization
Liquid (suspension).Herein, by laser diffraction particle size analysis measurement, the poly- methyl times in poly methyl silsesquioxane polymeric solution
The average grain diameter (D50) of half siloxane particles is 0.3 μm, and the fine grained that particle diameter is less than 0.5 μm exists with 99% amount
In solution.After 50 parts by weight poly methyl silsesquioxane polymeric solutions are mixed with 50 parts by weight ion exchange waters, 10 are added
Weight parts of styrene monomer, 0.1 weight parts of polymer initiator (potassium sulfate) and Tinuvin-770 as light stabilizer and
Tinuvin-P (Ciba-Geigy Corp.) each 3 parts by weight, are subsequently agitated for 30 minutes, so as to prepare mixing drop.On demand, add
Enter to be dissolved in the tricalcium phosphate that 0.025 parts by weight are dissolved in 2.5 parts by weight of deionized water, then by gained mixture at 75 DEG C
Placed to 95 DEG C about 5 hours, this completes reaction.Then, it is (poly- to be dehydrated the light diffusion powder obtained with powdered
Compound), then dried 12 hours at 80 DEG C, be derived from light diffusion powder (yield：98% or more).Overflow in the light of acquisition
Penetrate in powder, the weight ratio (PS of polystyrene resin and poly methyl silsesquioxane particle:PMSQ it is) 100:3.36, and lead to
Laser diffraction particle size analysis measurement is crossed, the light diffusion powder obtained is simultaneously containing the spherical shape that average grain diameter is 0.1mm to 2mm
Shape particle and the grain shape particle that major diameter is 0.5mm to 5mm.
Embodiment 1
By 100 parts by weight polystyrene resin (weight average molecular weight:340,000g/mol) prepare and implement with 24.5 parts by weight
The light diffusion powder mixing of example 1 and the extrusion in double screw extruder (φ=45mm), thus prepare pellet.Then, use
Pellet is injection moulded by 10 oz injection machines under 240 DEG C of forming temperature, thus manufactures the thick plane plate specimens of 1.5mm.
The light transmittance (total light transmittance, TT) and mist degree of manufactured sample are assessed according to following methods.As a result it is as shown in table 1.
Embodiment 2
Plane plate specimen is manufactured in the same manner as in example 1, and difference is the light diffusion powder for preparing embodiment 1
End is used with the amount of 30 parts by weight.Assess the light transmittance and mist degree of manufactured sample.As a result it is shown in Table 1.
Embodiment 3
Plane plate specimen is manufactured in the same manner as in example 1, and difference is the light diffusion powder for preparing embodiment 1
End is used with the amount of 40 parts by weight.Assess the light transmittance and mist degree of manufactured sample.As a result it is shown in Table 1.
Comparative example 1
By 100 parts by weight polystyrene resin (weight average molecular weight:340,000g/mol) with the poly- methyl sesquialter of 15 parts by weight
Siloxane particles (SL-100M, Samsung SDI, average grain diameter (D50):1 μm, average grain diameter (D50) is less than 0.5 μm thin
The content of particle:50%) and as the Tinuvin-770 and Tinuvin-P of light stabilizer (Ciba-Geigy Corp., weigh
Amount ratio:1:1) each 5 parts by weight mixing, thus prepares masterbatch.Then, by 100 parts by weight polystyrene resin (weight average molecular weight:
340,000g/mol) mix with 15 parts by weight masterbatch, and extruded in double screw extruder (φ=45mm), thus prepare grain
Material.Then, pellet is injection moulded under 240 DEG C of forming temperature using 10 oz injection machines, by preparing 1.5mm thickness
Plane plate specimen.The light transmittance (total light transmittance, TT) and mist degree of manufactured sample are assessed according to following methods.As a result such as the institute of table 1
Show.
Comparative example 2
Plane plate specimen is manufactured with identical mode in comparative example 1, difference is that masterbatch usage amount is 20 parts by weight.Comment
Estimate the light transmittance and mist degree of manufactured sample.As a result it is as shown in table 1.
Properties evaluations
(1) light transmittance (TT) (unit：%)：Use haze meter (NDH 5000 W, Nippon Denshoku
Industries Co., Ltd.) each sample of measurement light transmittance.
(2) mist degree (unit：%)：Use haze meter (NDH 5000 W, Nippon Denshoku Industries
Co., Ltd.) each sample of measurement mist degree.
[table 1]
(unit：Parts by weight)
It can be seen that (including average grain diameter is 0.3 μ using the light diffusion powder according to the present invention from the result shown in table 1
M poly methyl silsesquioxane particle) sample of manufacture has good diffusion performance, although its poly- methyl sesquialter silicon for using
The amount of oxygen alkane particle as little as 1.3 wt%.
Conversely, it can be seen that use the comparative example 1 for the organic poly sesquisiloxane particle that average grain diameter (D50) is 1.0 μm
Sample with 2, although having used a greater amount of organic poly sesquisiloxane particles than embodiment, has high transmission rate or ground fog
Degree, therefore the light diffusivity energy that performance is gone on business.
It should be appreciated that without departing from the spirit and scope of the present invention, those skilled in the art can do
Go out various modifications, change, change and equivalent implementations.
Claims (14)
1. a kind of light diffusion powder, comprising：
Polystyrene resin；With
Organic poly sesquisiloxane particle with about 0.1 μm to about 0.9 μm of average grain diameter (D50).
2. light diffusion powder according to claim 1, wherein relative to the polystyrene resin of 100 parts by weight, institute
Organic poly sesquisiloxane particle is stated with the amount of about 0.1 parts by weight to about 45 parts by weight to exist.
3. light diffusion powder according to claim 1, wherein the polystyrene resin exists and described with continuous phase
Organic poly sesquisiloxane particle exists with dispersed phase.
4. light diffusion powder according to claim 1, wherein the gross weight based on the organic poly sesquisiloxane particle,
The organic poly sesquisiloxane particle includes about 30wt% to the about 99.9wt% particle diameter with about 0.05 μm to about 0.5 μm
Fine grained.
5. light diffusion powder according to claim 1, wherein the light diffusion powder is with about 0.01mm to about 10mm
Particle diameter spherical form or be grain shape with about 0.01mm to about 10mm major diameter.
6. light diffusion powder according to claim 1, is further included：Light stabilizer.
7. light diffusion powder according to claim 6, wherein the light stabilizer includes benzotriazole cpd and triazine
At least one of compound.
8. light diffusion powder according to claim 6, wherein the light stabilizer has dispersed phase and relative to about 100
The polystyrene resin of parts by weight exists with the amount of about 0.1 parts by weight to about 45 parts by weight.
9. a kind of method for preparing light diffusion powder, comprising：
By styrene monomer with containing the organic poly sesquisiloxane with about 0.1 μm to about 0.9 μm of average grain diameter (D50)
Polymeric solution (suspension) mixing of grain；And
Light diffusion powder is prepared by the polymerization of the styrene monomer,
Wherein, the light diffusion powder includes the organic poly sesquisiloxane particle and polystyrene resin.
10. the method according to claim 9 for preparing light diffusion powder, wherein making organic alkane by sol-gel process
TMOS is hydrolyzed and is condensed to prepare the polymer solution of the organic poly sesquisiloxane.
11. it is according to claim 9 prepare light diffusion powder method, wherein by the styrene monomer with it is described gather have
The polymer solution mixing of machine silsesquioxane includes further addition light stabilizer.
12. the method according to claim 9 for preparing light diffusion powder, further comprises：
The light diffusion powder is dehydrated；With
The light diffusion powder of drying and dehydrating.
13. the method according to claim 12 for preparing light diffusion powder, is being dehydrated wherein the light diffusion powder has
The about 5wt% measured afterwards water content.
A kind of 14. light diffusing board manufactured using light diffusion powder according to any one of claim 1 to 8.
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| KR1020150074319A KR20160141078A (en) | 2015-05-27 | 2015-05-27 | Light diffusion powder and method for preparing the same |
| KR10-2015-0074319 | 2015-05-27 | ||
| PCT/KR2016/004602 WO2016190560A1 (en) | 2015-05-27 | 2016-05-02 | Light diffusing powder and preparation method therefor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1942521A (en) * | 2004-04-14 | 2007-04-04 | 出光兴产株式会社 | Light-diffusing resin composition |
| KR20080012257A (en) * | 2005-05-20 | 2008-02-11 | 제너럴 일렉트릭 캄파니 | Light diffusing films, methods of making the same, and articles using the same |
| KR100837090B1 (en) * | 2007-03-20 | 2008-06-12 | 제일모직주식회사 | Light diffusing particle, method for preparing the same and light-diffusing plate using the same |
| CN103842423A (en) * | 2011-10-31 | 2014-06-04 | 道康宁印度私人有限公司 | Light diffusing thermoplastic resin compositions and light diffusing members |
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| KR100856718B1 (en) * | 2006-12-15 | 2008-09-04 | 제일모직주식회사 | Silicone Light-Diffusing Agent with Bimodal Size Distribution, Method for Preparing the Same, and Light-Diffusing Plate Using the Same |
| KR100859498B1 (en) * | 2006-12-20 | 2008-09-22 | 제일모직주식회사 | Silicon Bead with High Quality Luminance and Lightfastness, Method for Preparing the Same and Light-Diffusing Plate Using the Same |
| KR101400323B1 (en) * | 2007-12-21 | 2014-05-28 | 코오롱인더스트리 주식회사 | Polymer beads having core-shell structure and Preparation method of polymer beads by core-shell method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1942521A (en) * | 2004-04-14 | 2007-04-04 | 出光兴产株式会社 | Light-diffusing resin composition |
| KR20080012257A (en) * | 2005-05-20 | 2008-02-11 | 제너럴 일렉트릭 캄파니 | Light diffusing films, methods of making the same, and articles using the same |
| KR100837090B1 (en) * | 2007-03-20 | 2008-06-12 | 제일모직주식회사 | Light diffusing particle, method for preparing the same and light-diffusing plate using the same |
| CN103842423A (en) * | 2011-10-31 | 2014-06-04 | 道康宁印度私人有限公司 | Light diffusing thermoplastic resin compositions and light diffusing members |
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| KR20160141078A (en) | 2016-12-08 |
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