CN1076638C - 接合的热塑性弹性体阻挡层 - Google Patents

接合的热塑性弹性体阻挡层 Download PDF

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CN1076638C
CN1076638C CN97192064A CN97192064A CN1076638C CN 1076638 C CN1076638 C CN 1076638C CN 97192064 A CN97192064 A CN 97192064A CN 97192064 A CN97192064 A CN 97192064A CN 1076638 C CN1076638 C CN 1076638C
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barrier layer
substrate
thermoplastic elastomer
bonded
layered composite
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CN1210480A (zh
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戴维·R·克罗策
尼尔·N·席尔瓦
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Thomas Bates International Inc
ABB Installation Products International LLC
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Abstract

本发明公开了一种热塑性弹性体阻挡层(14)。该热塑性弹性体阻挡层(14)可接合在基底(12)上，以防止污染物渗透进该基底(12)，或者是防止可渗透进基底(12)的污染物渗透过该基底(12)。热塑性弹性体阻挡层(14)通过热接合法接合在基底(12)上。

Description

接合的热塑性弹性体阻挡层
                  相关申请的交叉参考
本发明是于1996年10月28日申请的、1999年9月7日批准的第5,949,029号美国专利的部分继续专利申请。
                  发明领域
本发明一般地涉及弹性材料，而具体地涉及热塑性弹性体阻挡层，该阻挡层接合在基底上，以防止污染物渗透进该基底，或者是防止有可能渗透进基底的污染物渗透过该基底。
                  发明背景
硅橡胶按键垫已用于从电话到计算器的各种电子产品领域中。这些产品的制造商通常希望这些产品的使用寿命尽可能地长。这对于那些生产高可靠性产品的知名制造商来说更是如此。
不幸的是，在电子产品中使用硅橡胶按键垫会导致该电子产品过早地失效。例如，蜂窝电话通常安装有印刷电路板和匹配的硅橡胶按键垫。印刷电路板通常具有多个形成在其匹配表面上的导电触点，而硅橡胶按键垫通常具有多个与其匹配表面有关的相应导电触点。在操作时，蜂窝电话的使用者用他的手指在硅橡胶按键垫上施加压力，以在相应的导电触点之间产生电连接。
随着时间的延长，硅橡胶按键垫通常会沾染上污染物如奶油、洗液、和油脂。这些污染物可能直接来自于使用者的手指或者是来自于其他来源。无论这些污染物来自于何处，它们都有可能渗透进硅橡胶按键垫，并导致导电触点的腐蚀以及连接问题。
综上所述，提供一种防止污染物渗透进该硅橡胶按键垫，或者是防止有可能渗透进硅橡胶按键垫的污染物渗透过该硅橡胶按键垫，由此防止导电触点的腐蚀以及连接问题的装置，显而易见是非常有益的。从更宽的范围看，提供一种防止污染物渗透进或渗透过任何类型的基底材料，否则该基底材料就会发生污染物渗透的装置，将是非常有益的。
                     发明简述
本发明的主要目的是提供一种热塑性弹性体阻挡层，该阻挡层接合在基底上以防止污染物渗透进该基底，或者是防止有可能渗透进基底的污染物渗透过该基底。在一具体实施方案中，本发明是以层状复合体来实现的，该层状复合体包括：基底，该基底具有上表面和下表面，该基底由污染物可渗进其内的材料制成；以及第一阻挡层，该阻挡层接合在至少一部分基底之下表面上，该第一阻挡层由热塑性弹性体材料制成，该材料可防止污染物渗透进其中。弹性导电层可接合在至少一部分该第一阻挡层的表面上。同样，第二阻挡层可接合在至少一部分基底的上表面上，该第二阻挡层由热塑性弹性体材料制成，该材料可防止污染物渗透进其中。各层的接合是通过热接合法来进行的。
综上所述，可非常明显地看出本发明是如何克服上述缺陷的。通过以下参考附图对本发明的详细描述，本发明的上述主要目的、以及其他目的、特征和优点将变得更为明显。
                  附图简述
为便于更好地理解本发明，现对附图进行说明。这些图不应理解为是对本发明的限制，而仅是用于说明的目的。
图1是根据本发明之具有一个热塑性弹性体阻挡层的层状复合体的横截面图。
图2是根据本发明之具有一个热塑性弹性体阻挡层和一个弹性导电层的层状复合体的横截面图。
图3是根据本发明之具有一个热塑性弹性体阻挡层和一个弹性导电层的电话或计算器按键垫的横截面图。
图4是根据本发明之具有两个热塑性弹性体阻挡层和一个弹性导电层的电话或计算器按键垫的横截面图。
                  发明详述
如图1所示，其为层状复合体10的横截面图，该复合体10包括基底12和热塑性弹性体阻挡层14。对于最有用的热塑性弹性体阻挡层14来说，基底12应由如奶油、洗液和油脂等污染物可渗透进其中的材料制成。例如，基底可由弹性材料如硅橡胶、柔性材料如热塑性聚酰胺(已知商品名为nylonTM)、或者刚性材料如热塑性聚酰胺—酰亚胺(已知商品名为ultemTM)制成。热塑性弹性体阻挡层14可由如热塑性聚氨基甲酸酯弹性体或热塑性聚烯烃弹性体的热塑性弹性体制成。
层状复合体10可通过热接合法制成，该方法通常首先使基底12呈完全固化状态。然后通过喷涂和任何其他已知方法将热塑性弹性体阻挡层14沉积在基底12上。接着使该层状结构经受热循环处理，由此使热塑性弹性体阻挡层14完全固化并接合在基底12上。在该热接合过程中，热塑性弹性体阻挡层14的聚合物链被接枝在基底12的聚合物链上，由此在热塑性弹性体阻挡层14和基底12之间形成强的连接。该热接合法消除了对弹性基底12的表面进行浸蚀或预处理的需要。
一般来说对基底12的厚度没有限制。但是热塑性弹性体阻挡层14的厚度通常需要在12.7—127μm(0.5—5.0mils)的范围内，以防止有可能渗入基底12的污染物渗透过该基底12。
应注意的是，基底12和热塑性弹性体阻挡层14必须由具有相同或基本相同的膨胀系数的材料制成。因为这样可通过在热接合过程中保持较高的温度在基底12和热塑性弹性体阻挡层14之间形成强连接。
热塑性弹性体通常具有非常好的抗油和化学品的性质，而且它们的热塑性性质使得它们可被再加热和再流模以重新成形。在冷却后，它们还具有弹性。显而易见，在其上接合有热塑性弹性体的基底也具有弹性时，热塑性弹性体的弹性将是非常有益的。如果其上接合有热塑性弹性体的基底仅是柔性的，那么热塑性弹性体的弹性也将是非常有益的，这是因为热塑性弹性体可与柔性基底的任何形状相符合。如果其上接合有热塑性弹性体的基底是刚性的，可以看出热塑性弹性体的仅有益处是耐污染性，但是如下所述弹性仍是有益的。
参考图2，其为层状复合体20的横截面图，所述复合体20包括一个弹性基底22、一个热塑性弹性体阻挡层24、和一个弹性导电层26。在该具体实施方案中，弹性基底22是由硅橡胶制成的，而热塑性弹性体阻挡层24是由热塑性聚烯烃制成的。如前所述，硅橡胶是一种可允许污染物如奶油、洗液和油脂渗透进其中的材料。
弹性导电层26包括弹性材料28和大量导电片29的混合物。弹性材料28是由弹性材料如硅橡胶制成的。另外，弹性材料28也可由热塑性弹性体如热塑性聚烯烃弹性体制成。
导电片29是由导电性或半导电性材料如银、镍、或碳制成。另外，导电片29也可由其中涂覆或分散有其他导电性或半导电性材料如银、镍或碳的导电性、半导电性、或绝缘性材料制成。导电片29的大小和量可根据所需要的导电性来变化。弹性导电层26与1996年10月28日申请的、1999年9月7日批准的第5,949,029号美国专利中所公开和描述的弹性导电层类似。
层状复合体20可通过热接合法制成，该方法通常首先使基底22呈完全固化状态。然后通过喷涂和任何其他已知方法将热塑性弹性体阻挡层24沉积在弹性基底22上。同样通过喷涂和任何其他已知方法将弹性导电层26沉积在热塑性弹性体阻挡层24上。接着使整个层状结构经受热循环处理，由此使热塑性弹性体阻挡层24完全固化并接合在弹性基底22上，并使弹性导电层26完全固化并接合在热塑性弹性体阻挡层24上。在该热接合过程中，热塑性弹性体阻挡层24的聚合物链被接枝在弹性基底22的聚合物链上，由此在热塑性弹性体阻挡层24和弹性基底22之间形成强的连接。同样，弹性导电层26的聚合物链被接枝在热塑性弹性体阻挡层24的聚合物链上，由此在弹性导电层26和热塑性弹性体阻挡层24之间形成强连接。该热接合法消除了对弹性基底22的表面进行浸蚀或预处理的需要。
与图1中描述的层状复合体10类似，弹性基底22和热塑性弹性体阻挡层24必须由具有相同或基本相同的膨胀系数的材料制成，因为这样可通过在热接合过程中保持较高的温度在弹性基底22和热塑性弹性体阻挡层24之间形成强连接。出于相似的原因，热塑性弹性体阻挡层24和弹性导电层26由具有相同或基本相同的膨胀系数的材料制成也是非常重要的。
层状复合体20的功能是，热塑性弹性体阻挡层24防止可渗透进弹性基底22的污染物到达弹性导电层26。如果弹性导电层26本身是由允许污染物渗透于其中的材料(如硅橡胶)制成的，那么热塑性弹性体阻挡层24将防止此等污染物到达并渗入弹性导电层26，由此防止弹性导电层26以及任何相关的导电触点中的腐蚀和连接问题。即便弹性导电层26是由本身不允许污染物渗入其中的材料(如热塑性聚烯烃弹性体)制成的，大量的导电片29也会使弹性导电层26易于污染物的渗透，这是因为沿导电片周围发展出的开口或凹陷会使污染物渗透进弹性导电层26。但是，因为热塑性弹性体阻挡层24防止污染物到达弹性导电层26，所以此等污染物渗透不会发生。
应注意的是，一般情况下并不推荐将弹性导电层26直接接合在弹性基底22上，这是因为导电片29的数量通常太多，使得弹性导电层26的聚合物链的数量不足以接枝在弹性基底22的聚合物链上。也就是说，弹性导电层26和弹性基底22之间的连接因为弹性导电层26中导电片29的存在，将不如热塑性弹性体阻挡层24和弹性基底22之间的连接那么强。热塑性弹性体阻挡层24的作用是作为将弹性导电层26接合在层状复合体20中的底物。
可使用上述层状复合体20的一个具体应用是其中必须通过按压按键垫上的键来实现电连接的电话或计算器按键垫。如果此等按键垫是由允许污染物渗入其中的材料(如硅橡胶)制成的，那么就可根据上述方法将热塑性弹性体阻挡层接合在按键垫的下表面上，以防止任何污染物渗透过该按键垫。
参考图3，其为电话或计算器按键垫40的横截面图，该按键垫40包括一个弹性覆盖面42，该覆盖面42由允许污染物渗入其中的材料(如硅橡胶)制成。弹性覆盖面42具有多个形成在其中的按键44。沿弹性覆盖面42的所有下侧，热塑性弹性体阻挡层46接合在该弹性覆盖面42上。在热塑性弹性体阻挡层46的下表面上，在各按键44下在热塑性弹性体阻挡层46上接合弹性导电层48。
印刷电路板50设置在整个弹性覆盖面42之下，而且导电线路52在各按键44下形成在印刷电路板50上。这样，在例如通过手指54将力F施加在一个按键44上时，相应的弹性导电层48与相应的导电线路52形成电接触，由此形成电连接。
热塑性弹性体阻挡层46防止可渗入弹性覆盖面42的污染物渗透过弹性覆盖面42。也就是说，热塑性弹性体阻挡层46防止污染物到达弹性导电层48和导电线路52，由此防止腐蚀和连接问题。如上所述，热塑性弹性体阻挡层46的厚度通常是在12.7—127μm(0.5—5.0mils)之间，以防止可渗入弹性覆盖面42的污染物渗透过该弹性覆盖面42。
在另一实施方案中，热塑性弹性体阻挡层可接合在电话或计算器按键垫的上表面上，以防止污染物到达该按键垫。例如，图4示出一个电话或计算器按键垫60的横截面图，该电话或计算器按键垫60包括一个弹性覆盖面62，该覆盖面62的上表面上接合有热塑性弹性体阻挡层64。按键垫60的其余部分与图3中的按键垫40相似，其中，弹性覆盖面62具有多个形成在其中的按键66，热塑性弹性体阻挡层68接合在弹性覆盖面62之下表面上，而且弹性导电层70在各按键66下接合在热塑性弹性体阻挡层68上。印刷电路板72还是设置在整个弹性覆盖面62之下，而且在各按键66之下在印刷电路板72上形成导电线路74。这样，在例如通过手指76将力F施加在一个按键66上时，相应的弹性导电层70与相应的导电线路74形成电接触，由此形成电连接。
与图3的按键垫类似，弹性覆盖面62由允许污染物渗入其中的材料(如硅橡胶)制成。但是，热塑性弹性体阻挡层64将防止此等污染物到达弹性覆盖面62。而且，热塑性弹性体阻挡层64也可对阿尔法数字构型提供防护涂层，该数字构型是在热塑性弹性体阻挡层64接合在弹性覆盖面62之前被涂敷在弹性覆盖面62上的。此等保护作用包括对划痕、穿刺及其他损伤作用的抵抗。
如果由于其他原因热塑性阻挡层64被损坏或者允许污染物渗入覆盖面62，热塑性弹性体阻挡层68可起到另外的阻挡作用。同样，如上所述，热塑性弹性体阻挡层68可起到作为将弹性导电层70接合在按键垫60上的底物的作用。
根据上述实施方案，可以明显看出，热塑性弹性体阻挡层可接合在基底上，以防止污染物渗透进该基底，或者是防止有可能渗透进基底的污染物渗透过该基底。由于其弹性，热塑性弹性体阻挡层可接合在同时也具有弹性的基底上，或者是接合在具有柔性或刚性性质的基底上。对于最有用的热塑性弹性体阻挡层来说，基底应是由允许污染物渗入其中的材料制成的。
本发明并不仅限于上述具体实施方案的范围之内。的确，除其中所述之外，本领域普通技术人员从以上描述及附图还可对本发明进行各种的改进。因此，此等改进也在所附权利要求书之范围内。

Claims (18)

1、一种层状复合体，其包括：
一个基底，所述基底具有外表面，所述基底由允许污染物渗入其中的材料制成，而且所述基底具有第一膨胀系数；以及
一个阻挡层，该阻挡层接合在至少一部分所述基底之所述外表面上，所述阻挡层具有外表面，所述阻挡层由防止污染物渗入其中的热塑性弹性体材料制成，而且所述阻挡层具有的膨胀系数与所述第一膨胀系数基本相同。
2、如权利要求1所述的层状复合体，其中，所述阻挡层通过热处理接合在所述基底上。
3、如权利要求1所述的层状复合体，其中，所述基底由允许污染物渗入其中的弹性材料制成。
4、如权利要求1所述的层状复合体，其中，所述基底由允许污染物渗入其中的柔性材料热塑性聚酰胺制成。
5、如权利要求1所述的层状复合体，其中，所述基底由允许污染物渗入其中的热塑性聚酰胺—酰亚胺制成。
6、如权利要求1所述的层状复合体，其进一步包括接合在至少一部分所述阻挡层之所述外表面上的弹性导电层，而且所述弹性导电层具有的膨胀系数与所述第一膨胀系数基本相同。
7、如权利要求6所述的层状复合体，其中，所述弹性导电层通过热处理接合在所述所述阻挡层上。
8、如权利要求7所述的层状复合体，其中，通过单独一个热处理过程，所述阻挡层接合在所述基底上，而所述弹性导电层接合在所述阻挡层上。
9、如权利要求1所述的层状复合体，其中，所述阻挡层的厚度在12.7—127μm范围内。
10、一种层状复合体，其包括：
一个基底，所述基底具有上表面和下表面，所述基底由允许污染物渗入其中的材料制成，而且所述基底具有第一膨胀系数；
一个第一阻挡层，该阻挡层接合在至少一部分所述基底之所述上表面上，所述阻挡层由防止污染物渗入其中的热塑性弹性体材料制成，而且所述第一阻挡层具有的膨胀系数与所述第一膨胀系数基本相同；
一个第二阻挡层，该阻挡层接合在至少一部分所述基底之所述下表面上，所述第二阻挡层具有外表面，所述第二阻挡层由防止污染物渗入其中的热塑性弹性体材料制成，而且所述第二阻挡层具有的膨胀系数与所述第一膨胀系数基本相同；以及
一个弹性导电层，该导电层接合在至少一部分所述第二阻挡层之所述外表面上，而且所述弹性导电层具有的膨胀系数与所述第一膨胀系数基本相同。
11、如权利要求10所述的层状复合体，其中，所述第一阻挡层通过热处理接合在所述基底上。
12、如权利要求10所述的层状复合体，其中，所述第二阻挡层通过热处理接合在所述基底上。
13、如权利要求10所述的层状复合体，其中，所述弹性导电层通过热处理接合在所述第二阻挡层上。
14、如权利要求10所述的层状复合体，其中，通过单独一个热处理过程，所述第一阻挡层接合在所述基底上，所述第二阻挡层接合在所述基底上，而所述弹性导电层接合在所述第二阻挡层上。
15、如权利要求10所述的层状复合体，其中，所述基底由允许污染物渗入其中的弹性材料制成。
16、如权利要求10所述的层状复合体，其中，所述基底由允许污染物渗入其中的柔性材料热塑性聚酰胺制成。
17、如权利要求10所述的层状复合体，其中，所述基底由允许污染物渗入其中的热塑性聚酰胺一酰亚胺制成。
18、如权利要求10所述的层状复合体，其中，所述阻挡层的厚度在12.7—127μm范围内。
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EP0895486A1 (en) 1999-02-10
DE69725975T2 (de) 2004-09-02
JP2000504283A (ja) 2000-04-11
EP0895486B1 (en) 2003-11-05
CA2244868A1 (en) 1998-06-11
WO1998024558A1 (en) 1998-06-11
CA2244868C (en) 2002-01-15
CN1210480A (zh) 1999-03-10
DE69725975D1 (de) 2003-12-11
EP0895486A4 (en) 2000-11-02
US5871842A (en) 1999-02-16
JP3234606B2 (ja) 2001-12-04

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