CN107660075B

CN107660075B - Leveling method and device for hole plugging ink on printed circuit board

Info

Publication number: CN107660075B
Application number: CN201610589523.3A
Authority: CN
Inventors: 梁煜文
Original assignee: ASIA NEO TECH INDUSTRY Co Ltd
Current assignee: ASIA NEO TECH INDUSTRY Co Ltd
Priority date: 2016-07-25
Filing date: 2016-07-25
Publication date: 2020-03-10
Anticipated expiration: 2036-07-25
Also published as: CN107660075A

Abstract

The invention provides a leveling method of hole plugging ink on a printed circuit board, which comprises the steps of providing a rotary belt to circularly move in a loop path, and sequentially and circularly performing a sticking step and a cleaning step on the loop path by the rotary belt; wherein the step of adhering comprises contacting the rotary belt with ink for plugging holes on a surface of the printed circuit board, and the step of cleaning comprises cleaning the ink adhered on the rotary belt with a solution. The invention further provides a leveling device for the hole plugging ink on the printed circuit substrate, which is required for implementing the method. Therefore, the problem of poor leveling efficiency after ink filling holes on the surface of the traditional printed circuit board is solved.

Description

Leveling method and device for hole plugging ink on printed circuit board

Technical Field

The present invention relates to a hole plugging ink on the surface of a printed circuit board, particularly to a leveling method of the hole plugging ink on the printed circuit board and a device thereof.

Background

The Printed Circuit Board (PCB) is formed by compounding a plurality of layers of conductive copper plates and insulating plates, wherein each layer of conductive copper plate is respectively provided with a conductive circuit, the conductive circuits are isolated by the insulating plates, and a plurality of buried holes and through holes are drilled on the surface of the printed circuit board, so that the buried holes and the through holes can be electrically connected with each layer of conductive circuits after being filled with conductive materials to form a functional loop.

In the process of the printed circuit board, it is known that after the formation of the plurality of buried vias and through holes by drilling, an insulation process must be performed. The traditional insulation processing mode generally adopts screen printing, ink for insulation is coated on the surfaces of two ends of a circuit substrate, so that the ink can be filled into each through hole and each buried hole, and then the ink can not only be filled into the through holes and the buried holes, but also can scrape redundant ink on the surface of the printed circuit substrate and in the through holes and the buried holes by utilizing the relative moving contact action between a scraper and the surface of the substrate, so that the printing or spraying processing of the solder-resisting ink can be carried out continuously.

However, in the above ink hole plugging method, since the saturation of the hole plugging is required, ink is likely to seep out from the through hole and the buried hole, which causes an ink overflow phenomenon on the surface of both ends of the printed circuit board, and if the method of continuously covering the solder mask ink is a spraying method, the ink overflow phenomenon will affect the overall appearance and yield.

In order to overcome the above-mentioned problems, taiwan patent No. M485589 discloses a leveling device for ink plugging on a printed circuit board, which utilizes a roller to roll and contact an adhesive film, and presses and contacts the two end surfaces of the printed circuit board coated with ink by the adhesive film, so that the excess ink on the two end surfaces of the printed circuit board and in the through hole and the buried hole can be rolled and adhered on the adhesive film to be carried away from the two end surfaces of the printed circuit board, thereby improving the qualified rate of ink plugging operation.

However, the adhesive film in the above patent technology is a consumable that must be discarded, and particularly, after the adhesive film is stained with ink, the adhesive film must be collected into a bundle and discarded, and cannot be reused, so as to prevent the ink stained on the adhesive film from staining other printed circuit boards; the adhesive and leveling process can be continued only by frequently replacing the new adhesive film; therefore, not only the material cost of the adhesive film is increased, but also the replacement time of the adhesive film is consumed, and improvement is urgently needed.

Disclosure of Invention

Accordingly, the present invention is directed to improve the problem that the conventional adhesive film for adhering ink cannot be reused, and a new adhesive film needs to be replaced to continue the adhering and leveling process, thereby resulting in poor leveling efficiency after filling holes with ink on the surface of the printed circuit board.

In order to achieve the above objects and solve the problems, an embodiment of the present invention provides a method for leveling a hole plugging ink on a printed circuit board, the method comprising: providing a rotating belt to circularly move on a loop path, wherein the rotating belt sequentially and circularly executes a sticking step and a cleaning step on the loop path; wherein the step of adhering comprises contacting the rotary belt with ink for plugging holes on a surface of the printed circuit board, and the step of cleaning comprises cleaning the ink adhered on the rotary belt with a solution.

In further implementations, the method further comprises:

the rotary belt is composed of a ring-shaped belt or a rubber film.

The printed circuit substrate includes two opposite surfaces with via-hole ink present, and the leveling method includes performing on the two opposite surfaces of the printed circuit substrate.

The rotary belt is pressed to be adhered to the surface of the printed circuit substrate by the pressure of the roller.

The carousel contains cleaning ink immersed in a solution.

The cleaning step further comprises scraping off the residual ink on the carousel by at least one scraper. Wherein the doctor blade performs scraping of ink after the solution cleans ink on the carousel.

The above method can be realized by a device technology, and to this end, another embodiment of the present invention provides a leveling device for plugging ink on a printed circuit substrate, wherein the device technology comprises: a revolving belt which is arranged on a revolving path to circularly move; a sticking area station located on the loop path, the loop belt passing through the sticking area station to press and stick the hole plugging ink on one surface of the printed circuit substrate; and a cleaning station, which is located on the loop path and is spaced from the sticking station, wherein a solution is stored in the cleaning station, and the ink adhered on the loop tape is cleaned by sequentially contacting the loop tape of the sticking station with the solution.

In a further implementation, the apparatus further comprises:

the rotary belt is composed of a ring-shaped belt or a rubber film.

The printed circuit board comprises two opposite surfaces with hole plugging ink, and the two leveling devices are respectively arranged at the sides of the two opposite surfaces of the printed circuit board.

The loop path has a plurality of rollers arranged at intervals, and the rotating belt frame is enclosed among the plurality of rollers. The rollers include a pressing wheel, and the rotating belt is pressed to the surface of the printed circuit substrate by the pressing of the pressing wheel.

The clean area station includes a solution tank in which the solution is stored. Wherein the rotary belt is guided by at least one of the rollers to contact the solution in the solution tank.

The clean area station further includes at least one scraper configured to contact and scrape ink remaining on the carousel. The scraper is arranged on a swing arm, and the swing arm can swing to drive the scraper to contact with and be far away from the revolving belt. The scraper is arranged above the solution tank.

The cleaning station further includes at least one scraper configured to contact and scrape off ink remaining on the carousel, and an ink collecting tray configured at a bottom of the scraper to collect ink scraped off by the scraper. The scraper is arranged on a swing arm, and the swing arm can swing to drive the scraper to contact with and be far away from the revolving belt.

According to the technical means, the technical effects of the invention are as follows: the ink adhered to the rotating belt is removed by soaking the rotating belt in the solution, and the residual ink on the rotating belt is scraped by the scraper, so that the rotating belt can be repeatedly used for adhering the ink on the printed circuit substrate, and the leveling efficiency of the ink for plugging holes on the printed circuit substrate is improved.

The details of the above-described method and apparatus, as well as the details of its implementation in the performance of the method and apparatus, are explained with reference to the following examples and drawings.

Drawings

FIG. 1 is a flow chart of the steps of a method embodiment of the present invention;

FIG. 2 is a schematic configuration of an embodiment of the apparatus of the present invention;

fig. 3 is a schematic view of the configuration of another embodiment of the doctor blade of fig. 2.

Description of reference numerals: 10 a printed circuit substrate; 11 surface; 111 a first surface; 112 a second surface; 12 driving the roller; 20 a convoluted band; 201 a first convoluted band; 202 a first convoluted band; 30. 30a rollers; 31 pinch roller; 40 sticking zone station; 50 clean area station; 51, solution; a 52 solution tank; 53, a scraper blade; 54 swing arms; 55 an ink collecting disc; steps of the embodiments S1-S3 are described.

Detailed Description

Referring to fig. 1, the method for leveling the hole plugging ink on the printed circuit board according to the present invention includes steps S1 to S3 of providing a rotating tape 20:

step S1: and (4) circularly moving.

Referring to fig. 2, the rotating belt 20 is disposed beside the printed circuit board 10, the rotating belt 20 moves circularly along a loop path, and the rotating belt 20 can press the surface 11 of the printed circuit board 10 in a line contact or surface contact manner. Further, the rotating belt 20 is enclosed between a plurality of rollers 30 spaced apart from each other, and the rotating belt 20 is pressed against and adheres to the surface 11 of the printed circuit board 10 by the pressure of the rollers 30.

Step S2: sticking the ink.

Referring to fig. 2 again, the contact between the rotary belt 20 and the surface 11 of the printed circuit board 10 is illustrated to adhere the hole plugging ink attached to the surface 11. Further, the carousel 20 can be pressed into contact with the plugging ink on the surface 11 of the printed circuit board 10 in a line contact or surface contact manner.

Step S3: and cleaning the ink.

Referring to fig. 2, the carousel 20 is immersed in a solution 51, and the solution 51 is used to clean the ink adhered on the carousel 20. Further, the cleaning step further includes at least one scraper 53, the scraper 53 is used for scraping off the ink remaining on one side of the carousel 20, and the scraper 53 performs the action of scraping off the ink after the solution 51 cleans the ink on the carousel 20. In addition, the rotary belt 20 circularly performs the operations of adhering ink and cleaning ink along the loop path after performing the above-mentioned ink cleaning operation.

On the other hand, referring to fig. 2 again, the present invention is illustrated to provide a leveling device for the hole plugging ink on the printed circuit board, so that the leveling method for the hole plugging ink on the printed circuit board can be easily implemented. The leveling device for plugging ink on the printed circuit board comprises a rotary belt 20, a pasting area station 40 and a cleaning area station 50. Wherein:

the printed circuit board 10 is disposed between a plurality of transmission rollers 12 pivoted at intervals, and the transmission rollers 12 are guided and held on both sides of the printed circuit board 10, so that the printed circuit board 10 can be displaced in a vertical or horizontal direction, and further, the printed circuit board 10 is processed (for example, ink is applied).

The carousel 20 is looped between a plurality of rollers 30 to move in a circular path. Further, the rotating belt 20 can be made of a ring-shaped belt or a rubber film, and the rollers 30 move the rotating belt 20 by engaging or friction. In practical implementation, the surface 11 of the printed circuit board 10 and the rotating belt 20 are contacted with each other by static friction, that is, the moving speed of the rotating belt 20 and the printed circuit board 10 is the same, so that the relative speed between the two is zero, and thus the rotating belt 20 can be tightly contacted with the surface 11 of the printed circuit board 10, thereby improving the ink effect that the rotating belt 20 can be pressed and separated when contacting the printed circuit board 10.

The pasting area station 40 is located on the loop path, the rotating belt 20 contacts the surface 11 of the printed circuit board 10 in the pasting area station 40, and further pastes the hole plugging ink attached on the surface 11 of the printed circuit board 10, that is, the rotating belt 20 performs the step of pasting the ink in the pasting area station 40. Furthermore, the rollers 30 include a pressing wheel 31, the pressing wheel 31 is disposed beside the moving path of the pcb 10, and the rotating belt 20 is pressed against the surface 11 of the pcb 10 by the pressing wheel 31. More specifically, the pressing wheel 31 can press the revolving belt 20 by applying a force by a driving element such as a spring or a pneumatic cylinder.

The cleaning station 50 is located on the loop path, a solution tank 52 is disposed in the cleaning station 50, the solution 51 is filled in the solution tank 52, the carousel 20 circularly moves along the loop path and enters the solution tank 52 to contact the solution 51, that is, the carousel 20 performs the step of cleaning the ink at the cleaning station 50. Further, at least one roller 30a of the plurality of rollers 30 is adjacent to and above the solution tank 52, the carousel 20 is guided by the roller 30a to contact the solution 51 in the solution tank 52 along a loop path, and the roller 30a is implemented as a driving wheel for driving the carousel 20 to move along the loop path.

The doctor blade 53 is operatively disposed within the cleaning station 50 whereby the doctor blade 53 contacts and scrapes off ink remaining on the carousel 20. Further, the scraper 53 is fixed on a swing arm 54, and the swing arm 54 can drive the scraper 53 to swing, so that the scraper 53 contacts and separates from the revolving belt 20, and the scraper 53 contacts the revolving belt 20 to scrape off the ink remained on the revolving belt 20. In an implementation, the number of the scraper 53 may be two, and the two scrapers 53 are respectively disposed on opposite sides of the carousel 20, so that the two scrapers 53 scrape off the ink adhered on the carousel 20.

Referring again to fig. 2, the scraper 53 is disposed above the solution tank 52, so that the ink scraped off from the rotary belt 20 by the scraper 53 can be collected in the solution tank 52, which not only facilitates ink recovery, but also prevents the floor or other objects from being contaminated by the ink.

Referring to fig. 3, it is illustrated that the bottom of the scraper 53 may be further configured with an ink collecting tray 55, and the ink collecting tray 55 is used to collect the ink scraped off by the scraper 53 from the revolving belt 20, compared to the embodiment in which the scraper 53 needs to be configured above the solution tank 52, the scraper 53 in this embodiment has a larger configuration space.

Referring to fig. 2, the embodiment of the rotating tape 20 includes a first rotating tape 201 and a second rotating tape 202, wherein the first rotating tape 201 and the second rotating tape 202 are respectively disposed on two opposite surfaces 11 of the printed circuit substrate 10. Furthermore, the two opposite surfaces 11 of the printed circuit board 10 include a first surface 111 and a second surface 112, the first rotating belt 201 is used for contacting the first surface 111 of the printed circuit board 10, and the second rotating belt 202 is used for contacting the second surface 112 of the printed circuit board 10.

The above examples are only for the purpose of illustrating preferred embodiments of the present invention, and should not be construed as limiting the scope of the present invention.

Claims

1. A leveling method for hole plugging ink on a printed circuit substrate is characterized by comprising the following steps:

providing a rotating belt, circularly moving on a loop path, and sequentially and circularly moving the rotating belt on the loop path to perform a sticking step and a cleaning step; the cleaning step comprises cleaning the ink adhered on the rotary belt by a solution and at least one scraper, and the scraper scrapes the ink after the solution cleans the ink on the rotary belt.

2. The method of leveling via-hole ink on a printed circuit substrate of claim 1, wherein: the rotary belt is composed of a ring-shaped belt or a rubber film.

3. The method of leveling via-hole ink on a printed circuit substrate of claim 1, wherein: the printed circuit substrate includes two opposite surfaces with via-hole ink present, and the leveling method includes performing on the two opposite surfaces of the printed circuit substrate.

4. A method of levelling a plughole ink on a printed circuit substrate according to claim 1, 2 or 3, characterised in that: the rotary belt is pressed to be adhered to the surface of the printed circuit substrate by the pressure of the roller.

5. A method of levelling a plughole ink on a printed circuit substrate according to claim 1, 2 or 3, characterised in that: the carousel contains cleaning ink immersed in a solution.

6. A leveling device for plugging ink on a printed circuit substrate is characterized by comprising:

a revolving belt which is arranged on a revolving path to circularly move;

a sticking area station located on the loop path, the loop tape passing through the sticking area station in a press-contact manner with the static friction of the PCB at the same moving speed to stick the hole-plugging ink on one surface of the PCB; and

and the cleaning area station is positioned on the loop path and is mutually spaced from the adhering area station, a solution is stored in the cleaning area station, at least one scraper is arranged in the cleaning area station, and the ink adhered to the rotating belt is cleaned by sequentially contacting the solution and the scraper through the rotating belt of the adhering area station.

7. A leveling device for plugging ink on a printed circuit substrate as recited in claim 6, wherein: the rotary belt is composed of a ring-shaped belt or a rubber film.

8. A leveling device for plugging ink on a printed circuit substrate as recited in claim 6, wherein: the printed circuit board comprises two opposite surfaces with hole plugging ink, and the two leveling devices are respectively arranged at the sides of the two opposite surfaces of the printed circuit board.

9. A levelling device for the plugging ink on a printed circuit substrate according to claim 6, 7 or 8, characterized in that: the loop path has a plurality of rollers arranged at intervals, and the rotating belt frame is enclosed among the plurality of rollers.

10. A leveling device for plugging ink on a printed circuit substrate as recited in claim 9, wherein: the rollers include a pressing wheel, and the rotating belt is pressed to adhere to the surface of the printed circuit substrate by the pressing of the pressing wheel.

11. A leveling device for plugging ink on a printed circuit substrate as recited in claim 9, wherein: the clean area station includes a solution tank in which the solution is stored.

12. A leveling device for plugging ink on a printed circuit substrate as recited in claim 11, wherein: the rotary belt is guided by at least one of the rollers to contact the solution in the solution tank.

13. A leveling device for plugging ink on a printed circuit substrate as recited in claim 6, wherein: the scraper is arranged on a swing arm, and the swing arm can swing to drive the scraper to contact with and be away from the revolving belt.

14. A leveling device for plugging ink on a printed circuit substrate as recited in claim 11, wherein: the scraper is arranged above the solution tank.

15. A leveling device for plugging ink on a printed circuit substrate as recited in claim 9, wherein: the bottom of the scraper is also provided with an ink collecting disc for collecting the ink scraped by the scraper.

16. A leveling device for plugging ink on a printed circuit substrate as recited in claim 15, wherein: the scraper is arranged on a swing arm, and the swing arm can swing to drive the scraper to contact with and be away from the revolving belt.