TWM485589U - Leveling device for plugged ink of printed circuit board - Google Patents

Description

Leveling device for plugging ink on printed circuit board

The present invention relates to a leveling technique for ink on a surface of a printed circuit board, and more particularly to a leveling device for plugging ink on a printed circuit board.

The printed circuit board (PCB) is composed of a plurality of layers of conductive copper plates and insulating plates, wherein each layer of conductive copper plates are formed with conductive lines, which are separated by the insulating plates and penetrate through the surface of the printed circuit board. And the through hole, after the plurality of buried holes and the through holes are filled with the conductive material, the conductive lines of each layer can be electrically connected to form a functional circuit.

It is also known that in the manufacturing process of the above printed circuit board, after a plurality of buried vias and via holes are formed by drilling, insulation treatment must be performed first. The conventional insulation treatment method generally adopts screen printing, and the insulating ink is applied on the double-end surface of the circuit substrate, so that the ink can be stuffed into each of the through holes and the buried holes, and then the blade and the substrate surface are utilized. The relatively movable contact action between the two, so that the ink can not only be filled into the through hole and the buried hole, but also can scrape off the surface of the printed circuit board and the excess ink in the through hole and the buried hole, so as to continue the solder resist ink. Printing or spraying treatment.

However, the above-mentioned ink plug hole method often has the influence of the depth and the aperture of each through hole and the buried hole, the filling angle of the ink or the external environment, so that the ink is easily self-through hole in the process of scraping the ink. The bleed out of the buried hole causes ink overflow on the double-end surface of the printed circuit board, and even affects the yield of the ink plug hole operation.

In order to overcome the above problems, the Taiwan Patent Publication No. M324939 discloses a circuit board surface rolling leveling device which utilizes a roller roll Pressing the contact film and pressing the double-ended surface of the ink-coated printed circuit board by the film, so that the excess ink on the double-end surface of the printed circuit board and in the through-hole and the buried hole can be rolled And being adhered to the film and carried away from the double-end surface of the printed circuit board, thereby improving the yield of the ink plugging operation.

However, since the roller and the film in the above patent technology can only provide the limited contact area of the dot or the line and the double-end surface of the printed circuit board, the moment when the moving printed circuit board and the film are in contact with each other, The ink that can be pressed and removed is still very limited, which leads to the need to repeatedly carry out the process of sticking and leveling, resulting in poor leveling efficiency after ink plugging.

In view of the above, the object of the present invention is to improve the conventional problem that the roller-rolled film can provide insufficient contact with the double-end surface of the printed circuit board, and even the problem of poor leveling efficiency after the ink plug hole is affected. .

In order to achieve the above object and solve the problem, the present invention provides a leveling device for plugging ink on a printed circuit board, the technical means of which is broad to narrow, and may include: a printed circuit board having a plurality of through holes formed on one surface thereof a plurality of buried holes, wherein the plugs and the buried holes are filled with ink; and a flattening unit comprises at least two rollers, and a film is pressed between the two to form a sticky plane; wherein The surface of the printed circuit board contacts the bonding plane of the film, and the surface of the printed circuit board and the excess ink outside the through hole and the buried hole are removed and leveled through the bonding plane.

In a further implementation, the film is wound between a film supply wheel and a film take-up wheel that are spaced apart from each other. Wherein, the at least two roller systems are disposed between the film feeding wheel and the film collecting wheel to push the adhesive film to form the bonding plane.

In a further implementation, the screed unit further comprises a belt wound around the at least two rollers, and the at least two rollers push the adhesive film through the belt to form a viscous plane. Wherein, the leveling unit further comprises a force pushing wheel, wherein the tension pushing wheel is arranged between at least two rollers Push the belt.

In a further implementation, the surface of the printed circuit board is in parallel contact with the bonding plane of the film, and the surface of the printed circuit board and the bonding plane are in contact with each other by static friction.

In a further implementation, the surface comprises a first surface and a second surface of the double end of the printed circuit board, the leveling unit comprising a first leveling unit and a second leveling unit, the first surface contacting the first leveling unit Adhesive plane, the second surface contacts the tack plane of the second leveling unit. Wherein, the bonding planes of the first leveling unit and the second leveling unit are parallel to each other.

According to the above technical means, the present invention is to improve the contact area between the film and the surface of the printed circuit board by using the bonding plane formed by the pressing of the film through the two rollers to increase the contact between the film and the printed circuit board. The ink that can be pressed and removed, thereby improving the leveling efficiency of the flattening device on the printed circuit board.

In addition, the relevant technical details that can be implemented by the present invention will be explained in the following embodiments and drawings.

10‧‧‧Printed circuit board

11‧‧‧ surface

111‧‧‧ first surface

112‧‧‧ second surface

12‧‧‧Drive roller

20‧‧‧ leveling unit

201‧‧‧First leveling unit

202‧‧‧Second leveling unit

21‧‧‧Roller

22‧‧‧film

23‧‧‧Stained plane

24‧‧‧film supply wheel

25‧‧‧ Film take-up wheel

26‧‧‧Land

27‧‧‧ Tension push wheel

1 is a schematic view showing the configuration of a first embodiment of the present invention.

Figure 2 is a schematic view of the operation of Figure 1.

3 is a schematic view showing the configuration of a second embodiment of the present invention.

Figure 4 is a schematic view of the operation of Figure 3.

First, referring to FIG. 1 , a schematic diagram of a configuration of a first embodiment of the present invention is disclosed, illustrating a flattening device for a plugged ink on a printed circuit board provided by the present invention, including a printed circuit substrate 10 and a leveling unit 20, Wherein, the surface 11 of the printed circuit board 10 is formed with a plurality of through holes and a plurality of buried holes, and the insulating ink is applied to the surface 11 of the printed circuit board 10 by the roller so that the ink can be filled into the through holes and buried. Within the hole, borrowed The insulating process of the printed circuit board 10 is performed. Further, the printed circuit board 10 is placed between a plurality of spaced-apart drive rollers 12 that are supported on both sides of the printed circuit board 10 so that the printed circuit board 10 can be vertical or The horizontal direction is displaced, and the printed circuit board 10 is processed (for example, coated with ink).

The flattening unit 20 is a pressure film 22 that is spaced apart from each other by the two rollers 21, so that the adhesive film 22 forms a tack plane 23 between the two rollers 21, and the touch surface 23 is used to contact the printed circuit board 10. The surface 11, thereby removing and leveling the surface 11 of the printed circuit board 10 and excess ink outside the through holes and buried holes. Further, the film 22 is wound between a film supply wheel 24 and a film collecting wheel 25 which are spaced apart from each other. The film collecting wheel 25 is provided with power for rolling the film 22, such as a spring, a motor, etc. The film take-up wheel 25 can be rolled to receive the film 22 via a spring or a motor.

Furthermore, the two rollers 21 are disposed between the film supply wheel 24 and the take-up reel 25, and the adhesive film 22 is formed by pressing the adhesive film 22. Wherein, the two rollers 21 are synchronously arranged with a linear power (for example, a pneumatic cylinder) to push the adhesive film 22 to form a tension on the adhesive film 22 on the adhesive surface, or to arrange the linear power synchronously on the film supply wheel. 24 and the film collecting wheel 25, when the two rollers 21 are pressed against the sticking plane 23, the film 22 is supported by the movement of the film feeding wheel 24 and the film removing wheel 25 to form a tension, and the tension of the film 22 is The contact surface 23 can be brought into contact with the surface 11 of the printed circuit board 10 to enhance its effect of removing and leveling the excess ink. Further, the surface 11 of the printed circuit board 10 is a bonding plane 23 that is in parallel contact with the film 22, and the surface 11 of the printed circuit board 10 and the bonding plane 23 are in contact with each other by static friction, that is, a printed circuit board. 10 is the same as the moving speed of the film 22, so that the relative speed between the two is zero, whereby the sticking plane 23 formed by the film 22 can be in close contact with the surface 11 of the printed circuit board 10, thereby lifting the film 22 The ink effect that can be pressed and removed when in contact with the printed circuit board 10.

In addition, the leveling unit 20 can also include a belt 26, which The belt 26 is disposed between the at least two rollers 21, and the at least two rollers 21 mean that the number of the rollers 21 is at least two. Of course, the at least two rollers 21 also include three or more rollers. twenty one. The roller 21 presses the adhesive film 22 by surface contact by the belt 26 to form a sticking plane 23, and the belt 26 ensures the flatness of the sticking plane 23 and smoothes the sticking plane 23. And uniformly dispersing the stress to contact the surface 11 of the printed circuit board 10 to enhance its effect of removing and leveling the excess ink. Further, the leveling unit 20 further includes a tension pushing wheel 27 that is disposed between the at least two rollers 21 to push the belt 26 to increase the tension of the belt 26, thereby lifting the belt 26 The effect when the film 22 is pressed.

Referring to FIG. 2, the relative displacement of either the printed circuit board 10 or the leveling unit 20 can be performed in practice so that the surface 11 of the printed circuit board 10 can be in parallel contact with the bonding plane 23 of the film 22. The aforementioned relative displacement refers to the parallel movement between the printed circuit board 10 and the leveling unit 20, that is, the printed circuit board 10 or the leveling unit 20 can be moved in parallel to enable the surface 11 of the printed circuit board 10 to be The sticking planes 23 of the film 22 are in parallel contact. In the present embodiment, the printed circuit board 10 is displaced by the driving of the driving roller 12, and the bonding plane 23 is moved by the roller 21 to the moving path of the printed circuit board 10, and then the surface 11 of the printed circuit board 10 is The sticking planes 23 of the film 22 are in parallel contact to adhere and carry the ink from the surface 11 of the printed circuit board 10. It is to be particularly noted that the present invention is not limited to the surface 11 in which the bonding plane 23 is in parallel contact with the printed circuit board 10 in a vertical or horizontal manner.

Referring to FIG. 3 , a schematic diagram of a second embodiment of the present invention is disclosed. The screed unit 20 includes a first leveling unit 201 and a second leveling unit 202. The first leveling unit 201 and the The two leveling units 202 are disposed at both ends of the printed circuit board 10, respectively. Further, the two ends of the printed circuit board 10 are respectively formed with the first surface 111 and a second surface 112. The adhesion plane 23 of the first leveling unit 201 is used for contact printing. The first surface 111 of the circuit substrate 10 and the adhesion plane 23 of the second leveling unit 202 are for contacting the second surface 112 of the printed circuit substrate 10. Furthermore, the bonding planes 23 of the first leveling unit 201 and the second leveling unit 202 are parallel to each other to facilitate the adhesion of the plane 23 to the first surface 111 and the second surface of the printed circuit board 10. 112 can be in close contact.

Referring to FIG. 4, after the two ends of the printed circuit board 10, that is, the first surface 111 and the second surface 112 are coated with ink, by the first leveling unit 201 and the second leveling unit 202. In parallel contact, the ink on the first surface 111 and the second surface 112 of the printed circuit board 10 is adhered and removed, thereby completing the adhesion and leveling of the ink on the surface 11 of the printed circuit board 10.

The above embodiments are merely illustrative of the preferred embodiments of the present invention, but are not to be construed as limiting the scope of the present invention. Therefore, the present invention is subject to the content of the claims defined in the scope of the patent application.

10‧‧‧Printed circuit board

11‧‧‧ surface

12‧‧‧Drive roller

20‧‧‧ leveling unit

21‧‧‧Roller

22‧‧‧film

23‧‧‧Stained plane

24‧‧‧film supply wheel

25‧‧‧ Film take-up wheel

26‧‧‧Land

27‧‧‧ Tension push wheel

Claims (8)

A flattening device for plugging ink on a printed circuit board, comprising: a printed circuit board having a plurality of through holes and a plurality of buried holes formed on one surface thereof, wherein the through holes and the buried holes are filled with ink; The flat unit comprises at least two rollers, which are pressed apart from each other to push a film to form a bonding plane; wherein the surface of the printed circuit board contacts the bonding plane of the film, and is removed through the bonding plane And leveling the surface of the printed circuit board and excess ink outside the through hole and the buried hole. The flattening device for plugging ink on a printed circuit board according to claim 1, wherein the film is wound between a film supply wheel and a film collecting wheel which are spaced apart from each other. The flattening device for plugging ink on a printed circuit board according to claim 2, wherein the at least two roller systems are disposed between the film supply wheel and the film take-up wheel to press the adhesive film to form the sticking plane. The leveling device for plugging ink on a printed circuit board according to claim 3, wherein the leveling unit further comprises a belt wound around the at least two rollers, and the At least two rollers push the film through the belt to form a tack plane. The leveling device for plugging ink on a printed circuit board according to claim 4, wherein the leveling unit further comprises a force pushing wheel, wherein the tension pushing wheel is disposed between at least two rollers Belt. The flattening device for plugging ink on a printed circuit board according to claim 1, wherein the surface of the printed circuit board is in parallel contact with a bonding plane of the adhesive film, and the surface of the printed circuit board and the bonding plane are Contact each other with static friction. The flattening device for plugging ink on a printed circuit board according to any one of claims 1 to 6, wherein the surface comprises a printed circuit board a first surface and a second surface of the end, the leveling unit comprising a first leveling unit and a second leveling unit, the first surface contacting a tack plane of the first leveling unit, the second surface contacting the second Leveling the bonding plane of the unit. The flattening device for plugging ink on a printed circuit board according to claim 7, wherein the first flattening unit and the second flattening unit have mutually parallel planes.