CN107654864A - A kind of light source body with OFED structures and its application in illumination - Google Patents
A kind of light source body with OFED structures and its application in illumination Download PDFInfo
- Publication number
- CN107654864A CN107654864A CN201710718037.1A CN201710718037A CN107654864A CN 107654864 A CN107654864 A CN 107654864A CN 201710718037 A CN201710718037 A CN 201710718037A CN 107654864 A CN107654864 A CN 107654864A
- Authority
- CN
- China
- Prior art keywords
- light
- led
- organic
- light source
- source body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
- F21Y2115/15—Organic light-emitting diodes [OLED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
The present invention relates to a kind of light source body with OFED structures and its application in illumination.The invention provides a kind of light source body, it includes pcb board and the multiple LEDs being arranged on pcb board, each LED includes LED chip and the photoluminescent layers being disposed there above, wherein, the photoluminescent layers include at least one On Orgnic Luminous Materials, at least one On Orgnic Luminous Materials can launch the longer light of wavelength under the exciting of LED chip.The invention also discloses the lighting apparatus for including above-mentioned light source body.The illuminating product of the present invention improves the colour rendering index and excitation of spectrum on the one hand by the collocation of different On Orgnic Luminous Materials；On the other hand using the blue-light LED chip more than 460nm, harm of the blue light for human eye is reduced, realizes healthy light source truly.Technical scheme will be that major transformation is brought in the fields such as normal lighting, light light source and healthy eye protection lamp.
Description
Technical field
The present invention relates to lighting source technical field, more particularly to a kind of light source body with OFED structures and its illuminating
In application.
Background technology
Since incandescent lamp invention so far, the development of electric light source technology has had the history of more than 100 years.Wherein, light-emitting diodes
Pipe (Light emitting diode, LED) technology has low in energy consumption, long lifespan, reclaims the advantage such as easy, is acknowledged as future
Optimal light source, won market and the favor of consumer in lighting field.In the past few decades, with LED materials and encapsulation skill
The continuous progress of art, LED product brightness improve constantly, and application is more and more extensive.
Traditional white LED light source structure is roughly divided into following three kinds：
(1) blue-light LED chip excites yellow inorganic fluorescent powder structure；
(2) UV LED chip excites redgreenblue inorganic fluorescent powder structure simultaneously；
(3) redgreenblue LED integrated morphologies.
Though however, using the white LED light source of which kind of structure, all in the presence of it is following the defects of：First, have narrow spectrum,
The technical characterstic of high brightness, compared to the natural light of full spectrum, it appears not soft enough and too high brightness has larger to eyes
Excitant, easily cause people's eye injury；Second, narrow-spectrum light colour rendering is poor, it is impossible to reduces true colors, easily gives people to cause mistake
Feel；3rd, LED spectrum are discontinuous, and wavelength is single, and the spectral energy of short wavelength is very high, for a long time in a kind of the strong of wave band
Under light irradiation, the problems such as people will necessarily be allowed to reduce the resolution capability to other colors, and be possible to trigger anomalous trichromatism.
With the continuous improvement of quality of life, health turns into the topic of the more and more concerns of people.On this basis, for
The protective capability of eyes is then the major criterion from household light fixtures.Countries in the world all give enough weights to this problem
Depending on.Such as American Medical Association in this year has just passed through a official statement on LED street lamp, it is proposed that reduces a kind of new street lamp
Colour temperature and brightness, and suggest that the colour temperature of street lamp does not exceed 3000K, otherwise mean more shortwave blue lights, it is possible to right
Health damages.And China newest light fixture national standard GB700.1-2015 also clear stipulaties hazard rating of blue light.
At present, for technological layer, it is contemplated that the spectrum continuity of light source, colour temperature, stroboscopic, Luminance Distribution, blue light and
The various factors such as feux rouges component distribution, also without the eyeshield health light fixture of real meaning in existing market.On international market most
The LED chip of main flow is 440nm and 450nm chips, very strong with traditional inorganic fluorescent powder correspondence, the LED light encapsulated
Spectrum is fixed, containing a large amount of short wavelength's blue lights, human eyesight is damaged very big.
To sum up, it is contemplated that white light LEDs in terms of illumination exist the defects of, the improvement for multispectral LED technology
It will be the most important thing of following LED research fields.
The content of the invention
In view of the above problems, first purpose of the invention is to provide a kind of LED-based light source body.
The module is a kind of multispectral LED technology of novel fluorescent material, abbreviation organic fluorescence light emitting diode
Technology (Organic Light emitting diode, OLED).The technology is by traditional LED technology and On Orgnic Luminous Materials
Combine, excite a variety of On Orgnic Luminous Materials (including fluorescence radiation and phosphorescence light) by Conventional LED light sources, make light
The radiation spectrum in source obtains significantly broadening, makes soft healthy white-light illuminating spectrum.
Compared to traditional white light source, product one side taking by different On Orgnic Luminous Materials of the present invention
Match somebody with somebody, improve the colour rendering index and excitation of spectrum；On the other hand use>460nm blue-light LED chip, reduces blue light pair
In the harm of human eye, healthy light source truly is realized.OFED technologies will be normal lighting, light light source and health shield
Bring great innovation and change in the fields such as eye light fixture.
Second object of the present invention is to provide a kind of LED light source body for including application OFED technique constructions as described above
Lighting apparatus.The lighting apparatus considers spectrum continuity, colour temperature, stroboscopic, Luminance Distribution, blue light and the feux rouges component of light source
The various factors such as distribution, can reach real eyeshield effect in technological layer.
To solve above-mentioned first technical problem, present invention employs following technical scheme：
A kind of LED-based light source body, including pcb board and multiple LEDs for being arranged on pcb board,
Each described LED includes LED chip and the photoluminescent layers being disposed there above, wherein,
The photoluminescent layers include On Orgnic Luminous Materials, and the On Orgnic Luminous Materials can be in LED chip
Exciting under, launch the longer light of wavelength.
Preferably, lighting for the photoluminescent layers lights for fluorescence radiation and/or phosphorescence.
Preferably, the LED chip is blue-light LED chip.
Preferably, the launch wavelength of the blue-light LED chip is 460-470nm.
Preferably, the On Orgnic Luminous Materials are organic red light embedded photoluminescent material, organic green light luminescence generated by light material
One or more in material, organic gold-tinted embedded photoluminescent material, organic orange light embedded photoluminescent material.
It is further preferred that
The launch wavelength of the organic red light embedded photoluminescent material is 611-650nm；
The launch wavelength of the organic green light embedded photoluminescent material is 500-540nm；
The launch wavelength of organic gold-tinted embedded photoluminescent material is 545-595nm；
The launch wavelength of organic orange light embedded photoluminescent material is 597-610nm.
It is further preferred that
The absorption peak wavelength of the organic red light embedded photoluminescent material is 530-590nm；
The absorption peak wavelength of the organic green light embedded photoluminescent material is 450-470nm；
The absorption peak wavelength of organic gold-tinted embedded photoluminescent material is 450-470nm；
The absorption peak wavelength of organic orange light embedded photoluminescent material is 530-590nm.
Preferably, the photoluminescent layers also include inorganic fluorescent powder.
Preferably, the On Orgnic Luminous Materials are matched somebody with somebody selected from organic light emission small molecule, light emitting polymer and organic light emission
Compound, specific example is such as：
Organic green light embedded photoluminescent material can be (E) -4- ((cyano group benzylidene) amino) benzoic acid, (4- of 2,7- bis-
Pyridine radicals) -9-Fluorenone, 4,7- bis- (3,5- di-tert-butyl-phenyls) -2,1,3- diazosulfides, N, N'- dimethyl-quinacridones
And/or 2,3,6,7- tetrahydrochysene -1,1,7,7- tetramethyls -1H, 5H, 11H-10- (2-[4-morpholinodithio base)-quinolizino [9,9A, 1GH]
Cumarin etc.；
Organic red light embedded photoluminescent material can be rubrene, the 4- dicyanomethylene -2- tert-butyl groups -6- (1,1,7,7- tetra-
Methyl julolidine -4- vinyl) -4H- pyrans, (TXP-2 in formula, 5 be electroneutral part containing P to CuI (2-PBO) (TXP-2,5)
Three (2,5- xylyl) phosphines；2-PBO is electroneutral heterocyclic ligand 2- (2- benzoxazoles) pyridine), CuI (2-PBO)
(PPh2Cy) (PPh in formula2Cy is electroneutral ligand diphenylcyclo containing P base phosphine；2-PBO is electroneutral heterocyclic ligand 2- in formula
(2- benzoxazoles) pyridine), (CuIL)n(L is electroneutral heterocyclic ligand 4- (2- benzoxazoles) pyridine in formula) etc.；
Organic gold-tinted embedded photoluminescent material can be CuBr (TPP) (DAF) CH3(TPP and DAF is respectively electricity to Cl in formula
Neutral ligand triphenylphosphine containing P and heterocyclic ligand 4,5- diazas fluorenes), Zn (NO3)2(4-PBO)2(4-PBO is in electricity in formula
Property heterocyclic ligand 4- (2- benzoxazoles) pyridine), Cu (2-PBO) (TPP)2(PF6), (TPP is that well known electroneutral contains P in formula
Ligand triphenylphosphine, 2-PBO are electroneutral heterocyclic ligand 2- (2- benzoxazoles) pyridine) etc.；
Organic orange embedded photoluminescent material can be [Cu (2-QBO) (Xantphos)] PF6, (Xantphos is electricity in formula
Neutral biphosphine ligand 4, double (diphenylphosphine) -9,9- dimethyl xanthenes of 5-, 2-QBO are neutral heterocyclic ligand 2- (2- benzene and Evil
Azoles) quinoline), (TXP-2 in formula, 4 be electroneutral part containing P three (2,4- xylyl) phosphine to CuI (2-PBO) (TXP-2,4)；2-
PBO is electroneutral heterocyclic ligand 2- (2- benzoxazoles) pyridine), CuBr (2-PBO) (PPh3) (PPh in formula3Match somebody with somebody for electroneutral containing P
Body triphenylphosphine；2-PBO is electroneutral heterocyclic ligand 2- (2- benzoxazoles) pyridine in formula) etc..
Preferably, the inorganic fluorescent powder can be selected from silicate, fluosilicate, Chlorosilicate, aluminate, nitrogen oxidation
The series phosphor powders such as thing, nitride, tungstates, molybdate, oxysulfide, preferably silicate series fluorescent material etc., specifically
Fluorescent material is such as：Fluosilicate red Y3.5Eu0.83(SiO4)3F, fluosilicate red light fluorescent powder Y3.13Eu1.2(SiO4)3F, silicate
Red light fluorescent powder Li2Mg0.07Eu0.03SiO4, silicate red light fluorescent powder Li2Mg0.999Eu0.001SiO4, silicate red light fluorescent powder
Li2Mg0.99Eu0.01SiO4, silicate red light fluorescent powder Li2Mg0.995Eu0.005SiO4, silicate red light fluorescent powder Ba2Y2.5Eu0.5
[SiO4]3F, silicate red light fluorescent powder Li2Mg0.95Eu0.05SiO4, green emitting phosphor CeMgAl11O19：Mn2+。
Preferably, the photoluminescent layers are to be coated in the packing colloid above the LED chip, in the packing colloid
At least one On Orgnic Luminous Materials of Uniform Doped；It is further preferred that Uniform Doped is at least in the packing colloid
A kind of On Orgnic Luminous Materials and at least one inorganic fluorescent powder.
Preferably, the solid matter that the packing colloid is formed for the heat-curable glue of liquid by heating solidify afterwards, it is described
Heat-curable glue, epoxy resin, silica gel etc. can be selected from.
The preparation method of photoluminescent layers of the present invention can be by the heat-curable glue of liquid and organic electroluminescent light material
After material is uniformly mixed according to a ratio, it is heating and curing to obtain.
Wherein, the mass ratio of the packing colloid and On Orgnic Luminous Materials is preferably 1：(0.00001~0.002).
The preparation method of LED of the present invention is：By the heat-curable glue and On Orgnic Luminous Materials of liquid
After being uniformly mixed according to a ratio, with point gum machine dispensing to LED chip, that is, it is encapsulated in glow cup, is thermally cured glue and is heating and curing
Obtain.
The preparation method of photoluminescent layers of the present invention can also be by the heat-curable glue and organic electroluminescent light of liquid
After material, inorganic fluorescent powder are uniformly mixed according to a ratio, it is heating and curing to obtain.
Wherein, the packing colloid, On Orgnic Luminous Materials, the mass ratio of inorganic fluorescent powder are preferably 1：(0.00001
~0.002)：(0.15~0.4).
A kind of preferable composition of photoluminescent layers includes：Packing colloid, organic green light embedded photoluminescent material (E) -4-
((cyano group benzylidene) amino) benzoic acid, organic gold-tinted embedded photoluminescent material CuBr (TPP) (DAF) CH3Cl, organic orange light
Embedded photoluminescent material [Cu (2-QBO) (Xantphos)] PF6, organic red light embedded photoluminescent material CuI (2-PBO) (PPh2Cy)；Its
In, the packing colloid, organic green light embedded photoluminescent material, organic gold-tinted embedded photoluminescent material, organic orange light luminescence generated by light material
Material, the mass ratio of organic red light embedded photoluminescent material are 1：(0.0001~0.0005)：(0.0001~0.0005)：(0.0001
~0.0005)：(0.0001~0.0005).
The preparation method of LED of the present invention is：By the heat-curable glue of liquid and On Orgnic Luminous Materials,
After inorganic fluorescent powder is uniformly mixed according to a ratio, with point gum machine dispensing to LED chip, that is, it is encapsulated in glow cup, is thermally cured
Glue is heating and curing to obtain.
Preferably, the white-light spectrum that LED light source body of the invention is sent is close to natural light spectrum.
White LED light source technology most general at present excites yellow fluorescent powder for blue-light LED chip.Its principle of luminosity is：
The light that LED chip is launched is by the inorganic fluorescent powder multi-absorption of LED enclosed insides, and by multipath reflection, final transmitting to lamp
Tool is outside.But the spectrum that this kind of structure is launched is very dull, color rendition degree is poor.And the exciting light of inorganic fluorescent powder
Spectrum and emission spectrum displacement are big, and high efficiency of color conversion is low, causes its colour rendering index bad.
The LED light source body designed based on OFED technologies of the present invention, by introducing suitable organic electroluminescent light material
Material, solves above mentioned problem well.Its principle of luminosity is：Suitable On Orgnic Luminous Materials are selected, utilize organic light
The all or part of inorganic fluorescent powder that adulterates in substitution packing colloid of electroluminescent material, by blue-light LED chip light and have can
The light that inorganic fluorescent powder existing for energy is sent further excites On Orgnic Luminous Materials, makes it launch satisfactory organic
Fluorescence or phosphorescence.
Due to the diversity of On Orgnic Luminous Materials, having of being added in encapsulating structure can be arbitrarily adjusted as needed
Species, addition, proportioning and the combination of machine luminescent material, in addition as needed can any mixture different color organic photic hair
Luminescent material and inorganic fluorescent powder, and concentration and color are adjusted, to make final luminescent material composition absorption blue light as much as possible
The emission spectrum of LED chip, energy loss is reduced, and adjust the wave-length coverage of emission spectrum, make it as far as possible close to natural light
Spectrum, make the good white-light illuminating light source of reduction true colors, mildness.
On the other hand, the LED chip of most main flow is 440nm and 450nm chips on international market, because 450nm blue light cores
Piece excites the efficiency highest of yellow YAG phosphor.But the LED light spectrum that so assembled package comes out is fixed, containing a large amount of
Short wavelength's blue light, short wavelength's blue light can penetrate cornea and crystalline lens, and gone directly fundus flavimaculatus area, and unrepairable is caused to eyeball
Injury, human eyesight is damaged very big.In addition, used inorganic fluorescent powder typically using rare earth element as the centre of luminescence, mixes
It is about 30% with ratio, addition is big, and micron-sized fluorescent powder grain and packing colloid mixture effect are poor, cause the light of product
Performance heterogeneity is, it is necessary to increase sort process.These have all drawn high the production cost of whole device.
In view of the above-mentioned problems, the LED backlight module that the present invention is designed based on OFED technologies also can solve.It is logical
Introducing On Orgnic Luminous Materials are crossed, the special light emitting composition of the present invention not only has to general 440nm, 450nmxin chip
Good absorption, even more 460,470nm etc. >=460nm chip can be adapted to, and can be by adjusting luminescent material
Content, species and combination matching, realize the customization that reconciles to LED light spectrum.And 30% dosage is up to inorganic fluorescent powder
Compare, be doped with organic fluorescence materials, due to its efficient phototranstormation efficiency, its dosage can reduce by more than 1,000 times, and its
It can be dissolved each other with packing colloid, product homogeneity is good, eliminates sort process.As above beneficial effect causes LED finished product entirety valencys
Lattice decline more than 30%.
To solve above-mentioned Second Problem, the invention provides application of the LED-based light source body in illumination.
The present invention adopts the following technical scheme that：
A kind of lighting apparatus, including described LED-based light source body and driving IC.
In addition to light efficiency, the protective capability for eyes is to select the major criterion of lighting apparatus, especially household light fixtures.
It is as shown in table 1 below but currently used light fixture has many deficiencies in this respect：
The standard of 1 preferable eye-protecting lamp of table and the deficiency of current Ordinary Light Sources Have
Therefore, for technological layer, it is contemplated that the spectrum continuity of light source, colour temperature, stroboscopic, Luminance Distribution, blue light and
The various factors such as feux rouges component distribution, currently also without the eyeshield health light fixture of real meaning.
And the light emitting composition in the lighting apparatus designed by the present invention is to chips such as 440nm, 450nm, 460nm, 470nm
It can be adapted to, and by a variety of On Orgnic Luminous Materials or organic allotment combined with phosphor, realize
Spectrum continuity, low colour temperature, the requirement that blue color components are few, infrared component is few are realized in the customization that reconciles to LED light spectrum, perfection.
Simultaneously by the design to encapsulating structure, make the scattering of light source more uniform, so as to obtain preferable healthy light source, carried for eyes
For farthest protection.Sorted from the angle for meeting eye protection lamp requirement：OFED light sources ＞ candle ＞ incandescent lamps of the present invention
＞ yellow electricity-saving lamp ＞ white electricity-saving lamp ＞ yellow LED lamp ＞ white led lamps.
Therefore, lighting apparatus of the invention, all color characters are included in the spectrum sent, colour rendering index is high, can root
Ra can be adjusted according to needs to 100；Using >=460nm blue chips, blue light harm is greatly reduced, and is endangered without infrared light,
Softer light-emitting lamp can be obtained；Multispectral LED chip difficulty of processing is reduced, technique is prepared simply, and cost is controllable, and
And by circuit design, stroboscopic can be avoided to endanger.Extension application of the lighting apparatus of the present invention as OFED technologies, it can prepare true
Healthy light source in positive meaning, realizes the innovation and change of light source.
Beneficial effect of the present invention：
1st, the spectral diversity of On Orgnic Luminous Materials is strong.
The color and absorption spectrum of the photoluminescent layers material compositions of the present invention can be adjusted arbitrarily, and different color lights
Material can any mixture, and concentration and color are adjusted, so as to the LED light spectrum needed.
2nd, outstanding chip suitability.
The chip of main flow is 440nm and 450nm chips on international market, very strong with traditional inorganic fluorescent powder correspondence.
And the special light emitting composition of the present invention is to 440,450,460, the chip such as 470nm can be adapted to, and can pass through adjustment
Content and different process processing procedure in light emitting composition, realize the customization that reconciles to LED light spectrum.
3rd, healthy light source.
Compared to traditional white light LEDs, OFED improves excitation and spectral width, have higher colour rendering index and compared with
Low blue light contamination, really realize healthy light source.
4th, specular removal, low energy consumption.
Compared to traditional LED, OFED is because spectrum is wider, distribution is more balanced, therefore can obtained more under equal-wattage
High brightness, there is higher luminous efficiency.According to test, under the conditions of same brightness, the observable index tradition LED of OFED light sources
15%-50% can be saved.
5th, it is inexpensive.
Technical solution of the present invention can reduce by more than 1,000 times to the dosage of embedded photoluminescent material compared to conventional LED, the water
It is flat to belong to the first in the world.By the core technology, LED overall prices can be caused to decline more than 30%.OFED illuminations simultaneously are set
Standby preparation technology is fairly simple, and production cost is relatively controllable.
6th, performance is relatively stable
Used On Orgnic Luminous Materials are only involved in light activated fluorescence or phosphorescent radiation in OFED lighting apparatus, surely
It is qualitative that to compare OLED class products higher.
Brief description of the drawings
Fig. 1 shows the conventional package of white LED light source body in the prior art.Wherein, 1- glow cups, 2- packaging plastics
Body, 3- inorganic fluorescent powders, 4-PCB plates, 5-LED chips.
Fig. 2 shows the encapsulating structure of the white LED light source body in the present invention.Wherein, 1- glow cups, 2- packing colloids,
3- inorganic fluorescent powders, 4-PCB plates, 5-LED chips, 6- On Orgnic Luminous Materials.
Fig. 3 shows the including organic green light embedded photoluminescent material, having based on 470nm LED blue chips of embodiment 1
The LED light source body of machine gold-tinted embedded photoluminescent material, organic orange light embedded photoluminescent material and inorganic red light fluorescent powder composition
Eyeshield white light emission spectrogram.
Fig. 4 shows the including organic green light embedded photoluminescent material, having based on 470nm LED blue chips of embodiment 2
The LED light of machine gold-tinted embedded photoluminescent material, organic orange light embedded photoluminescent material and organic red light embedded photoluminescent material composition
The eyeshield white light emission spectrogram of source body.
Embodiment
To make those skilled in the art more fully understand technical scheme, below in conjunction with the accompanying drawings and specific embodiment party
Method for anti-counterfeit provided by the invention and system are described in detail formula.In the drawings, for structure identically or comparably
Into key element, identical label is marked.Below be only the present invention method for anti-counterfeit and system preferred forms, the present invention and not only
It is limited to the description below.
Embodiment 1
As shown in Fig. 2 a kind of LED-based light source body, including pcb board 4 and the LED light emitter that is arranged on pcb board 4
Part, the LED include blue-light LED chip 5 and the photoluminescent layers being disposed there above；
The photoluminescent layers are that packing colloid 2 is loaded into luminous coated in the packing colloid 2 above the LED chip
In cup 1, coating layer thickness 0.3mm, (organic green light is photic for Uniform Doped On Orgnic Luminous Materials 6 in the packing colloid 2
Luminescent material+organic gold-tinted embedded photoluminescent material+organic orange light embedded photoluminescent material) and a kind of inorganic red light fluorescent powder 3.
The launch wavelength of the blue-light LED chip is 470nm.
The organic green light embedded photoluminescent material is (E) -4- ((cyano group benzylidene) amino) benzoic acid (its preparation method
Referring to Chinese patent application 201610307169.0)；Its launch wavelength is 540nm.
Organic gold-tinted embedded photoluminescent material is CuBr (TPP) (DAF) CH3(TPP and DAF is respectively electricity to Cl in formula
Neutral ligand triphenylphosphine containing P and heterocyclic ligand 4,5- diazas fluorenes) (its preparation method is referring to Chinese patent application
201510393664.3)；Its launch wavelength is 568nm.
Organic orange light embedded photoluminescent material is [Cu (2-QBO) (Xantphos)] PF6, (Xantphos is electricity in formula
Neutral biphosphine ligand 4, double (diphenylphosphine) -9,9- dimethyl xanthenes of 5-, 2-QBO are neutral heterocyclic ligand 2- (2- benzene and Evil
Azoles) quinoline) (its preparation method is referring to Chinese patent application 201510353071.4)；Its launch wavelength is 607nm.
The inorganic red light fluorescent powder is silicate red light fluorescent powder Li2Mg0.07Eu0.03SiO4(its preparation method is in
State's patent application 201710291161.4)；Its launch wavelength is 613nm.
The preparation method of LED of the present invention is：By the KMT-1270 silica gel of liquid, the photic hair of organic green light
Luminescent material, organic gold-tinted embedded photoluminescent material, organic orange light embedded photoluminescent material, inorganic red light fluorescent powder in mass ratio 1：
0.0005：0.0005：0.0002：After 0.40 is well mixed, it is heating and curing to obtain, heating-up temperature is 90 DEG C, heat time 1h.
LED-based light source body described in embodiment 1 has the eyeshield white light emission spectrogram shown in Fig. 3, and it is used to shine
Bright, wavelength continuity is substantially improved compared to conventional white light LED, and colour temperature is reduced to 3000K, and eyeshield is better.
Embodiment 2
A kind of LED-based light source body, including pcb board and the LED that is arranged on pcb board, the LED light
Device includes blue-light LED chip and the photoluminescent layers being disposed there above；
The photoluminescent layers are to be loaded into glow cup coated in the packing colloid above the LED chip, packing colloid
In, coating layer thickness 0.3mm, Uniform Doped organic green light embedded photoluminescent material, organic gold-tinted are photic in the packing colloid
Luminescent material, organic orange light embedded photoluminescent material, organic red light embedded photoluminescent material.
The launch wavelength of the blue-light LED chip is 470nm.
The organic green light embedded photoluminescent material is (E) -4- ((cyano group benzylidene) amino) benzoic acid (its preparation method
Referring to Chinese patent application 201610307169.0)；Its launch wavelength is 540nm.
Organic gold-tinted embedded photoluminescent material is CuBr (TPP) (DAF) CH3(TPP and DAF is respectively electricity to Cl in formula
Neutral ligand triphenylphosphine containing P and heterocyclic ligand 4,5- diazas fluorenes) (its preparation method is referring to Chinese patent application
201510393664.3)；Its launch wavelength is 568nm.
Organic orange light embedded photoluminescent material is [Cu (2-QBO) (Xantphos)] PF6, (Xantphos is electricity in formula
Neutral biphosphine ligand 4, double (diphenylphosphine) -9,9- dimethyl xanthenes of 5-, 2-QBO are neutral heterocyclic ligand 2- (2- benzene and Evil
Azoles) quinoline) (its preparation method is referring to Chinese patent application 201510353071.4)；Its launch wavelength is 607nm.
The organic red light embedded photoluminescent material is CuI (2-PBO) (PPh2Cy) (PPh in formula2Cy is electroneutral part containing P
Diphenylcyclohexyl phosphine；2-PBO is electroneutral heterocyclic ligand 2- (2- benzoxazoles) pyridine in formula) (its preparation method is with reference in
State's patent application 201610307172.2)；Its launch wavelength is 640nm.
The preparation method of LED described in the present embodiment is：The KMT-1270 silica gel of liquid, organic green light is photic
Luminescent material, organic gold-tinted embedded photoluminescent material, organic orange light embedded photoluminescent material, organic red light embedded photoluminescent material press quality
Than 1：0.0005：0.0005：0.0002：After 0.0003 is well mixed, it is heating and curing to obtain, heating-up temperature is 90 DEG C, during heating
Between be 1h.
LED-based light source body described in embodiment 2 has the eyeshield white light emission spectrogram shown in Fig. 3, and it is used to shine
Bright, wavelength continuity is substantially improved compared to conventional white light LED, and colour temperature is reduced to 2700K, and eyeshield is better.
Embodiment 3
It is substantially the same manner as Example 1, differ only in：The preparation method of LED described in the present embodiment is：By liquid
KMT-1270 silica gel, organic green light embedded photoluminescent material, organic gold-tinted embedded photoluminescent material, the organic orange light luminescence generated by light material of state
Material, inorganic red light fluorescent powder in mass ratio 1：0.0005：0.0005：0.0005：After 0.15 is well mixed, it is heating and curing to obtain,
Heating-up temperature is 90 DEG C, heat time 1h.
LED-based light source body described in embodiment 3 has the eyeshield white light emission spectrogram shown in Fig. 3, and it is used to shine
Bright, wavelength continuity is substantially improved compared to conventional white light LED, and colour temperature is 2892K, and eyeshield effect is good.
Embodiment 4
A kind of lighting apparatus, including LED-based light source body and driving IC described in embodiment 1.
Embodiment 5
A kind of lighting apparatus, including LED-based light source body and driving IC described in embodiment 2.
Embodiment 6
A kind of lighting apparatus, including LED-based light source body and driving IC described in embodiment 3.
Comparative example
As shown in figure 1, a kind of LED-based light source body, including pcb board 4 and the LED light emitter that is arranged on pcb board 4
Part, the LED include blue-light LED chip 5 and the photoluminescent layers being disposed there above；
The photoluminescent layers are that packing colloid 2 is loaded into luminous coated in the packing colloid 2 above the LED chip
In cup 1, coating layer thickness 0.3mm, the Uniform Doped (inorganic green light fluorescent powder+nothing of inorganic fluorescent powder 3 in the packing colloid 2
Machine red light fluorescent powder+inorganic yellow fluorescent powder).
The launch wavelength of the blue-light LED chip is 460nm.
The organic red light embedded photoluminescent material is CuI (2-PBO) (PPh2Cy) (PPh in formula2Cy is electroneutral part containing P
Diphenylcyclohexyl phosphine；2-PBO is electroneutral heterocyclic ligand 2- (2- benzoxazoles) pyridine in formula) (its preparation method is with reference in
State's patent application 201610307172.2)；Its launch wavelength is 640nm.
The inorganic yellow fluorescent powder is La3.9Ca(SiO4)3O：0.1Ce3+(its preparation method is referring to Chinese patent application
201110060588.6)；Its launch wavelength is 560nm.
The inorganic green light fluorescent powder is Li2Ca1.995Si2O7:Eu0.005,@Ag0.00025(@represents cladding, its preparation method
Referring to Chinese patent application 201310090136.1)；Its launch wavelength is 540nm.
The preparation method of LED described in this comparative example is：By the KMT-1270 epoxy resin of liquid, inorganic green glow
Fluorescent material, inorganic red light fluorescent powder, inorganic yellow fluorescent powder material in mass ratio 1：0.1：0.1：After 0.1 is well mixed, heating
Solidification obtains, and heating-up temperature is 160 DEG C, heat time 1h.
LED-based light source body described in comparative example can be used for illuminating, and lighting apparatus be collectively constituted with driving IC, with reality
Apply a 1-2 to compare, its wavelength continuity is poor, and colour temperature is 3227K.
Principle that embodiment of above is intended to be merely illustrative of the present and the illustrative embodiments used, but this hair
It is bright to be not limited thereto.For those skilled in the art, the feelings of spirit and substance of the present invention are not being departed from
Under condition, various changes and modifications can be made therein.These variations and modifications are also considered as protection scope of the present invention.
Claims (12)
1. a kind of LED-based light source body, including pcb board and multiple LEDs for being arranged on pcb board, its feature exist
In：
Each described LED includes LED chip and the photoluminescent layers being disposed there above, wherein,
The photoluminescent layers include On Orgnic Luminous Materials, and the On Orgnic Luminous Materials being capable of swashing in LED chip
Give, launch the longer light of wavelength.
2. LED-based light source body according to claim 1, it is characterised in that：The LED chip is blue-light LED chip.
3. LED-based light source body according to claim 2, it is characterised in that：The launch wavelength of the blue-light LED chip
For 460-470nm.
4. LED-based light source body according to claim 1, it is characterised in that：The On Orgnic Luminous Materials are to have
Machine red photoluminescent material, organic green light embedded photoluminescent material, organic gold-tinted embedded photoluminescent material, organic orange light luminescence generated by light
One or more in material.
5. LED-based light source body according to claim 4, it is characterised in that：
The launch wavelength of the organic red light embedded photoluminescent material is 611-650nm；
The launch wavelength of the organic green light embedded photoluminescent material is 500-540nm；
The launch wavelength of organic gold-tinted embedded photoluminescent material is 545-595nm；
The launch wavelength of organic orange light embedded photoluminescent material is 597-610nm.
6. LED-based light source body according to claim 1, it is characterised in that：It is characterized in that：The photoluminescent layers
Principle of luminosity lighted for fluorescence radiation and/or phosphorescence.
7. LED-based light source body according to claim 1, it is characterised in that：The photoluminescent layers are also comprising inorganic
Fluorescent material.
8. according to any described LED-based light source body in claim 1-7, it is characterised in that：The organic electroluminescent light
Material is selected from organic light emission small molecule, light emitting polymer or organic light emission complex.
9. LED-based light source body according to claim 1, it is characterised in that：The photoluminescent layers are to be coated in institute
State the packing colloid above LED chip, the Uniform Doped On Orgnic Luminous Materials in the packing colloid.
10. LED-based light source body according to claim 9, it is characterised in that：Uniform Doped in the packing colloid
The On Orgnic Luminous Materials and at least one inorganic fluorescent powder.
11. LED-based light source body according to claim 1, it is characterised in that：The composition bag of the photoluminescent layers
Include：Packing colloid, organic green light embedded photoluminescent material (E) -4- ((cyano group benzylidene) amino) benzoic acid, organic gold-tinted are photic
Luminescent material CuBr (TPP) (DAF) CH3Cl, organic orange light embedded photoluminescent material [Cu (2-QBO) (Xantphos)] PF6, have
Machine red photoluminescent material C uI (2-PBO) (PPh2Cy)；Wherein, the packing colloid, organic green light embedded photoluminescent material,
Organic gold-tinted embedded photoluminescent material, organic orange light embedded photoluminescent material, the mass ratio of organic red light embedded photoluminescent material are 1：
(0.0001~0.0005)：(0.0001~0.0005)：(0.0001~0.0005)：(0.0001~0.0005).
12. a kind of lighting apparatus, including LED-based light source body and driving IC any one of claim 1-11.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610700381 | 2016-08-22 | ||
| CN2016107003813 | 2016-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107654864A true CN107654864A (en) | 2018-02-02 |
Family
ID=61127818
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710719690.XA Pending CN107680959A (en) | 2016-08-22 | 2017-08-21 | Contain the light source body of organic green light and gold-tinted embedded photoluminescent material with the OFED structures of inorganic red light fluorescent powder composition and application |
| CN201710718037.1A Pending CN107654864A (en) | 2016-08-22 | 2017-08-21 | A kind of light source body with OFED structures and its application in illumination |
| CN201710719440.6A Pending CN107833962A (en) | 2016-08-22 | 2017-08-21 | Light source body with OFED structures and its application containing organic green light, gold-tinted and red photoluminescent material compositions |
| CN201710718607.7A Pending CN107883199A (en) | 2016-08-22 | 2017-08-21 | The light source body of OFED structures containing organic green light embedded photoluminescent material and inorganic feux rouges and yellow fluorescent powder composition and application |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710719690.XA Pending CN107680959A (en) | 2016-08-22 | 2017-08-21 | Contain the light source body of organic green light and gold-tinted embedded photoluminescent material with the OFED structures of inorganic red light fluorescent powder composition and application |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710719440.6A Pending CN107833962A (en) | 2016-08-22 | 2017-08-21 | Light source body with OFED structures and its application containing organic green light, gold-tinted and red photoluminescent material compositions |
| CN201710718607.7A Pending CN107883199A (en) | 2016-08-22 | 2017-08-21 | The light source body of OFED structures containing organic green light embedded photoluminescent material and inorganic feux rouges and yellow fluorescent powder composition and application |
Country Status (1)
| Country | Link |
|---|---|
| CN (4) | CN107680959A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220398987A1 (en) * | 2019-04-11 | 2022-12-15 | PixelDisplay, Inc. | Method and apparatus of multi-modal illumination and display for improved color rendering, power efficiency, health and eye-safety |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110970541B (en) * | 2018-09-29 | 2023-04-21 | 有研稀土新材料股份有限公司 | Semiconductor light source and optical device prepared by same |
| CN110094641B (en) * | 2019-04-29 | 2020-07-21 | 佛山市国星光电股份有限公司 | White light L ED lamp pearl and lamp strip and lamps and lanterns |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1941431A (en) * | 2005-09-29 | 2007-04-04 | 上海乐金广电电子有限公司 | White-light luminescent component and its production |
| CN101120204A (en) * | 2005-02-14 | 2008-02-06 | 三菱化学株式会社 | Light source, solid-state light-emitting element module, phosphor module, light distribution element module, illumination device and image display device, and light control method for the light source |
| CN101307865A (en) * | 2008-05-06 | 2008-11-19 | 孙润光 | Light source device |
| CN101866992A (en) * | 2009-04-15 | 2010-10-20 | 苏忠杰 | White light light-emitting diode |
| CN102130279A (en) * | 2010-12-30 | 2011-07-20 | 陕西科技大学 | LED device with improved LED color rendering index (CRI) and manufacturing method thereof |
| CN102544322A (en) * | 2012-01-13 | 2012-07-04 | 深圳市兆驰节能照明有限公司 | White light LED (light emitting diode) and packaging process thereof |
| CN102918668A (en) * | 2011-06-02 | 2013-02-06 | 三菱化学株式会社 | Semiconductor light-emitting device, semiconductor light-emitting system, and illumination apparatus |
| CN103459550A (en) * | 2011-02-09 | 2013-12-18 | 皇家飞利浦电子股份有限公司 | Polymeric matrix with organic phosphor and manufactory thereof |
| CN104583363A (en) * | 2012-08-23 | 2015-04-29 | 皇家飞利浦有限公司 | Stabilized wavelength converting element |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4114331B2 (en) * | 2001-06-15 | 2008-07-09 | 豊田合成株式会社 | Light emitting device |
| JP2006278980A (en) * | 2005-03-30 | 2006-10-12 | Sanyo Electric Co Ltd | Semiconductor light-emitting device |
| JP2007250629A (en) * | 2006-03-14 | 2007-09-27 | Toshiba Corp | Light emitting apparatus and manufacturing method thereof, and fluorescent pattern formation |
| JP4724818B2 (en) * | 2006-10-26 | 2011-07-13 | 国立大学法人三重大学 | Luminescent body, white luminous body, capsule endoscope, and manufacturing method of luminous body |
| CN101855081A (en) * | 2007-11-08 | 2010-10-06 | 帝人杜邦薄膜日本有限公司 | Multilayer film |
| US20090162956A1 (en) * | 2007-12-20 | 2009-06-25 | Ult Technology Co., Ltd. | Led fabrication method employing a water washing process |
| CN102032469A (en) * | 2009-09-30 | 2011-04-27 | 孙润文 | LED (light emitting diode) light source device and fabrication method thereof |
| US9117979B2 (en) * | 2010-12-13 | 2015-08-25 | Toray Industries, Inc. | Phosphor sheet, LED and light emitting device using the same and method for manufacturing LED |
| US20140021857A1 (en) * | 2011-04-12 | 2014-01-23 | Koninklijke Philips N.V. | luminescent converter for a phosphor enhanced light source |
-
2017
- 2017-08-21 CN CN201710719690.XA patent/CN107680959A/en active Pending
- 2017-08-21 CN CN201710718037.1A patent/CN107654864A/en active Pending
- 2017-08-21 CN CN201710719440.6A patent/CN107833962A/en active Pending
- 2017-08-21 CN CN201710718607.7A patent/CN107883199A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101120204A (en) * | 2005-02-14 | 2008-02-06 | 三菱化学株式会社 | Light source, solid-state light-emitting element module, phosphor module, light distribution element module, illumination device and image display device, and light control method for the light source |
| CN1941431A (en) * | 2005-09-29 | 2007-04-04 | 上海乐金广电电子有限公司 | White-light luminescent component and its production |
| CN101307865A (en) * | 2008-05-06 | 2008-11-19 | 孙润光 | Light source device |
| CN101866992A (en) * | 2009-04-15 | 2010-10-20 | 苏忠杰 | White light light-emitting diode |
| CN102130279A (en) * | 2010-12-30 | 2011-07-20 | 陕西科技大学 | LED device with improved LED color rendering index (CRI) and manufacturing method thereof |
| CN103459550A (en) * | 2011-02-09 | 2013-12-18 | 皇家飞利浦电子股份有限公司 | Polymeric matrix with organic phosphor and manufactory thereof |
| CN102918668A (en) * | 2011-06-02 | 2013-02-06 | 三菱化学株式会社 | Semiconductor light-emitting device, semiconductor light-emitting system, and illumination apparatus |
| CN102544322A (en) * | 2012-01-13 | 2012-07-04 | 深圳市兆驰节能照明有限公司 | White light LED (light emitting diode) and packaging process thereof |
| CN104583363A (en) * | 2012-08-23 | 2015-04-29 | 皇家飞利浦有限公司 | Stabilized wavelength converting element |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220398987A1 (en) * | 2019-04-11 | 2022-12-15 | PixelDisplay, Inc. | Method and apparatus of multi-modal illumination and display for improved color rendering, power efficiency, health and eye-safety |
| US11842699B2 (en) * | 2019-04-11 | 2023-12-12 | PixelDisplay, Inc. | Method and apparatus of multi-modal illumination and display for improved color rendering, power efficiency, health and eye-safety |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107680959A (en) | 2018-02-09 |
| CN107883199A (en) | 2018-04-06 |
| CN107833962A (en) | 2018-03-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107565006B (en) | LED light source with sunlight visible light part spectrum structure and lamp | |
| CN104011457B (en) | White light source and include the white light source system of described white light source | |
| CN102792473B (en) | White light illumination device | |
| CN107678207A (en) | A kind of backlight with OFED structures and its application in full-color display | |
| CN102244185B (en) | White light LED (light emitting diode) with high color rendering index, high light efficiency and low color temperature and preparation method thereof | |
| CN109545941A (en) | Phosphor mixture and light-emitting device thereof | |
| CN101346452A (en) | Yellow light-emitting phosphor and white light-emitting device using same | |
| WO2015166782A1 (en) | Light emitting device | |
| CN101872825B (en) | Novel method for preparing high-power white LED with low color temperature and high color rendering property | |
| CN107369742B (en) | A kind of high S/P value white light LEDs of high color rendering index (CRI) and its preparation method and application | |
| CN108630794A (en) | White light emitting device | |
| CN109301058A (en) | Phosphor mixture and light-emitting device thereof | |
| CN107654864A (en) | A kind of light source body with OFED structures and its application in illumination | |
| CN103329289B (en) | Ac led white light emitting device | |
| CN104241494A (en) | Novel adjustable low-color-temperature high-color-rendering high-power white light LED method | |
| CN207146291U (en) | A kind of light source module group and the lighting device including the light source module group | |
| CN112608750A (en) | Full-spectrum LED fluorescent powder composition and full-spectrum white LED device | |
| CN109370593A (en) | Phosphor mixture and light-emitting device thereof | |
| CN110676363B (en) | Optical device | |
| US10301538B2 (en) | Phosphor composition and light emitting device using the same | |
| WO2011117791A1 (en) | Led-based lighting device comprising a plurality of luminescent materials | |
| CN102005531A (en) | Packaging structure and packaging method of inverted LED (light emitting diode) chip | |
| AU2015284080B2 (en) | Oxyfluoride phosphor compositions and lighting apparatus thereof | |
| CN105226171A (en) | A kind of light-emitting diode (LED) module | |
| CN205141020U (en) | Light emitting diode module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180202 |