CN107643778A - Terminal end surface temprature control method, device and terminal - Google Patents
Terminal end surface temprature control method, device and terminal Download PDFInfo
- Publication number
- CN107643778A CN107643778A CN201610584705.1A CN201610584705A CN107643778A CN 107643778 A CN107643778 A CN 107643778A CN 201610584705 A CN201610584705 A CN 201610584705A CN 107643778 A CN107643778 A CN 107643778A
- Authority
- CN
- China
- Prior art keywords
- temperature
- heat transfer
- terminal
- matrix
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Toys (AREA)
- Control Of Temperature (AREA)
Abstract
The present invention provides a kind of terminal end surface temprature control method, device and terminal.Methods described includes：The temperature of all devices in acquisition terminal；Acquisition device thermal resistance matrix；According to the temperature of all devices in the terminal gathered and the power consumption of all devices of device thermal resistance matrix computations；Obtain surface resistance of heat transfer matrix；According to the power consumption calculation surface temperature of the surface resistance of heat transfer matrix and all devices；According to the surface temperature and predetermined temperature control device power consumption.The present invention is capable of the surface temperature of intelligent control terminal.
Description
Technical field
The present invention relates to technical field of temperature control, more particularly to a kind of terminal end surface temprature control method, device and end
End.
Background technology
With the development of science and technology the operation processing speed of the terminal such as mobile phone is more and more faster at present, the thickness of terminal in itself in addition
Degree more and more thinner, volume are less and less, and therefore, the poor user experience and various safety problems that terminal self-heating is brought are more
Substantially.As terminal uses increasingly extensive, terminal is also applied to different scenes, such as mobile phone at present, and someone is used for dialing
Phone, someone are for playing game, someone is used for playing video etc..As terminal realizes the variation of function, by terminal heating pair
The influence that terminal is brought is also increasingly severeer.Current terminal temperature control strategy is all based on die temperature sensors or onboard temperature
Sensor is spent to realize temperature control.
During the present invention is realized, inventor has found following technical problem in the prior art at least be present：It is existing
Terminal temperature control technology correspond to surface temperature have larger error and hysteresis quality, can not intelligent control terminal surface temperature.
The content of the invention
Terminal end surface temprature control method, device and terminal provided by the invention, it is capable of the surface temperature of intelligent control terminal
Degree.
In a first aspect, the present invention provides a kind of terminal end surface temprature control method, methods described includes：
The temperature of all devices in acquisition terminal；
Acquisition device thermal resistance matrix；
According to the temperature of all devices in the terminal gathered and the power consumption of all devices of device thermal resistance matrix computations；
Obtain surface resistance of heat transfer matrix；
According to the power consumption calculation surface temperature of the surface resistance of heat transfer matrix and all devices；
According to the surface temperature and predetermined temperature control device power consumption.
Alternatively, the acquisition device thermal resistance matrix includes：
The temperature rise of itself relative ambient temperature and other device versus environmentals caused by detecting under each device unit work consumptiom
The temperature rise of temperature；
The temperature rise of itself relative ambient temperature and other device versus environmental temperature caused by under the device unit work consumptiom
The temperature rise of degree forms the device thermal resistance matrix.
Alternatively, the acquisition surface resistance of heat transfer matrix includes：
The surface temperature peak under unit work consumptiom when each device works independently is detected, by the surface temperature peak
Form focus；
Detect the temperature rise of caused all focuses under each device unit work consumptiom；
Surface resistance of heat transfer matrix is formed by the temperature rise of caused all focuses under all device unit work consumptioms.
Alternatively, the acquisition surface resistance of heat transfer matrix includes：Before acquisition surface resistance of heat transfer matrix and obtain after surface resistance of heat transfer square
Battle array.
Alternatively, the power consumption calculation surface temperature according to the surface resistance of heat transfer matrix and all devices includes：
Surface temperature before being calculated according to preceding surface resistance of heat transfer matrix and all device power consumptions；According to rear surface resistance of heat transfer matrix and the institute
Have device power consumption calculating after surface temperature.
Alternatively, it is described to be included according to the surface temperature and predetermined temperature control device power consumption：When the surface temperature
During more than the predetermined temperature, regulate and control the power consumption of device in terminal.
Second aspect, the present invention provide a kind of terminal end surface temperature control equipment, and described device includes：
Collecting unit, the temperature for all devices in acquisition terminal；
First acquisition unit, for acquisition device thermal resistance matrix；
First computing unit, according to the terminal gathered based on the temperature of all devices and the device thermal resistance matrix
Calculate the power consumption of all devices；
Second acquisition unit, for obtaining surface resistance of heat transfer matrix；
Second computing unit, for the power consumption calculation surface temperature according to the surface resistance of heat transfer matrix and all devices
Degree；
Control unit, for according to the surface temperature and predetermined temperature control device power consumption.
Alternatively, the first acquisition unit includes the first detection unit and thermal resistance matrix determining unit；Wherein,
First detection unit is used to detect the temperature of itself caused relative ambient temperature under each device unit work consumptiom
The temperature rise of liter and other device relative ambient temperatures；
The device thermal resistance matrix determining unit is used for itself versus environmental according to caused by under the device unit work consumptiom
The temperature rise of temperature and the temperature rise of other device relative ambient temperatures form the device thermal resistance matrix.
Alternatively, the second acquisition unit includes the second detection unit and surface resistance of heat transfer matrix determining unit；Wherein,
Second detection unit is used to detect surface temperature peak when each device works independently under unit work consumptiom,
Focus is formed by the surface temperature peak；And detect the temperature of caused all focuses under each device unit work consumptiom
Rise；
The surface resistance of heat transfer matrix determining unit is used for the temperature according to caused all focuses under all device unit work consumptioms
Rise composition surface resistance of heat transfer matrix.
Alternatively, the second acquisition unit, for surface resistance of heat transfer matrix after surface resistance of heat transfer matrix before obtaining and acquisition.
Alternatively, second computing unit, for being calculated according to preceding surface resistance of heat transfer matrix and all device power consumptions
Preceding surface temperature；Surface temperature after being calculated according to rear surface resistance of heat transfer matrix and all device power consumptions.
Alternatively, described control unit, for when the surface temperature exceedes the predetermined temperature, regulating and controlling device in terminal
The power consumption of part.
The third aspect, the present invention provide a kind of terminal, and the terminal includes terminal end surface temperature control described above and filled
Put.
Terminal end surface temprature control method, device and terminal provided in an embodiment of the present invention, by some thermal resistance matrixes come
Virtual surface temperature, and then regulate and control surface temperature by regulating and controlling terminal inner device power consumption.It is limited interior relative to being currently based on
Portion's sensor carries out the temperature control strategy of indirect surface temperature control, and surface temperature can be allowed to obtain more accurately virtualizing directly
Control, it is capable of the surface temperature of intelligent control terminal.
Brief description of the drawings
Fig. 1 is the flow chart of one embodiment of the invention terminal end surface temprature control method；
Fig. 2 is the detail flowchart of one embodiment of the invention terminal end surface temprature control method；
Fig. 3 is the structural representation of terminal inner device of the embodiment of the present invention；
Fig. 4 is the structural representation of one embodiment of the invention terminal part thermal resistance matrix；
Fig. 5 is the structural representation on the preceding surface of one embodiment of the invention terminal；
Fig. 6 is the structural representation on surface after one embodiment of the invention terminal；
Fig. 7 is surface resistance of heat transfer matrix before one embodiment of the invention terminal；
Fig. 8 is surface resistance of heat transfer matrix after one embodiment of the invention terminal；
Fig. 9 is the structural representation of one embodiment of the invention terminal end surface temperature control equipment.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only
Only it is part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
The present invention provides a kind of terminal end surface temprature control method, as shown in figure 1, methods described includes：
The temperature of all devices in S11, acquisition terminal；
S12, acquisition device thermal resistance matrix；
S13, according to the temperature of all devices in the terminal gathered and all devices of device thermal resistance matrix computations
Power consumption；
S14, obtain surface resistance of heat transfer matrix；
S15, the power consumption calculation surface temperature according to the surface resistance of heat transfer matrix and all devices；
S16, according to the surface temperature and predetermined temperature control device power consumption.
Terminal end surface temprature control method provided in an embodiment of the present invention, by some thermal resistance matrixes come virtual surface temperature
Degree, and then regulate and control surface temperature by regulating and controlling terminal inner device power consumption.It is next relative to limited inner sensor is currently based on
The temperature control strategy of indirect surface temperature control is carried out, surface temperature can be allowed to obtain more accurately virtualizing direct control, can
The surface temperature of intelligent control terminal.
Alternatively, the acquisition device thermal resistance matrix includes：
The temperature rise of itself relative ambient temperature and other device versus environmentals caused by detecting under each device unit work consumptiom
The temperature rise of temperature；
The temperature rise of itself relative ambient temperature and other device versus environmental temperature caused by under the device unit work consumptiom
The temperature rise of degree forms the device thermal resistance matrix.
Alternatively, the acquisition surface resistance of heat transfer matrix includes：
The surface temperature peak under unit work consumptiom when each device works independently is detected, by the surface temperature peak
Form focus；
Detect the temperature rise of caused all focuses under each device unit work consumptiom；
Surface resistance of heat transfer matrix is formed by the temperature rise of caused all focuses under all device unit work consumptioms.
Alternatively, the acquisition surface resistance of heat transfer matrix includes：Before acquisition surface resistance of heat transfer matrix and obtain after surface resistance of heat transfer square
Battle array.
Alternatively, the power consumption calculation surface temperature according to the surface resistance of heat transfer matrix and all devices includes：
Surface temperature before being calculated according to preceding surface resistance of heat transfer matrix and all device power consumptions；According to rear surface resistance of heat transfer matrix and the institute
Have device power consumption calculating after surface temperature.
Alternatively, it is described to be included according to the surface temperature and predetermined temperature control device power consumption：When the surface temperature
During more than the predetermined temperature, regulate and control the power consumption of device in terminal.
The detailed process of terminal end surface temprature control method provided in an embodiment of the present invention as shown in Fig. 2 it is main include with
Lower step：
Step S21：The temperature of all devices in acquisition terminal.As shown in figure 3, some TEMPs are set in terminal inner
Device, chip internal is specifically located at, to the temperature Tj of detection terminal internal components.It is additionally provided with simultaneously away from heat source region
One independent sensor, to monitors environment temperature Ta.
Step S22：Acquisition device thermal resistance matrix.Thermal resistance matrix refers to when having multiple heater members and depositing, each device
There is a temperature field when part works independently, the power consumption of the difference divided by device work of every bit and environment temperature in temperature field
The thermal resistance of as one point, if dry units constitute several thermal resistance matrixes with the point in corresponding some temperature fields.For device
Part thermal resistance matrix, thermal resistance refer to the resistance that heat runs on heat flow path, the heat-transfer capability reflected between medium or medium it is big
It is small, indicate the temperature rise size caused by 1W heats, unit for DEG C/W or K/W.Specific to the chip on chip for cell phone, being exactly 1W
Itself temperature rise of chip caused by power consumption (relative to environment temperature), and the temperature rise of other chips around (relative to environment temperature).
Some chips each set 1W heating powers, caused by some chips temperature rise composition math matrix, form device thermal resistance square
Battle array.Such as have 5 chips ABCDE as described in Figure 3, in terminal, A setting 1W are given, A temperature rises are R11, and B temperature rise is R13, C temperature
R13 is upgraded to, D temperature rise is R14, and E temperature rise is R15, then the first behavior [R11 R12 R13 R14 of device thermal resistance matrix
R15].Corresponding individually applies 1W heat power consumptions to BCDE successively, obtains [R21 R22 R23 R24 R25], [R31 R32
R33 R34 R35]、[R41 R42 R43 R44 R45]、[R51 R52 R53 R54 R55].So as to obtain the heat shown in Fig. 4
Hinder matrix A.The numerical value of specific thermal resistance matrix is by hot simulation software, and for example the software such as Flotherm, Icepak has been established
Whole device structure physical property model, 1W is each separately provided to ABCDE devices respectively according to above method, then passes through emulation
Calculate, obtain ABCDE temperature rise data, thermal resistance matrix is obtained after arrangement.
Step S23：Calculate the power consumption of all devices.Because thermal resistance is that the difference of every bit and environment temperature is removed in temperature field
Power consumption with device work is the thermal resistance of a point, it is assumed that device ABCDE device temperature be distributed as Tj1, Tj2, Tj3,
Tj4, Tj5, device ABCDE power consumption is p1, p2, p2, p2, p5, then can obtain below equation：
Tj1=R11*p1+R21*p2+R31*p3+R41*p4+R51*p5+Ta
Tj2=R12*p1+R22*p2+R32*p3+R42*p4+R52*p5+Ta
Tj3=R13*p1+R23*p2+R33*p3+R43*p4+R53*p5+Ta
Tj4=R14*p1+R24*p2+R34*p3+R44*p4+R54*p5+Ta
Tj5=R15*p1+R25*p2+R35*p3+R45*p4+R55*p5+Ta
Solve the power consumption number that the equation can obtain each device.
Step S24：Surface resistance of heat transfer matrix before acquisition.
Step S25：Surface resistance of heat transfer matrix after acquisition.Detect the surface temperature under unit work consumptiom when each device works independently
The rear surface of terminal shown in peak, the surface temperature peak composition focus, the preceding surface of terminal as shown in Figure 5 and Fig. 6,
For example A devices set 1W heat power consumptions, and Temperature Distribution can be formed on mobile phone surface, corresponding to have a maximum temperature point, there is one
Temperature rise numerical value.Same BCDE each sets 1W heat power consumptions, and corresponding four maximum temperature points can be formed on mobile phone surface, i.e., hot
Point.So surface A 1, B1 before five devices correspondences of ABCDE, C1, D1, five focuses of E1, rear surface A 2, B2, C2, D2, E2 five
Focus.The temperature rise of caused all focuses under each device unit work consumptiom is detected, by drawing under all device unit work consumptioms
The temperature rise composition surface resistance of heat transfer matrix of all focuses risen.Preceding surface resistance of heat transfer matrix B can obtain according to this method, as shown in fig. 7,
And rear surface resistance of heat transfer Matrix C, as shown in Figure 8.
Step S26：Calculate preceding surface hot(test)-spot temperature；
Step S27：Surface hot(test)-spot temperature after calculating.Assuming that the preceding surface hot(test)-spot temperature of terminal is Tfs, according to preceding surface resistance of heat transfer
Matrix B and device power consumption can calculate the temperature for obtaining preceding five focuses in surface of terminal, and calculation formula is as follows：
Tfs1=Rfs11*p1+Rfs21*p2+Rfs31*p3+Rfs41*p4+Rfs51*p5+Ta
Tfs2=Rfs12*p1+Rfs22*p2+Rfs32*p3+Rfs42*p4+Rfs52*p5+Ta
Tfs3=Rfs13*p1+Rfs23*p2+Rfs33*p3+Rfs43*p4+Rfs53*p5+Ta
Tfs4=Rfs14*p1+Rfs24*p2+Rfs34*p3+Rfs44*p4+Rfs54*p5+Ta
Tfs5=Rfs15*p1+Rfs25*p2+Rfs35*p3+Rfs45*p4+Rfs55*p5+Ta
Corresponding, it is assumed that the temperature of surface focus is Tbs after terminal, according to rear surface resistance of heat transfer Matrix C and device power consumption
The temperature for obtaining five focuses in surface after terminal can be calculated, calculation formula is as follows：
Tbs1=Rbs11*p1+Rbs21*p2+Rbs31*p3+Rbs41*p4+Rbs51*p5+Ta
Tbs2=Rbs12*p1+Rbs22*p2+Rbs32*p3+Rbs42*p4+Rbs52*p5+Ta
Tbs3=Rbs13*p1+Rbs23*p2+Rbs33*p3+Rbs43*p4+Rbs53*p5+Ta
Tbs4=Rbs14*p1+Rbs24*p2+Rbs34*p3+Rbs44*p4+Rbs54*p5+Ta
Tbs5=Rbs15*p1+Rbs25*p2+Rbs35*p3+Rbs45*p4+Rbs55*p5+Ta
Step S28：According to device power consumption in hot(test)-spot temperature and predetermined temperature control terminal.If there is certain of terminal end surface
Individual hot(test)-spot temperature exceedes predetermined temperature, regulates and controls the power consumption of device in terminal.It is alternatively possible to influence is found out most by thermal resistance matrix
Big device carries out power consumption regulation and control.
Step S29：Jump to step S21 after delay predetermined time, the temperature of all devices in acquisition terminal.Surface temperature
After control terminates, delay waits the scheduled time, such as two minutes, then re-executes whole temperature control process, can anti-locking system frequency
Numerous control device power consumption, avoid causing performance acute variation.
The embodiment of the present invention also provides a kind of terminal end surface temperature control equipment, as shown in figure 9, described device includes：
Collecting unit 91, the temperature for all devices in acquisition terminal；
First acquisition unit 92, for acquisition device thermal resistance matrix；
First computing unit 93, for the temperature according to all devices in the terminal gathered and the device thermal resistance matrix
Calculate the power consumption of all devices；
Second acquisition unit 94, for obtaining surface resistance of heat transfer matrix；
Second computing unit 95, for the power consumption calculation surface temperature according to the surface resistance of heat transfer matrix and all devices
Degree；
Control unit 96, for according to the surface temperature and predetermined temperature control device power consumption.
Terminal end surface temperature control equipment provided in an embodiment of the present invention, by some thermal resistance matrixes come virtual surface temperature
Degree, and then regulate and control surface temperature by regulating and controlling terminal inner device power consumption.It is next relative to limited inner sensor is currently based on
The temperature control strategy of indirect surface temperature control is carried out, surface temperature can be allowed to obtain more accurately virtualizing direct control, can
The surface temperature of intelligent control terminal.
Alternatively, the first acquisition unit 92 includes the first detection unit and thermal resistance matrix determining unit；Wherein,
First detection unit is used to detect the temperature of itself caused relative ambient temperature under each device unit work consumptiom
The temperature rise of liter and other device relative ambient temperatures；
The device thermal resistance matrix determining unit is used for itself versus environmental according to caused by under the device unit work consumptiom
The temperature rise of temperature and the temperature rise of other device relative ambient temperatures form the device thermal resistance matrix.
Alternatively, the second acquisition unit 94 includes the second detection unit and surface resistance of heat transfer matrix determining unit；Wherein,
Second detection unit is used to detect surface temperature peak when each device works independently under unit work consumptiom,
Focus is formed by the surface temperature peak；And detect the temperature of caused all focuses under each device unit work consumptiom
Rise；
The surface resistance of heat transfer matrix determining unit is used for the temperature according to caused all focuses under all device unit work consumptioms
Rise composition surface resistance of heat transfer matrix.
Alternatively, the second acquisition unit 94, for surface resistance of heat transfer matrix after surface resistance of heat transfer matrix before obtaining and acquisition.
Alternatively, second computing unit 95, based on according to preceding surface resistance of heat transfer matrix and all device power consumptions
Surface temperature before calculation；Surface temperature after being calculated according to rear surface resistance of heat transfer matrix and all device power consumptions.
Alternatively, described control unit 96, for when the surface temperature exceedes the predetermined temperature, regulating and controlling in terminal
The power consumption of device.
The workflow of terminal end surface temperature control equipment provided in an embodiment of the present invention is in the terminal end surface temperature control
Have been described in, will not be repeated here in method processed.
The embodiment of the present invention also provides a kind of terminal, and the terminal includes terminal end surface temperature control described above and filled
Put.
Terminal end surface temprature control method, device and terminal provided in an embodiment of the present invention, it is limited relative to being currently based on
Internal sensor carries out the temperature control strategy of indirect surface temperature control, can allow surface temperature obtain more accurately virtualizing it is straight
Control is connect, superior performance can be kept to run the long period, and it is gentler to allow processor performance to change, customer experience is more preferable.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, the change or replacement that can readily occur in, all should
It is included within the scope of the present invention.Therefore, protection scope of the present invention should be defined by scope of the claims.
Claims (13)
- A kind of 1. terminal end surface temprature control method, it is characterised in that including：The temperature of all devices in acquisition terminal；Acquisition device thermal resistance matrix；According to the temperature of all devices in the terminal gathered and the power consumption of all devices of device thermal resistance matrix computations；Obtain surface resistance of heat transfer matrix；According to the power consumption calculation surface temperature of the surface resistance of heat transfer matrix and all devices；According to the surface temperature and predetermined temperature control device power consumption.
- 2. terminal end surface temprature control method according to claim 1, it is characterised in that the acquisition device thermal resistance matrix Including：The temperature rise of itself relative ambient temperature and other device relative ambient temperatures caused by detecting under each device unit work consumptiom Temperature rise；Temperature rise and other device relative ambient temperatures by itself relative ambient temperature caused by under the device unit work consumptiom Temperature rise forms the device thermal resistance matrix.
- 3. terminal end surface temprature control method according to claim 1, it is characterised in that the acquisition surface resistance of heat transfer matrix Including：The surface temperature peak under unit work consumptiom when each device works independently is detected, is made up of the surface temperature peak Focus；Detect the temperature rise of caused all focuses under each device unit work consumptiom；Surface resistance of heat transfer matrix is formed by the temperature rise of caused all focuses under all device unit work consumptioms.
- 4. the terminal end surface temprature control method according to any one of claim 1-3, it is characterised in that the acquisition table Face thermal resistance matrix includes：Before acquisition surface resistance of heat transfer matrix and obtain after surface resistance of heat transfer matrix.
- 5. terminal end surface temprature control method according to claim 4, it is characterised in that described according to the surface resistance of heat transfer The power consumption calculation surface temperature of matrix and all devices includes：According to preceding surface resistance of heat transfer matrix and all device power consumptions Surface temperature before calculating；Surface temperature after being calculated according to rear surface resistance of heat transfer matrix and all device power consumptions.
- 6. terminal end surface temprature control method according to claim 5, it is characterised in that described according to the surface temperature And predetermined temperature control device power consumption includes：When the surface temperature exceedes the predetermined temperature, regulate and control device in terminal Power consumption.
- A kind of 7. terminal end surface temperature control equipment, it is characterised in that including：Collecting unit, the temperature for all devices in acquisition terminal；First acquisition unit, for acquisition device thermal resistance matrix；First computing unit, for the temperature according to all devices in the terminal gathered and the device thermal resistance matrix computations institute There is the power consumption of device；Second acquisition unit, for obtaining surface resistance of heat transfer matrix；Second computing unit, for the power consumption calculation surface temperature according to the surface resistance of heat transfer matrix and all devices；Control unit, for according to the surface temperature and predetermined temperature control device power consumption.
- 8. terminal end surface temperature control equipment according to claim 7, it is characterised in that the first acquisition unit includes First detection unit and thermal resistance matrix determining unit；Wherein,First detection unit be used to detecting under each device unit work consumptiom caused by itself relative ambient temperature temperature rise and The temperature rise of other device relative ambient temperatures；The device thermal resistance matrix determining unit is used for itself relative ambient temperature according to caused by under the device unit work consumptiom Temperature rise and the temperature rises of other device relative ambient temperatures form the device thermal resistance matrix.
- 9. terminal end surface temperature control equipment according to claim 7, it is characterised in that the second acquisition unit includes Second detection unit and surface resistance of heat transfer matrix determining unit；Wherein,Second detection unit is used to detect surface temperature peak when each device works independently under unit work consumptiom, by institute State surface temperature peak and form focus；And detect the temperature rise of caused all focuses under each device unit work consumptiom；The surface resistance of heat transfer matrix determining unit is used for the temperature rise group according to caused all focuses under all device unit work consumptioms Into surface resistance of heat transfer matrix.
- 10. the terminal end surface temperature control equipment according to any one of claim 7-9, it is characterised in that described second Acquiring unit, for surface resistance of heat transfer matrix after surface resistance of heat transfer matrix before obtaining and acquisition.
- 11. terminal end surface temperature control equipment according to claim 10, it is characterised in that second computing unit, For surface temperature before being calculated according to preceding surface resistance of heat transfer matrix and all device power consumptions；According to rear surface resistance of heat transfer matrix and institute State surface temperature after all device power consumptions calculate.
- 12. terminal end surface temperature control equipment according to claim 11, it is characterised in that described control unit, be used for When the surface temperature exceedes the predetermined temperature, regulate and control the power consumption of device in terminal.
- 13. a kind of terminal, it is characterised in that the terminal includes the terminal end surface temperature any one of claim 7-12 Control device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610584705.1A CN107643778B (en) | 2016-07-22 | 2016-07-22 | Terminal surface temperature control method and device and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610584705.1A CN107643778B (en) | 2016-07-22 | 2016-07-22 | Terminal surface temperature control method and device and terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107643778A true CN107643778A (en) | 2018-01-30 |
| CN107643778B CN107643778B (en) | 2020-11-20 |
Family
ID=61109302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610584705.1A Active CN107643778B (en) | 2016-07-22 | 2016-07-22 | Terminal surface temperature control method and device and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107643778B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109000801A (en) * | 2018-05-14 | 2018-12-14 | 东莞市迈纳斯航空技术有限公司 | A kind of acquisition methods and system of plane multimedia equipment surface temperature |
| CN113030160A (en) * | 2021-02-05 | 2021-06-25 | 华荣科技股份有限公司 | Method and system for obtaining highest surface temperature value of explosion suppression device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101017510A (en) * | 2006-03-13 | 2007-08-15 | 信息产业部电子第五研究所 | Heat resistance network model and method for calculating junction temperature of microelectronics using same |
| WO2008123173A1 (en) * | 2007-03-26 | 2008-10-16 | Kuraray Co., Ltd. | Polypropylene fiber, method of producing the same and utilization of the same |
| CN103048606A (en) * | 2012-12-30 | 2013-04-17 | 杭州士兰微电子股份有限公司 | Thermal resistance test device and method of semiconductor power device |
| CN103401607A (en) * | 2013-07-09 | 2013-11-20 | 青岛海信宽带多媒体技术有限公司 | Method and device for acquiring monitoring temperature of optical module |
| CN104021260A (en) * | 2014-06-26 | 2014-09-03 | 北京师范大学 | Module level thermal analytical method based on pre-sampling |
| CN104020801A (en) * | 2013-02-28 | 2014-09-03 | 控制技术有限公司 | Temperature controlling method, temperature calculating method and driver |
| CN104048992A (en) * | 2014-06-24 | 2014-09-17 | 中国东方电气集团有限公司 | Device for measuring thermal resistance from bottom shell of semiconductor device to air under thermal coupling effect |
| CN105335269A (en) * | 2014-06-30 | 2016-02-17 | 展讯通信（上海）有限公司 | Temperature control method, temperature control device and mobile terminal |
| CN105843979A (en) * | 2016-01-22 | 2016-08-10 | 厦门大学 | Measuring method of thermal coupling and junction temperature distribution among chips in LED multi-chip module |
-
2016
- 2016-07-22 CN CN201610584705.1A patent/CN107643778B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101017510A (en) * | 2006-03-13 | 2007-08-15 | 信息产业部电子第五研究所 | Heat resistance network model and method for calculating junction temperature of microelectronics using same |
| WO2008123173A1 (en) * | 2007-03-26 | 2008-10-16 | Kuraray Co., Ltd. | Polypropylene fiber, method of producing the same and utilization of the same |
| CN103048606A (en) * | 2012-12-30 | 2013-04-17 | 杭州士兰微电子股份有限公司 | Thermal resistance test device and method of semiconductor power device |
| CN104020801A (en) * | 2013-02-28 | 2014-09-03 | 控制技术有限公司 | Temperature controlling method, temperature calculating method and driver |
| CN103401607A (en) * | 2013-07-09 | 2013-11-20 | 青岛海信宽带多媒体技术有限公司 | Method and device for acquiring monitoring temperature of optical module |
| CN104048992A (en) * | 2014-06-24 | 2014-09-17 | 中国东方电气集团有限公司 | Device for measuring thermal resistance from bottom shell of semiconductor device to air under thermal coupling effect |
| CN104021260A (en) * | 2014-06-26 | 2014-09-03 | 北京师范大学 | Module level thermal analytical method based on pre-sampling |
| CN105335269A (en) * | 2014-06-30 | 2016-02-17 | 展讯通信（上海）有限公司 | Temperature control method, temperature control device and mobile terminal |
| CN105843979A (en) * | 2016-01-22 | 2016-08-10 | 厦门大学 | Measuring method of thermal coupling and junction temperature distribution among chips in LED multi-chip module |
Non-Patent Citations (1)
| Title |
|---|
| 邱宝军等: "《多芯片组件热阻技术研究》", 《电子元件与材料》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109000801A (en) * | 2018-05-14 | 2018-12-14 | 东莞市迈纳斯航空技术有限公司 | A kind of acquisition methods and system of plane multimedia equipment surface temperature |
| CN113030160A (en) * | 2021-02-05 | 2021-06-25 | 华荣科技股份有限公司 | Method and system for obtaining highest surface temperature value of explosion suppression device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107643778B (en) | 2020-11-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009527820A5 (en) | ||
| CN104460913B (en) | A kind of method and system reducing mobile terminal complete machine temperature | |
| CN104456963B (en) | The control method and device of compressor operating frequency | |
| CN107643778A (en) | Terminal end surface temprature control method, device and terminal | |
| CN107704053A (en) | Mobile terminal method for regulating temperature, mobile terminal and storage device | |
| CN104238592A (en) | Rapid thermostat self-adaption control method and system | |
| CN109353127A (en) | A kind of Method of printing of thermal printer, thermal printer and storage medium | |
| CN105685537A (en) | Electric rice cooker and method for making jam by using electric rice cooker | |
| CN112155434B (en) | Temperature control method, temperature control device, control equipment, storage medium and heater | |
| CN102393866A (en) | Transfer function determination method of system object parameter model and device | |
| CN107440293A (en) | Heated hair-waving appliance and method for permanent waving hair | |
| US8615328B2 (en) | Noise reduction apparatus, method, and container data center including the same | |
| CN105187596A (en) | Automatic temperature rise testing device and method | |
| CN103901036B (en) | Method for judging material characteristics of target object and electronic device | |
| CN105652915B (en) | A kind of information processing method and electronic equipment | |
| CN207558819U (en) | Electric heating system based on electrically heated laminated hot plate and laminated hot plate | |
| CN101893904A (en) | Temperature control device and method of electric heating body | |
| CN103941843B (en) | mode switching method and device | |
| CN105527999B (en) | Temprature control method of the pressure cooker in packing stage, device and system | |
| WO2024066315A1 (en) | Power battery temperature control method, system, apparatus and vehicle | |
| JP2007086991A5 (en) | ||
| CN103900735B (en) | A kind of method for obtaining temperature response curve, device and control system | |
| CN105910648A (en) | Toughened glass cooling process monitoring system | |
| CN112730506B (en) | Method and device for evaluating heat exchange performance of air preheater | |
| CN102749940B (en) | Double-temperature-control constant-temperature heating system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |