CN107643778B - Terminal surface temperature control method and device and terminal - Google Patents
Terminal surface temperature control method and device and terminal Download PDFInfo
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- CN107643778B CN107643778B CN201610584705.1A CN201610584705A CN107643778B CN 107643778 B CN107643778 B CN 107643778B CN 201610584705 A CN201610584705 A CN 201610584705A CN 107643778 B CN107643778 B CN 107643778B
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Abstract
The invention provides a terminal surface temperature control method and device and a terminal. The method comprises the following steps: collecting the temperature of all devices in the terminal; obtaining a device thermal resistance matrix; calculating the power consumption of all devices according to the acquired temperature of all devices in the terminal and the device thermal resistance matrix; acquiring a surface thermal resistance matrix; calculating the surface temperature according to the surface thermal resistance matrix and the power consumption of all the devices; and controlling the power consumption of the device according to the surface temperature and the preset temperature. The invention can intelligently regulate and control the surface temperature of the terminal.
Description
Technical Field
The invention relates to the technical field of temperature control, in particular to a terminal surface temperature control method, a terminal surface temperature control device and a terminal.
Background
With the progress of science and technology, the operation processing speed of the mobile phone and other terminals is faster and faster at present, and the thickness and the volume of the terminal are thinner and smaller, so that the user experience and various safety problems caused by the self-heating of the terminal are more and more obvious. With the increasing use of terminals, terminals are also applied to different scenes, such as mobile phones, some for making a call, some for playing a game, some for playing a video, and so on. With the diversification of the functions realized by the terminal, the influence of terminal heating on the terminal is more and more severe. The current terminal temperature control strategy is based on a chip temperature sensor or an on-board temperature sensor to realize temperature control.
In the process of implementing the invention, the inventor finds that at least the following technical problems exist in the prior art: the existing terminal temperature control technology has large error and hysteresis corresponding to the surface temperature, and the surface temperature of the terminal cannot be intelligently regulated and controlled.
Disclosure of Invention
The terminal surface temperature control method, the terminal surface temperature control device and the terminal can intelligently regulate and control the surface temperature of the terminal.
In a first aspect, the present invention provides a method for controlling a temperature of a surface of a terminal, the method comprising:
collecting the temperature of all devices in the terminal;
obtaining a device thermal resistance matrix;
calculating the power consumption of all devices according to the acquired temperature of all devices in the terminal and the device thermal resistance matrix;
acquiring a surface thermal resistance matrix;
calculating the surface temperature according to the surface thermal resistance matrix and the power consumption of all the devices;
and controlling the power consumption of the device according to the surface temperature and the preset temperature.
Optionally, the obtaining a device thermal resistance matrix includes:
detecting the temperature rise of each device relative to the ambient temperature and the temperature rise of other devices relative to the ambient temperature caused by unit power consumption of each device;
the device thermal resistance matrix is formed by the temperature rise of the device relative to the ambient temperature caused by unit power consumption and the temperature rise of other devices relative to the ambient temperature.
Optionally, the obtaining the surface thermal resistance matrix includes:
detecting the highest surface temperature point under unit power consumption when each device works independently, and forming a hot spot by the highest surface temperature point;
detecting the temperature rise of all the hot spots caused by unit power consumption of each device;
and the temperature rise of all hot spots caused by unit power consumption of all devices forms a surface thermal resistance matrix.
Optionally, the obtaining the surface thermal resistance matrix includes: a front surface thermal resistance matrix is obtained and a back surface thermal resistance matrix is obtained.
Optionally, the calculating the surface temperature according to the surface thermal resistance matrix and the power consumption of all the devices includes: calculating the front surface temperature according to the front surface thermal resistance matrix and the power consumption of all the devices; and calculating the rear surface temperature according to the rear surface thermal resistance matrix and the power consumption of all the devices.
Optionally, the controlling the power consumption of the device according to the surface temperature and a predetermined temperature includes: and regulating and controlling the power consumption of the device in the terminal when the surface temperature exceeds the preset temperature.
In a second aspect, the present invention provides a terminal surface temperature control device, the device comprising:
the acquisition unit is used for acquiring the temperature of all devices in the terminal;
the first obtaining unit is used for obtaining a device thermal resistance matrix;
the first calculation unit is used for calculating the power consumption of all the devices according to the acquired temperatures of all the devices in the terminal and the device thermal resistance matrix;
the second acquisition unit is used for acquiring a surface thermal resistance matrix;
the second calculating unit is used for calculating the surface temperature according to the surface thermal resistance matrix and the power consumption of all the devices;
and the control unit is used for controlling the power consumption of the device according to the surface temperature and the preset temperature.
Optionally, the first obtaining unit includes a first detecting unit and a thermal resistance matrix determining unit; wherein the content of the first and second substances,
the first detection unit is used for detecting the temperature rise of each device relative to the ambient temperature and the temperature rise of other devices relative to the ambient temperature caused by unit power consumption of each device;
the device thermal resistance matrix determining unit is used for forming the device thermal resistance matrix according to the temperature rise of the device relative to the environment temperature caused by unit power consumption of the device and the temperature rise of other devices relative to the environment temperature.
Optionally, the second acquiring unit includes a second detecting unit and a surface thermal resistance matrix determining unit; wherein the content of the first and second substances,
the second detection unit is used for detecting the highest surface temperature point under unit power consumption when each device works independently, and the highest surface temperature point forms a hot spot; detecting the temperature rise of all the hot spots caused by unit power consumption of each device;
the surface thermal resistance matrix determining unit is used for forming a surface thermal resistance matrix according to the temperature rise of all hot spots caused by unit power consumption of all devices.
Optionally, the second obtaining unit is configured to obtain a front surface thermal resistance matrix and obtain a back surface thermal resistance matrix.
Optionally, the second calculating unit is configured to calculate a front surface temperature according to the front surface thermal resistance matrix and the power consumption of all devices; and calculating the rear surface temperature according to the rear surface thermal resistance matrix and the power consumption of all the devices.
Optionally, the control unit is configured to regulate power consumption of a device in the terminal when the surface temperature exceeds the predetermined temperature.
In a third aspect, the present invention provides a terminal comprising the terminal surface temperature control device described above.
According to the terminal surface temperature control method, the terminal surface temperature control device and the terminal, the surface temperature is virtualized through the plurality of thermal resistance matrixes, and the surface temperature is further regulated and controlled through regulating and controlling the power consumption of devices inside the terminal. Compared with the current temperature control strategy of carrying out indirect surface temperature control based on a limited internal sensor, the method can enable the surface temperature to be controlled more accurately and directly in a virtual mode, and can intelligently regulate and control the surface temperature of the terminal.
Drawings
FIG. 1 is a flow chart of a method for controlling a surface temperature of a terminal according to an embodiment of the present invention;
FIG. 2 is a detailed flowchart of a method for controlling a surface temperature of a terminal according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of an internal device of the terminal according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a thermal resistance matrix of a termination device according to an embodiment of the invention;
FIG. 5 is a structural schematic of a front surface of a terminal according to an embodiment of the present invention;
FIG. 6 is a structural schematic of the rear surface of the terminal according to one embodiment of the present invention;
FIG. 7 is a thermal resistance matrix of the front surface of the terminal according to one embodiment of the present invention;
FIG. 8 is a thermal resistance matrix for the rear surface of the terminal according to one embodiment of the present invention;
fig. 9 is a schematic structural diagram of a terminal surface temperature control device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a terminal surface temperature control method, as shown in fig. 1, the method comprises the following steps:
s11, collecting the temperature of all devices in the terminal;
s12, acquiring a device thermal resistance matrix;
s13, calculating the power consumption of all the devices according to the collected temperatures of all the devices in the terminal and the device thermal resistance matrix;
s14, acquiring a surface thermal resistance matrix;
s15, calculating the surface temperature according to the surface thermal resistance matrix and the power consumption of all the devices;
and S16, controlling the power consumption of the device according to the surface temperature and the preset temperature.
According to the terminal surface temperature control method provided by the embodiment of the invention, the surface temperature is virtualized through a plurality of thermal resistance matrixes, and the surface temperature is regulated and controlled by regulating and controlling the power consumption of devices in the terminal. Compared with the current temperature control strategy of carrying out indirect surface temperature control based on a limited internal sensor, the method can enable the surface temperature to be controlled more accurately and directly in a virtual mode, and can intelligently regulate and control the surface temperature of the terminal.
Optionally, the obtaining a device thermal resistance matrix includes:
detecting the temperature rise of each device relative to the ambient temperature and the temperature rise of other devices relative to the ambient temperature caused by unit power consumption of each device;
the device thermal resistance matrix is formed by the temperature rise of the device relative to the ambient temperature caused by unit power consumption and the temperature rise of other devices relative to the ambient temperature.
Optionally, the obtaining the surface thermal resistance matrix includes:
detecting the highest surface temperature point under unit power consumption when each device works independently, and forming a hot spot by the highest surface temperature point;
detecting the temperature rise of all the hot spots caused by unit power consumption of each device;
and the temperature rise of all hot spots caused by unit power consumption of all devices forms a surface thermal resistance matrix.
Optionally, the obtaining the surface thermal resistance matrix includes: a front surface thermal resistance matrix is obtained and a back surface thermal resistance matrix is obtained.
Optionally, the calculating the surface temperature according to the surface thermal resistance matrix and the power consumption of all the devices includes: calculating the front surface temperature according to the front surface thermal resistance matrix and the power consumption of all the devices; and calculating the rear surface temperature according to the rear surface thermal resistance matrix and the power consumption of all the devices.
Optionally, the controlling the power consumption of the device according to the surface temperature and a predetermined temperature includes: and regulating and controlling the power consumption of the device in the terminal when the surface temperature exceeds the preset temperature.
The detailed flow of the terminal surface temperature control method provided by the embodiment of the invention is shown in fig. 2, and mainly comprises the following steps:
step S21: and collecting the temperature of all devices in the terminal. As shown in fig. 3, a plurality of temperature sensors are disposed inside the terminal, specifically inside the chip, for detecting the temperature Tj of the device inside the terminal. And meanwhile, an independent sensor is arranged in a region far away from the heat source to monitor the ambient temperature Ta.
Step S22: and acquiring a device thermal resistance matrix. The thermal resistance matrix refers to that when a plurality of heating devices coexist, each device has a temperature field when working independently, the difference value of each point and the ambient temperature in the temperature field is divided by the power consumption of the working device to form the thermal resistance of one point, and a plurality of devices and the points in a plurality of corresponding temperature fields form a plurality of thermal resistance matrixes. For a device thermal resistance matrix, thermal resistance refers to resistance encountered by heat on a heat flow path, reflects the size of a medium or heat transfer capacity between media, and indicates the size of temperature rise caused by 1W of heat, and the unit is ℃/W or K/W. Particularly, on the mobile phone chip, the temperature rise of the chip itself (relative to the ambient temperature) caused by the power consumption of the chip of 1W and the temperature rise of other chips around (relative to the ambient temperature) are caused. The plurality of chips are respectively set with 1W heating power, and the temperature rise of the plurality of chips is caused to form a mathematical matrix to form a device thermal resistance matrix. For example, as shown in fig. 3, 5 chips ABCDE are in the terminal, a is set to 1W, a temperature rise is R11, B is R13, C is R13, D is R14, and E is R15, so that the first behavior of the device thermal resistance matrix is [ R11R 12R 13R 14R 15 ]. Correspondingly, 1W thermal power is separately applied to BCDE in sequence to obtain [ R21R 22R 23R 24R 25], [ R31R 32R 33R 34R 35], [ R41R 42R 43R 44R 45], [ R51R 52R 53R 54R 55 ]. Thereby obtaining a thermal resistance matrix a shown in fig. 4. The numerical value of the specific thermal resistance matrix is that a complete equipment structure physical property model is established through thermal simulation software, such as Flotherm, Icepak and other software, 1W is independently set for the ABCDE devices respectively according to the method, then temperature rise data of the ABCDE is obtained through simulation calculation, and the thermal resistance matrix is obtained after the temperature rise data is arranged.
Step S23: the power consumption of all devices is calculated. Since the thermal resistance is the thermal resistance of one point obtained by dividing the difference between each point in the temperature field and the ambient temperature by the power consumption of the operating device, assuming that the device temperature distribution of the device ABCDE is Tj1, Tj2, Tj3, Tj4, Tj5, and the power consumption of the device ABCDE is p1, p2, p2, p2, p5, the following equations can be obtained:
Tj1＝R11*p1+R21*p2+R31*p3+R41*p4+R51*p5+Ta
Tj2＝R12*p1+R22*p2+R32*p3+R42*p4+R52*p5+Ta
Tj3＝R13*p1+R23*p2+R33*p3+R43*p4+R53*p5+Ta
Tj4＝R14*p1+R24*p2+R34*p3+R44*p4+R54*p5+Ta
Tj5＝R15*p1+R25*p2+R35*p3+R45*p4+R55*p5+Ta
solving the equation can obtain the power consumption value of each device.
Step S24: a front surface thermal resistance matrix is obtained.
Step S25: a back surface thermal resistance matrix is obtained. Detecting the highest surface temperature point of each device under unit power consumption when each device works independently, wherein the highest surface temperature point forms a hot point, for example, the front surface of the terminal shown in fig. 5 and the rear surface of the terminal shown in fig. 6 are provided with 1W heat power consumption, for example, the device a is provided with 1W heat power consumption, temperature distribution is formed on the surface of the mobile phone, and a highest temperature point is correspondingly arranged and has a temperature rise value. Similarly, the BCDE respectively sets 1W heat power consumption, and four corresponding highest temperature points, namely heat points, are formed on the surface of the mobile phone. Thus, five ABCDE devices correspond to five hot spots on the front surface A1, B1, C1, D1 and E1, and five hot spots on the back surface A2, B2, C2, D2 and E2. And detecting the temperature rises of all the hot spots caused by the unit power consumption of each device, and forming a surface thermal resistance matrix by the temperature rises of all the hot spots caused by the unit power consumption of all the devices. According to this method, a front surface thermal resistance matrix B, as shown in FIG. 7, and a back surface thermal resistance matrix C, as shown in FIG. 8, are obtained.
Step S26: calculating the front surface hot spot temperature;
step S27: the rear surface hot spot temperature was calculated. Assuming that the temperature of the hot spot on the front surface of the terminal is Tfs, the temperature of five hot spots on the front surface of the terminal can be calculated according to the front surface thermal resistance matrix B and the power consumption of the device, and the calculation formula is as follows:
Tfs1＝Rfs11*p1+Rfs21*p2+Rfs31*p3+Rfs41*p4+Rfs51*p5+Ta
Tfs2＝Rfs12*p1+Rfs22*p2+Rfs32*p3+Rfs42*p4+Rfs52*p5+Ta
Tfs3＝Rfs13*p1+Rfs23*p2+Rfs33*p3+Rfs43*p4+Rfs53*p5+Ta
Tfs4＝Rfs14*p1+Rfs24*p2+Rfs34*p3+Rfs44*p4+Rfs54*p5+Ta
Tfs5＝Rfs15*p1+Rfs25*p2+Rfs35*p3+Rfs45*p4+Rfs55*p5+Ta
correspondingly, assuming that the temperature of the hot spot on the rear surface of the terminal is Tbs, the temperature of the five hot spots on the rear surface of the terminal can be calculated according to the rear surface thermal resistance matrix C and the power consumption of the device, and the calculation formula is as follows:
Tbs1＝Rbs11*p1+Rbs21*p2+Rbs31*p3+Rbs41*p4+Rbs51*p5+Ta
Tbs2＝Rbs12*p1+Rbs22*p2+Rbs32*p3+Rbs42*p4+Rbs52*p5+Ta
Tbs3＝Rbs13*p1+Rbs23*p2+Rbs33*p3+Rbs43*p4+Rbs53*p5+Ta
Tbs4＝Rbs14*p1+Rbs24*p2+Rbs34*p3+Rbs44*p4+Rbs54*p5+Ta
Tbs5＝Rbs15*p1+Rbs25*p2+Rbs35*p3+Rbs45*p4+Rbs55*p5+Ta
step S28: and controlling the power consumption of the devices in the terminal according to the hot spot temperature and the preset temperature. And if the temperature of a certain hot spot on the surface of the terminal exceeds a preset temperature, regulating and controlling the power consumption of the device in the terminal. Alternatively, the most influential device can be found out by the thermal resistance matrix for power consumption regulation.
Step S29: and (5) after delaying for a preset time, jumping to step S21, and collecting the temperatures of all devices in the terminal. After the surface temperature control is finished, the surface temperature control is delayed for a preset time, for example, two minutes, and then the whole temperature control process is executed again, so that the power consumption of the device can be prevented from being frequently controlled by the system, and the severe performance change is avoided.
An embodiment of the present invention further provides a terminal surface temperature control device, as shown in fig. 9, the device includes:
the acquisition unit 91 is used for acquiring the temperature of all devices in the terminal;
a first obtaining unit 92, configured to obtain a device thermal resistance matrix;
the first calculating unit 93 is configured to calculate power consumption of all devices according to the acquired temperatures of all devices in the terminal and the device thermal resistance matrix;
a second obtaining unit 94 for obtaining a surface thermal resistance matrix;
a second calculating unit 95, configured to calculate a surface temperature according to the surface thermal resistance matrix and power consumption of all the devices;
and the control unit 96 is used for controlling the power consumption of the device according to the surface temperature and the preset temperature.
According to the terminal surface temperature control device provided by the embodiment of the invention, the surface temperature is virtualized through a plurality of thermal resistance matrixes, and the surface temperature is regulated and controlled through regulating and controlling the power consumption of devices in the terminal. Compared with the current temperature control strategy of carrying out indirect surface temperature control based on a limited internal sensor, the method can enable the surface temperature to be controlled more accurately and directly in a virtual mode, and can intelligently regulate and control the surface temperature of the terminal.
Optionally, the first obtaining unit 92 includes a first detecting unit and a thermal resistance matrix determining unit; wherein the content of the first and second substances,
the first detection unit is used for detecting the temperature rise of each device relative to the ambient temperature and the temperature rise of other devices relative to the ambient temperature caused by unit power consumption of each device;
the device thermal resistance matrix determining unit is used for forming the device thermal resistance matrix according to the temperature rise of the device relative to the environment temperature caused by unit power consumption of the device and the temperature rise of other devices relative to the environment temperature.
Optionally, the second obtaining unit 94 includes a second detecting unit and a surface thermal resistance matrix determining unit; wherein the content of the first and second substances,
the second detection unit is used for detecting the highest surface temperature point under unit power consumption when each device works independently, and the highest surface temperature point forms a hot spot; detecting the temperature rise of all the hot spots caused by unit power consumption of each device;
the surface thermal resistance matrix determining unit is used for forming a surface thermal resistance matrix according to the temperature rise of all hot spots caused by unit power consumption of all devices.
Optionally, the second obtaining unit 94 is configured to obtain a front surface thermal resistance matrix and obtain a back surface thermal resistance matrix.
Optionally, the second calculating unit 95 is configured to calculate a front surface temperature according to the front surface thermal resistance matrix and the power consumption of all devices; and calculating the rear surface temperature according to the rear surface thermal resistance matrix and the power consumption of all the devices.
Optionally, the control unit 96 is configured to regulate power consumption of devices in the terminal when the surface temperature exceeds the predetermined temperature.
The working process of the terminal surface temperature control device provided by the embodiment of the invention has been described in detail in the terminal surface temperature control method, and is not described herein again.
The embodiment of the invention also provides a terminal, which comprises the terminal surface temperature control device.
Compared with the current temperature control strategy of carrying out indirect surface temperature control based on a limited internal sensor, the terminal surface temperature control method, the device and the terminal provided by the embodiment of the invention can ensure that the surface temperature is more accurately and directly controlled in a virtualized way, can keep higher performance for running for a longer time, ensure that the performance change of a processor is more gradual, and ensure better customer experience.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (5)
1. A method for controlling a temperature of a surface of a terminal, comprising:
collecting the temperature of all devices in the terminal;
obtaining a device thermal resistance matrix;
calculating the power consumption of all devices according to the acquired temperature of all devices in the terminal and the device thermal resistance matrix;
acquiring a surface thermal resistance matrix;
calculating the surface temperature according to the surface thermal resistance matrix and the power consumption of all the devices;
controlling the power consumption of the device according to the surface temperature and the preset temperature;
wherein obtaining a device thermal resistance matrix comprises: detecting the temperature rise of the device relative to the ambient temperature and the temperature rise of other devices relative to the ambient temperature caused by the unit power consumption of each device, wherein the temperature rise of the device relative to the ambient temperature and the temperature rise of other devices relative to the ambient temperature caused by the unit power consumption of the device form the thermal resistance matrix of the device; the obtaining of the surface thermal resistance matrix comprises: detecting the highest surface temperature point of each device under unit power consumption when each device works independently, forming a hot spot by the highest surface temperature point, detecting the temperature rise of all the hot spots caused under the unit power consumption of each device, and forming a surface thermal resistance matrix by the temperature rises of all the hot spots caused under the unit power consumption of all the devices;
the obtaining of the surface thermal resistance matrix comprises: acquiring a front surface thermal resistance matrix and a rear surface thermal resistance matrix;
the calculating the surface temperature according to the surface thermal resistance matrix and the power consumption of all the devices comprises the following steps: calculating the front surface temperature according to the front surface thermal resistance matrix and the power consumption of all the devices; and calculating the rear surface temperature according to the rear surface thermal resistance matrix and the power consumption of all the devices.
2. A terminal surface temperature control method according to claim 1, wherein said controlling device power consumption according to the surface temperature and a predetermined temperature comprises: and regulating and controlling the power consumption of the device in the terminal when the surface temperature exceeds the preset temperature.
3. A terminal surface temperature control apparatus, comprising:
the acquisition unit is used for acquiring the temperature of all devices in the terminal;
the device comprises a first acquisition unit, a second acquisition unit and a device thermal resistance matrix determination unit, wherein the first acquisition unit is used for acquiring a device thermal resistance matrix and comprises a first detection unit and a device thermal resistance matrix determination unit, the first detection unit is used for detecting the temperature rise of the device relative to the ambient temperature and the temperature rise of other devices relative to the ambient temperature caused by the unit power consumption of each device, and the device thermal resistance matrix determination unit is used for forming the device thermal resistance matrix according to the temperature rise of the device relative to the ambient temperature and the temperature rise of other devices relative to the ambient temperature caused by the unit power consumption of the device;
the first calculation unit is used for calculating the power consumption of all the devices according to the acquired temperatures of all the devices in the terminal and the device thermal resistance matrix;
the second acquisition unit is used for acquiring a surface thermal resistance matrix and comprises a second detection unit and a surface thermal resistance matrix determination unit, wherein the second detection unit is used for detecting the highest surface temperature point under the unit power consumption when each device works independently, forming a hot point by the highest surface temperature point and detecting the temperature rise of all the hot points caused under the unit power consumption of each device, and the surface thermal resistance matrix determination unit is used for forming the surface thermal resistance matrix according to the temperature rises of all the hot points caused under the unit power consumption of all the devices; the second obtaining unit is used for obtaining a front surface thermal resistance matrix and obtaining a rear surface thermal resistance matrix;
the second calculating unit is used for calculating the surface temperature according to the surface thermal resistance matrix and the power consumption of all the devices; the second calculating unit is used for calculating the front surface temperature according to the front surface thermal resistance matrix and the power consumption of all the devices; calculating the rear surface temperature according to the rear surface thermal resistance matrix and the power consumption of all the devices;
and the control unit is used for controlling the power consumption of the device according to the surface temperature and the preset temperature.
4. A terminal surface temperature control apparatus according to claim 3, wherein the control unit is configured to regulate power consumption of devices in the terminal when the surface temperature exceeds the predetermined temperature.
5. A terminal characterized in that it comprises a terminal surface temperature control device according to any one of claims 3 to 4.
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| CN113030160B (en) * | 2021-02-05 | 2021-12-14 | 华荣科技股份有限公司 | Method and system for obtaining highest surface temperature value of explosion suppression device |
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