CN107641485A - Heat foamable glue and preparation method thereof - Google Patents
Heat foamable glue and preparation method thereof Download PDFInfo
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- CN107641485A CN107641485A CN201610579298.5A CN201610579298A CN107641485A CN 107641485 A CN107641485 A CN 107641485A CN 201610579298 A CN201610579298 A CN 201610579298A CN 107641485 A CN107641485 A CN 107641485A
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Abstract
The invention provides a kind of heat foamable glue and preparation method thereof.The heat foamable glue includes the first heat-expandable microsphere and the second heat-expandable microsphere；The particle diameter of first heat-expandable microsphere is 10~30 μm, and the initial temperature of its expansion is 70~100 DEG C；The particle diameter of second heat-expandable microsphere is 8~25 μm, and the initial temperature of its foaming is 90~120 DEG C.Two kinds of different heat-expandable microspheres of blowing temperature are mixed obtained heat foamable glue by the heat foamable glue of the present invention, to heat sensitive adhesive tape foaming when, heat sensitive adhesive tape can not only pass through the expansion Automatic-falling of heat foamable glue, also controllable different temperatures section is foamed simultaneously, and meets different foaming effects.The degree and process that control heat sensitive adhesive tape is peeled off by substrate.
Description
Technical field
The present invention relates to the technical field of lithium ion battery, in particular to a kind of heat foamable glue and preparation method thereof.
Background technology
Lithium ion battery has high operating voltage, energy density big (in light weight), long circulation life, memory-less effect and nothing
The advantages that pollution, there is safe and reliable and energy fast charging and discharging again, turn into main force's power supply of each electronic product.By
It is the free of contamination secondary cell of environmental type in lithium ion battery, meeting the big development of countries nowadays energy environment protection aspect needs
Ask, increased sharply in the usage amount of all trades and professions.At present secondary lithium battery except be widely used in it is daily known to mobile phone,
Outside the digital electronic goods such as notebook computer and MP3, in recent years in terms of some high power batteries such as electric car, electric bicycle
Also have begun to use.
At present in lithium ion battery electrode using continuity coating production negative electrode and anode, coating be lithium ion battery just
Key link in the making of pole, good positive electrode have a direct impact to performances such as battery capacities.So-called coating just refers to pasty state
Polymer, molten polymer or polymer solution are coated on the method that composite membrane is made on film, for lithium ion battery
Speech, coated substrate (film) is metal foil, generally copper foil or aluminium foil.
Coating process will be put into coating machine (being referred to as unreeling) from substrate and out (claim from coating machine to the substrate after coating
To unreel) some series-operations and use laser cleaning localizing electrode surface after being coated with, to facilitate and tab welding.
But because in laser cleaning, aluminium foil or copper foil surface have high-temperature oxydation, cause aluminium foil or copper foil performance to reduce, because
This, this method reduce unit capacity after the service life of lithium ion battery.
Involved foamed glue band is made primarily directed to semiconductor, multi-layer ceramics pad and other minor items at present
Interim fixation in technique.For the sector application characteristic：It is required that at a certain temperature, it can foam and come off, separate well
Small electronic product.Therefore, its foamed glue being related to band emphasis is entered for starting blowing temperature or optimal foaming temperature
Professional etiquette is determined, and in foaming process, usually single temperature range, is seldom related to carrying out in different temperatures range intervals
Foaming, which is peeled off, to be required, so, the heat-expandable microsphere added is generally single microballoon, even or more foam microspheres mixing
Use, its temperature range is also essentially identical.
As in patent ZL 201110404492.7 different foam microspheres are carried out with related definition, but defined expansion is micro-
Ball is substantially left at 130 degree in the specific identical starting blowing temperature in same temperature section and optimal foaming temperature, its optimum temperature
It is right.There is also such in same patent JP-A-2002-003800, JP-A-2002-121505 or JP-A-2004-018761
Problem：Its blowing temperature is substantially single temperature range.Or the initial expansion temperature section base of different mixing expandable microspheres
This is overlapping.
In addition, also few correlations are reported for work application of the foamed glue band in lithium ion battery industry at present, more without reference to
To specific formula and multistage blowing temperature section.
The content of the invention
In view of this, the invention provides a kind of heat foamable glue, including the first heat-expandable microsphere and the second thermal expansivity
Microballoon；The particle diameter of first heat-expandable microsphere is 10~30 μm, and the initial temperature of its expansion is 70~100 DEG C；It is described
The particle diameter of second heat-expandable microsphere is 8~25 μm, and the initial temperature of its foaming is 90~120 DEG C.
In some embodiments, the maximum swelling temperature of first heat-expandable microsphere is 105~140 DEG C；It is described
The maximum swelling temperature of second heat-expandable microsphere is 125~155 DEG C.
In some embodiments, the mass ratio of first heat-expandable microsphere and second heat-expandable microsphere
For 1：8~1：2.
Present invention also offers a kind of preparation method of heat foamable glue, including：
S10：First heat-expandable microsphere and the second heat-expandable microsphere are filtered out by particle size analyzer；First heat
The particle diameter of dilatancy microballoon is 10~30 μm；The particle diameter of second heat-expandable microsphere is 8~25 μm；
S20：The first heat-expandable microsphere obtained in S10 and the second heat-expandable microsphere are mixed, stirred obtained
Mix microballoon；
S30：It is well mixed microballoon is mixed made from step S20 with acrylate pressure-sensitive adhesive.
In some embodiments, the initial temperature of the expansion of first heat-expandable microsphere is 70~100 DEG C.
In some embodiments, the initial temperature of the expansion of second heat-expandable microsphere is 90~120 DEG C.
In some embodiments, the maximum swelling temperature of first heat-expandable microsphere is 105~140 DEG C.
In some embodiments, the maximum swelling temperature of second heat-expandable microsphere is 125~155 DEG C.
In some embodiments, the mass ratio of first heat-expandable microsphere and second heat-expandable microsphere
For 1：8~1：2.
In some embodiments, microballoon is mixed in the step S30 with acrylate pressure-sensitive adhesive using mass ratio as 1:6~
1:1 is well mixed.
The advantages of heat foamable glue provided by the invention and preparation method thereof, is：
For in lithium ion battery industry using heat sensitive adhesive tape main purpose be in order to guard electrode be coated with continuity it is poly-
During compound slurry, protect substrate so that substrate without laser cleaning can direct soldering polar ear, avoid substrate swash
During light cleans, because temperature is too high and oxidized, the phenomenon that causes the performance of substrate to reduce.Therefore, except requiring：It is full
Outside the certain starting blowing temperature of foot and maximum swelling temperature, it is necessary to mobility, baking with reference to the polymer paste of coating
Need to the association outside heat sensitive adhesive tape protection zone while also to combine actual operation during technique and foaming and intumescing.
It is understood that when rear end (using coating sizing-agent drying as node) foams, easily occur and heat sensitive adhesive tape surface
The polymer paste thickness increase in the region that surrounding is connected, while groove shape also be present.Equally, in front end foaming, easily go out
The lug bonding pad of existing polymer paste pollution heat sensitive adhesive tape protection, and in heat sensitive adhesive tape foaming process, because curling easily goes out
Now glue the polymer paste of the lug bonding pad of the non-thermal sensitive tape protection of damage.
Two kinds of different heat-expandable microspheres of blowing temperature are mixed obtained heat hair by the heat foamable glue of the present invention
Steep glue, to heat sensitive adhesive tape foaming when, heat sensitive adhesive tape not only can be by the expansion Automatic-falling of heat foamable glue, while may be used also
The different temperatures section of control is foamed, and meets different foaming effects.The degree and enter that control heat sensitive adhesive tape is peeled off by substrate
Journey.
In summary, the present invention has the advantages of above-mentioned many and practical value, and there are no in like product similar
Method publish or use and really belong to innovation.It provide not only a kind of heat foamable glue and preparation method thereof.And the technique
In the case of lower-cost, you can accurately find out the important parameter in the preparation technology of lithium battery.Greatly reduce lithium
Financial cost in the production of battery.Moreover, the unit capacity of lithium ion battery can be improved effectively, lithium-ion electric is improved
The service life in pond.
Brief description of the drawings
It should be appreciated that the following drawings illustrate only certain embodiments of the present invention, therefore it is not construed as to model
The restriction enclosed, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to these
Accompanying drawing obtains other related accompanying drawings.
Fig. 1 is the flow chart of the preparation method of the heat foamable glue of an embodiment of the present invention.
Embodiment
The claim of the present invention is described in further detail with reference to the mode of specific embodiment, following
Many details are elaborated in description in order to fully understand the present invention.
But the invention can be embodied in many other ways as described herein, those skilled in the art can be with
Similar improvement is done in the case of without prejudice to intension of the present invention, therefore the present invention is not limited to the specific embodiments disclosed below.
Referring to Fig. 1, the invention provides a kind of heat foamable glue, including the first heat-expandable microsphere and the second thermal expansivity it is micro-
Ball；The particle diameter of first heat-expandable microsphere is 10~30 μm, and the initial temperature of its expansion is 70~100 DEG C；Described
The particle diameter of two heat-expandable microspheres is 8~25 μm, and the initial temperature of its foaming is 90~120 DEG C.
Further, the maximum swelling temperature of first heat-expandable microsphere is 105~140 DEG C；Second heat is swollen
The maximum swelling temperature of swollen property microballoon is 125~155 DEG C.
Further, the mass ratio of first heat-expandable microsphere and second heat-expandable microsphere is 1：8~
1：2.
Present invention also offers a kind of preparation method of heat foamable glue, including：
S10：First heat-expandable microsphere and the second heat-expandable microsphere are filtered out by particle size analyzer；First heat
The particle diameter of dilatancy microballoon is 10~30 μm；The particle diameter of second heat-expandable microsphere is 8~25 μm；
S20：The first heat-expandable microsphere obtained in S10 and the second heat-expandable microsphere are mixed, stirred obtained
Mix microballoon；
S30：It is well mixed microballoon is mixed made from step S20 with acrylate pressure-sensitive adhesive.
Further, the initial temperature of the expansion of first heat-expandable microsphere is 70~100 DEG C.
Further, the initial temperature of the expansion of second heat-expandable microsphere is 90~120 DEG C.
Further, the maximum swelling temperature of first heat-expandable microsphere is 105~140 DEG C.
Further, the maximum swelling temperature of second heat-expandable microsphere is 125~155 DEG C.
Further, the mass ratio of first heat-expandable microsphere and second heat-expandable microsphere is 1：8~
1：2.
Further, microballoon is mixed in the step S30 with acrylate pressure-sensitive adhesive using mass ratio as 1:6~1:1 mixing
Uniformly.
It is above-mentioned, in lithium ion battery industry using heat sensitive adhesive tape main purpose be in order to guard electrode continuity apply
During cloth polymer paste, protect substrate so that substrate without laser cleaning can direct soldering polar ear, avoid substrate
During laser cleaning, because temperature is too high and oxidized, the phenomenon that causes the performance of substrate to reduce.Therefore, except wanting
Ask：Meet outside certain starting blowing temperature and maximum swelling temperature, it is necessary to mobility with reference to the polymer paste of coating,
Need to the association outside heat sensitive adhesive tape protection zone while also to combine actual operation during baking process and foaming and intumescing.
It is understood that when rear end (using coating sizing-agent drying as node) foams, easily occur and heat sensitive adhesive tape surface
The polymer paste thickness increase in the region that surrounding is connected, while groove shape also be present.Equally, in front end foaming, easily go out
The lug bonding pad of existing polymer paste pollution heat sensitive adhesive tape protection, and in heat sensitive adhesive tape foaming process, because curling easily goes out
Now glue the polymer paste of the lug bonding pad of the non-thermal sensitive tape protection of damage.
Two kinds of different heat-expandable microspheres of blowing temperature are mixed obtained heat hair by the heat foamable glue of the present invention
Steep glue, to heat sensitive adhesive tape foaming when, heat sensitive adhesive tape not only can be by the expansion Automatic-falling of heat foamable glue, while may be used also
The different temperatures section of control is foamed, and meets different foaming effects.The degree and enter that control heat sensitive adhesive tape is peeled off by substrate
Journey.
In summary, the present invention has the advantages of above-mentioned many and practical value, and there are no in like product similar
Method publish or use and really belong to innovation.It provide not only a kind of heat foamable glue and preparation method thereof.And the technique
In the case of lower-cost, you can accurately find out the important parameter in the preparation technology of lithium battery.Greatly reduce lithium
Financial cost in the production of battery.Moreover, the unit capacity of lithium ion battery can be improved effectively, lithium-ion electric is improved
The service life in pond.
It is to be appreciated that the preparation that the heat foamable glue can be not only used for lithium battery can be also used for other species batteries
Preparation
For the ease of understanding the present invention, technical scheme is further illustrated with reference to embodiment.Applicant
Statement, the present invention illustrate the detailed process equipment of the present invention and technological process, but not office of the invention by above-described embodiment
It is limited to above-mentioned detailed process equipment and technological process, that is, does not mean that the present invention should rely on above-mentioned detailed process equipment and technique stream
Cheng Caineng is implemented.Person of ordinary skill in the field is it will be clearly understood that any improvement in the present invention, to each original of product of the present invention
The equivalence replacement of material and the addition of auxiliary element, the selection of concrete mode etc., all fall within protection scope of the present invention and open model
Within enclosing.
Embodiment 1
Particle diameter is filtered out as 10 μm by particle size analyzer, the initial temperature of foaming is 70 DEG C, and maximum swelling temperature is 105
DEG C the first heat-expandable microsphere, and particle diameter is 8 μm, and the initial temperature of foaming is 90 DEG C, and maximum swelling temperature is 125 DEG C the
Two heat-expandable microspheres；
S20：It is 1 by the first heat-expandable microsphere obtained in S10 and the second heat-expandable microsphere example in mass ratio：8 is mixed
1h is stirred after conjunction, is stirred.
S30：Microballoon will be mixed made from step S20 with acrylate pressure-sensitive adhesive using mass ratio as 1:6 well mixed mixing
Uniformly.
Embodiment 2
Particle diameter is filtered out as 30 μm by particle size analyzer, the initial temperature of foaming is 100 DEG C, and maximum swelling temperature is
140 DEG C of the first heat-expandable microsphere, and particle diameter are 25 μm, and the initial temperature of foaming is 120 DEG C, and maximum swelling temperature is
155 DEG C of second heat-expandable microsphere；
S20：It is 1 by the first heat-expandable microsphere obtained in S10 and the second heat-expandable microsphere example in mass ratio：2 is mixed
10h is stirred after conjunction, is stirred.
S30：Microballoon will be mixed made from step S20 with acrylate pressure-sensitive adhesive using mass ratio as 1:3 well mixed mixing
Uniformly.
Embodiment 3
Particle diameter is filtered out as 15 μm by particle size analyzer, the initial temperature of foaming is 80 DEG C, and maximum swelling temperature is 130
DEG C the first heat-expandable microsphere, and particle diameter is 15 μm, and the initial temperature of foaming is 100 DEG C, and maximum swelling temperature is 135 DEG C
Second heat-expandable microsphere；
S20：It is 1 by the first heat-expandable microsphere obtained in S10 and the second heat-expandable microsphere example in mass ratio：4 is mixed
5h is stirred after conjunction, is stirred.
S30：Microballoon will be mixed made from step S20 with acrylate pressure-sensitive adhesive using mass ratio as 1:1 well mixed mixing
Uniformly.
Embodiment 4
Particle diameter is filtered out as 20 μm by particle size analyzer, the initial temperature of foaming is 85 DEG C, and maximum swelling temperature is 115
DEG C the first heat-expandable microsphere, and particle diameter is 20 μm, and the initial temperature of foaming is 95 DEG C, and maximum swelling temperature is 140 DEG C
Second heat-expandable microsphere；
S20：It is 1 by the first heat-expandable microsphere obtained in S10 and the second heat-expandable microsphere example in mass ratio：5 is mixed
6h is stirred after conjunction, is stirred.
S30：Microballoon will be mixed made from step S20 with acrylate pressure-sensitive adhesive using mass ratio as 1:2 well mixed mixing
Uniformly.
Embodiment 5
Particle diameter is filtered out as 18 μm by particle size analyzer, the initial temperature of foaming is 77 DEG C, and maximum swelling temperature is 136
DEG C the first heat-expandable microsphere, and particle diameter is 12 μm, and the initial temperature of foaming is 95 DEG C, and maximum swelling temperature is 140 DEG C
Second heat-expandable microsphere；
S20：It is 1 by the first heat-expandable microsphere obtained in S10 and the second heat-expandable microsphere example in mass ratio：3 is mixed
8h is stirred after conjunction, is stirred.
S30：Microballoon will be mixed made from step S20 with acrylate pressure-sensitive adhesive using mass ratio as 1:5 well mixed mixing
Uniformly.
Embodiment 6
Particle diameter is filtered out as 12 μm by particle size analyzer, the initial temperature of foaming is 93 DEG C, and maximum swelling temperature is 124
DEG C the first heat-expandable microsphere, and particle diameter is 12 μm, and the initial temperature of foaming is 95 DEG C, and maximum swelling temperature is 140 DEG C
Second heat-expandable microsphere；
S20：It is 1 by the first heat-expandable microsphere obtained in S10 and the second heat-expandable microsphere example in mass ratio：3 is mixed
8h is stirred after conjunction, is stirred.
S30：Microballoon will be mixed made from step S20 with acrylate pressure-sensitive adhesive using mass ratio as 1:4 well mixed mixing
Uniformly.
Embodiment 7
Particle diameter is filtered out as 22 μm by particle size analyzer, the initial temperature of foaming is 82 DEG C, and maximum swelling temperature is 129
DEG C the first heat-expandable microsphere, and particle diameter is 22 μm, and the initial temperature of foaming is 104 DEG C, and maximum swelling temperature is 133 DEG C
Second heat-expandable microsphere；
S20：It is 1 by the first heat-expandable microsphere obtained in S10 and the second heat-expandable microsphere example in mass ratio：4 is mixed
10h is stirred after conjunction, is stirred.
S30：Microballoon will be mixed made from step S20 with acrylate pressure-sensitive adhesive using mass ratio as 1:2 well mixed mixing
Uniformly.
Embodiment 8
Particle diameter is filtered out as 14 μm by particle size analyzer, the initial temperature of foaming is 74 DEG C, and maximum swelling temperature is 132
DEG C the first heat-expandable microsphere, and particle diameter is 16 μm, and the initial temperature of foaming is 92 DEG C, and maximum swelling temperature is 137 DEG C
Second heat-expandable microsphere；
S20：It is 1 by the first heat-expandable microsphere obtained in S10 and the second heat-expandable microsphere example in mass ratio：3 is mixed
3h is stirred after conjunction, is stirred.
S30：Microballoon will be mixed made from step S20 with acrylate pressure-sensitive adhesive using mass ratio as 1:6 well mixed mixing
Uniformly.
Embodiment 9
Particle diameter is filtered out as 27 μm by particle size analyzer, the initial temperature of foaming is 90 DEG C, and maximum swelling temperature is 105
DEG C the first heat-expandable microsphere, and particle diameter is 9 μm, and the initial temperature of foaming is 118 DEG C, and maximum swelling temperature is 152 DEG C
Second heat-expandable microsphere；
S20：It is 1 by the first heat-expandable microsphere obtained in S10 and the second heat-expandable microsphere example in mass ratio：8 is mixed
1h is stirred after conjunction, is stirred.
S30：Microballoon will be mixed made from step S20 with acrylate pressure-sensitive adhesive using mass ratio as 1:1 well mixed mixing
Uniformly.
Applicant states that the present invention can only for of the invention by a series of describe in detail of those listed above
Row embodiment illustrates, but the invention is not limited in above-mentioned detailed process equipment and technological process.And i.e. not
Mean that the present invention should rely on above-mentioned detailed process equipment and technological process and could implement.Person of ordinary skill in the field should
This is clear, any improvement in the present invention, and the equivalence replacement and auxiliary element to each raw material of product of the present invention are added, are specific square
Selection of formula etc., within the scope of all falling within protection scope of the present invention and disclosing.
Claims (10)
1. heat foamable glue, it is characterised in that：Including the first heat-expandable microsphere and the second heat-expandable microsphere；First heat is swollen
The particle diameter of swollen property microballoon is 10~30 μm, and the initial temperature of its expansion is 70~100 DEG C；Second heat-expandable microsphere
Particle diameter is 8~25 μm, and the initial temperature of its foaming is 90~120 DEG C.
2. heat foamable glue as claimed in claim 1, it is characterised in that：The maximum swelling temperature of first heat-expandable microsphere
For 105~140 DEG C；The maximum swelling temperature of second heat-expandable microsphere is 125~155 DEG C.
3. heat foamable glue as claimed in claim 1, it is characterised in that：First heat-expandable microsphere and second heat are swollen
The mass ratio of swollen property microballoon is 1：8~1：2.
4. the preparation method of heat foamable glue as claimed in claim 1, it is characterised in that：Including：
S10：First heat-expandable microsphere and the second heat-expandable microsphere are filtered out by particle size analyzer；First thermal expansion
Property microballoon particle diameter be 10~30 μm；The particle diameter of second heat-expandable microsphere is 8~25 μm；
S20：The first heat-expandable microsphere obtained in S10 and the second heat-expandable microsphere are mixed, stirs and mixing is made
Microballoon；
S30：It is well mixed microballoon is mixed made from step S20 with acrylate pressure-sensitive adhesive.
5. the preparation method of heat foamable glue as claimed in claim 4, it is characterised in that：First heat-expandable microsphere it is swollen
Swollen initial temperature is 70~100 DEG C.
6. the preparation method of heat foamable glue as claimed in claim 4, it is characterised in that：Second heat-expandable microsphere it is swollen
Swollen initial temperature is 90~120 DEG C.
7. the preparation method of heat foamable glue as claimed in claim 4, it is characterised in that：First heat-expandable microsphere is most
Big expansion temperature is 105~140 DEG C.
8. the preparation method of heat foamable glue as claimed in claim 4, it is characterised in that：Second heat-expandable microsphere is most
Big expansion temperature is 125~155 DEG C.
9. the preparation method of heat foamable glue as claimed in claim 4, it is characterised in that：First heat-expandable microsphere and institute
The mass ratio for stating the second heat-expandable microsphere is 1：8~1：2.
10. the preparation method of heat foamable glue as claimed in claim 4, it is characterised in that：In the step S30 mix microballoon with
Acrylate pressure-sensitive adhesive is using mass ratio as 1:6~1:1 is well mixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610579298.5A CN107641485A (en) | 2016-07-21 | 2016-07-21 | Heat foamable glue and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610579298.5A CN107641485A (en) | 2016-07-21 | 2016-07-21 | Heat foamable glue and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107641485A true CN107641485A (en) | 2018-01-30 |
Family
ID=61108848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610579298.5A Pending CN107641485A (en) | 2016-07-21 | 2016-07-21 | Heat foamable glue and preparation method thereof |
Country Status (1)
| Country | Link |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102559101A (en) * | 2011-12-07 | 2012-07-11 | 新丰杰力电工材料有限公司 | Thermal-spalling acrylic ester pressure-sensitive adhesive, adhesive tape and preparation method thereof |
| CN104371610A (en) * | 2014-12-03 | 2015-02-25 | 新丰杰力电工材料有限公司 | Preparation method and application of thermal-peeling acrylic ester pressure-sensitive adhesive |
| CN105419669A (en) * | 2015-12-25 | 2016-03-23 | 新丰杰力电工材料有限公司 | Production method of thermal-stripping acrylate pressure-sensitive adhesive tape |
-
2016
- 2016-07-21 CN CN201610579298.5A patent/CN107641485A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102559101A (en) * | 2011-12-07 | 2012-07-11 | 新丰杰力电工材料有限公司 | Thermal-spalling acrylic ester pressure-sensitive adhesive, adhesive tape and preparation method thereof |
| CN104371610A (en) * | 2014-12-03 | 2015-02-25 | 新丰杰力电工材料有限公司 | Preparation method and application of thermal-peeling acrylic ester pressure-sensitive adhesive |
| CN105419669A (en) * | 2015-12-25 | 2016-03-23 | 新丰杰力电工材料有限公司 | Production method of thermal-stripping acrylate pressure-sensitive adhesive tape |
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