CN107634132A - A kind of burst of ultraviolel white light LEDs containing Two Colour Fluorescence powder and preparation method thereof - Google Patents
A kind of burst of ultraviolel white light LEDs containing Two Colour Fluorescence powder and preparation method thereof Download PDFInfo
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- CN107634132A CN107634132A CN201710894837.9A CN201710894837A CN107634132A CN 107634132 A CN107634132 A CN 107634132A CN 201710894837 A CN201710894837 A CN 201710894837A CN 107634132 A CN107634132 A CN 107634132A
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- colour fluorescence
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- light leds
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Abstract
The invention discloses a kind of burst of ultraviolel white light LEDs containing Two Colour Fluorescence powder, the white light LEDs include UV LED chip, the Two Colour Fluorescence arogel body that yellow fluorescent powder, blue colour fluorescent powder and phosphor gel are mixed to form, Two Colour Fluorescence arogel body is coated on UV LED chip, the mass ratio of curing agent added with 1 ~ 5wt% in the Two Colour Fluorescence arogel body, the Two Colour Fluorescence powder and phosphor gel is 1:2~3.The white light LEDs are using UV LED chip as matrix, and with ultraviolet excitation Two Colour Fluorescence colloid, colloid used is not easy to be decomposed by ultraviolet light and ozone, and no double bond is present, at high temperature(Or radiation exposure)The chemical bond of molecule is not broken, long-term use of, is not cracked, is non-sclerous, colloid can heal automatically after being ftractureed by external force.
Description
Technical field
The invention belongs to White light LED technology field, and in particular to a kind of burst of ultraviolel white light LEDs containing Two Colour Fluorescence powder
And preparation method thereof.
Background technology
GaN is a kind of wide bandgap compound semiconductors material, have transmitting blue light, high temperature, high frequency, high pressure, it is high-power and
The features such as acidproof, alkaline-resisting, corrosion-resistant, it is one of most important semi-conducting material after germanium, silicon and GaAs.So that it is in indigo plant
Light and ultraviolet photoelectron technical field occupy critical role, and make high temperature, the ideal material of large power semiconductor device.
At present, gallium nitride based LED obtains white light main method and had:Blue-ray LED+yellow fluorescent powder, three-color LED synthesis are white
3 kinds of light, purple LED+three-color phosphor methods.
Commercial white light LEDs are to utilize GaN base matter LED chip and the surface for launching 450-470 nano blue lights at present
The blue light of coating excites the yttrium aluminate fluorescent material of the fluorescent material of yellow emission, mainly cerium dopping.This commercial fluorescent material
In the presence of some shortcomings, the unstability of mainly poor color saturation and colour temperature.Poor color saturation is due to be lacked in white light
Few red light portion, the unstability of colour temperature are due to caused by use for a long time makes LED and fluorescent material performance degradation.
For white light LEDs, the current country is primarily present following patent document:
Publication No. 106876544A Chinese patent disclose a kind of spontaneous White-light LED chip structure of GaN base unstressed configuration powder and
Its preparation method, wherein preparation method include:It is thin that GaN cushions, N-type GaN, silica are sequentially depositing on a sapphire substrate
Film.Using photoetching technique along Sapphire Substrate [1-100] and [11-20] crystal orientation in described SiO2Perform etching, make on film
Standby SiO2Mask.Grow N-type GaN, InGaN/GaN SQW, p-type GaN, transparency conducting layer successively in silicon dioxide mask layer
And prepare N-type and P-type electrode.The present invention takes into account the current conventional semiconductor devices technological process of production, it is possible to achieve
Ejecting white light under conditions of unstressed configuration powder, avoid influence of the fluorescent material to the attenuation of white light LEDs.
The content of the invention
To solve above-mentioned problem, it is an object of the invention to provide a kind of burst of ultraviolel containing Two Colour Fluorescence powder
White light LEDs and preparation method thereof, the white light LEDs are using UV LED chip as matrix, with ultraviolet excitation Two Colour Fluorescence colloid, institute
It is not easy to be decomposed by ultraviolet light and ozone with colloid, no double bond is present, at high temperature(Or radiation exposure)The chemical bond of molecule is not
Fracture, it is long-term use of, it is not cracked, is non-sclerous, colloid can heals automatically after being ftractureed by external force.
To reach above-mentioned purpose, the technical scheme is that:
A kind of burst of ultraviolel white light LEDs containing Two Colour Fluorescence powder, the white light LEDs include UV LED chip, yellow fluorescent powder,
The Two Colour Fluorescence arogel body that blue colour fluorescent powder is mixed to form with phosphor gel, Two Colour Fluorescence arogel body are coated on UV LED chip,
The mass ratio of curing agent added with 1 ~ 5wt% in the Two Colour Fluorescence arogel body, the Two Colour Fluorescence powder and phosphor gel is 1:
2~3。
Further, the glue material of the phosphor gel is silica gel, including A glue and B glue, and the mass ratio of A glue and B glue is 1:1~2.
Preferably, the mass ratio of the A glue and B glue is 1:1.
Preferably, A glue viscosity at 25 DEG C is 7500mPas, and B glue viscosity at 25 DEG C is 4000mPas.
Preferably, the curing agent is siloxanes.
Meanwhile the present invention also provides a kind of preparation method of the burst of ultraviolel white light LEDs containing Two Colour Fluorescence powder, the system
Preparation Method comprises the following steps:1) extracting container, A glue and B glue, mix 10 ~ 20 minutes under 30 ~ 40 revs/min of rotating speed, very
Empty deaeration 7 ~ 8 minutes, obtains phosphor gel;2) yellow fluorescent powder, blue colour fluorescent powder, curing agent are added, in 70 ~ 80 revs/min turn
The lower stirring of speed 20 ~ 30 minutes, obtains Two Colour Fluorescence arogel body;3) solidify:Two Colour Fluorescence arogel body 40 ~ 60 is toasted at 85 ~ 90 DEG C
Minute, then be warming up to 100 ~ 120 DEG C and toast 1.5 ~ 2.5 hours;4) the white fluorescent powder colloid after step 3) is solidified, which is injected, to be applied
UV LED chip surface is overlying on, produces the burst of ultraviolel white light LEDs containing Two Colour Fluorescence powder.
Further, gained phosphor gel viscosity at 25 DEG C is 5500mPas after mixing.
Preferably, refractive index is 1.45 at 25 DEG C of white fluorescent powder colloid after the step 3) solidification.
The invention has the advantages that:
The white light LEDs are using UV LED chip as matrix, and with ultraviolet excitation Two Colour Fluorescence colloid, colloid used is not easy ultraviolet
Light and ozone are decomposed, and no double bond is present, at high temperature(Or radiation exposure)The chemical bond of molecule is not broken, long-term use of, no
It is cracked, is non-sclerous, colloid can heals automatically after being ftractureed by external force.
Embodiment
Below by specific embodiment, the present invention is described further, but embodiment is not intended to limit the protection of the present invention
Scope.
A kind of burst of ultraviolel white light LEDs containing Two Colour Fluorescence powder provided by the present invention, the white light LEDs include
UV LED chip, the Two Colour Fluorescence arogel body that yellow fluorescent powder, blue colour fluorescent powder and phosphor gel are mixed to form, Two Colour Fluorescence powder
Colloid is added with 1 ~ 5wt% curing agent, the Two Colour Fluorescence powder coated on UV LED chip in the Two Colour Fluorescence arogel body
Mass ratio with phosphor gel is 1:2~3.
Further, the glue material of the phosphor gel is silica gel, including A glue and B glue, and the mass ratio of A glue and B glue is 1:1~2.
Preferably, the mass ratio of the A glue and B glue is 1:1.
Preferably, A glue viscosity at 25 DEG C is 7500mPas, and B glue viscosity at 25 DEG C is 4000mPas.
Preferably, the curing agent is siloxanes.
Meanwhile the present invention also provides a kind of preparation method of the burst of ultraviolel white light LEDs containing Two Colour Fluorescence powder, the system
Preparation Method comprises the following steps:1) extracting container, A glue and B glue, mix 10 ~ 20 minutes under 30 ~ 40 revs/min of rotating speed, very
Empty deaeration 7 ~ 8 minutes, obtains phosphor gel;2) yellow fluorescent powder, blue colour fluorescent powder, curing agent are added, in 70 ~ 80 revs/min turn
The lower stirring of speed 20 ~ 30 minutes, obtains Two Colour Fluorescence arogel body;3) solidify:Two Colour Fluorescence arogel body 40 ~ 60 is toasted at 85 ~ 90 DEG C
Minute, then be warming up to 100 ~ 120 DEG C and toast 1.5 ~ 2.5 hours;4) the white fluorescent powder colloid after step 3) is solidified, which is injected, to be applied
UV LED chip surface is overlying on, produces the burst of ultraviolel white light LEDs containing Two Colour Fluorescence powder.
Further, gained phosphor gel viscosity at 25 DEG C is 5500mPas after mixing.
Preferably, refractive index is 1.45 at 25 DEG C of white fluorescent powder colloid after the step 3) solidification.
It should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention and it is unrestricted.Although with reference to compared with
The present invention is described in detail good embodiment, it will be understood by those within the art that, can be to the technology of invention
Scheme is modified or equivalent substitution, and without departing from the scope of technical solution of the present invention, it all should cover the power in the present invention
In sharp claimed range.
Claims (8)
1. a kind of burst of ultraviolel white light LEDs containing Two Colour Fluorescence powder, it is characterised in that the white light LEDs include UVLED cores
Piece, the Two Colour Fluorescence arogel body that yellow fluorescent powder, blue colour fluorescent powder and phosphor gel are mixed to form, the coating of Two Colour Fluorescence arogel body
In on UV LED chip, 1 ~ 5wt% curing agent, the Two Colour Fluorescence powder and fluorescent material are added with the Two Colour Fluorescence arogel body
The mass ratio of glue is 1:2~3.
2. the burst of ultraviolel white light LEDs according to claim 1 containing Two Colour Fluorescence powder, it is characterised in that the fluorescence
The glue material of arogel is silica gel, including A glue and B glue, and the mass ratio of A glue and B glue is 1:1~2.
3. the burst of ultraviolel white light LEDs according to claim 2 containing Two Colour Fluorescence powder, it is characterised in that the A glue and
The mass ratio of B glue is 1:1.
4. the burst of ultraviolel white light LEDs according to claim 2 containing Two Colour Fluorescence powder, it is characterised in that the A glue exists
Viscosity is 7500mPas at 25 DEG C, and B glue viscosity at 25 DEG C is 4000mPas.
5. the burst of ultraviolel white light LEDs according to claim 1 containing Two Colour Fluorescence powder, it is characterised in that the solidification
Agent is siloxanes.
A kind of 6. preparation side of burst of ultraviolel white light LEDs containing Two Colour Fluorescence powder as any one of claim 1 ~ 5
Method, it is characterised in that the preparation method comprises the following steps:1) extracting container, A glue and B glue, under 30 ~ 40 revs/min of rotating speed
Mix 10 ~ 20 minutes, vacuum defoamation 7 ~ 8 minutes, obtain phosphor gel;2) yellow fluorescent powder, blue colour fluorescent powder, solidification are added
Agent, stirred 20 ~ 30 minutes under 70 ~ 80 revs/min of rotating speed, obtain Two Colour Fluorescence arogel body;3) solidify:Toasted at 85 ~ 90 DEG C
Two Colour Fluorescence arogel body 40 ~ 60 minutes, then be warming up to 100 ~ 120 DEG C and toast 1.5 ~ 2.5 hours;4) it is white after step 3) is solidified
The injection of color fluorescent powder colloid is coated on UV LED chip surface, produces the burst of ultraviolel white light LEDs containing Two Colour Fluorescence powder.
7. a kind of preparation method of burst of ultraviolel white light LEDs containing Two Colour Fluorescence powder according to claim 6, its feature
It is, gained phosphor gel viscosity at 25 DEG C is 5500mPas after mixing.
8. a kind of preparation method of burst of ultraviolel white light LEDs containing Two Colour Fluorescence powder according to claim 6, its feature
It is, refractive index is 1.45 at 25 DEG C of white fluorescent powder colloid after the step 3) solidification.
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102229802A (en) * | 2011-04-14 | 2011-11-02 | 东北师范大学 | Rare earth double primary colour luminescent material for converting white light by utilizing violet light LED (light-emitting diode) and preparation method thereof |
CN102376857A (en) * | 2011-11-18 | 2012-03-14 | 杭州五湖电子有限公司 | Packaging method for light-emitting manner of LED (Light-Emitting Diode) with specific wavelength |
CN102637806A (en) * | 2012-04-13 | 2012-08-15 | 厦门多彩光电子科技有限公司 | Dispensing method applicable to flip chip |
CN106784177A (en) * | 2016-11-30 | 2017-05-31 | 深圳市聚飞光电股份有限公司 | A kind of method for packing of quantum dot LED lamp bead |
-
2017
- 2017-09-28 CN CN201710894837.9A patent/CN107634132A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102229802A (en) * | 2011-04-14 | 2011-11-02 | 东北师范大学 | Rare earth double primary colour luminescent material for converting white light by utilizing violet light LED (light-emitting diode) and preparation method thereof |
CN102376857A (en) * | 2011-11-18 | 2012-03-14 | 杭州五湖电子有限公司 | Packaging method for light-emitting manner of LED (Light-Emitting Diode) with specific wavelength |
CN102637806A (en) * | 2012-04-13 | 2012-08-15 | 厦门多彩光电子科技有限公司 | Dispensing method applicable to flip chip |
CN106784177A (en) * | 2016-11-30 | 2017-05-31 | 深圳市聚飞光电股份有限公司 | A kind of method for packing of quantum dot LED lamp bead |
Non-Patent Citations (1)
Title |
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尤凤翔,张猛: "《LED照明设计与封装技术应用》", 31 October 2015 * |
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Application publication date: 20180126 |