CN107622946A - The anti-stress automatic molding process of stamp-mounting-paper diode - Google Patents
The anti-stress automatic molding process of stamp-mounting-paper diode Download PDFInfo
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- CN107622946A CN107622946A CN201710917744.3A CN201710917744A CN107622946A CN 107622946 A CN107622946 A CN 107622946A CN 201710917744 A CN201710917744 A CN 201710917744A CN 107622946 A CN107622946 A CN 107622946A
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- paper diode
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Abstract
The invention discloses the anti-stress automatic molding process of stamp-mounting-paper diode, including：(1) the step of making the upper and lower framework of stamp-mounting-paper diode and matched moulds；(2) the step of welding；(3) the step of plastic packaging；(4) the step of solidifying and electroplate；(5) the step of rib cutting bending and molding；(6) the step of Reflow Soldering；(7) the step of examining simultaneously shipment；Wherein, step (5) includes bending twice, is followed successively by hydraulic press and pre-bends and automatic corner crimping machine bending and molding.The present invention employs bending twice in Trim Molding, first passes through hydraulic press increase and pre-bends step, then completes whole bending step by automatic corner crimping machine, reduces the stress of bent angle, improves product quality, while do not reduce production efficiency.
Description
Technical field
The invention belongs to diode technologies field, specifically a kind of anti-stress automatic molding process of stamp-mounting-paper diode.
Background technology
There is stress by the bent angle of conventionally produced stamp-mounting-paper diode, and stress can then influence the electrical yield of product
And unfailing performance, so as to cause product to be failed during later stage use.At present, because the factors such as stress cause such production
The electrical yield of product is only 93%.
The content of the invention
The present invention is in order to overcome the above-mentioned deficiencies of the prior art, there is provided a kind of rib cutting bending bent angle stress of can reducing
The anti-stress automatic molding process of stamp-mounting-paper diode, including：
(1) the step of making the upper and lower framework of stamp-mounting-paper diode and matched moulds；
(2) the step of welding；
(3) the step of plastic packaging；
(4) the step of solidifying and electroplate；
(5) the step of rib cutting bending and molding；
(6) the step of Reflow Soldering；
(7) the step of examining simultaneously shipment；
Wherein, step (5) includes bending twice, is followed successively by hydraulic press and pre-bends and automatic corner crimping machine bending and molding.
The anti-stress automatic molding process of stamp-mounting-paper diode of the present invention, step (1) are：Lower tablet → sieve → the material of crystal grain filling
The piece filling underframe → upper tablet → sieve of the crystal grain filling → upper framework → upper and lower framework matched moulds of tablet filling.
The anti-stress automatic molding process of stamp-mounting-paper diode of the present invention, using tin cream as viscose glue when loading in step (1).
The anti-stress automatic molding process of stamp-mounting-paper diode of the present invention, step (2) carry out conventional weldering using tunnel soldering furnace
Connect, filled with hydrogen or nitrogen as protective gas in stove, and the material being welded is cleaned and dried after welding.
The anti-stress automatic molding process of stamp-mounting-paper diode of the present invention, step (3) carries out plastic packaging using epoxy resin, after plastic packaging
The solidification and plating of routine are carried out successively.
The anti-stress automatic molding process of stamp-mounting-paper diode of the present invention, step (6) is using the reflow soldering material good to rib cutting
Carry out Reflow Soldering, Reflow Soldering includes eight humidity provinces, eight area's temperature be followed successively by 150 DEG C, 160 DEG C, 180 DEG C, 190 DEG C, 230 DEG C,
240℃、280℃、280℃；The chain speed of reflow soldering conveyer belt is 97-103cm/min, and the good material of rib cutting exists in temperature
The time of 240 DEG C of area above is 10-30s.
The anti-stress automatic molding process of stamp-mounting-paper diode of the present invention, the material after Reflow Soldering are cased after natural cooling, then
The shipment after TMTT test passes.
The beneficial effects of the invention are as follows：Relative to prior art, the present invention employs bending twice in Trim Molding, first
Pre-bended step by hydraulic press increase, then whole bending step completed by automatic corner crimping machine, reduce the stress of bent angle,
Product quality is improved, while does not reduce production efficiency.
Embodiment
The present invention is further detailed explanation now.
Embodiment 1
A kind of anti-stress automatic molding process of stamp-mounting-paper diode, including：
(1) the step of making the upper and lower framework of stamp-mounting-paper diode and matched moulds：Lower tablet → the sieve of crystal grain filling → tablet filling
Underframe → upper tablet → the sieve of the crystal grain filling → upper framework → upper and lower framework matched moulds of tablet filling；
(2) conventional welding is carried out using tunnel soldering furnace, high-purity hydrogen is filled with stove as protective gas, and welding
The material being welded is cleaned and dried to prevent oxidation after connecing；
(3) the step of plastic packaging being carried out using epoxy resin；
(4) using solidified and electroplated by the way of conventional the step of；
(5) the step of rib cutting bending and molding：Hydraulic press pre-bends → automatic corner crimping machine bending and molding；
(6) Reflow Soldering is carried out using the reflow soldering material good to rib cutting, Reflow Soldering includes eight humidity provinces, eight area's temperature
It is followed successively by 150 DEG C, 160 DEG C, 180 DEG C, 190 DEG C, 230 DEG C, 240 DEG C, 280 DEG C, 280 DEG C；The chain speed of reflow soldering conveyer belt is
100cm/min, and the good material of rib cutting is 20s in the time of 240 DEG C of area above in temperature；Material after Reflow Soldering is through nature
Cased after cooling；
(7) after TMTT test passes the step of shipment.
Embodiment 2
A kind of anti-stress automatic molding process of stamp-mounting-paper diode, including：
(1) the step of making the upper and lower framework of stamp-mounting-paper diode and matched moulds：Lower tablet → the sieve of crystal grain filling → tablet filling
Underframe → upper tablet → the sieve of the crystal grain filling → upper framework → upper and lower framework matched moulds of tablet filling；
(2) conventional welding is carried out using tunnel soldering furnace, high pure nitrogen is filled with stove as protective gas, and welding
The material being welded is cleaned and dried to prevent oxidation after connecing；
(3) the step of plastic packaging being carried out using epoxy resin；
(4) using solidified and electroplated by the way of conventional the step of；
(5) the step of rib cutting bending and molding：Hydraulic press pre-bends → automatic corner crimping machine bending and molding；
(6) Reflow Soldering is carried out using the reflow soldering material good to rib cutting, Reflow Soldering includes eight humidity provinces, eight area's temperature
It is followed successively by 150 DEG C, 160 DEG C, 180 DEG C, 190 DEG C, 230 DEG C, 240 DEG C, 280 DEG C, 280 DEG C；The chain speed of reflow soldering conveyer belt is
100cm/min, and the good material of rib cutting is 10s in the time of 240 DEG C of area above in temperature；Material after Reflow Soldering is through nature
Cased after cooling；
(7) after TMTT test passes the step of shipment.
Embodiment 3
A kind of anti-stress automatic molding process of stamp-mounting-paper diode, including：
(1) the step of making the upper and lower framework of stamp-mounting-paper diode and matched moulds：Lower tablet → the sieve of crystal grain filling → tablet filling
Underframe → upper tablet → the sieve of the crystal grain filling → upper framework → upper and lower framework matched moulds of tablet filling；
(2) conventional welding is carried out using tunnel soldering furnace, high pure nitrogen is filled with stove as protective gas, and welding
The material being welded is cleaned and dried to prevent oxidation after connecing；
(3) the step of plastic packaging being carried out using epoxy resin；
(4) using solidified and electroplated by the way of conventional the step of；
(5) the step of rib cutting bending and molding：Hydraulic press pre-bends → automatic corner crimping machine bending and molding；
(6) Reflow Soldering is carried out using the reflow soldering material good to rib cutting, Reflow Soldering includes eight humidity provinces, eight area's temperature
It is followed successively by 150 DEG C, 160 DEG C, 180 DEG C, 190 DEG C, 230 DEG C, 240 DEG C, 280 DEG C, 280 DEG C；The chain speed of reflow soldering conveyer belt is
100cm/min, and the good material of rib cutting is 20s in the time of 240 DEG C of area above in temperature；Material after Reflow Soldering is through nature
Cased after cooling；
(7) after TMTT test passes the step of shipment.
Embodiment 4
A kind of anti-stress automatic molding process of stamp-mounting-paper diode, including：
(1) the step of making the upper and lower framework of stamp-mounting-paper diode and matched moulds：Lower tablet → the sieve of crystal grain filling → tablet filling
Underframe → upper tablet → the sieve of the crystal grain filling → upper framework → upper and lower framework matched moulds of tablet filling；
(2) conventional welding is carried out using tunnel soldering furnace, high pure nitrogen is filled with stove as protective gas, and welding
The material being welded is cleaned and dried to prevent oxidation after connecing；
(3) the step of plastic packaging being carried out using epoxy resin；
(4) using solidified and electroplated by the way of conventional the step of；
(5) the step of rib cutting bending and molding：Hydraulic press pre-bends → automatic corner crimping machine bending and molding；
(6) Reflow Soldering is carried out using the reflow soldering material good to rib cutting, Reflow Soldering includes eight humidity provinces, eight area's temperature
It is followed successively by 150 DEG C, 160 DEG C, 180 DEG C, 190 DEG C, 230 DEG C, 240 DEG C, 280 DEG C, 280 DEG C；The chain speed of reflow soldering conveyer belt is
100cm/min, and the good material of rib cutting is 30s in the time of 240 DEG C of area above in temperature；Material after Reflow Soldering is through nature
Cased after cooling；
(7) after TMTT test passes the step of shipment.
Embodiment 5
A kind of anti-stress automatic molding process of stamp-mounting-paper diode, including：
(1) the step of making the upper and lower framework of stamp-mounting-paper diode and matched moulds：Lower tablet → the sieve of crystal grain filling → tablet filling
Underframe → upper tablet → the sieve of the crystal grain filling → upper framework → upper and lower framework matched moulds of tablet filling；
(2) conventional welding is carried out using tunnel soldering furnace, high pure nitrogen is filled with stove as protective gas, and welding
The material being welded is cleaned and dried to prevent oxidation after connecing；
(3) the step of plastic packaging being carried out using epoxy resin；
(4) using solidified and electroplated by the way of conventional the step of；
(5) the step of rib cutting bending and molding：Hydraulic press pre-bends → automatic corner crimping machine bending and molding；
(6) Reflow Soldering is carried out using the reflow soldering material good to rib cutting, Reflow Soldering includes eight humidity provinces, eight area's temperature
It is followed successively by 150 DEG C, 160 DEG C, 180 DEG C, 190 DEG C, 230 DEG C, 240 DEG C, 280 DEG C, 280 DEG C；The chain speed of reflow soldering conveyer belt is
100cm/min, and the good material of rib cutting is 40s in the time of 240 DEG C of area above in temperature；Material after Reflow Soldering is through nature
Cased after cooling；
(7) TMTT test, it is qualified after shipment the step of.
Embodiment 6
A kind of anti-stress automatic molding process of stamp-mounting-paper diode, including：
(1) the step of making the upper and lower framework of stamp-mounting-paper diode and matched moulds：Lower tablet → the sieve of crystal grain filling → tablet filling
Underframe → upper tablet → the sieve of the crystal grain filling → upper framework → upper and lower framework matched moulds of tablet filling；
(2) conventional welding is carried out using tunnel soldering furnace, high pure nitrogen is filled with stove as protective gas, and welding
The material being welded is cleaned and dried to prevent oxidation after connecing；
(3) the step of plastic packaging being carried out using epoxy resin；
(4) using solidified and electroplated by the way of conventional the step of；
(5) the step of rib cutting bending and molding：Hydraulic press pre-bends → automatic corner crimping machine bending and molding；
(6) Reflow Soldering is carried out using the reflow soldering material good to rib cutting, Reflow Soldering includes eight humidity provinces, eight area's temperature
It is followed successively by 150 DEG C, 160 DEG C, 180 DEG C, 190 DEG C, 230 DEG C, 240 DEG C, 280 DEG C, 280 DEG C；The chain speed of reflow soldering conveyer belt is
100cm/min, and the good material of rib cutting is 5s in the time of 240 DEG C of area above in temperature；Material after Reflow Soldering is through nature
Cased after cooling；
(7) TMTT test, it is qualified after shipment the step of.
Step (2) in above-mentioned all embodiments need to be 10-35 DEG C in room temperature, be carried out in the environment of humidity≤70%RH.
The good material of rib cutting is first placed on pallet by step (6) in Reflow Soldering, then pallet is placed to the conveyer belt of reflow soldering
On, and control before and after pallet distance in more than 10mm.
The present invention employs bending twice in Trim Molding, first passes through hydraulic press increase and pre-bends step, then passes through
Automatic corner crimping machine completes whole bending step, reduces the stress of bent angle, improves product quality, while does not reduce production effect
Rate.Again by under the chain speed of 97-103cm/min in Reflow Soldering, can farthest reduce in 240 DEG C of area above 10-30s
Stress, greatly improves the quality of product, and the electrical yield of product can reach more than 98%.
Above-mentioned according to the present invention is enlightenment, by above-mentioned description, relevant staff completely can without departing from
In the range of this invention technological thought, various changes and amendments are carried out.The technical scope of this invention is not limited to
In the content on specification, it is necessary to determine its technical scope according to right.
Claims (7)
- A kind of 1. anti-stress automatic molding process of stamp-mounting-paper diode, it is characterised in that including：(1) the step of making the upper and lower framework of stamp-mounting-paper diode and matched moulds；(2) the step of welding；(3) the step of plastic packaging；(4) the step of solidifying and electroplate；(5) the step of rib cutting bending and molding；(6) the step of Reflow Soldering；(7) the step of examining simultaneously shipment；Wherein, the step (5) includes bending twice, is followed successively by hydraulic press and pre-bends and automatic corner crimping machine bending and molding.
- 2. the anti-stress automatic molding process of stamp-mounting-paper diode according to claim 1, it is characterised in that the step (1) For：Lower tablet → the sieve of the crystal grain filling → tablet filling underframe → upper tablet → sieve of the crystal grain filling → upper framework of tablet filling → upper and lower framework matched moulds.
- 3. the anti-stress automatic molding process of stamp-mounting-paper diode according to claim 2, it is characterised in that the step (1) Using tin cream as viscose glue during middle filling.
- 4. the anti-stress automatic molding process of stamp-mounting-paper diode according to claim 1, it is characterised in that step (2) uses Tunnel soldering furnace welding, stove is interior to be filled with hydrogen or nitrogen, and the material being welded is cleaned and dried after welding.
- 5. the anti-stress automatic molding process of stamp-mounting-paper diode according to claim 1, it is characterised in that step (3) uses Epoxy resin carries out plastic packaging.
- 6. the anti-stress automatic molding process of stamp-mounting-paper diode according to claim 1, it is characterised in that step (6) uses The reflow soldering material good to rib cutting carries out Reflow Soldering, and Reflow Soldering includes eight humidity provinces, eight area's temperature be followed successively by 150 DEG C, 160 ℃、180℃、190℃、230℃、240℃、280℃、280℃；The chain speed of reflow soldering conveyer belt is 97-103cm/min, and The good material of rib cutting is 10-30s in the time of 240 DEG C of area above in temperature.
- 7. the anti-stress automatic molding process of stamp-mounting-paper diode according to claim 1, it is characterised in that after the Reflow Soldering Material cased after natural cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710917744.3A CN107622946B (en) | 2017-09-30 | 2017-09-30 | Automatic anti-stress forming process for surface mount diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710917744.3A CN107622946B (en) | 2017-09-30 | 2017-09-30 | Automatic anti-stress forming process for surface mount diode |
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| Publication Number | Publication Date |
|---|---|
| CN107622946A true CN107622946A (en) | 2018-01-23 |
| CN107622946B CN107622946B (en) | 2020-10-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710917744.3A Active CN107622946B (en) | 2017-09-30 | 2017-09-30 | Automatic anti-stress forming process for surface mount diode |
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| CN103681319A (en) * | 2013-12-18 | 2014-03-26 | 常州星海电子有限公司 | Manufacturing technology of diodes |
| CN204108535U (en) * | 2014-07-24 | 2015-01-21 | 如皋市易达电子有限责任公司 | A kind of bridge rectifier diode graphite jig |
| CN105118790A (en) * | 2015-07-23 | 2015-12-02 | 淄博美林电子有限公司 | Preparation method of high temperature resistant packaging framework of silicon carbide diode |
| CN105140137A (en) * | 2015-07-30 | 2015-12-09 | 常州银河世纪微电子有限公司 | Molding process of diode |
| CN105762199A (en) * | 2016-05-04 | 2016-07-13 | 滨海治润电子有限公司 | Ultra-thin packaging product of diode and packaging method thereof |
| CN205551243U (en) * | 2016-04-08 | 2016-09-07 | 东莞市星河精密压铸模具有限公司 | A hot shaping device of metallic structure spare for injection molding |
| CN106001824A (en) * | 2016-05-11 | 2016-10-12 | 山东迪电子科技有限公司 | Welding preparation method for semiconductor rectifier bridge |
| CN206432259U (en) * | 2017-01-22 | 2017-08-22 | 常州银河世纪微电子股份有限公司 | Stamp-mounting-paper diode framework |
-
2017
- 2017-09-30 CN CN201710917744.3A patent/CN107622946B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681319A (en) * | 2013-12-18 | 2014-03-26 | 常州星海电子有限公司 | Manufacturing technology of diodes |
| CN204108535U (en) * | 2014-07-24 | 2015-01-21 | 如皋市易达电子有限责任公司 | A kind of bridge rectifier diode graphite jig |
| CN105118790A (en) * | 2015-07-23 | 2015-12-02 | 淄博美林电子有限公司 | Preparation method of high temperature resistant packaging framework of silicon carbide diode |
| CN105140137A (en) * | 2015-07-30 | 2015-12-09 | 常州银河世纪微电子有限公司 | Molding process of diode |
| CN205551243U (en) * | 2016-04-08 | 2016-09-07 | 东莞市星河精密压铸模具有限公司 | A hot shaping device of metallic structure spare for injection molding |
| CN105762199A (en) * | 2016-05-04 | 2016-07-13 | 滨海治润电子有限公司 | Ultra-thin packaging product of diode and packaging method thereof |
| CN106001824A (en) * | 2016-05-11 | 2016-10-12 | 山东迪电子科技有限公司 | Welding preparation method for semiconductor rectifier bridge |
| CN206432259U (en) * | 2017-01-22 | 2017-08-22 | 常州银河世纪微电子股份有限公司 | Stamp-mounting-paper diode framework |
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| CN107622946B (en) | 2020-10-09 |
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