CN107818923A - The efficient pin transfer load technique of diode - Google Patents
The efficient pin transfer load technique of diode Download PDFInfo
- Publication number
- CN107818923A CN107818923A CN201710938691.3A CN201710938691A CN107818923A CN 107818923 A CN107818923 A CN 107818923A CN 201710938691 A CN201710938691 A CN 201710938691A CN 107818923 A CN107818923 A CN 107818923A
- Authority
- CN
- China
- Prior art keywords
- diode
- pin transfer
- draw point
- transfer load
- reflow soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005476 soldering Methods 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims abstract description 20
- 229920000297 Rayon Polymers 0.000 claims abstract description 18
- 238000003466 welding Methods 0.000 claims abstract description 11
- 239000013078 crystal Substances 0.000 claims abstract description 10
- 238000005520 cutting process Methods 0.000 claims abstract description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000006071 cream Substances 0.000 claims abstract description 7
- 239000011159 matrix material Substances 0.000 claims abstract description 7
- 238000005452 bending Methods 0.000 claims abstract description 4
- 238000000465 moulding Methods 0.000 claims abstract description 4
- 238000004806 packaging method and process Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 12
- 239000011120 plywood Substances 0.000 claims description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000002994 raw material Substances 0.000 abstract description 4
- 230000007306 turnover Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
Abstract
The present invention relates to a kind of efficient pin transfer load technique of diode, including：(1) the step of making the upper and lower framework of stamp-mounting-paper diode and matched moulds；(2) the step of welding；(3) the step of plastic packaging；(4) the step of solidifying and electroplate；(5) the step of rib cutting bending and molding；(6) the step of Reflow Soldering；(7) the step of examining simultaneously shipment；In the efficient pin transfer load technique of the diode, matrix form framework is employed, so as to improve the efficiency of viscose glue, production capacity is added, saves labour turnover；Meanwhile pin transfer syringe needle has been changed to two-layer equation draw point head, during being pushed by spring to draw point, do not allow crystal grain to rupture, reduce the electrical influence to diode, simultaneously, adjust the distance that draw point point arrives lower face, to reach suitable length, viscose glue amount can be effectively controlled, is improving raw material utilization rate, reduce loss, moreover, the size of draw point syringe needle can be adjusted, to improve the control to the viscose glue amount of tin cream.
Description
Technical field
The invention belongs to diode technologies field, and in particular to a kind of efficient pin transfer load technique of diode.
Background technology
The conventional method of diode adhering process at present, is to use wall scroll formula framework adhering process in process of production, right
Diode it is electrically extremely unstable, and wall scroll formula framework adhering process, that is, waste the utilization rate of raw material, increase this again
The cost of product；Moreover, existing pin transfer syringe needle be all using single-layer type can reduction copper spring syringe needle, spring is easily by glue
Pollution, influence elasticity and production efficiency.
The content of the invention
The technical problem to be solved in the present invention is：For overcome the deficiencies in the prior art, there is provided a kind of efficient pin of diode
Shift load technique.
The technical solution adopted for the present invention to solve the technical problems is：A kind of efficient pin transfer load technique of diode,
Including：
(1) the step of making the upper and lower framework of stamp-mounting-paper diode and matched moulds；
(2) the step of welding；
(3) the step of plastic packaging；
(4) the step of solidifying and electroplate；
(5) the step of rib cutting bending and molding；
(6) the step of Reflow Soldering；
(7) the step of examining simultaneously shipment；
Wherein, step (1) includes：Shelve → lower tablet → the sieve of crystal grain filling → tablet filling underframe → crystal grain filling
Upper tablet → sieve → upper framework → upper and lower framework the matched moulds of tablet filling, in shelving, each matrix form framework is shelved；
Wherein, when being loaded in step (1), draw point, top plate, lower plywood and bullet are included using the pin transfer syringe needle of viscose glue
Spring, the upper surface of lower plywood are provided with a step, and draw point sequentially passes through top plate, step and lower plywood, and spring is set in draw point
Periphery, spring is between top plate and step.
Specifically, using tin cream as viscose glue when being loaded in step (1).
Specifically, step (2) is welded using tunnel soldering furnace, hydrogen or nitrogen, and butt welding after welding are filled with stove
The material connected is cleaned and dried.
Specifically, step (6) carries out Reflow Soldering using the reflow soldering material good to rib cutting, Reflow Soldering includes eight temperature
Area, eight area's temperature are followed successively by 150 DEG C, 160 DEG C, 180 DEG C, 190 DEG C, 230 DEG C, 240 DEG C, 280 DEG C, 280 DEG C；Reflow soldering transmits
The chain speed of band is 97-103cm/min, and the good material of rib cutting is 10-30s in the time of 240 DEG C of area above of temperature.
Specifically, the material after Reflow Soldering is cased after natural cooling.
The invention has the advantages that in the efficient pin transfer load technique of the diode, matrix form framework is employed, so as to
The efficiency of viscose glue can be improved, adds production capacity, is saved labour turnover；Meanwhile pin transfer syringe needle two-layer equation draw point is changed to
Head, during being pushed by spring to draw point, do not allow crystal grain to rupture, reduce the electrical shadow to diode
Ring, meanwhile, regulation draw point point arrives the distance of lower face, to reach suitable length, can effectively control viscose glue amount, former improving
Expect utilization rate, loss is reduced, moreover, the size of draw point syringe needle can be adjusted, to improve the control to the viscose glue amount of tin cream.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is the structural representation of the pin transfer syringe needle of the efficient pin transfer load technique of diode of the present invention；
In figure：1. top plate, 2. lower plywoods, 3. draw points, 4. steps, 5. springs.
Embodiment
The present invention is further detailed explanation now：
A kind of efficient pin transfer load technique of diode, including：
(1) the step of making the upper and lower framework of stamp-mounting-paper diode and matched moulds；
(2) the step of welding；
(3) the step of plastic packaging；
(4) the step of solidifying and electroplate；
(5) the step of rib cutting bending and molding；
(6) the step of Reflow Soldering；
(7) the step of examining simultaneously shipment；
Wherein, step (1) includes：Shelve → lower tablet → the sieve of crystal grain filling → tablet filling underframe → crystal grain filling
Upper tablet → sieve → upper framework → upper and lower framework the matched moulds of tablet filling, in shelving, each matrix form framework is shelved；
Wherein, when being loaded in step (1), draw point 3, top plate 1, the and of lower plywood 2 are included using the pin transfer syringe needle of viscose glue
Spring 5, the upper surface of lower plywood 2 are provided with a step 4, and draw point 3 sequentially passes through top plate 1, step 4 and lower plywood 2, spring 5
The periphery of draw point 3 is set in, spring 5 is between top plate 1 and step 4.
Specifically, using tin cream as viscose glue when being loaded in step (1).
Specifically, step (2) is welded using tunnel soldering furnace, hydrogen or nitrogen, and butt welding after welding are filled with stove
The material connected is cleaned and dried.
Specifically, step (6) carries out Reflow Soldering using the reflow soldering material good to rib cutting, Reflow Soldering includes eight temperature
Area, eight area's temperature are followed successively by 150 DEG C, 160 DEG C, 180 DEG C, 190 DEG C, 230 DEG C, 240 DEG C, 280 DEG C, 280 DEG C；Reflow soldering transmits
The chain speed of band is 97-103cm/min, and the good material of rib cutting is 10-30s in the time of 240 DEG C of area above of temperature.
Specifically, the material after Reflow Soldering is cased after natural cooling.
Wherein, original wall scroll formula framework is changed to matrix form framework, while adds the quantity of pin transfer syringe needle, from
And the efficiency of viscose glue can be improved, add production capacity.
As shown in Figure 1：Pin transfer syringe needle is two-layer equation draw point head, including top plate and lower plywood, passes through spring buffer energy
Enough during draw point pushes, do not allow crystal grain to rupture, reduce the influence electrical to diode；Meanwhile lower plywood and
Step can effectively stop glue stain spring, ensure normal use, improve production efficiency；Meanwhile adjust draw point point and arrive lower plate
The distance in face, to reach suitable length, viscose glue amount can be effectively controlled, improve raw material utilization rate, reducing loss.Moreover,
The size of draw point syringe needle is convenient for adjusting, to improve the control to the viscose glue amount of tin cream.
Compared with prior art, in the efficient pin transfer load technique of the diode, matrix form framework is employed, so as to
The efficiency of viscose glue is improved, production capacity is added, saves labour turnover；Meanwhile pin transfer syringe needle has been changed to two-layer equation draw point head, lead to
During crossing spring 5 draw point 3 being pushed, do not allow crystal grain to rupture, reduce the electrical influence to diode, together
When, regulation draw point point arrives the distance of lower face, to reach suitable length, can effectively control viscose glue amount, makes improving raw material
With rate, loss is reduced, moreover, the size of draw point syringe needle can be adjusted, to improve the control to tin cream viscose glue amount.
It is complete by above-mentioned description, relevant staff using the above-mentioned desirable embodiment according to the present invention as enlightenment
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property scope is not limited to the content on specification, it is necessary to determines its technical scope according to right.
Claims (5)
1. a kind of efficient pin transfer load technique of diode, it is characterised in that comprise the following steps：
(1) the step of making the upper and lower framework of stamp-mounting-paper diode and matched moulds；
(2) the step of welding；
(3) the step of plastic packaging；
(4) the step of solidifying and electroplate；
(5) the step of rib cutting bending and molding；
(6) the step of Reflow Soldering；
(7) the step of examining simultaneously shipment；
Wherein, the step (1) includes：Shelve → lower tablet → the sieve of crystal grain filling → tablet filling underframe → crystal grain filling
Upper tablet → sieve → upper framework → upper and lower framework the matched moulds of tablet filling, in shelving, each matrix form framework is shelved；
When being loaded in the step (1), draw point, top plate, lower plywood and spring, lower floor are included using the pin transfer syringe needle of viscose glue
The upper surface of plate is provided with a step, and draw point sequentially passes through top plate, step and lower plywood, and spring is set in the periphery of draw point,
Spring is between top plate and step.
2. the efficient pin transfer load technique of diode as claimed in claim 1, it is characterised in that loaded in the step (1)
Shi Caiyong tin creams are as viscose glue.
3. the efficient pin transfer load technique of diode as claimed in claim 1, it is characterised in that the step (2) uses tunnel
Road soldering furnace welding, stove is interior to be filled with hydrogen or nitrogen, and the material being welded is cleaned and dried after welding.
4. the efficient pin transfer load technique of diode as claimed in claim 1, it is characterised in that the step (6) uses back
The fluid welding stove material good to rib cutting carries out Reflow Soldering, and Reflow Soldering includes eight humidity provinces, eight area's temperature be followed successively by 150 DEG C, 160
℃、180℃、190℃、230℃、240℃、280℃、280℃；The chain speed of reflow soldering conveyer belt is 97-103cm/min, and
The good material of rib cutting is 10-30s in the time of 240 DEG C of area above of temperature.
5. the efficient pin transfer load technique of diode as claimed in claim 1, it is characterised in that the material after the Reflow Soldering
Cased after natural cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710938691.3A CN107818923B (en) | 2017-09-30 | 2017-09-30 | The efficient needle of diode shifts load technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710938691.3A CN107818923B (en) | 2017-09-30 | 2017-09-30 | The efficient needle of diode shifts load technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107818923A true CN107818923A (en) | 2018-03-20 |
| CN107818923B CN107818923B (en) | 2019-11-08 |
Family
ID=61608013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710938691.3A Active CN107818923B (en) | 2017-09-30 | 2017-09-30 | The efficient needle of diode shifts load technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107818923B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204067374U (en) * | 2014-07-28 | 2014-12-31 | 阳信金鑫电子有限公司 | A kind of high-power high-current diode package structure |
| CN105728260A (en) * | 2014-12-11 | 2016-07-06 | 重庆市合川区华丰包装有限公司 | Paperboard gumming machine |
| CN105762199A (en) * | 2016-05-04 | 2016-07-13 | 滨海治润电子有限公司 | Ultra-thin packaging product of diode and packaging method thereof |
| CN205881879U (en) * | 2016-06-24 | 2017-01-11 | 扬州扬杰电子科技股份有限公司 | SMD semiconductor device production line |
-
2017
- 2017-09-30 CN CN201710938691.3A patent/CN107818923B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204067374U (en) * | 2014-07-28 | 2014-12-31 | 阳信金鑫电子有限公司 | A kind of high-power high-current diode package structure |
| CN105728260A (en) * | 2014-12-11 | 2016-07-06 | 重庆市合川区华丰包装有限公司 | Paperboard gumming machine |
| CN105762199A (en) * | 2016-05-04 | 2016-07-13 | 滨海治润电子有限公司 | Ultra-thin packaging product of diode and packaging method thereof |
| CN205881879U (en) * | 2016-06-24 | 2017-01-11 | 扬州扬杰电子科技股份有限公司 | SMD semiconductor device production line |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107818923B (en) | 2019-11-08 |
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